KR900006911B1 - 1-옥사-3-아자 테트랄린기를 함유하는 화합물과 시클로지방족 에폭시드로부터 유도된 중합성 수지로 되는 조성물 - Google Patents
1-옥사-3-아자 테트랄린기를 함유하는 화합물과 시클로지방족 에폭시드로부터 유도된 중합성 수지로 되는 조성물 Download PDFInfo
- Publication number
- KR900006911B1 KR900006911B1 KR1019850006735A KR850006735A KR900006911B1 KR 900006911 B1 KR900006911 B1 KR 900006911B1 KR 1019850006735 A KR1019850006735 A KR 1019850006735A KR 850006735 A KR850006735 A KR 850006735A KR 900006911 B1 KR900006911 B1 KR 900006911B1
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy
- composition
- group
- bis
- phenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 150000002118 epoxides Chemical class 0.000 title claims description 27
- 150000001875 compounds Chemical class 0.000 title claims description 26
- 239000002952 polymeric resin Substances 0.000 title description 4
- 229920003002 synthetic resin Polymers 0.000 title description 4
- 229940045720 antineoplastic alkylating drug epoxides Drugs 0.000 title 1
- 229920005989 resin Polymers 0.000 claims description 34
- 239000011347 resin Substances 0.000 claims description 34
- 239000000203 mixture Substances 0.000 claims description 33
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 30
- WTAVYBAEMMFITK-UHFFFAOYSA-N 3,4-dihydro-2h-1,3-benzoxazine Chemical group C1=CC=C2OCNCC2=C1 WTAVYBAEMMFITK-UHFFFAOYSA-N 0.000 claims description 28
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 24
- 125000001931 aliphatic group Chemical group 0.000 claims description 16
- 150000001412 amines Chemical class 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 150000002989 phenols Chemical class 0.000 claims description 12
- -1 (4-hydroxy-phenyl)- Chemical class 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 9
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N N-phenyl amine Natural products NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims description 9
- QKUSYGZVIAWWPY-UHFFFAOYSA-N 1,3-dioxane;7-oxabicyclo[4.1.0]heptane Chemical compound C1COCOC1.C1CCCC2OC21 QKUSYGZVIAWWPY-UHFFFAOYSA-N 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 claims description 4
- HMNKTRSOROOSPP-UHFFFAOYSA-N 3-Ethylphenol Chemical compound CCC1=CC=CC(O)=C1 HMNKTRSOROOSPP-UHFFFAOYSA-N 0.000 claims description 4
- VLJSLTNSFSOYQR-UHFFFAOYSA-N 3-propan-2-ylphenol Chemical compound CC(C)C1=CC=CC(O)=C1 VLJSLTNSFSOYQR-UHFFFAOYSA-N 0.000 claims description 4
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 claims description 4
- YQUQWHNMBPIWGK-UHFFFAOYSA-N 4-isopropylphenol Chemical compound CC(C)C1=CC=C(O)C=C1 YQUQWHNMBPIWGK-UHFFFAOYSA-N 0.000 claims description 4
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 claims description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 4
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 claims description 4
- LMMDJMWIHPEQSJ-UHFFFAOYSA-N bis[(3-methyl-7-oxabicyclo[4.1.0]heptan-4-yl)methyl] hexanedioate Chemical compound C1C2OC2CC(C)C1COC(=O)CCCCC(=O)OCC1CC2OC2CC1C LMMDJMWIHPEQSJ-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 4
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims description 4
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 claims description 4
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 3
- GRWFFFOEIHGUBG-UHFFFAOYSA-N 3,4-Epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclo-hexanecarboxylate Chemical compound C1C2OC2CC(C)C1C(=O)OCC1CC2OC2CC1C GRWFFFOEIHGUBG-UHFFFAOYSA-N 0.000 claims description 3
