497374 經濟部智慧財產局員工消費合作社印製 五 A7 B7497374 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A5 B7
發明說明（ 發明領域： 本發明係有關於一錄古^ ⑽—叙製程，特; :明=熱性及良好可靠度之電著 一般印刷電路柄你LV (epoxy resm) jPy)所構成。然而’隨著電子工業中積體電路 微小化的趨勢，％氧樹脂樹驗常在許多現代高速元件的 南熱和電的侧上卻不如職。為了製造高密度之多 層電路板，縮短的傳播延遲（pr〇pagati〇nddays)，提升的 操作溫度和更高的可靠性，—些更高級的材料，例如雙順 丁稀一酸醯亞胺（bismaldmide , BMI )、氰酯樹脂 (cyanate ester, CE)和雙順丁稀二酸醯亞胺/三氮阱複合樹 脂（bismaleimide triazine-based，BT)皆可滿足製程所需。 而在這些材料中，雙順丁稀二酸醯亞胺/三氮阱複合樹脂 (以下簡稱BT樹脂）則被認為是最具潛力的一種。 通常BT樹脂是由雙順丁稀二酸醯亞胺 (bismaleimide)與多功能之氰酯類（p〇iyfuncti〇nai cynate ester)所合成而成： ------^----- --裝 (請先閱讀背面之注咅？事項再填寫本頁) Λτ ϋ ϋ% n I I I I .1 l i ϋ -^1 訂· 〇Description of the invention (Field of the invention: The present invention is related to a recorded ancient process of ^ 特-narrative process, special;: Ming = thermal and good reliability of the electronic book general printed circuit handle you LV (epoxy resm) jPy). However, with the trend toward miniaturization of integrated circuits in the electronics industry, the% oxygen resin tree test often fails on the south heat and electricity side of many modern high-speed components. In order to manufacture high-density multi-layer circuit boards, shortened propagation delays (pr0pagatioonds), increased operating temperature, and higher reliability, some more advanced materials, such as bis-cis-butyric acid imine ( bismaldmide (BMI), cyanate ester (CE), and bismaleimide triazine-based resin (BT) can all meet the needs of the manufacturing process. Among these materials, bismaleic acid imine / trinitrogen trap composite resin (hereinafter referred to as BT resin) is considered to be the most promising one. Generally, BT resin is synthesized from bismaleimide and multifunctional cyanate esters: ------ ^ ----- --Installation (Please read the note on the back? Matters before filling out this page) Λτ ϋ ϋ% n IIII .1 li ϋ-^ 1 Order · 〇
N— Art—N 〇 〇 〇 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 497374 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（>) 其中雙順丁稀二酸醯亞胺為第一分子型式（formula I ) ’且其Arl可為芳香轉（aromatic ester )、苯基 (phenyl group )、燒基（alkyl group )、環己院 (cycloalkyl)或其混合體；且其氰酯類分子中至少含有兩 氰基（-OCN)。而第二分子型式（f〇rmula]I)之雙功能氰 酉旨類（bifunctional):N—Art—N 〇〇〇 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 497374 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (>) The maleimide maleate is the first molecular formula (formula I) 'and its Arl can be aromatic ester, phenyl group, alkyl group, cycloalkyl Or a mixture thereof; and the cyanate molecule thereof contains at least two cyano groups (-OCN). The bifunctional cyanocyanine of the second molecular form (f〇rmula) I:
