JP2007013113A - 多層配線板 - Google Patents
多層配線板 Download PDFInfo
- Publication number
- JP2007013113A JP2007013113A JP2006145458A JP2006145458A JP2007013113A JP 2007013113 A JP2007013113 A JP 2007013113A JP 2006145458 A JP2006145458 A JP 2006145458A JP 2006145458 A JP2006145458 A JP 2006145458A JP 2007013113 A JP2007013113 A JP 2007013113A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- multilayer wiring
- multilayer
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
Abstract
【解決手段】 本発明の好適な実施形態に係る多層配線板12は、屈曲性を有する印刷配線板1の両面に、カバーレイ10を介して屈曲性を有しない印刷配線板6が積層された構造を有する。この多層配線板に12おいて、カバーレイ10は、印刷配線板1の印刷配線板6が配置されていない領域を保護するとともに、印刷配線板6との接着を行う接着剤層11としても機能する。つまり、多層配線板12においては、カバーレイ10と接着剤層11とが同一の層である。
【選択図】 図1
Description
まず、厚さ0.019mmのガラス布(旭シュエーベル株式会社製1027)を含む、厚み50μmのイミド系プリプレグ(日立化成工業株式会社製)を準備した。次いで、このプリプレグの両側に厚み18μmの銅箔(F2−WS−18、古河サーキットフォイル株式会社製)を、その接着面がプリプレグと合わさるようにして重ねた。そして、これを230℃、90分、4.0MPaのプレス条件でプレスし両面銅張積層板を作製した。
まず、厚さ0.019mmのガラス布(旭シュエーベル株式会社製1027)を含む、厚み50μmのアクリルエポキシ系プリプレグ(日立化成工業株式会社製)を準備した。このプリプレグの両側に厚み18μmの銅箔(HLA−18、日本電解株式会社製)を、その接着面がプリプレグと合わさるようにして重ねた。そして、これを230℃、90分、4.0MPaのプレス条件でプレスして両面銅張積層板を作製した。
まず、両面銅付きポリイミドフィルム(宇部興産株式会社製)の両側にエッチングレジストとしてMIT−215(日本合成モートン株式会社製、厚み15μm)をラミネートし、従来のフォトリソ工程により所定のパターンとなるように加工した。それから、塩化第二鉄系の銅エッチング液により銅箔のエッチングを行いパターン形成した。その後、水洗、乾燥を行い、折り曲げ可能な第1の導体回路を含む印刷回路板(第1の印刷配線板)を作製した。
実施例1〜3で得られた多層配線板を、それぞれカバーレイで覆われたフレキシブルな部分で折り曲げたところ、いずれも任意に折り曲げることができた。具体的には、曲率半径0.5mmのピンに沿って180度折り曲げることが可能であった。
Claims (9)
- 第1の導体回路を含み、且つ、表面にカバーレイが設けられた第1の印刷配線板と、
接着剤層を介して前記第1の印刷配線板上に積層された、第2の導体回路を含む第2の印刷配線板と、を備え、
前記カバーレイが、前記接着剤層と同一の層である、多層配線板。 - 第1の導体回路を含む第1の印刷配線板と、
前記第1の導体回路を覆うように前記第1の印刷配線板の表面上に形成されたカバーレイと、
前記第1の印刷配線板上に一部不連続となるように積層された、第2の導体回路を含む第2の印刷配線板と、を備え、
前記第2の印刷配線板は、前記カバーレイと接着することにより前記第1の印刷配線板上に積層されている、多層配線板。 - 前記第1の印刷配線板上に、Bステージの樹脂フィルムを積層し、該樹脂フィルム上に前記第2の印刷配線板を重ね、加熱・加圧して前記樹脂フィルムから前記カバーレイを形成することにより得られた、請求項1又は2記載の多層配線板。
- 前記第1の印刷配線板は、任意に折り曲げ可能な印刷配線板である、請求項1〜3のいずれか一項に記載の多層配線板。
- 前記カバーレイは、熱硬化性樹脂組成物を含む、請求項1〜4のいずれか一項に記載の多層配線板。
- 前記熱硬化性樹脂組成物は、グリシジル基を有する樹脂を含む、請求項5記載の多層配線板。
- 前記熱硬化性樹脂組成物は、アミド基を有する樹脂を含む、請求項5又は6記載の多層配線板。
- 前記熱硬化性樹脂組成物は、アクリル樹脂を含む、請求項5〜7のいずれか一項に記載の多層配線板。
- 前記第1の印刷配線板は、基材上に前記第1の導体回路が形成された構成を有しており、該基材は、繊維基材を含み、且つ、該繊維基材は、厚み50μm以下のガラスクロスである、請求項1〜8のいずれか一項に記載の多層配線板。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006145458A JP2007013113A (ja) | 2005-05-30 | 2006-05-25 | 多層配線板 |
KR1020077030679A KR101172562B1 (ko) | 2005-05-30 | 2006-05-26 | 다층 배선판 |
DE112006001415T DE112006001415T5 (de) | 2005-05-30 | 2006-05-26 | Mehrschichtleiterplatte |
PCT/JP2006/310532 WO2006129560A1 (ja) | 2005-05-30 | 2006-05-26 | 多層配線板 |
CN2006800192560A CN101189926B (zh) | 2005-05-30 | 2006-05-26 | 多层配线板 |