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 3
- 239000007795 chemical reaction product Substances 0.000 claims description 3
- 229920003986 novolac Polymers 0.000 claims description 3
- 239000001294 propane Substances 0.000 claims description 3
- XLAIWHIOIFKLEO-UHFFFAOYSA-N (E)-4-<2-(4-hydroxyphenyl)ethenyl>phenol Natural products C1=CC(O)=CC=C1C=CC1=CC=C(O)C=C1 XLAIWHIOIFKLEO-UHFFFAOYSA-N 0.000 claims description 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 claims description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 2
- FYDMBFIJIQPURU-UHFFFAOYSA-N 2-[2-(2-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=CC=C(N)C=1C(C)(C)C1=CC=CC=C1N FYDMBFIJIQPURU-UHFFFAOYSA-N 0.000 claims description 2
- DXADWKPCWTXPOY-UHFFFAOYSA-N 3-[(3-hydroxyphenyl)methyl]phenol Chemical compound OC1=CC=CC(CC=2C=C(O)C=CC=2)=C1 DXADWKPCWTXPOY-UHFFFAOYSA-N 0.000 claims description 2
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 claims description 2
- ASHGTJPOSUFTGB-UHFFFAOYSA-N 3-methoxyphenol Chemical compound COC1=CC=CC(O)=C1 ASHGTJPOSUFTGB-UHFFFAOYSA-N 0.000 claims description 2
- HVMHLMJYHBAOPL-UHFFFAOYSA-N 4-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)propan-2-yl]-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1C(C)(C)C1CC2OC2CC1 HVMHLMJYHBAOPL-UHFFFAOYSA-N 0.000 claims description 2
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 claims description 2
- QEYQMWSESURNPP-UHFFFAOYSA-N 4-propan-2-yloxyphenol Chemical compound CC(C)OC1=CC=C(O)C=C1 QEYQMWSESURNPP-UHFFFAOYSA-N 0.000 claims description 2
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 claims description 2
- ADAHGVUHKDNLEB-UHFFFAOYSA-N Bis(2,3-epoxycyclopentyl)ether Chemical compound C1CC2OC2C1OC1CCC2OC21 ADAHGVUHKDNLEB-UHFFFAOYSA-N 0.000 claims description 2
- 239000007983 Tris buffer Substances 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 claims description 2
- WRUOQYMMDKPTCY-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) benzene-1,4-dicarboxylate Chemical compound C1CC2OC2CC1COC(=O)C(C=C1)=CC=C1C(=O)OCC1CC2OC2CC1 WRUOQYMMDKPTCY-UHFFFAOYSA-N 0.000 claims description 2
- SSNKDSAZVVJGHJ-UHFFFAOYSA-N bis[(3-methyl-7-oxabicyclo[4.1.0]heptan-4-yl)methyl] benzene-1,4-dicarboxylate Chemical compound C1C2OC2CC(C)C1COC(=O)C(C=C1)=CC=C1C(=O)OCC1CC2OC2CC1C SSNKDSAZVVJGHJ-UHFFFAOYSA-N 0.000 claims description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 claims description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 2
- 229960001755 resorcinol Drugs 0.000 claims description 2
- XLAIWHIOIFKLEO-OWOJBTEDSA-N trans-stilbene-4,4'-diol Chemical compound C1=CC(O)=CC=C1\C=C\C1=CC=C(O)C=C1 XLAIWHIOIFKLEO-OWOJBTEDSA-N 0.000 claims description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims 2
- LKVFCSWBKOVHAH-UHFFFAOYSA-N 4-Ethoxyphenol Chemical compound CCOC1=CC=C(O)C=C1 LKVFCSWBKOVHAH-UHFFFAOYSA-N 0.000 claims 1
- BSIYUNUWMVMQGM-UHFFFAOYSA-N CC1CC2C(O2)CC1COC(=O)C3CCCCC3 Chemical compound CC1CC2C(O2)CC1COC(=O)C3CCCCC3 BSIYUNUWMVMQGM-UHFFFAOYSA-N 0.000 claims 1
- 125000002490 anilino group Chemical group [H]N(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims 1
- IUYXBMLZOKLWOY-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CC2OC2CC1COC(=O)C1CCCCC1C(=O)OCC1CC2OC2CC1 IUYXBMLZOKLWOY-UHFFFAOYSA-N 0.000 claims 1
- 125000001142 dicarboxylic acid group Chemical group 0.000 claims 1
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 description 12