N 三 C—Ό一Λγ2一0—C 三 N 其中Ar2可為氫（Η )、苯基（phenyl group )、烧基 (alkyl group)、環己烷（cyci〇aikyi)或其混合體，且此 氰酯可經二聚環化（Cycl〇trimerizeci)形成一三氮六環 (triazine)結構物。另外，所形成之BT樹脂可藉由添加如 環氧樹脂、聚胺酯（polyurethane)、環胺（polyamine)及 丁二烷（butadiene )等樹脂加以調整性質。鹵素 (Halogen)亦可與之結合增加其防火性質。而通常典型 BT樹脂可經由二苯曱院（diphenylmethane )基雙順丁稀·二 酸醯亞胺與不同莫耳比例之2, 2-雙（4-羥苯基）丙院 (biphenolA)氰酯樹脂混合製成。 常見製作多層電路板的方式即是以預浸材（prepreg) 為黏著劑（adhesion)將若干單位電路薄板進行疊合而 成。美國專利號4,526,835係揭露一種藉由纖維強化（仙沉-reinforced)之BT基板，完成多層電路板製程，如圖一所 示，其利用BT基（BT_based)預浸材為黏著層，而疊合單 ____ 3 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） I I 1 n I ϋ n n ϋ 01 I I -#i ϋ n ϋ (請先閱讀背面之注音？事項再填寫本頁) · 翁· 五、發明說明（〉） 3路薄板卜各該單位電路薄板i包含纖維強化之職緣 層（刪latlonlayer) 2，且至少在BT絕緣層2之一面上設 電路層3。所述各兩單位電路薄板1藉著預浸材4以埶 鍵結（heatbonded)方式達到疊合之目的。 、 美國專利號4,075,757亦揭露了一種於兩單位電路薄板 :曰:係利，兩片纖維強化之環氧預浸基材作為黏 者層，以《合形成多層電路板。另一美國專利號^⑷爪 亦揭露應用預浸基材作為黏著層以製造多層電路板，且此 專利，，出使用兩片環氧基（ep〇Xy_based)預浸基材而非 一片環氧預浸基材作為黏著層。不同的是，此專利係利用 所述之兩片環氧預浸基材作為黏著層，將一片銅箱 kpper foil)和一單位之電路薄板進行熱壓疊合，再以微 影技術在銅箱層製作銅導線圖案，而經逐步重複此疊合製 程，終將完成製作出一多層電路板。 口 這類方法的缺點之一，即是以預浸基材作為黏著層， 而預浸材4中原本的樹脂將在熱鍵結時，流入金屬圖案曰3間 的溝渠6内（箭頭所指處），如圖二所示。在這種情況 下，溝渠6内缺少纖維的樹脂將具有較高的熱膨脹係數， 而使得多層電路板的可靠性惡化。另一個缺點則是在熱鍵 結期間，纖維5可能未填人溝渠6内，且甚至接觸金屬圖 案3的邊角7，如圖二所示，亦導至該多層電路板可靠性 的惡化。再一缺點為，在某些特別情況下，如所使用樹脂 含$少之預浸材4中的樹脂填滿金屬圖案3間的溝渠6，尤 其是在上單位電路薄板1，空氣氣泡可能形成存在於溝渠6 本紙張尺"度適用ΤΪ國家--—^— (請先閱讀背面之注音？事項再填寫本頁) ——裝 訂--- -線· 經濟部智慧財產局員工消費合作社印製 經 濟 部 智 慧 財 產 局 消 費 合 作 社 印 製 A7 發明說明（^) 内，其亦將‘致抗熱性（heat-resistance)的退化。此問題 對於製作局電路密度之多層電路板時，將更趨明顯。 發明概述： 本發明的主要目的係為提供一種多層電路板之製 程，尤其是高密度之多層電路板，其係具有優良黏著 性及高抗熱性，並提供良好之可靠度。 本發明的另一目的為提供一種多層電路板之製 私’尤其是向密度與高抗熱性之多層電路板，其中在 熱鍵結之前’先覆上-BT錢蓋層於單位電路薄板 表面，當在疊合多單位電路薄板時，纖維強化之Βτ 預浸基材則作為黏著層之用。所述之單位薄板，其為 包含纖維強化之ΒΤ絕緣層，且至少在此絕緣層之一 面設置有電路層。 本發明的再一目的為提供一種多層電路板之製 程，其係以ΒΤ基樹脂化合物形成覆蓋層，該Βτ基 覆蓋層可在熱鍵結之前，先填充單位電路薄板表面之 至屬圖案間。違ΒΤ基樹脂化合物的流變性質 (rfie〇l〇glcal pr叩ertles)可適當地選擇，其流動性為在低 室溫的時容易掌握，但是在高溫時如80°C〜1〇〇乞則具高 流動性，以使得更容易填入單位電路層間的空間。所述之 化合物係為BT基樹脂、填充材（fiUer)及/或溶劑 (solvent)所混合而成。 片 •為達上述之目的，本發明係提供一種多層電路板之 製私，所述之多層電路板係以預浸材作黏著劑，疊合 -----^---—Γ I t I I.----訂------I (請先閱讀背面之注音？事項再填寫本頁) 尺度_> (CNS)A4 _21G Χ 297彳讀） 497374 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（^) 右干單位電路薄板形成。並以預浸材（prepreg)作為黏 著層（adhesion layer)。所述之單位電路薄板包含一由纖 維強化之雙順丁稀二酸醯亞胺/三氮阱複合樹脂化合物 (bismaleimide triazine-based Resin composite)之絕緣層， 與至少一面之圖案化導電層。作黏著用之預浸材亦以雙順 丁稀二酸醯亞胺/三氮阱複合樹脂所構成。在堆疊單位電路 薄板之前，將雙順丁稀二酸醯亞胺/三氮阱複合樹脂塗覆在 單位電路薄板之表面，以填充金屬圖案間的空隙。 本叙明之優點在於可消砰預浸材表面之纖維變形現象 及於任何兩單位電路薄板間形成氣泡（v〇id)之現象，提 南多層電路板之可靠度。 為了使貴審查委員對本發明之目的、特徵及功效，有 更進一步的瞭解與認同，茲配合圖式詳加說明如后： 圖式之簡單說明： 圖一係習知技術中疊合兩單位電路薄板之示音圖。 一圖二係另-習知技術中疊合兩電路薄板所遭遇問題之 不意圖。 圖三係本發明第-實施例中疊合兩單位電路薄板之示 意圖。 〃 圖立四係本發明第二實施例中疊合兩單位電路薄板 I不思圖。 圖五係本發明另-實施例中多層電路板 圖號說明： 得丁心圓 1，8,9，11，12，18，19,21〜25_ 單位電路薄板 I紙張尺用中0國家標準（CNS)A4規格（21Q χ二公爱- (請先閱讀背面之注意事項再填寫本頁) ---裝--------訂· •線_ 497374 五、發明說明（L) 2-絕緣層 4, 27-預浸材 6 -溝渠 10，13- BT基化合物 14, 15, 16, 17-導電孔 20-多層電路板 3-電路層 5-纖維 7-邊角 26-次多層電路板 經濟部智慧財產局員工消費合作社印製 詳細說明： 本發明係針對多層電路板製作，提出一高密度與高抗 熱性之多層電路板製程，其中之預浸基材係於兩單位電路 薄板間作黏著用，而疊合形成多層電路板。 請參閱圖三，首先提供單位電路薄板& 9，各單位電 路薄板8或9包含有絕緣層2，該絕緣層2係由雙順丁稀二酸 酉监亞胺/二氮胖複合樹脂（bismaleimide Resm )，或其衍生之化合物所構成。設置圖案化電路層3 於絕緣層2之頂部和/或底部的表面，例如銅或鋁，上述曰製 程係可由一般習知技藝而輕易完成。其中電路層亦可經^ 面化學或物理性粗化，以增加對BT樹脂之黏著性，此粗化 製程亦可為一般習知技藝而輕易完成。 接著一BT基化合物1〇覆於單位電路薄板8、9之表面， SBT基化合物1〇係以如網印（screenprinting)等方式沈積 於溝渠6内。將一預浸材4置於兩單位電路薄板8、9間，該 預浸材4係為纖維強化2BT基樹脂。再將單位電路薄板8 9 以預浸材4為黏著層進行熱壓。而經熱壓，於預浸材4中的 樹月曰固化之後，兩單位電路薄板8, 9之疊合步驟即完成。 ------;----舞I-裝：---------訂—— (請先閱讀背面之注音？