KR970068753A - 인쇄 회로판용 프리프레그(prepreg for printed circuti board) - Google Patents

인쇄 회로판용 프리프레그(prepreg for printed circuti board) Download PDF

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KR970068753A
KR970068753A KR1019960039568A KR19960039568A KR970068753A KR 970068753 A KR970068753 A KR 970068753A KR 1019960039568 A KR1019960039568 A KR 1019960039568A KR 19960039568 A KR19960039568 A KR 19960039568A KR 970068753 A KR970068753 A KR 970068753A
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South Korea
Prior art keywords
single crystal
prepreg
carrier film
thermosetting resin
fiber
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KR1019960039568A
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KR100272884B1 (ko
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노리오 오까노
가즈히또 고바야시
아끼시 나까소
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단노 다께시
히다찌 가세이 고오교 가부시끼가이샤
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Priority claimed from JP8011353A external-priority patent/JPH09202834A/ja
Priority claimed from JP8011352A external-priority patent/JPH09202833A/ja
Priority claimed from JP8011351A external-priority patent/JPH09202832A/ja
Priority claimed from JP8063990A external-priority patent/JPH09255798A/ja
Application filed by 단노 다께시, 히다찌 가세이 고오교 가부시끼가이샤 filed Critical 단노 다께시
Publication of KR970068753A publication Critical patent/KR970068753A/ko
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Publication of KR100272884B1 publication Critical patent/KR100272884B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/248—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using pre-treated fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0251—Non-conductive microfibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
    • Y10T428/249995—Constituent is in liquid form
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/268—Monolayer with structurally defined element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
    • Y10T428/2942—Plural coatings
    • Y10T428/2949—Glass, ceramic or metal oxide in coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

반경화 열경화성 수지 및 상기 반경화 열경화성 수지에 분산된 전기절연성 단결정 (whisker) 또는 단락(short fiber) 을 포함하고, 필요하다면 캐리어 필름이 부착되어 있거나 결합되어 있는 프리프레그 (prepreg) 는 보다 얇고 고생산성 및 저생산비와 더불어 고배선집적도 및 고접속신뢰도의 다중층 인쇄 회로판을 생산하기에 적합하다.

Description

인쇄 회로판용 프리프레그(PREPREG FOR PRINTED CIRCUTI BOARD)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도 1 은 본 발명의 프리프레그 (prepreg) 의 한 예를 포함하는 회로판 단면의 전자현미경 사진이다.

Claims (14)