- 239000000047 product Substances 0.000 description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000011541 reaction mixture Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- DIKBFYAXUHHXCS-UHFFFAOYSA-N bromoform Chemical compound BrC(Br)Br DIKBFYAXUHHXCS-UHFFFAOYSA-N 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- OKJPEAGHQZHRQV-UHFFFAOYSA-N iodoform Chemical compound IC(I)I OKJPEAGHQZHRQV-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 150000003141 primary amines Chemical class 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- MOEFFSWKSMRFRQ-UHFFFAOYSA-N 2-ethoxyphenol Chemical compound CCOC1=CC=CC=C1O MOEFFSWKSMRFRQ-UHFFFAOYSA-N 0.000 description 1
- KLSLBUSXWBJMEC-UHFFFAOYSA-N 4-Propylphenol Chemical compound CCCC1=CC=C(O)C=C1 KLSLBUSXWBJMEC-UHFFFAOYSA-N 0.000 description 1
- SDUZNEIVCAVWSH-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptane-3,4-dicarboxylic acid Chemical compound C1C(C(O)=O)C(C(=O)O)CC2OC21 SDUZNEIVCAVWSH-UHFFFAOYSA-N 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005727 Friedel-Crafts reaction Methods 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical class [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241000428199 Mustelinae Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 150000001502 aryl halides Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- KCXMKQUNVWSEMD-UHFFFAOYSA-N benzyl chloride Chemical compound ClCC1=CC=CC=C1 KCXMKQUNVWSEMD-UHFFFAOYSA-N 0.000 description 1
- 229940073608 benzyl chloride Drugs 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- ONEGPAXCXUHWGX-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) 7-oxabicyclo[4.1.0]heptane-3,4-dicarboxylate Chemical compound C1CC2OC2CC1COC(=O)C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 ONEGPAXCXUHWGX-UHFFFAOYSA-N 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229950005228 bromoform Drugs 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000012772 electrical insulation material Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 150000002431 hydrogen Chemical group 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- SNHMUERNLJLMHN-UHFFFAOYSA-N iodobenzene Chemical compound IC1=CC=CC=C1 SNHMUERNLJLMHN-UHFFFAOYSA-N 0.000 description 1
- INQOMBQAUSQDDS-UHFFFAOYSA-N iodomethane Chemical compound IC INQOMBQAUSQDDS-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- JZMJDSHXVKJFKW-UHFFFAOYSA-M methyl sulfate(1-) Chemical compound COS([O-])(=O)=O JZMJDSHXVKJFKW-UHFFFAOYSA-M 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- JXBYOCZNGOKONE-UHFFFAOYSA-N oxiran-2-ylmethyl(propyl)silane Chemical compound CCC[SiH2]CC1CO1 JXBYOCZNGOKONE-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002990 reinforced plastic Substances 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D265/00—Heterocyclic compounds containing six-membered rings having one nitrogen atom and one oxygen atom as the only ring hetero atoms
- C07D265/04—1,3-Oxazines; Hydrogenated 1,3-oxazines
- C07D265/12—1,3-Oxazines; Hydrogenated 1,3-oxazines condensed with carbocyclic rings or ring systems
- C07D265/14—1,3-Oxazines; Hydrogenated 1,3-oxazines condensed with carbocyclic rings or ring systems condensed with one six-membered ring
- C07D265/16—1,3-Oxazines; Hydrogenated 1,3-oxazines condensed with carbocyclic rings or ring systems condensed with one six-membered ring with only hydrogen or carbon atoms directly attached in positions 2 and 4