事項再填寫本頁) 線· 本紙張尺度適財目國家標準（CNS)A4規格（210 X 2犯公髮 497374 A7N three C—Ό-Λγ2—0—C three N where Ar2 may be hydrogen (Η), phenyl group, alkyl group, cyclohexane (cycioaikyi), or a mixture thereof, and This cyanoester can be formed into a triazine structure through dimerization. In addition, the properties of the formed BT resin can be adjusted by adding resins such as epoxy resin, polyurethane, polyamine, and butadiene. Halogen can also be combined with it to increase its fire resistance. Generally, the typical BT resin can be passed through diphenylmethane-based biscisbutene diammonium diimide and different molar ratios of 2,2-bis (4-hydroxyphenyl) propane (biphenolA) cyanate. Made of resin. A common method for making a multilayer circuit board is to prepreg a plurality of unit circuit thin plates by using prepreg as an adhesive. U.S. Patent No. 4,526,835 discloses a multi-layer circuit board manufacturing process using fiber-reinforced BT substrates. As shown in Figure 1, it uses BT-based prepreg as the adhesive layer and superimposes it. Single ____ 3 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) II 1 n I ϋ nn ϋ 01 II-# i ϋ n ϋ (Please read the note on the back? Matters before filling in this Page) · Weng · V. Description of the invention (>) The 3-way thin plate includes the unit circuit sheet i including a fiber-reinforced latlonlayer 2 and a circuit layer 3 on at least one side of the BT insulation layer 2. Each of the two unit circuit sheets 1 is overlapped in a heatbonded manner through a prepreg 4. U.S. Patent No. 4,075,757 also discloses a thin circuit board for two units: Saily, two fiber-reinforced epoxy prepreg substrates are used as adhesive layers to form a multilayer circuit board. Another U.S. Patent No. ^ Claw also discloses the use of a prepreg substrate as an adhesive layer to make a multilayer circuit board, and this patent discloses the use of two epoxy-based prepreg substrates instead of an epoxy The prepreg substrate serves as an adhesive layer. The difference is that this patent uses the two epoxy prepreg substrates as the adhesive layer, hot-pressing a copper box (kpper foil) and a unit of circuit sheet, and then using lithography technology in the copper box Layers of copper wire patterns are made, and by repeating this stacking process step by step, a multilayer circuit board will eventually be produced. One of the disadvantages of this type of method is that the prepreg substrate is used as the adhesive layer, and the original resin in the prepreg 4 will flow into the trenches 6 in the metal pattern 3 when the thermal bonding is performed (the arrow indicates Place), as shown in Figure 2. In this case, the resin lacking fibers in the trench 6 will have a high coefficient of thermal expansion, which deteriorates the reliability of the multilayer circuit board. Another disadvantage is that during thermal bonding, the fibers 5 may not fill the trenches 6 and even touch the corners 7 of the metal pattern 3, as shown in Figure 2, which leads to the deterioration of the reliability of the multilayer circuit board. Another disadvantage is that, in some special cases, if the resin in the prepreg 4 containing less resin fills the trenches 6 between the metal patterns 