KR910003807A - 수직공핍 mos 트랜지스터와 제너다이오드로 구성되는 vdmos/논리집적회로 - Google Patents
수직공핍 mos 트랜지스터와 제너다이오드로 구성되는 vdmos/논리집적회로 Download PDFInfo
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- KR910003807A KR910003807A KR1019900010728A KR900010728A KR910003807A KR 910003807 A KR910003807 A KR 910003807A KR 1019900010728 A KR1019900010728 A KR 1019900010728A KR 900010728 A KR900010728 A KR 900010728A KR 910003807 A KR910003807 A KR 910003807A
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- Prior art keywords
- transistor
- region
- vdmos
- integrated circuit
- depletion
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- 108091006146 Channels Proteins 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 102000004129 N-Type Calcium Channels Human genes 0.000 claims 1
- 108090000699 N-Type Calcium Channels Proteins 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000009792 diffusion process Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000001465 metallisation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7827—Vertical transistors
- H01L29/7828—Vertical transistors without inversion channel, e.g. vertical ACCUFETs, normally-on vertical MISFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
- H01L27/0218—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L of field effect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/0883—Combination of depletion and enhancement field effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명에 따라 구성요소가 실현된 집적회로칩의 부분단면도,
제3도 및 제4도는 향상된 파워 트랜지스터와 부하의 종래의 연결모드를 보인 도면.
Claims (5)
- VDMOS트랜지스터(1) 형태의 파워요소와 공핍 가로 MOS트랜지스터(2) 및 향상된 가로 MOS트랜지스터(3)로 구성되는 논리요소를 포함하는 집적회로에 있어서, N/N+에피택셜 기판(10, 11)내에서, - 논리 트랜지스터가 형성되는 웰(12)에 해당하는 지역을 제공하는 제1P형 도핑단계와, - 저항접촉부(17, 18)의 설치를 가능케하는 높은 도핑레벨을 갖춘 2차 P형 도핑단계와, -공핍 MOS트랜지스터의 채널 영역(13)을 형성하는 3차 N형 도핑단계와, -VDMOS트랜지스터의 채널 영역에 해당하는 영역(30)을 형성하는 4차 P형 도핑단계와, - 저항 접촉부 (32-36)의 형성을 가능케 하는 높은 도핑레벨을 갖는 5차 N형 도핑단계와, - 에칭을 통해 여러 금속화 영역을 형성하는 단일금속층화단계로 구성되는 기술적이 공정을 통해 실현되며, 3차 도핑단계에서 얻어지는 N형 채널영역(62)과 1차 도핑단계에서 얻어지는 P웰(61)과 5차 도핑단계에서 얻어지는 N+소오스영역(64, 65)으로 이루어지고, 향상된 VDMOS트랜지스터(1)와 공통되는 드레인을 구비하는 N채널 공핍 VDMOS트랜지스터(60)을 추가로 구성함을 특징으로 하는 집적회로.
- 제1항에 있어서, 4차 도핑단계에서 얻어지는 P영역내에서 형성되고 5차 도핑단계에서 N+영역으로 구성되는 제너다이오드(70)를 또한 구성함을 특징으로 하는 집적회로.
- 제2항에 있어서, 제너다이오드의 P영역이 기판의 N형 에피택셜층내에 형성됨을 특징으로 하는 집적회로.
- 제2항에 있어서, 제너다이오드의 P영역이 2차 도핑단계에서 얻어지는 공핍 VDMOS트랜지스터용 웰을 형성하기 위해 연장되는 영역내에서 형성됨을 특징을 하는 집적회로.