US11/916,090 US20100065313A1 (en) | 2005-05-30 | 2006-05-26 | Multi-layer wiring board |
TW101110566A TWI450651B (zh) | 2005-05-30 | 2006-05-29 | Multilayer wiring board |
TW095119011A TW200727744A (en) | 2005-05-30 | 2006-05-29 | Multilayer wiring board |
US13/550,347 US20120285732A1 (en) | 2005-05-30 | 2012-07-16 | Multi-layer wiring board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005157614 | 2005-05-30 | ||
JP2006145458A JP2007013113A (ja) | 2005-05-30 | 2006-05-25 | 多層配線板 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011262687A Division JP2012069989A (ja) | 2005-05-30 | 2011-11-30 | 多層配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007013113A true JP2007013113A (ja) | 2007-01-18 |
Family
ID=37481489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006145458A Pending JP2007013113A (ja) | 2005-05-30 | 2006-05-25 | 多層配線板 |
Country Status (7)
Country | Link |
---|---|
US (2) | US20100065313A1 (ja) |
JP (1) | JP2007013113A (ja) |
KR (1) | KR101172562B1 (ja) |
CN (1) | CN101189926B (ja) |
DE (1) | DE112006001415T5 (ja) |
TW (2) | TWI450651B (ja) |
WO (1) | WO2006129560A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008102795A1 (ja) * | 2007-02-20 | 2008-08-28 | Hitachi Chemical Company, Ltd. | フレキシブル多層配線板 |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007013113A (ja) * | 2005-05-30 | 2007-01-18 | Hitachi Chem Co Ltd | 多層配線板 |
US7570082B2 (en) * | 2006-08-15 | 2009-08-04 | International Business Machines Corporation | Voltage comparator apparatus and method having improved kickback and jitter characteristics |
US8192815B2 (en) | 2007-07-13 | 2012-06-05 | Apple Inc. | Methods and systems for forming a dual layer housing |
US8315043B2 (en) * | 2008-01-24 | 2012-11-20 | Apple Inc. | Methods and systems for forming housings from multi-layer materials |
US8646637B2 (en) * | 2008-04-18 | 2014-02-11 | Apple Inc. | Perforated substrates for forming housings |
US8367304B2 (en) | 2008-06-08 | 2013-02-05 | Apple Inc. | Techniques for marking product housings |
JPWO2010007704A1 (ja) * | 2008-07-16 | 2012-01-05 | イビデン株式会社 | フレックスリジッド配線板及び電子デバイス |
US20100159273A1 (en) | 2008-12-24 | 2010-06-24 | John Benjamin Filson | Method and Apparatus for Forming a Layered Metal Structure with an Anodized Surface |
US9173336B2 (en) | 2009-05-19 | 2015-10-27 | Apple Inc. | Techniques for marking product housings |
US9884342B2 (en) * | 2009-05-19 | 2018-02-06 | Apple Inc. | Techniques for marking product housings |
US8663806B2 (en) * | 2009-08-25 | 2014-03-04 | Apple Inc. | Techniques for marking a substrate using a physical vapor deposition material |
US8809733B2 (en) * | 2009-10-16 | 2014-08-19 | Apple Inc. | Sub-surface marking of product housings |