3, especially on the upper unit circuit sheet 1, air bubbles may form Exist in the ditch 6 This paper rule " degree is applicable to the country of origin --- ^-(Please read the phonetic on the back? Matters and then fill out this page) ——Binding ----Line · Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperative In the A7 Invention Note (^) printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics and Industry, it will also cause 'heat-resistance degradation'. This problem will become more apparent when manufacturing multilayer circuit boards with local circuit density. SUMMARY OF THE INVENTION The main object of the present invention is to provide a process for a multilayer circuit board, especially a high-density multilayer circuit board, which has excellent adhesion and high heat resistance, and provides good reliability. Another object of the present invention is to provide a multilayer circuit board, especially a multilayer circuit board with a high density and high heat resistance, in which a -BT coin cover is applied to the surface of a unit circuit sheet before thermal bonding, When laminating multiple unit circuit sheets, the fiber-reinforced Bτ prepreg is used as an adhesive layer. The unit sheet is a fiber-reinforced BT insulating layer, and a circuit layer is provided on at least one side of the insulating layer. Yet another object of the present invention is to provide a process for a multilayer circuit board, which is formed by using a BTT-based resin compound to form a cover layer, and the Bτ-based cover layer can fill the sub-patterns on the surface of a unit circuit board before thermal bonding. The rheological properties (rfie〇glcal pr 叩 ertles) of the BT-based resin compound can be appropriately selected, and its fluidity is easy to grasp at low room temperature, but at high temperature such as 80 ° C ~ 100 It has high fluidity to make it easier to fill the space between unit circuit layers. The compound is a mixture of a BT-based resin, a fiUer, and / or a solvent. Sheet • In order to achieve the above-mentioned object, the present invention provides a manufacturing method of a multilayer circuit board. The multilayer circuit board is made of a prepreg as an adhesive, and is laminated ----- ^ ---- Γ I t I I .---- Order ------ I (Please read the phonetic on the back? Matters before filling out this page) Standard _ > (CNS) A4 _21G × 297 Read) 497374 Employees of Intellectual Property Bureau, Ministry of Economic Affairs Printed by the Consumer Cooperative A7 V. Description of the Invention (^) The circuit board of the right stem unit is formed. A prepreg is used as an adhesion layer. The unit circuit sheet includes an insulating layer of fiber-reinforced bismaleimide triazine-based Resin composite and a patterned conductive layer on at least one side. The prepreg used for adhesion is also composed of bis-succinic acid imine / three nitrogen trap composite resin. Before stacking the unit circuit sheets, the bismaleic acid imine / trinitrogen trap composite resin was coated