KR980006151A - 집적 회로 다이를 노출하는 열림구를 가지는 집적회로 장치 및 관련된 방법 - Google Patents

집적 회로 다이를 노출하는 열림구를 가지는 집적회로 장치 및 관련된 방법 Download PDF

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KR980006151A
KR980006151A KR1019970002262A KR19970002262A KR980006151A KR 980006151 A KR980006151 A KR 980006151A KR 1019970002262 A KR1019970002262 A KR 1019970002262A KR 19970002262 A KR19970002262 A KR 19970002262A KR 980006151 A KR980006151 A KR 980006151A
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integrated circuit
circuit die
opening
conductive member
fingerprint
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매튜 엠 살라티노
에스 제임스 스튜드베이커
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스코드 티 마이쿠엔
해리스 코포레이션
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/60—Static or dynamic means for assisting the user to position a body part for biometric acquisition
    • G06V40/67—Static or dynamic means for assisting the user to position a body part for biometric acquisition by interactive indications to the user
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    • G07—CHECKING-DEVICES
    • G07C—TIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
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    • G07C9/00174—Electronically operated locks; Circuits therefor; Nonmechanical keys therefor, e.g. passive or active electrical keys or other data carriers without mechanical keys
    • G07C9/00563—Electronically operated locks; Circuits therefor; Nonmechanical keys therefor, e.g. passive or active electrical keys or other data carriers without mechanical keys using personal physical data of the operator, e.g. finger prints, retinal images, voicepatterns
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07C—TIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
    • G07C9/00—Individual registration on entry or exit
    • G07C9/20—Individual registration on entry or exit involving the use of a pass
    • G07C9/22—Individual registration on entry or exit involving the use of a pass in combination with an identity check of the pass holder
    • G07C9/25—Individual registration on entry or exit involving the use of a pass in combination with an identity check of the pass holder using biometric data, e.g. fingerprints, iris scans or voice recognition
    • G07C9/26—Individual registration on entry or exit involving the use of a pass in combination with an identity check of the pass holder using biometric data, e.g. fingerprints, iris scans or voice recognition using a biometric sensor integrated in the pass
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07C—TIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
    • G07C9/00—Individual registration on entry or exit
    • G07C9/30—Individual registration on entry or exit not involving the use of a pass
    • G07C9/32—Individual registration on entry or exit not involving the use of a pass in combination with an identity check
    • G07C9/37—Individual registration on entry or exit not involving the use of a pass in combination with an identity check using biometric data, e.g. fingerprints, iris scans or voice recognition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Storage Device Security (AREA)
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  • Fire-Detection Mechanisms (AREA)
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Abstract

본 발명은 지문센서 장치를 포함하며, 집적회로 다이와, 집적회로 다이를 둘러싸며 집적회로 다이 부분을 노출시키는 열림구를 가지는 외피물질체, 그리고 열림구에 인접하여 외피물질체에 마운트되는 도전성 부재 또는 프레임을 구비하는 집적회로 장치에 관한 것이다. 도전성 부재는 집적회로 다이에 접착되어 부착된다. 따라서, 접착되어 설치되는 도전성 부재는 외피층 및 다이 사이의 공간을 밀봉하는 역할을 할 수 있다. 프레임은 제조공정의 중간 단계에서 제거가능한 물질을 둘러싸는 것으로 정의될 수 있다. 제거가능한 물질층 및 그것의 프레임은 플라스틱이 사출되어 어셈블리를 둘러싸게 하기 위해 주조되는 동안에 집적회로 다이 상에 설치될 수 있다.

Description

집적 회로 다이를 노출하는 열림구를 가지는 집적회로 장치 및 관련된 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제11도는 제3도의 11-11 선을 따라 자른 단면을 약간 확대한 도식적인 개략도.

Claims (16)

