KR960040102A - 금속기재 다층 회로 기판 및 그 제조 방법과 이를 구비하는 반도체 모듈 - Google Patents
금속기재 다층 회로 기판 및 그 제조 방법과 이를 구비하는 반도체 모듈 Download PDFInfo
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Abstract
금속판과, 하나 이상의 금속 산화물 및/또는 하나 이상의 금속 질화물을 함유하는 제 1절연성 접착층에 의하여 상기 금속판상에 결합되는 회로 기판으로 이루어지는 금속기재 다층 회로 기판이 제공되었다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 본 발명의 금속기재 (metal-base) 다층 회로 기판의 한 실시예를 설명하는 단면도, 제 6도는 본 발명의 금속기재 다층 회로 기판으로 사용된 금속기재 회로 기판을 설명하는 단면도.
Claims (16)
- 금속판과, 하나 이상의 금속 산화물 및/또는 하나 이상의 금속 질화물을 함유하는 제 1절연성 접착층에 의하여 상기 금속판상에 결합되는 회로 기판으로 이루어지는 금속기재 다층 회로 기판.
- 제 1항에 있어서, 상기 제 1절연성 접착층의 열 전도성은 35×10-4cal/㎝·sec·℃ 내지 150×10-4cal/㎝·sec·℃이며, 두께는 20㎛ 내지 200㎛인 것을 특징으로 하는 금속기재 다층 회로 기판.
- 제 1항에 있어서, 상기 금속 산화물은 알루미늄 산화물 또는 규소 산화물이며, 상기 금속 질화물은 보론질화물인 것을 특징으로 하는 금속기재 다층 회로 기판.
- 제 1항에 있어서, 상기 제 1회로 기판상에서 상기 제 1절연층 접착층과 마주대하는 상기 제 1회로 도체층의 표면 거칠기 (Rz)는 0.1㎛ 내지 10㎛인 것을 특징으로 하는 금속기재 다층 회로 기판.
- 제 4항에 있어서, 상기 회로 기판상의 상기 제 1회로 도체층에는 상기 제 1절연성 접착층과 마주대하는 도금된 구리층이 제공됨을 특징으로 하는 금속기재 다층 회로 기판.
- 제 5항에 있어서, 상기 도금된 구리층은 최소한 니켈 또는 코발트중의 하나를 포함함을 특징으로 하는 금속기재 다층 회로 기판.
- 제 1항에 있어서, 상기 회로 기판은, 하나 이상의 금속 산화물 및/또는 하나 이상의 금속 질화물을 함유하는 제 2절연성 접착층에 의하여 결합되는 두개 이상의 회로 도체층을 구비함을 특징으로 하는 금속기재 다층 회로 기판.
- 제 7항에 있어서, 상기 제 2절연성 접착층의 열 전도성은 35×104cal/㎝·sec·℃ 내지 150×10-4cal/㎝·sec·℃이며, 두께는 40㎛ 내지 200㎛인 것을 특징으로 하는 금속기재 다층 회로 기판.
- 제 1항에 있어서, 열 전도성이 높은 전도성 접착제를 사용하여 상기 제 1절연성 접착층상에 열 방출 전자장치를 장착함을 특징으로 하는 금속기재 다층 회로 기판.
- 제 9항에 있어서, 상기 제 1절연성 접착층과 상기 열 전도성이 높은 전도성 접착제 사이에 금속층이 제공됨을 특징으로 하는 금속기재 다층 회로 기판.
- 금속판과, 제 1절연성 접착층에 의하여 상기 금속판상에 형성된 제 1회로 도체층을 구비하는 금속기재 회로 기판의 상기 제 1회로 도체층상에 제 2절연성 접착층에 의하여 제 2회로 도체층을 형성하는 단계 (1)과, 상기 제 2회로 도체층과 상기 제 1회로 도체층을 전기적으로 연결시키는 관통홀을 형성시키는 단계 (2)와, 상기 제 2회로 도체층에 회로를 형성하는 단계 (3)으로 이루어지는, 청구항 1에 기재된 금속기재 다층 회로 기판의 제조방법.
- 제 11항에 있어서, 상기 제 1절연성 접착층은 단계 (2)전에 열경화되는 것을 특징으로 하는 금속기재 다층 회로 기판 제조 방법.
- 제 11항에 있어서, 상기 관통홀을 형성하기 위한 단계 (2)에서, 상기 제 2회로 도체층의 소정 부분을 에칭하여 제거함으로서 홀을 형성하고, 상기 홀을 통과하도록 레이저 빔을 조사하여 상기 제 2절연성 접착층을 제거함으로서 관통홀을 형성하는 것을 특징으로 하는 금속기재 다층 회로 기판 제조 방법.
- 제 11항에 있어서, 상기 제 1회로 도체층의 두께는 5㎛ 내지 150㎛인 것을 특징으로 하는 금속기재 다층 회로 기판 제조 방법.
- 청구항 8항에 기재된 금속기재 다층 회로 기판과 상기 회로 기판상에 장착된 반도체 장치를 구비하며, 알루미늄 와이어 또는 금 와이어에 의하여 와이어 본딩된 반도체 모듈.
- 제 15항에 있어서, 상기 회로 기판의 제 1절연성 접착층과 마주대하는 상기 제 1회로 도체층은 차폐 패턴으로 사용됨을 특징으로 하는 반도체 모듈.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8700195A JPH08148781A (ja) | 1994-09-19 | 1995-04-12 | 金属ベース多層回路基板 |
JP95-87001 | 1995-04-12 | ||
JP8700295A JP3199599B2 (ja) | 1995-04-12 | 1995-04-12 | 金属ベース多層回路基板 |
JP95-87002 | 1995-04-12 | ||
JP95-88045 | 1995-04-13 | ||
JP8804595A JP3282776B2 (ja) | 1995-04-13 | 1995-04-13 | 金属ベース多層回路基板 |
JP23400195 | 1995-09-12 | ||
JP95-234001 | 1995-09-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960040102A true KR960040102A (ko) | 1996-11-25 |
KR100382631B1 KR100382631B1 (ko) | 2003-08-02 |
Family
ID=27467321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960010843A KR100382631B1 (ko) | 1995-04-12 | 1996-04-10 | 금속기재다층회로기판과이를구비하는반도체모듈 |
Country Status (3)
Country | Link |
---|---|
US (2) | US6175084B1 (ko) |
EP (1) | EP0738007A3 (ko) |
KR (1) | KR100382631B1 (ko) |
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-
1996
- 1996-04-08 US US08/629,229 patent/US6175084B1/en not_active Expired - Lifetime
- 1996-04-10 EP EP96105663A patent/EP0738007A3/en not_active Ceased
- 1996-04-10 KR KR1019960010843A patent/KR100382631B1/ko not_active IP Right Cessation
-
2000
- 2000-06-13 US US09/593,059 patent/US6369332B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0738007A2 (en) | 1996-10-16 |
US6369332B1 (en) | 2002-04-09 |
EP0738007A3 (en) | 1998-04-29 |
US6175084B1 (en) | 2001-01-16 |
KR100382631B1 (ko) | 2003-08-02 |
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