US10071583B2 (en) * | 2009-10-16 | 2018-09-11 | Apple Inc. | Marking of product housings |
US9845546B2 (en) | 2009-10-16 | 2017-12-19 | Apple Inc. | Sub-surface marking of product housings |
US20110089039A1 (en) * | 2009-10-16 | 2011-04-21 | Michael Nashner | Sub-Surface Marking of Product Housings |
US8628836B2 (en) * | 2010-03-02 | 2014-01-14 | Apple Inc. | Method and apparatus for bonding metals and composites |
US8489158B2 (en) | 2010-04-19 | 2013-07-16 | Apple Inc. | Techniques for marking translucent product housings |
US8724285B2 (en) | 2010-09-30 | 2014-05-13 | Apple Inc. | Cosmetic conductive laser etching |
US20120248001A1 (en) | 2011-03-29 | 2012-10-04 | Nashner Michael S | Marking of Fabric Carrying Case for Portable Electronic Device |
US9280183B2 (en) | 2011-04-01 | 2016-03-08 | Apple Inc. | Advanced techniques for bonding metal to plastic |
CN102802346B (zh) * | 2011-05-27 | 2015-08-05 | 中国科学院理化技术研究所 | 一种液态金属印刷电路板及其制备方法 |
US9040837B2 (en) * | 2011-12-14 | 2015-05-26 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
US8879266B2 (en) * | 2012-05-24 | 2014-11-04 | Apple Inc. | Thin multi-layered structures providing rigidity and conductivity |
US9089071B2 (en) | 2012-06-28 | 2015-07-21 | International Business Machines Corporation | Implementing enhanced low loss, thin, high performance flexible circuits |
US10071584B2 (en) | 2012-07-09 | 2018-09-11 | Apple Inc. | Process for creating sub-surface marking on plastic parts |
KR101482404B1 (ko) * | 2013-05-27 | 2015-01-13 | 삼성전기주식회사 | 리지드 플렉시블 인쇄회로기판 및 그 제조방법 |
US9434197B2 (en) | 2013-06-18 | 2016-09-06 | Apple Inc. | Laser engraved reflective surface structures |
US9314871B2 (en) | 2013-06-18 | 2016-04-19 | Apple Inc. | Method for laser engraved reflective surface structures |
TWI501713B (zh) * | 2013-08-26 | 2015-09-21 | Unimicron Technology Corp | 軟硬板模組以及軟硬板模組的製造方法 |
TWI517775B (zh) | 2014-03-06 | 2016-01-11 | 相互股份有限公司 | 印刷電路板及其製法 |
US10999917B2 (en) | 2018-09-20 | 2021-05-04 | Apple Inc. | Sparse laser etch anodized surface for cosmetic grounding |
KR102653216B1 (ko) * | 2018-11-16 | 2024-04-01 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 전자기기 |
TWI713420B (zh) * | 2019-04-01 | 2020-12-11 | 新揚科技股份有限公司 | 電路板結構 |
US11583171B2 (en) * | 2019-08-22 | 2023-02-21 | Omnivision Technologies, Inc. | Surface-mount device platform and assembly |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0758425A (ja) * | 1993-08-17 | 1995-03-03 | Toshiba Corp | リジッド・フレキシブルプリント配線板 |
JPH0870176A (ja) * | 1994-08-29 | 1996-03-12 | Mitsubishi Gas Chem Co Inc | 折りたたみ可能な多層回路板の製造方法 |
JP2002069270A (ja) * | 2000-01-11 | 2002-03-08 | Nippon Kayaku Co Ltd | 難燃性非ハロゲンエポキシ樹脂組成物及びその用途 |