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C1/00—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds
- B22C1/16—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents
- B22C1/20—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C1/00—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds
- B22C1/16—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents
- B22C1/20—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents
- B22C1/22—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins
- B22C1/2233—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- B22C1/226—Polyepoxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
- C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
- C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
- C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Epoxy Resins (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polyamides (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Nitrogen Condensed Heterocyclic Rings (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Developing Agents For Electrophotography (AREA)
- Dental Preparations (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Epoxy Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3433851A DE3433851C2 (de) | 1984-09-14 | 1984-09-14 | Chemisch härtbare Harze aus 1-Oxa-3-aza-tetralin-Gruppen enthaltenden Verbindungen und cycloaliphatischen Epoxid-harzen, Verfahren zu deren Herstellung sowie Verwendung solcher Harze |
| DEP3433851.9 | 1984-09-14 | ||
| CN85107439.1A CN1005719B (zh) | 1984-09-14 | 1985-10-09 | 耐热聚合物树脂的组合物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR860002537A KR860002537A (ko) | 1986-04-26 |
| KR900006911B1 true KR900006911B1 (ko) | 1990-09-24 |
Family
ID=25742095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019850006735A Expired KR900006911B1 (ko) | 1984-09-14 | 1985-09-14 | 1-옥사-3-아자 테트랄린기를 함유하는 화합물과 시클로지방족 에폭시드로부터 유도된 중합성 수지로 되는 조성물 |
Country Status (24)
Families Citing this family (85)
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|---|---|---|---|---|
| ATE135724T1 (de) * | 1988-07-18 | 1996-04-15 | Gurit Essex Ag | Zu schwerentflammbaren und hochtemperaturbeständigen kunststoffen härtbare harze und verfahren zu deren herstellung |
| DE3934940A1 (de) * | 1989-10-20 | 1991-04-25 | Gvt Giesserei Verfahrenstechni | Bindemittel zum abbinden von giessereisand |
| US5051209A (en) * | 1990-04-27 | 1991-09-24 | E. I. Du Pont De Nemours And Company | Conductive epoxypolyamide coating composition |
| DE4016296C1 (en) * | 1990-05-21 | 1991-09-05 | Gurit-Essex Ag, Freienbach, Ch | Flame retardant thermosetting adhesive for metals etc. - comprises oxa:aza:tetralin, halogenated epoxy] resins and opt. additives |
| US5443911A (en) * | 1990-05-21 | 1995-08-22 | Gurit-Essex Ag | Curable resins comprising halogenated epoxy resins and 1-oxa-3-aza tetraline compounds, method for preparing and use of resins |
| DE4016548C1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1990-05-23 | 1991-09-12 | Gurit-Essex Ag, Freienbach, Ch | |
| EP0493310A1 (de) * | 1990-12-21 | 1992-07-01 | Gurit-Essex AG | Zu schwerentflammbaren Kunststoffen härtbare Harzmischungen und deren Verwendung |
| US5152939A (en) * | 1991-03-12 | 1992-10-06 | Edison Polymer Innovation Corp. | Composite densification with benzoxazines |
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| US6005064A (en) * | 1993-12-27 | 1999-12-21 | Hitachi Chemical Company, Ltd. | Thermosetting compounds, cured product thereof and method of preparing the thermosetting compound |