on the surface of the unit circuit sheets to fill the spaces between the metal patterns. The advantage of this description is that it can eliminate the fiber deformation phenomenon on the surface of the prepreg and the phenomenon of forming bubbles between any two units of the circuit board, which improves the reliability of the multilayer circuit board. In order to allow your reviewers to further understand and agree with the purpose, features, and effects of the present invention, we will explain in detail with the drawings as follows: A brief description of the drawings: Figure 1 is a stack of two unit circuits in the conventional technology The sound chart of the sheet. One picture two is another unintended problem in the conventional technique of overlapping two circuit sheets. Fig. 3 is a schematic view showing a stack of two unit circuit sheets in the first embodiment of the present invention. 〃 Figure 4 shows that the two unit circuit sheets are stacked in the second embodiment of the present invention. Figure 5 is a drawing of a multi-layer circuit board according to another embodiment of the present invention. Figures show: Ding Xinyuan 1,8,9,11,12,18,19,21 ~ 25_ Unit circuit sheet I Paper ruler 0 National Standard (CNS) A4 specifications (21Q χ Ergongai-(Please read the precautions on the back before filling in this page) --------------- Order · • Wire _ 497374 V. Description of the invention (L) 2-Insulation Layer 4, 27-Prepreg 6-Ditch 10, 13- BT-based compound 14, 15, 16, 17- Conductive hole 20-Multilayer circuit board 3-Circuit layer 5-Fiber 7-Corner 26-Sub-layer circuit board Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Detailed description: The present invention is a multi-layer circuit board process with high density and high heat resistance for the production of multi-layer circuit boards. Refer to Figure 3. First, provide unit circuit sheet & 9, each unit circuit sheet 8 or 9 contains an insulating layer 2, which is made of bismaleic acid It consists of bismaleimide resin (bismaleimide Resm), or its derivative compound. Set pattern circuit The surface of layer 3 on the top and / or bottom of insulating layer 2, such as copper or aluminum, the above-mentioned process can be easily completed by conventional techniques. The circuit layer can also be chemically or physically roughened to increase the thickness. For the adhesion of BT resin, this roughening process can also be easily completed by ordinary conventional techniques. Next, a BT-based compound 10 is coated on the surface of the unit circuit sheets 8 and 9, and the SBT-based compound 10 is used as screen printing. (Screenprinting) and other methods are deposited in the trench 6. A prepreg 4 is placed between the two unit circuit sheets 8, 9 which is a fiber-reinforced 2BT-based resin. The unit circuit sheet 8 9 is pre-prepared. The impregnating material 4 is hot-pressed as an adhesive layer. After hot pressing, after the tree moon in the prepreg 4 is cured, the superimposing step of the two unit circuit sheets 8, 9 is completed. ------;- --- 舞 I- 装 ： --------- Order—— (Please read the note on the back? Matters before filling out this page) Thread · This paper size is suitable for the national standard (CNS) A4 specification ( 210 X 2 offenders issued 497374 A7