JP2002246748A (ja) * | 2001-02-16 | 2002-08-30 | Nippon Mektron Ltd | フレキシブルプリント基板およびその製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5499444A (en) * | 1994-08-02 | 1996-03-19 | Coesen, Inc. | Method of manufacturing a rigid flex printed circuit board |
TW389780B (en) * | 1995-09-13 | 2000-05-11 | Hitachi Chemical Co Ltd | Prepreg for printed circuit board |
TW336245B (en) * | 1996-05-07 | 1998-07-11 | Toray Industries | Epoxy resin composition for fiber reinforced composite material, prepreg and fiber reinforced composite material |
DE69832944T2 (de) * | 1997-10-29 | 2006-10-26 | Hitachi Chemical Co., Ltd. | Siloxanmodifizierte Polyamidharzzusammensetzung, Klebefilme, Klebefolie und Halbleiterbauelement |
JP3994298B2 (ja) * | 1998-03-20 | 2007-10-17 | 日立化成工業株式会社 | フレキシブル配線板 |
US6320137B1 (en) * | 2000-04-11 | 2001-11-20 | 3M Innovative Properties Company | Flexible circuit with coverplate layer and overlapping protective layer |
TW497374B (en) * | 2001-01-12 | 2002-08-01 | Phoenix Prec Technology Corp | Method for producing multilayer circuit board using prepreg as adhesive layer |
JP4455806B2 (ja) * | 2001-05-24 | 2010-04-21 | 日立化成工業株式会社 | プリプレグ及び積層板 |
CN1434674A (zh) * | 2001-12-28 | 2003-08-06 | 全懋精密科技股份有限公司 | 以预浸基材作为粘着层制作多层电路板的方法 |
JP4718145B2 (ja) * | 2004-08-31 | 2011-07-06 | 富士通株式会社 | 半導体装置及びゲート電極の製造方法 |
JP2007013113A (ja) * | 2005-05-30 | 2007-01-18 | Hitachi Chem Co Ltd | 多層配線板 |
KR100754080B1 (ko) * | 2006-07-13 | 2007-08-31 | 삼성전기주식회사 | 리지드-플렉서블 인쇄회로기판 및 그 제조방법 |
WO2010144792A1 (en) * | 2009-06-11 | 2010-12-16 | Rogers Corporation | Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith |
KR101067214B1 (ko) * | 2010-04-07 | 2011-09-22 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
-
2006
- 2006-05-25 JP JP2006145458A patent/JP2007013113A/ja active Pending
- 2006-05-26 KR KR1020077030679A patent/KR101172562B1/ko active IP Right Grant
- 2006-05-26 DE DE112006001415T patent/DE112006001415T5/de not_active Withdrawn
- 2006-05-26 CN CN2006800192560A patent/CN101189926B/zh active Active
- 2006-05-26 US US11/916,090 patent/US20100065313A1/en not_active Abandoned
- 2006-05-26 WO PCT/JP2006/310532 patent/WO2006129560A1/ja active Application Filing
- 2006-05-29 TW TW101110566A patent/TWI450651B/zh active
- 2006-05-29 TW TW095119011A patent/TW200727744A/zh unknown
-
2012
- 2012-07-16 US US13/550,347 patent/US20120285732A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0758425A (ja) * | 1993-08-17 | 1995-03-03 | Toshiba Corp | リジッド・フレキシブルプリント配線板 |
JPH0870176A (ja) * | 1994-08-29 | 1996-03-12 | Mitsubishi Gas Chem Co Inc | 折りたたみ可能な多層回路板の製造方法 |