| JP3513558B2 (ja) * | 1994-12-28 | 2004-03-31 | 日立化成工業株式会社 | 熱硬化性樹脂、その製造法及びこの樹脂を硬化して得られる硬化物 |
| JP3543866B2 (ja) * | 1995-02-28 | 2004-07-21 | 日立化成工業株式会社 | 摩擦材及びその製造方法 |
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| US7216691B2 (en) * | 2002-07-09 | 2007-05-15 | Alotech Ltd. Llc | Mold-removal casting method and apparatus |
| KR20070052361A (ko) | 2002-07-11 | 2007-05-21 | 콘솔리데이티드 엔지니어링 캄파니, 인크. | 주조품으로부터 샌드 주형의 제거를 보조하기 위한 방법 |
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| US7121318B2 (en) | 2002-09-20 | 2006-10-17 | Alotech Ltd. Llc | Lost pattern mold removal casting method and apparatus |
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| JP2005113043A (ja) * | 2003-10-09 | 2005-04-28 | Konica Minolta Medical & Graphic Inc | 活性光線硬化型インク組成物、画像形成方法及びインクジェット記録装置 |
| JP2005120201A (ja) * | 2003-10-16 | 2005-05-12 | Konica Minolta Medical & Graphic Inc | 活性光線硬化型インクジェットインク組成物とそれを用いた画像形成方法及びインクジェット記録装置 |
| JP2004156045A (ja) * | 2003-12-22 | 2004-06-03 | Hitachi Chem Co Ltd | 摩擦材 |
| DE102004046744B4 (de) | 2004-09-27 | 2007-05-24 | Atotech Deutschland Gmbh | Verfahren zur Übertragung von Pulvern und Pulverlacken auf Substrate und Verwendung zur Herstellung von Leiterplatten und Solarzellen |
| DE102004046745B4 (de) * | 2004-09-27 | 2008-04-24 | Atotech Deutschland Gmbh | Verfahren zur lösungsmittelfreien Herstellung einer faserverstärkten, mit Harz beschichteten Folie und Verwendung derselben |
| US7666938B2 (en) * | 2004-12-03 | 2010-02-23 | Henkel Corporation | Nanoparticle silica filled benzoxazine compositions |
| US8029889B1 (en) | 2004-12-03 | 2011-10-04 | Henkel Corporation | Prepregs, towpregs and preforms |
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| US20100151253A1 (en) * | 2005-07-08 | 2010-06-17 | Henkel Kgaa | Primer Compositions for Adhesive Bonding Systems |
| KR100646939B1 (ko) * | 2005-08-29 | 2006-11-23 | 삼성에스디아이 주식회사 | 박막트랜지스터 및 그 제조방법 |
| CN100369949C (zh) * | 2006-03-06 | 2008-02-20 | 哈尔滨工业大学 | 耐高温4,5-环氧环己烷-1,2-二甲酸二缩水甘油酯环氧树脂体系及其制备方法 |
| DE102006017891A1 (de) * | 2006-04-13 | 2007-10-25 | Hexion Specialty Chemicals Gmbh | Harzdispersion |
| US7759435B2 (en) * | 2006-09-26 | 2010-07-20 | Loctite (R&D) Limited | Adducts and curable compositions using same |
| KR101433982B1 (ko) * | 2006-10-25 | 2014-08-25 | 헨켈 아일랜드 리미티드 | 이미늄염 및 이러한 신규 이미늄염을 사용하는 전자 결핍 올레핀의 제조 방법 |
| WO2008060545A1 (en) | 2006-11-13 | 2008-05-22 | Henkel Corporation | Benzoxazine compositions with core shell rubbers |
| CN101589127B (zh) * | 2006-11-21 | 2012-10-10 | 汉高公司 | 用于预先加工的增韧粘合剂组合物 |
| US7537827B1 (en) | 2006-12-13 | 2009-05-26 | Henkel Corporation | Prepreg laminates |
| EP2167478A4 (en) * | 2007-06-18 | 2011-07-27 | Henkel Corp | Benzoxazine containing compositions of matter and curable compositions made therewith |
| DE102007029531A1 (de) * | 2007-06-25 | 2009-01-08 | Hexion Specialty Chemicals Gmbh | Harzdispersion |
| CN101889048B (zh) * | 2007-12-06 | 2012-09-05 | 汉高两合股份公司 | 基于苯并噁嗪的可固化组合物、它们的制备及其固化产物 |
| BRPI0820687B1 (pt) * | 2007-12-06 | 2019-11-26 | Henkel Ag & Co Kgaa | composições curáveis, adesivas, selantes ou de revestimento contendo enrijecedores baseados em isocianato |
| EP2070984A1 (en) * | 2007-12-12 | 2009-06-17 | Hexion Specialty Chemicals Research Belgium S.A. | Epoxy-phenolic resins co-dispersions |
| US7847034B2 (en) * | 2008-03-20 | 2010-12-07 | Loctite (R&D) Limited | Adducts and curable compositions using same |