  1. 집적회로 다이와; 상기 접적회로 다이를 둘러싸며 상기 접적회로 다이부분을 노출하는 열림구를 가지는 외피물질체; 및 상기 외피물질체내의 열림구에 인접하여 외피물질체상에 마운트되는 프레임 부재를 구비하는 것을 특징으로 하는 집적회로 장치.
  2. 제1항에 있어서, 상기 외피물질체내의 열림구를 통해 노출된 상기 집적회로 다이부분을 지문센서로 되는 센서부를 구비하는 것을 특징으로 하는 집적회로 장치.
  3. 제1항 또는 제2항 중 어느 한 항에 있어서, 상기 프레임 부재는 적어도 상기 외피물질체내의 열림구부위를 정의할 수 있도록 배치되며, 바람직하게는 닫힌 기하학적 형태를 하며, 도전성이고; 상기 집적회로 다이에 상기 프레임 부제를 전기적으로 연결하는 내적연결 수단과, 상기 프레임 부재의 전압을 클램프하기 위하여 프레임 부재에 효과적으로 연결된 전압 클램프 수단을 포함하는 것을 특징으로 하는 집적회로 장치.
  4. 제1항 내지 제3항 중 어느 한 항에 있어서, 상기 집적회로 다이는 복수개의 결합 패드와, 상기 복수개의 결합 패드를 부식으로부터 방지하기 위한 결합 패드 밀봉 수단을 추가로 구비하며, 상기 집적회로 다이는 : 상대적으로 단단한 기판; 및 상기 기판상에 배치되며 상기 집적회로 다이의 강도를 제공하기 위하여 상대적으로 얇으면서 상대적으로 견고한 복수개의 금속층으로 이루어지며, 상기 집적회로 다이와 상기 프레임 부재 사이에 배치되는 접착제층과, 상기 프레임 부재와 상기 외피물질체 사이공간에 정의되어 이들 사이에서 기계적인 맞물림을 형성하기 위한 맞물림 수단을 구비하는 것을 특징으로 하는 집적회로 장치.
  5. 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 결합 패드의 각각은 부식작용을 견디는 제1 금속층을 구비하며 : 외피물질체는 상기 집적회로 다이 부분을 노출하는 열림구를 구비하며 복수개의 결합 패드를 덮으며 상기 집적회로를 둘러싸고; 결합 패드 밀봉수단은 부식으로부터 상기 복수개의 결합패드를 보호하며, 상기 외피물질체층내의 열림구를 통하여 노출되는 상기 집적회로 다이부분은 지문센서로 구성되는 센서부를 이루는 것을 특징으로 하는 집적회로 장치.
  6. 제5항에 있어서, 상기 결합 패드 밀봉 수단은 상기 제1층 상에 차단 금속층을 추가로 구비하며, 바람직하게는 상기 차단 금속층은 내화금속으로 이루어지며, 상기 결합 패드 밀봉 수단내에 상기 제1층의 모서리 부분을 덮는 바람직하게는 질화실리콘인 패시베이션층이 포함되는 것을 특징으로 하는 집적회로 장치.
  7. 제1항 내지 제6항 중 어느 한 항에 있어서, 상기 결합 패드 밀봉 수단은 상기 차단 금속층 상에 배치되는 금층을 추가로 구비하며, 상기 금층에 상기 전압 클램프 수단이 상기 도전성 부재를 사용자가 접촉하는 때의 사용자의 정전기적인 전하를 감속시키기 위하여 효과적으로 연결되어 있는 것을 특징으로 하는 집적회로 장치.
  8. 제7항에 있어서, 집적회로 다이는 상대적으로 견고한 기판과 상기 기판상에 설치되는 복수개의 금속층을 구비하며, 상기 금속층 각각은 상기 집적회로 다이의 강도를 제공하기 위하여 상대적으로 얇으면서 상대적으로 견고하며, 상기 외피물질체내의 열림구를 통하여 노출된 상기 집적회로 다이 부분은 센서부를 이루며, 상기 복수개의 금속층 각각은 텅스텐, 몰리브덴, 티탄 중의 적어도 하나로부터 선택된 내화금속으로 이루어지고, 그리고 상기 복수개의 금속층 각각은 알루미늄이 함유되지 않은 것을 특징으로 하는 집적회로 장치.
  9. 집적회로 다이를 제공하는 단계와; 집적회로 다이상에 제거가능한 물질체를 배치하는 단계와; 집적회로 다이와 제거가능한 물질체를 둘러싸는 외피물질체를 형성하는 단계; 및 집적회로 다이부분을 노출하기 위하여 외피물질체를 통하는 열림구를 정의하기 위하여 제거가능한 물질체를 제거하는 단계를 구비하는 것을 특징으로 하는 집적회로 장치를 제조하는 방법.
  10. 제9항에 있어서, 집적회로 다이를 제공하는 단계는 외피물질체내의 열림구를 통하여 노출되어지는 센서부를 구성하는 집적회로 다이를 제공하는 단계로 이루어지며, 상기 센서부는 외피물질체내의 열림구를 통하여 노출되어지는 지문센서부인 것을 특징으로 하는 방법.