JP2002069270A (ja) * | 2000-01-11 | 2002-03-08 | Nippon Kayaku Co Ltd | 難燃性非ハロゲンエポキシ樹脂組成物及びその用途 |
JP2002246748A (ja) * | 2001-02-16 | 2002-08-30 | Nippon Mektron Ltd | フレキシブルプリント基板およびその製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008102795A1 (ja) * | 2007-02-20 | 2008-08-28 | Hitachi Chemical Company, Ltd. | フレキシブル多層配線板 |
JPWO2008102795A1 (ja) * | 2007-02-20 | 2010-05-27 | 日立化成工業株式会社 | フレキシブル多層配線板 |
KR101099400B1 (ko) * | 2007-02-20 | 2011-12-27 | 히다치 가세고교 가부시끼가이샤 | 플렉시블 다층 배선판 |
US8232476B2 (en) | 2007-02-20 | 2012-07-31 | Hitachi Chemical Company, Ltd. | Flexible multilayer wiring board |
Also Published As
Publication number | Publication date |
---|---|
DE112006001415T5 (de) | 2008-05-08 |
CN101189926A (zh) | 2008-05-28 |
WO2006129560A1 (ja) | 2006-12-07 |
CN101189926B (zh) | 2012-05-02 |
US20100065313A1 (en) | 2010-03-18 |
TW200727744A (en) | 2007-07-16 |
KR20080014089A (ko) | 2008-02-13 |
KR101172562B1 (ko) | 2012-08-08 |
TW201236519A (en) | 2012-09-01 |
TWI450651B (zh) | 2014-08-21 |
US20120285732A1 (en) | 2012-11-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI450651B (zh) | Multilayer wiring board | |
JP5124984B2 (ja) | 印刷配線板 | |
JP5470725B2 (ja) | 金属箔張積層板及びプリント配線板 | |
JP5056553B2 (ja) | 金属箔張り積層板およびプリント配線板 | |
JP2006066894A (ja) | 印刷回路板 | |
JP4517749B2 (ja) | プリプレグ並びにこれを用いた金属張積層板及び印刷回路板 | |
JP4735092B2 (ja) | 印刷回路板 | |
JP4962001B2 (ja) | 絶縁性基板、金属箔付き基板、及びプリント配線板 | |
JP2008201117A (ja) | 樹脂付き金属薄膜、印刷回路板及びその製造方法、並びに、多層配線板及びその製造方法 | |
JP4736671B2 (ja) | プリプレグ、金属箔張積層板及びこれらを使用した印刷回路板 | |
JP5018011B2 (ja) | 金属箔張り積層板、樹脂付き金属箔及び多層プリント配線板 | |
JP4555985B2 (ja) | プリプレグ、並びにこれを用いて得られる金属箔張積層板及び印刷回路板 | |
JP4590982B2 (ja) | 樹脂付き金属箔 | |
JP5241992B2 (ja) | プリプレグ、並びにこれを用いて得られる金属箔張積層板及び印刷回路板 | |
JP2005325203A (ja) | プリプレグ、金属箔張積層板及びこれらを使用した印刷回路板 | |
JP4586424B2 (ja) | 印刷回路板 | |
JP2012069989A (ja) | 多層配線板 | |
JP2008137367A (ja) | 金属張積層板、並びに印刷回路板及びその製造方法 | |
JP4774702B2 (ja) | プリプレグ、並びにこれを用いて得られる金属箔張積層板及び印刷回路板 | |
JP4595434B2 (ja) | プリプレグ、並びにこれを用いて得られる金属箔張積層板及び印刷回路板 | |
JP2012169680A (ja) | 印刷配線板 | |
JP2005281663A (ja) | プリプレグ及びこれを用いた金属箔張積層板、印刷回路板。 | |
JP2005325162A (ja) | プリプレグ、金属箔張積層板及びこれらを使用した印刷回路板 | |
JP2008019444A (ja) | プリプレグ及び積層板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20081224 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110531 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110801 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20110830 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111130 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120112 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20120117 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20120316 |