| DE102008023076A1 (de) | 2008-05-09 | 2009-11-12 | Henkel Ag & Co. Kgaa | Polymerisierbare Zusammensetzung |
| DE102008031555A1 (de) | 2008-07-07 | 2010-01-14 | Henkel Ag & Co. Kgaa | Polymerisierbare Zusammensetzung enthaltend anorganische Partikel mit organischer Hülle |
| DE102008032176A1 (de) | 2008-07-09 | 2010-01-14 | Henkel Ag & Co. Kgaa | Polymerisierbare Zusammensetzung |
| WO2010018198A1 (en) * | 2008-08-14 | 2010-02-18 | Henkel Ag & Co. Kgaa | Polymerizable benzoxazine compositions |
| PL2370219T3 (pl) | 2008-11-21 | 2015-03-31 | Henkel US IP LLC | Powlekane ulegającym rozkładowi termicznemu polimerem proszki metali |
| DE102009003032A1 (de) | 2009-05-12 | 2010-11-18 | Henkel Ag & Co. Kgaa | Kationische Benzoxazin(co)polymere |
| DE102009003033B4 (de) | 2009-05-12 | 2013-02-21 | Henkel Ag & Co. Kgaa | Polymerisierbare Benzoxazin-Verbindungen mit grenzflächenaktiven bzw. oberflächenaktiven Eigenschaften |
| TWI540159B (zh) * | 2009-05-14 | 2016-07-01 | 漢士門先進材料美國責任有限公司 | 以液態單苯并為主之樹脂系統 |
| DE102009028099A1 (de) | 2009-07-29 | 2011-02-03 | Henkel Ag & Co. Kgaa | Schlagzähmodifizierte Zusammensetzungen |
| KR101626454B1 (ko) | 2009-10-15 | 2016-06-01 | 헨켈 아이피 앤드 홀딩 게엠베하 | 혐기 경화성 조성물 |
| EP2314579A1 (en) | 2009-10-22 | 2011-04-27 | Henkel AG & Co. KGaA | Fast-curing benzoxazine compounds |
| KR20120099020A (ko) | 2009-10-22 | 2012-09-06 | 헨켈 아게 운트 코. 카게아아 | 벤족사진 화합물 및 가열-활성 촉매로서 고리 구조를 갖는 술폰산 에스테르를 포함하는 경화성 조성물 |
| KR20120099024A (ko) | 2009-10-27 | 2012-09-06 | 헨켈 아게 운트 코. 카게아아 | 벤족사진-함유 조성물 |
| WO2011130188A2 (en) | 2010-04-13 | 2011-10-20 | Henkel Corporation | Curable compositions, processes for using such compositions to prepare composites and processes for preparing composites having superior surface finish and high fiber consolidation |
| US9682447B2 (en) | 2010-08-20 | 2017-06-20 | Henkel IP & Holding GmbH | Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes |
| EP2431438B1 (en) | 2010-09-20 | 2012-11-28 | Henkel AG & Co. KGaA | Electrically conductive adhesives |
| EP2336221A1 (en) | 2010-12-10 | 2011-06-22 | Henkel AG & Co. KGaA | Curable compositions |
| GB201101302D0 (en) | 2011-01-25 | 2011-03-09 | Cytec Tech Corp | Benzoxazine resins |
| EP2487215B1 (en) | 2011-02-11 | 2013-07-24 | Henkel AG & Co. KGaA | Electrically conductive adhesives comprising at least one metal precursor |
| TWI454528B (zh) * | 2011-05-04 | 2014-10-01 | Taiwan Union Technology Corp | 樹脂組合物及由其製成之半固化片與印刷電路板 |
| CN102775728B (zh) * | 2011-05-11 | 2016-01-20 | 台燿科技股份有限公司 | 树脂组合物及由其制成的半固化片与印刷电路板 |
| JP6050364B2 (ja) | 2011-09-06 | 2016-12-21 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | はんだペースト用の二官能性または多官能性電子不足オレフィン被覆金属粉末 |
| AU2013219821B2 (en) | 2012-02-17 | 2017-05-04 | Huntsman Advanced Materials Americas Llc | Mixture of benzoxazine, epoxy and anhydride |
| DE102012215510A1 (de) | 2012-08-31 | 2014-05-28 | Henkel Ag & Co. Kgaa | Flammgeschützte Benzoxazin-haltige Zusammensetzung |
| WO2015047605A1 (en) | 2013-09-24 | 2015-04-02 | Henkel IP & Holding GmbH | Pyrolized organic layers and conductive prepregs made therewith |
| CN106574164A (zh) | 2014-08-29 | 2017-04-19 | 古河电气工业株式会社 | 导电性接合剂组合物 |
| CA2960646A1 (en) | 2014-09-12 | 2016-03-17 | Henkel IP & Holding GmbH | Cationically curable benzoxazine compositions |
| AU2016226110B2 (en) | 2015-03-04 | 2020-04-02 | Huntsman Advanced Materials Americas Llc | Benzoxazine low temperature curable composition |