  11. 제9항 또는 제10항 중 어느 한 항에 있어서, 제거가능한 물질체로 프레임 부재를 고정하는 단계를 포함하며; 제거가능한 물질체를 제거하는 단계는 외피물질체 대신에 프레임 부재가 남아있는 동안에 제거가능한 물질체를 제거하는 것으로 이루어지며, 제거가능한 물질체를 배치하는 단계는 프레임 부재를 접착제로 집적회로 다이에 고정하는 단계를 구비하며, 프레임 부재를 고정하는 단계는 제거가능한 물질체 주변을 완전히 감싸도록 프레임을 고정하는 단계로 이루어지며, 외피물질체를 형성하는 단계는 제거가능한 물질체 및 집적회로 다이를 둘러싸는 플라스틱을 사출성형하는 단계로 이루어지며, 용해가능한 물질체를 용액내에 제공하는 단계를 포함하며; 및 제거하는 단계는 용액내의 용해가능한 물질체를 용액에 노출하는 단계로 이루어지는 것을 특징으로 하는 방법.
  12. 제9항, 제10항 또는 제11항에 있어서, 제거가능한 물질체에 도전성 부재를 고정하는 단계와; 집적회로 다이 상에 제거가능한 물질체와 도전성 부재를 배치하는 단계와; 집적회로 다이, 제거가능한 물질체 및 도전성 부재를 둘러싸는 외피물질체를 형성하는 단계; 및 도전성 부재가 외피물질체 대신 남아있는 동안에 집적회로 다이부분을 노출시키기 위한 외피물질체를 통하여 열림구를 정의하기 위해 게거가능한 물질체를 제거하고, 그리고 외피물질체내의 열림구를 통하여 노출되어지는 지문센서로 구성되는 센서를 구비하는 집적회로 다이를 제공하는 단계를 포함하는 것을 특징으로 하는 방법.
  13. 사용자의 손가락에 의하여 접촉되는 지문 감지부를 구비하는 집적회로 다이와; 상기 집적회로 다이를 둘러싸며 상기 집적회로 다이의 지문 감지부를 노출시키는 열림구를 구비하는 외피물질체; 및 상기 외피물질체상에 열림구에 인접하여 마운트된 도전성 부재로 이루어지며, 상기 도전성 부재는 상기 외피물질체내의 열림구에 있어서 적어도 프레임부를 정의할 수 있도록 배치되며, 상기 도전성 부재는 닫힌 기하학적 형상이며, 바람직하게는 사각형이고, 상기 집적회로 다이에 상기 도전성 부재를 전기적으로 연결하는 연결수단을 포함하는 것을 특징으로 하는 지문감지장치.
  14. 제13항에 있어서, 상기 연결장치는 : 상기 도전성 부재와 상기 집적회로 다이 사이에 배치되는 도전성 접착제와; 상기 집적회로 내의 적어도 하나의 통로; 및 상기 적어도 하나의 통로 내의 도전성 물질을 구비하는 것을 특징으로 하는 지문감지장치.
  15. 제13항 또는 제14항 중 어느 한 항에 있어서, 상기 지문감지부는 전기장 지문센서로 이루어지며, 상기 전기장 지문센서는 : 전기장 감지 전극의 배열과; 상기 전기장 감지 전극 위에 설치되며 손가락을 받아들이기 위한 유전체층과; 상기 전기장 감지 전극에서 지문 출력 신호가 생성될 수 있도록 하기 위하여 상기 전기장 감지 전극 및 상기 손가락의 인접부위로 전기장 구동 신호를 인가하는 구동 수단; 및 상기 도전성 부재에 효과적으로 연결되어 그 전압을 클램핑하기 위한 접압 클램프 수단, 및 상기 도전성 부재에 효과적으로 연결되어 그 전압을 클램핑하기 위한 전압 클램프 수단, 및 사용자의 손가락이 상기 도전성 부재에 접촉되는 때에 사용자의 정전기적 전하를 감소시키기 위한 정전기 방전수단을 포함하는 것을 특징으로 하는 지문 감지장치.
  16. 제15항에 있어서, 상기 집적회로 다이에 연결된 리드 프레임을 포함하며, 상기 최외각 패시베이션층은 질화물, 탄화물, 및 다이아몬드 중에서 적어도 하나로 이루어지는 것을 특징으로 하는 지문감지장치.
KR1019970002262A 1996-01-26 1997-01-27 집적회로다이를노출하는열림구를가지는집적회로장치및관련된방법 KR100486994B1 (ko)

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US08/592,472 US5956415A (en) 1996-01-26 1996-01-26 Enhanced security fingerprint sensor package and related methods
US08/592,472 1996-01-26
US08/671,430 US5862248A (en) 1996-01-26 1996-06-27 Integrated circuit device having an opening exposing the integrated circuit die and related methods
US08/671,430 1996-06-27

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ATE281677T1 (de) 2004-11-15
KR970059976A (ko) 1997-08-12
US5862248A (en) 1999-01-19
EP0786745A2 (en) 1997-07-30
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