MY147729A - Polishing composition and method utilizing abrasive particles treated with an aminosilane - Google Patents
Polishing composition and method utilizing abrasive particles treated with an aminosilaneInfo
- Publication number
- MY147729A MY147729A MYPI2010001235A MYPI20101235A MY147729A MY 147729 A MY147729 A MY 147729A MY PI2010001235 A MYPI2010001235 A MY PI2010001235A MY PI20101235 A MYPI20101235 A MY PI20101235A MY 147729 A MY147729 A MY 147729A
- Authority
- MY
- Malaysia
- Prior art keywords
- abrasive particles
- polishing composition
- aminosilane
- method utilizing
- particles treated
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 239000002245 particle Substances 0.000 title abstract 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 title 1
- -1 AMINOSILANE COMPOUND Chemical class 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 229920006317 cationic polymer Polymers 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Composite Materials (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US97434007P | 2007-09-21 | 2007-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY147729A true MY147729A (en) | 2013-01-15 |
Family
ID=40472131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2010001235A MY147729A (en) | 2007-09-21 | 2008-09-19 | Polishing composition and method utilizing abrasive particles treated with an aminosilane |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7994057B2 (enExample) |
| EP (1) | EP2197972B1 (enExample) |
| JP (1) | JP5519507B2 (enExample) |
| KR (1) | KR101232585B1 (enExample) |
| CN (1) | CN101802125B (enExample) |
| IL (1) | IL203477A (enExample) |
| MY (1) | MY147729A (enExample) |
| TW (1) | TWI428436B (enExample) |
| WO (1) | WO2009042072A2 (enExample) |
Families Citing this family (58)
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|---|---|---|---|---|
| MY149975A (en) * | 2007-09-21 | 2013-11-15 | Cabot Microelectronics Corp | Polishing composition and method utilizing abrasive particles treated with an aminosilane |
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| US10428241B2 (en) * | 2017-10-05 | 2019-10-01 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions containing charged abrasive |
| US20190185713A1 (en) * | 2017-12-14 | 2019-06-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cmp slurry compositions containing silica with trimethylsulfoxonium cations |
| JP7028120B2 (ja) * | 2018-09-20 | 2022-03-02 | Jsr株式会社 | 化学機械研磨用水系分散体及びその製造方法、並びに化学機械研磨方法 |
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| US10781343B2 (en) * | 2019-01-24 | 2020-09-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Acid polishing composition and method of polishing a substrate having enhanced defect inhibition |
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| US20230094224A1 (en) * | 2020-01-16 | 2023-03-30 | Showa Denko Materials Co., Ltd. | Polishing agent, stock solution for polishing agent, and polishing method |
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-
2008
- 2008-09-19 JP JP2010525837A patent/JP5519507B2/ja active Active
- 2008-09-19 MY MYPI2010001235A patent/MY147729A/en unknown
- 2008-09-19 EP EP08834266.2A patent/EP2197972B1/en active Active
- 2008-09-19 KR KR1020107008621A patent/KR101232585B1/ko active Active
- 2008-09-19 US US12/234,173 patent/US7994057B2/en active Active
- 2008-09-19 WO PCT/US2008/010896 patent/WO2009042072A2/en not_active Ceased
- 2008-09-19 CN CN2008801073426A patent/CN101802125B/zh active Active
- 2008-09-22 TW TW097136354A patent/TWI428436B/zh active
-
2010
- 2010-01-20 IL IL203477A patent/IL203477A/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| US7994057B2 (en) | 2011-08-09 |
| TWI428436B (zh) | 2014-03-01 |
| CN101802125A (zh) | 2010-08-11 |
| KR101232585B1 (ko) | 2013-02-12 |
| JP5519507B2 (ja) | 2014-06-11 |
| CN101802125B (zh) | 2013-11-06 |
| IL203477A (en) | 2013-03-24 |
| EP2197972A4 (en) | 2011-06-01 |
| EP2197972B1 (en) | 2020-04-01 |
| US20090081871A1 (en) | 2009-03-26 |
| WO2009042072A2 (en) | 2009-04-02 |
| EP2197972A2 (en) | 2010-06-23 |
| JP2010541203A (ja) | 2010-12-24 |
| WO2009042072A3 (en) | 2009-06-18 |
| TW200918658A (en) | 2009-05-01 |
| KR20100074207A (ko) | 2010-07-01 |
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