KR960002770A - 폴리머와 금속 사이의 공유 영역 접착 방법 및 장치 - Google Patents

폴리머와 금속 사이의 공유 영역 접착 방법 및 장치 Download PDF

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KR960002770A
KR960002770A KR1019950014559A KR19950014559A KR960002770A KR 960002770 A KR960002770 A KR 960002770A KR 1019950014559 A KR1019950014559 A KR 1019950014559A KR 19950014559 A KR19950014559 A KR 19950014559A KR 960002770 A KR960002770 A KR 960002770A
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semiconductor
metal
leadframe
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가네산 산까라나라얀안
마틴 베지 하워드
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빈센트 비. 인그라시아
모토로라 인코포레이티드
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Publication of KR960002770A publication Critical patent/KR960002770A/ko

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Abstract

리드프레임(11)에 폴리머(17,19)의 접착을 개선하기 위한 리드프레임(11)과 방법에 관한 것이다. 리드프레임(11)은 상부 표면(15)과 하부 표면(18)을 가진 플래그(14)와, 리드(12)를 가진다. 미세 고정 기구(31)는 모래알형 재료로 플래그(14)를 충돌하므로서 플래그(14)의 상부 표면(15)과 하부 표면(18)내에 형성된다. 그러므로, 상부 및 하부 표면(15,18)은 거칠어진다. 반도체 다이(13)는 다이 부착 재료(17)에 의해 플러그(14)에 부착되고 반도체 다이(13)와 리드(12)의 일부분은 성형 화합물에 의해 포장된다. 피트(구멍)은 리드프레임(11)에 다이 부착 재료(17)와 성형 화합물(19)의 접착을 개선한다.

Description

폴리머와 금속 사이의 공유 영역 접착 방법 및 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예를 따라서 거칠게한 반도체 리드프레임에 장착된 반도체 다이의 단면도,
제2도는 제1도의 반도체 리드프레임의 일부분의 확대도.

Claims (5)

  1. 폴리머(17,19)와 금속 표면 또는 금속 합금 표면중 하나(15,18)사이의 공유영역 접착을 개선하기 위한 방법에 있어서, 금속 표면 또는 금속 합금 표면중 하나(15,18)을 제공하는 단계와, 상기 금속 표면 또는 금속 합금 표면중 하나(15,18)를 가스 운반 매체내에 현수된 모래알형 재료로 충돌시키는 단계와, 상기 금속 표면또는 금속 합금 표면중 하나(15,18)의 일부분을 성형 화합물(19)로 포장되는 단계를 포함하는 것을 특징으로 하는 공유영역 접착 방법.
  2. 제1항에 있어서, 상기 금속 표면 또는 합금 표면 중 하나(15,18)를 모래알형 재료로 충돌시키는 단계는 상기 금속 표면 또는 합금 표면중 하나(15,18)를 모래알형 재료로 타격하는 단계를 부가로 포함하는 것을 특징으로 하는 공유영역 접착 방법.
  3. 폴리머(17,19)와 반도체 리드프레임(11)사이의 공유영역 접착을 개선하기 위한 방법에 있어서, 상기 반도체 리드프레임(11)을 제공하는 단계와, 상기 반도체 리드프레임(11)의 일부분을 가스 매체를 통해 모래알형 재료를 사용하여 거칠게하는 단계와, 상기 반도체 리드프레임(11)에 적어도 하나의 반도체 다이(13)를 장착하는 단계와, 상기 적어도 하나의 반도체 다이(13)의 반도체 리드프레임(11)을 폴리머(19)내로 포장하는 단계를 포함하는 것을 특징으로 하는 공유영역 접착 방법.
  4. 제3항에 있어서, 상기 반도체 리드프레임(11)의 일부분을 거칠게하는 단계는 모래, 이산화실리콘, 산화알루미늄, 탄화실리콘과 중탄산염으로 구성된 그룹으로부터 선택된 모래알형 재료를 사용하여 반도체 리드프레임(11)의 일부분을 거칠게하는 단계를 부가로 포함하는 것을 특징으로 하는 공유영역 접착 방법.
  5. 일부분이 미세 고정 기구(31)와 적어도 1,500옹스트롬의 표면 조도를 가지는 제1표면(15)과 제2표면(18)을 가지는 반도체 리드프레임(11)과, 상기 제1표면(15)에 장착된 반도체 다이(13)와, 상기 반도체 다이(13)와 미세 고정 기구(31)를 가진 제1표면(15)을 포장하는 성형 화합물(19)을 포함하는 것을 특징으로 하는 반도체 패키지(10).
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950014559A 1994-06-06 1995-06-02 폴리머와 금속 사이의 공유 영역 접착 방법 및 장치 KR960002770A (ko)

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US08/254,842 US5554569A (en) 1994-06-06 1994-06-06 Method and apparatus for improving interfacial adhesion between a polymer and a metal
US254,842 1994-06-06

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KR960002770A true KR960002770A (ko) 1996-01-26

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