意 項▼ 再 I 填 1 寫鞋 頁I 請 先 閱 讀 背 面 \ 訂Meaning ▼ Then I fill in 1 to write the shoe page I Please read the back first \ Order
線 497374 A7 B7 五、發明說明（沴） (melamine powders )與聚苯乙烯粉末（p〇iystyrene powders)等。其中填充材佔總BT基化合物的重量比於 0.01〜90 wt%之間，最佳比例在5〇〜85 wt%，且填充材之 平均粒徑在100//m以下，較佳者在lOvm以下。然而一 些耦合劑（coupling agent )，如甲矽烷耦合劑 (silane)、鈦耦合劑、鍅耦合劑、鋁耦合劑等亦可加入 使填充材穩定地散佈。 (C)該溶劑係由N-甲基氮壞戊（N-methyl pyrrolidone )、二甲 稀甲醯胺（dimethylformamide )、二曱浠乙酸胺 (dimethylacetamide)、四曱基脲（tetramethyl urea)、 丁内酯（butyrolactone )、丙酮（acetone ) 、丁酮 (methylethyl ketone )、2_ 曱基戊酮（methyl isobutyl ketone )、環己酮（cyclohexanone )、二氯甲炫 (methylene chloride)、氣乙院（ethyl chloride)、：1,2-二氣乙院（l，2-dichloroethane) 1,4-環氧己烷（dioxane) 四氮吹 ϋ南(tetrahydrofuran )、乙二醇乙燒（ethyl glycol )、乙酸乙酯（ethyl acetate )' ethyl glycol acetate、methyl glycol acetate、diethylene glycol、乙醚 (diethyl ether ) 、diethylene glycol、monoethyl ether acetate、苯（benzene)、二曱基（xylene)等所選出， 所述溶劑可依需要加入BT基化合物適當地減低其黏滯 性，但其重量比不可超過化合物的30 wt%。 該BT基化合物之（a ) BT樹脂系統（BT resin system)、和/或（b)無機或有機填充材（filler)、和/或 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注音？事項再填寫本頁) i I · ! — !丨訂·--丨—丨 I · 經濟部智慧財產局員工消費合作社印製 497374 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 A7 B7 五、發明說明（/ ) (c )>谷劑以及其他添加料’係以如Banbury授掉器 (Banbury mixer)、旋擠壓出機（screw extruder)、柔捏 機（kneader)或熱滚（hot roll)等方式混合。該BT基樹 脂化合物的流變性質（rheological properties )可適當地選 擇，其流動性為在低室溫的時容易掌握，但是在高溫時如 80°C〜100 °C則具高流動性，以使得更容易填入各單位電 路薄板導線間的空間。因此如有必要，可以在各單位電路 薄板疊合之前先使預浸材之樹脂先部分固化，以減少樹脂 流動。適用於本發明之BT基樹脂可取自日本Mitsubishi GasLine 497374 A7 B7 V. Description of the Invention (沴) (melamine powders) and polystyrene powders (Polystyrene powders), etc. The weight ratio of the filler to the total BT-based compound is between 0.01 and 90 wt%, and the optimal ratio is between 50 and 85 wt%, and the average particle diameter of the filler is below 100 // m, preferably 10vm. the following. However, some coupling agents (such as silane, titanium coupling agent, osmium coupling agent, aluminum coupling agent, etc.) can also be added to make the filler stably spread. (C) The solvent is composed of N-methyl pyrrolidone, dimethylformamide, dimethylacetamide, tetramethyl urea, tetrabutyl urea Lactone (butyrolactone), acetone, methylethyl ketone, 2_ methyl isobutyl ketone, cyclohexanone, methylene chloride, ethyl acetate chloride) ,: 1,2-dichloroethane, 1,4-dioxane, tetrahydrofuran, ethyl glycol, acetic acid Ethyl acetate 'ethyl glycol acetate, methyl glycol acetate, diethylene glycol, diethyl ether, diethylene glycol, monoethyl ether acetate, benzene, xylene, etc. are selected, and the solvent may be selected Adding a BT-based compound as needed appropriately reduces its viscosity, but its weight ratio cannot exceed 30 wt% of the compound. (A) BT resin system of the BT-based compound, and / or (b) inorganic or organic fillers, and / or this paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the phonetic on the back? Matters before filling out this page) i I ·! —! 