- 수직확산 MOS(VDMOS) 트랜지스터(1) 형태의 파워요소와 공핍가로 MOS트랜지스터(2) 및 향상된 가로 MOS트랜지스터(3)의 논리요소를 포함하는 집적회로가 있어서, 향상된 VDMOS트랜지스터와 공통되는 드레인을 구비하는 공핍 VDMOS트랜지스터(60)와 음극이 VDMOS 트랜지스터의 소오스에 연결되고 양극은 상기 공핍 VDMOS트랜지스터의 게이트와 기판에 연결되는 제너다이오드를 직렬연결함으로써 얻어지는 내부전압기준을 추가로 구성함을 특징으로 하는 집적회로.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8909911A FR2649828B1 (fr) | 1989-07-17 | 1989-07-17 | Circuit integre vdmos/logique comprenant un transistor vertical deplete et une diode zener |
FR89/09911 | 1989-07-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR910003807A true KR910003807A (ko) | 1991-02-28 |
Family
ID=9384056
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900010728A KR910003807A (ko) | 1989-07-17 | 1990-07-14 | 수직공핍 mos 트랜지스터와 제너다이오드로 구성되는 vdmos/논리집적회로 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5045902A (ko) |
EP (1) | EP0409746B1 (ko) |
JP (1) | JPH0357267A (ko) |
KR (1) | KR910003807A (ko) |
DE (1) | DE69030791T2 (ko) |
FR (1) | FR2649828B1 (ko) |
Families Citing this family (32)
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US5223732A (en) * | 1991-05-28 | 1993-06-29 | Motorola, Inc. | Insulated gate semiconductor device with reduced based-to-source electrode short |
JP3111576B2 (ja) * | 1992-01-06 | 2000-11-27 | 富士電機株式会社 | 半導体装置 |
US5242841A (en) * | 1992-03-25 | 1993-09-07 | Texas Instruments Incorporated | Method of making LDMOS transistor with self-aligned source/backgate and photo-aligned gate |
FR2698486B1 (fr) * | 1992-11-24 | 1995-03-10 | Sgs Thomson Microelectronics | Structure de protection contre les surtensions directes pour composant semiconducteur vertical. |
EP0621636B1 (en) * | 1993-04-21 | 1999-07-14 | Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno | Integrated structure protection device for the protection of logic-level power MOS devices against electro static discharges |
JP3216743B2 (ja) * | 1993-04-22 | 2001-10-09 | 富士電機株式会社 | トランジスタ用保護ダイオード |
DE69327320T2 (de) * | 1993-09-30 | 2000-05-31 | Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania | Integrierte aktive Klammerungsstruktur für den Schutz von Leistungsanordnungen gegen Überspannungen, und Verfahren zu ihrer Herstellung |
JP3183020B2 (ja) * | 1994-03-17 | 2001-07-03 | 株式会社日立製作所 | 保護回路を内蔵した絶縁ゲート型半導体装置 |
FR2725307B1 (fr) * | 1994-09-30 | 1996-12-20 | Sgs Thomson Microelectronics | Composant semiconducteur d'alimentation, de recirculation et de demagnetisation d'une charge selfique |
JP2987328B2 (ja) * | 1995-06-02 | 1999-12-06 | シリコニックス・インコーポレイテッド | 双方向電流阻止機能を備えたトレンチ型パワーmosfet |
EP0765025A3 (de) * | 1995-09-21 | 1998-12-30 | Siemens Aktiengesellschaft | Anlaufschaltung und Halbleiterkörper für eine solche Anlaufschaltung |
US5629536A (en) * | 1995-11-21 | 1997-05-13 | Motorola, Inc. | High voltage current limiter and method for making |
US5578841A (en) * | 1995-12-18 | 1996-11-26 | Motorola, Inc. | Vertical MOSFET device having frontside and backside contacts |
JP3917211B2 (ja) * | 1996-04-15 | 2007-05-23 | 三菱電機株式会社 | 半導体装置 |
FR2751489B1 (fr) * | 1996-07-16 | 1998-10-16 | Sgs Thomson Microelectronics | Microdisjoncteur statique autoblocable |
US6096608A (en) * | 1997-06-30 | 2000-08-01 | Siliconix Incorporated | Bidirectional trench gated power mosfet with submerged body bus extending underneath gate trench |
US5911104A (en) * | 1998-02-20 | 1999-06-08 | Texas Instruments Incorporated | Integrated circuit combining high frequency bipolar and high power CMOS transistors |