  1. 반경화 열경화성 수지 및 이에 분산되어 있는 전기절연성 단결정 또는 단락 (short fiber) 을 포함하고, 캐리어 필름 상에 형성될 수 있는 인쇄 회로판용 프리프레그 (prepreg).
  2. 제 1 항에 있어서, 열경화성 수지가 필름 형성력을 가지고 캐리어 필름 없이 전기절연성 단결정이 분산되어 있는 프리프레그.
  3. 제 1 항에 있어서, 열경화성 수지가 필름 형성력을 가지거나 가지지 않으며 캐리어 필름 없이 전기절연성 단결정이 분산되어 있는 프리프레그.
  4. 제 1 항에 있어서, 열경화성 수지가 필름 형성력을 가지지 않고 전기절연성 단결정이 분산되어 있으며 캐리어 필름 상에 형성되는 프리프레그.
  5. 제 1 항에 있어서, 전기절연성 단결정이 열경화성 수지 내에 분산되어 있고, 캐리어 필름으로서의 구리 호일의 비활면 상에 형성되는 프리프레그.
  6. 제 1 항에 있어서, 열경화성 수지가 필름 형성력을 가지지 않고 전기절연성 단락이 분산되어 있으며, 캐리어 필름으로서의 구리 호일의 비활면 상에 형성되는 프리프레그.
  7. 제 1 항 내지 제 5 항 중 어느 한 항에 있어서, 단결정이 200 GPa 이상의 탄성율을 가지는 프리프레그.
  8. 제 1 항 내지 제 5 항 중 어느 한 항에 있어서, 단결정이 붕산알루미늄 단결정, 규회석 단결정, 티탄칼륨 단결정, 염기성 황산마그네슘 단결정, 질화규소 단결정 또는 α-알루미나 단결정 중의 한 가지 이상인 프리프레그.
  9. 제 1 항 내지 제 5 항 중 어느 한 항에 있어서, 단결정의 평균 직경이 0.3㎛ 내지 3 ㎛ 이고 평균 길이가 평균 직경의 10 배 및 100 ㎛ 이하인 프리프레그.
  10. 제 2 항, 제 3 항 및 제 5 항 중 어느 한 항에 있어서, 단결정이 붕산알루미늄 단결정인 프리프레그.
  11. 제 6 항에 있어서, 단락이 아라미드 섬유, 초고분자량 폴리에틸렌 섬유, 폴리아릴레이트 섬유, 폴리-p-옥시 벤조일 단결정, 폴리-2-옥시-6-나프톨 단결정, 폴리옥시메틸렌 단결정, 알루미나 섬유, 마그네샤 섬유, 실리카 섬유 또는 지르코니아 섬유의 단락들 중의 한 가지 이상인 프리프레그.
  12. 다중층 인쇄 회로판을 수득하기 위한 제 1 항 내지 제 6 항 중 어느 한 항의 프리프레그의 용도.
  13. 열경화성 수지 니스를 단결정 또는 단락과 함께 균일하게 혼합하고, 이에 수득되는 혼합물을 캐리어 필름상에 도포하며, 도포된 혼합물을 가열, 건조하여 용매를 제거하고, 수지를 반경화하는 것을 포함하는 제 1 항 내지 제 6 항 중 어느 한 항의 프리프레그를 제조하는 방법.
  14. 열경화성 수지 니스를 단결정 또는 단락과 함께 균일하게 혼합하고, 이에 수득되는 혼합물을 캐리어 필름상에 도포하며, 도포된 혼합물을 가열하여 용매를 제거하고, 수지를 반경화한 후, 캐리어 필름을 제거하는 것을 포함하는 제 1 항 내지 제 6 항 중 어느 한 항의 프리프레그를 제조하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960039568A 1995-09-13 1996-09-12 인쇄회로판용프리프레그 KR100272884B1 (ko)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP95-235300 1995-09-13
JP23530095 1995-09-13
JP96-011353 1996-01-26
JP8011353A JPH09202834A (ja) 1996-01-26 1996-01-26 プリント配線板用のプリプレグ及びその製造方法
JP96-011351 1996-01-26
JP8011352A JPH09202833A (ja) 1996-01-26 1996-01-26 多層プリント配線板用の銅箔付きプリプレグ及びその製造方法
JP96-011352 1996-01-26
JP8011351A JPH09202832A (ja) 1996-01-26 1996-01-26 プリント配線板用のプリプレグ及びその製造方法
JP96-063990 1996-03-21
JP8063990A JPH09255798A (ja) 1996-03-21 1996-03-21 プリント配線板用の銅箔付きプリプレグ及びその製造方法

Publications (2)

Publication Number Publication Date
KR970068753A true KR970068753A (ko) 1997-10-13
KR100272884B1 KR100272884B1 (ko) 2000-11-15

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KR1019960039568A KR100272884B1 (ko) 1995-09-13 1996-09-12 인쇄회로판용프리프레그

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US (1) US5965245A (ko)
EP (1) EP0763562B1 (ko)
KR (1) KR100272884B1 (ko)
CN (1) CN1150377A (ko)
DE (1) DE69611020T2 (ko)
MY (1) MY120902A (ko)
TW (1) TW389780B (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6596391B2 (en) * 1997-05-14 2003-07-22 Honeywell International Inc. Very ultra thin conductor layers for printed wiring boards
US6702916B2 (en) * 1997-05-14 2004-03-09 Honeywell International Inc. Very ultra thin conductor layers for printed wiring boards
JP3184485B2 (ja) * 1997-11-06 2001-07-09 三井金属鉱業株式会社 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板
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MY120902A (en) 2005-12-30
CN1150377A (zh) 1997-05-21
EP0763562B1 (en) 2000-11-22
DE69611020D1 (de) 2000-12-28
TW389780B (en) 2000-05-11
US5965245A (en) 1999-10-12
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EP0763562A3 (en) 1997-12-03
KR100272884B1 (ko) 2000-11-15

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