| AU2016296886B2 (en) | 2015-07-23 | 2020-04-30 | Huntsman Advanced Materials Americas Llc | Curable benzoxazine compositions |
| CN109646859A (zh) | 2017-10-10 | 2019-04-19 | 宁波水星环保科技有限公司 | 一种植物型活性阻燃灭火剂及其制备方法和应用 |
| WO2020169785A1 (en) | 2019-02-22 | 2020-08-27 | Universitat Autonoma De Barcelona | Process for polymerizing 1,3-benzoxazines |
| JP7613459B2 (ja) | 2019-10-02 | 2025-01-15 | 東レ株式会社 | ベンゾオキサジン樹脂組成物、プリプレグ、及び繊維強化複合材料 |
| US20240043636A1 (en) | 2020-12-04 | 2024-02-08 | Toray Composite Materials America, Inc. | Prepreg and carbon fiber-reinforced composite material |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2137942A1 (de) * | 1971-07-29 | 1973-02-08 | Basf Ag | Polyaether |
| US3749683A (en) * | 1972-01-24 | 1973-07-31 | Dow Chemical Co | Bi-2-oxazoline and oxazine ethers and thioethers |
| GB1437814A (en) * | 1972-05-09 | 1976-06-03 | Sued West Chemie Gmbh | Polymerisable and or hardenable products |
| CH579113A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1972-05-09 | 1976-08-31 | Micafil Ag | |
| CH606169A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1975-04-22 | 1978-10-31 | Herbert Schreiber | |
| JPS608246B2 (ja) * | 1980-11-03 | 1985-03-01 | ユニオン・カ−バイド・コ−ポレ−シヨン | 硬化し得るエポキシ樹脂含有組成物 |
| EP0066447A1 (en) * | 1981-05-25 | 1982-12-08 | Mitsubishi Gas Chemical Company, Inc. | Reaction of a phenol, aldehyde and amine to produce hardening agent for epoxy resins |
| US4383102A (en) * | 1982-01-29 | 1983-05-10 | Texaco Inc. | Method for producing a low viscosity spray polyol by reacting an alkylene oxide with the reaction product of a phenol, an amine and a smaller formaldehyde portion |
-
1984
- 1984-09-14 DE DE3433851A patent/DE3433851C2/de not_active Expired
-
1985
- 1985-08-12 DE DE8585110081T patent/DE3561397D1/de not_active Expired
- 1985-08-12 AT AT85110081T patent/ATE31935T1/de not_active IP Right Cessation
- 1985-08-12 EP EP85110081A patent/EP0178414B1/de not_active Expired
- 1985-09-02 YU YU01374/85A patent/YU137485A/xx unknown
- 1985-09-04 GR GR852139A patent/GR852139B/el unknown
- 1985-09-10 PT PT81104A patent/PT81104B/pt not_active IP Right Cessation
- 1985-09-10 US US06/774,433 patent/US4607091A/en not_active Ceased
- 1985-09-12 IN IN750/DEL/85A patent/IN169130B/en unknown
- 1985-09-12 DD DD85280567A patent/DD240210A5/de not_active IP Right Cessation
- 1985-09-12 CS CS856508A patent/CS266333B2/cs unknown
- 1985-09-13 CA CA000490729A patent/CA1233597A/en not_active Expired
- 1985-09-13 TR TR38024A patent/TR22297A/xx unknown
- 1985-09-13 ZA ZA857043A patent/ZA857043B/xx unknown
- 1985-09-13 JP JP60203238A patent/JPS6178824A/ja active Granted
- 1985-09-13 HU HU853468A patent/HUT39755A/hu unknown
- 1985-09-13 BR BR8504463A patent/BR8504463A/pt unknown
- 1985-09-13 ES ES546944A patent/ES8700297A1/es not_active Expired
- 1985-09-13 IL IL76383A patent/IL76383A/xx unknown
- 1985-09-13 DK DK417385A patent/DK417385A/da not_active Application Discontinuation
- 1985-09-13 AU AU47450/85A patent/AU564441B2/en not_active Ceased
- 1985-09-14 KR KR1019850006735A patent/KR900006911B1/ko not_active Expired
- 1985-09-16 PH PH32789A patent/PH20728A/en unknown
- 1985-10-09 CN CN85107439.1A patent/CN1005719B/zh not_active Expired
-
1987
- 1987-03-03 US US07/021,151 patent/USRE32745E/en not_active Expired - Lifetime
-
1988
- 1988-07-21 HK HK544/88A patent/HK54488A/xx not_active IP Right Cessation
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