US6133591A (en) * | 1998-07-24 | 2000-10-17 | Philips Electronics North America Corporation | Silicon-on-insulator (SOI) hybrid transistor device structure |
DE19935100B4 (de) * | 1999-07-27 | 2004-10-28 | Infineon Technologies Ag | Halbbrückenkonfiguration |
CN100339946C (zh) * | 2004-12-22 | 2007-09-26 | 中国电子科技集团公司第二十四研究所 | 小比导通电阻的集成化大电流功率器件结构的设计方法 |
DE102005046406B4 (de) * | 2005-09-28 | 2010-02-25 | Infineon Technologies Ag | Halbleiteranordnung mit einem elektrischen Verbraucher und einer Halbleitereinrichtung zur Steuerung der Stärke eines elektrischen Stroms |
US7479444B2 (en) * | 2006-06-01 | 2009-01-20 | Micrel, Inc. | Method for forming Schottky diodes and ohmic contacts in the same integrated circuit |
CN100466228C (zh) * | 2007-09-13 | 2009-03-04 | 无锡市晶源微电子有限公司 | 增强型和耗尽型垂直双扩散型场效应管单片集成制作工艺 |
US7638857B2 (en) * | 2008-05-07 | 2009-12-29 | United Microelectronics Corp. | Structure of silicon controlled rectifier |
CN102779759A (zh) * | 2012-07-31 | 2012-11-14 | 杭州士兰集成电路有限公司 | 耗尽型mosfet的制造方法 |
CN102760754B (zh) * | 2012-07-31 | 2015-07-15 | 杭州士兰集成电路有限公司 | 耗尽型vdmos及其制造方法 |
US9548294B2 (en) * | 2012-08-09 | 2017-01-17 | Fuji Electric Co., Ltd. | Semiconductor device with temperature-detecting diode |
CN105529262A (zh) * | 2014-09-29 | 2016-04-27 | 无锡华润华晶微电子有限公司 | 一种垂直双扩散金属氧化物半导体场效应管及其制作方法 |
CN104505390B (zh) * | 2015-01-08 | 2019-03-15 | 电子科技大学 | 集成式二极管链功率mos防静电保护结构 |
CN104538395B (zh) * | 2015-01-08 | 2019-01-25 | 电子科技大学 | 一种功率vdmos器件二极管并联式esd防护机构 |
CN111295763B (zh) * | 2017-11-13 | 2023-12-29 | 新电元工业株式会社 | 宽带隙半导体装置 |
TWI688192B (zh) * | 2018-11-06 | 2020-03-11 | 新唐科技股份有限公司 | 控制電路及其包含之半導體結構 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US4163988A (en) * | 1978-01-30 | 1979-08-07 | Xerox Corporation | Split gate V groove FET |
DE3108726A1 (de) * | 1981-03-07 | 1982-09-16 | Deutsche Itt Industries Gmbh, 7800 Freiburg | Monolithisch integrierte referenzspannungsquelle |
JPS5944862A (ja) * | 1982-09-07 | 1984-03-13 | Toshiba Corp | 半導体装置 |
JPS61182264A (ja) * | 1985-02-08 | 1986-08-14 | Nissan Motor Co Ltd | 縦型mosトランジスタ |
FR2596922B1 (fr) * | 1986-04-04 | 1988-05-20 | Thomson Csf | Resistance integree sur un substrat semi-conducteur |
JPH0685441B2 (ja) * | 1986-06-18 | 1994-10-26 | 日産自動車株式会社 | 半導体装置 |
GB2206993A (en) * | 1987-06-08 | 1989-01-18 | Philips Electronic Associated | A method of manufacturing a semiconductor device |
JPH01147854A (ja) * | 1987-12-04 | 1989-06-09 | Nissan Motor Co Ltd | 半導体装置 |
-
1989
- 1989-07-17 FR FR8909911A patent/FR2649828B1/fr not_active Expired - Lifetime
-
1990
- 1990-07-11 EP EP90420329A patent/EP0409746B1/fr not_active Expired - Lifetime
- 1990-07-11 DE DE69030791T patent/DE69030791T2/de not_active Expired - Fee Related
- 1990-07-14 KR KR1019900010728A patent/KR910003807A/ko not_active Application Discontinuation
- 1990-07-16 US US07/552,627 patent/US5045902A/en not_active Expired - Lifetime
- 1990-07-17 JP JP2187330A patent/JPH0357267A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0409746B1 (fr) | 1997-05-28 |
DE69030791T2 (de) | 1998-01-08 |
FR2649828B1 (fr) | 1991-10-31 |
DE69030791D1 (de) | 1997-07-03 |
EP0409746A1 (fr) | 1991-01-23 |
FR2649828A1 (fr) | 1991-01-18 |
US5045902A (en) | 1991-09-03 |
JPH0357267A (ja) | 1991-03-12 |
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