丨 Order ·-丨 — 丨 I · Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 497374 Intellectual Property Bureau of the Ministry of Economic Affairs Printed by employees 'consumer cooperatives A7 B7 V. Description of the invention (/) (c) > Cereals and other additives' are such as Banbury mixer, screw extruder, soft kneading Kneader or hot roll. The rheological properties of the BT-based resin compound can be appropriately selected. Its fluidity is easy to grasp at low room temperature, but it has high fluidity at high temperature such as 80 ° C ~ 100 ° C. It makes it easier to fill in the space between the thin circuit wires of each unit circuit. Therefore, if necessary, the resin of the prepreg can be partially cured before the unit circuit sheets are laminated to reduce the resin flow. BT-based resins suitable for the present invention can be obtained from Mitsubishi Gas, Japan
Chemical公司的商業產品，包括BT-M355F、BF_S657或 BT-S652 等。 接下所述為本發明另一實施例，其為多層電路板之製 程。如圖五所示，一多層電路板2〇透過七個單位電路薄板 18, 19, 21〜25疊合製成。在將所有單位電路薄板疊合以形 成多層電路板20之前，先將單位電路薄板19，21疊合製成 一次多層電路板26 ( sub-multilayer )，該次多層電路板26 中並已㈣完成導f孔I5，同樣地，在所有單位電路薄板 進行璺合之韵，導電孔16及17亦必須在單位電路薄板π 及23先行完成；當然，導電孔之數目與位置可視實際需求 決定。在導電孔15, 16, 17製成之後，所有單位電路薄板18, 19, 21〜25係依序疊合，經熱壓之後，單位電路薄板18 19’ 21〜25藉由預浸材27鍵結在一起，再製成包含導電孔I*之 多層電路板20。 綜上所述，本發明係揭露一種高密度多層電路板之製 本紙張尺度適用τ國國家標準（CNS)A4規格⑽χ 2益 ------^----r --裝--------訂---- (請先閱讀背面之注音？事項再填寫本頁) 497374 A7Chemical's commercial products, including BT-M355F, BF_S657 or BT-S652. The following is another embodiment of the present invention, which is a process for manufacturing a multilayer circuit board. As shown in Fig. 5, a multilayer circuit board 20 is formed by stacking seven unit circuit sheets 18, 19, 21 ~ 25. Before laminating all the unit circuit sheets to form a multilayer circuit board 20, the unit circuit sheets 19, 21 are first laminated to form a multi-layer circuit board 26 (sub-multilayer). The sub-multilayer circuit board 26 has been completed. The f-hole I5 is similarly performed on all unit circuit sheets. The conductive holes 16 and 17 must be completed before the unit circuit sheets π and 23. Of course, the number and position of the conductive holes can be determined according to actual needs. After the conductive holes 15, 16, 17 are made, all the unit circuit sheets 18, 19, 21 ~ 25 are sequentially stacked, and after heat pressing, the unit circuit sheets 18 19 '21 ~ 25 are made of prepreg 27 keys They are combined together to form a multilayer circuit board 20 including conductive holes I *. To sum up, the present invention is to disclose a paper for manufacturing a high-density multilayer circuit board. The paper size is applicable to τ national standard (CNS) A4 specifications ⑽χ 2 benefits ------ ^ ---- r --pack --- ----- Order ---- (Please read the Zhuyin on the back? Matters before filling out this page) 497374 A7
經濟部智慧財產局員工消費合作社印製Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs