KR900003848B1 - 인쇄 회로 기판의 제조방법 - Google Patents

인쇄 회로 기판의 제조방법 Download PDF

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Publication number
KR900003848B1
KR900003848B1 KR1019870007457A KR870007457A KR900003848B1 KR 900003848 B1 KR900003848 B1 KR 900003848B1 KR 1019870007457 A KR1019870007457 A KR 1019870007457A KR 870007457 A KR870007457 A KR 870007457A KR 900003848 B1 KR900003848 B1 KR 900003848B1
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KR
South Korea
Prior art keywords
substrate
resin composition
photosensitive resin
copper
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019870007457A
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English (en)
Korean (ko)
Other versions
KR880002416A (ko
Inventor
도시아끼 이시마루
노부유끼 하야시
하루오 아까호시
간지 무라까미
모또요 와지마
Original Assignee
히따찌 가세이 고오교 가부시끼가이샤
요꼬야마 료오지
가부시끼가이샤 히따찌 세이사꾸쇼
미따 가쯔시게
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Publication date
Application filed by 히따찌 가세이 고오교 가부시끼가이샤, 요꼬야마 료오지, 가부시끼가이샤 히따찌 세이사꾸쇼, 미따 가쯔시게 filed Critical 히따찌 가세이 고오교 가부시끼가이샤
Publication of KR880002416A publication Critical patent/KR880002416A/ko
Application granted granted Critical
Publication of KR900003848B1 publication Critical patent/KR900003848B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
KR1019870007457A 1986-07-11 1987-07-10 인쇄 회로 기판의 제조방법 Expired KR900003848B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP163097 1986-07-11
JP86-163097 1986-07-11
JP61163097A JPS6318692A (ja) 1986-07-11 1986-07-11 印刷配線板の製造方法

Publications (2)

Publication Number Publication Date
KR880002416A KR880002416A (ko) 1988-04-30
KR900003848B1 true KR900003848B1 (ko) 1990-06-02

Family

ID=15767122

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870007457A Expired KR900003848B1 (ko) 1986-07-11 1987-07-10 인쇄 회로 기판의 제조방법

Country Status (4)

Country Link
JP (1) JPS6318692A (enrdf_load_stackoverflow)
KR (1) KR900003848B1 (enrdf_load_stackoverflow)
DE (1) DE3722749C2 (enrdf_load_stackoverflow)
GB (1) GB2193730B (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5004672A (en) * 1989-07-10 1991-04-02 Shipley Company Inc. Electrophoretic method for applying photoresist to three dimensional circuit board substrate
CA2079417C (en) 1991-10-28 2003-01-07 Lilip Lau Expandable stents and method of making same
US5352326A (en) * 1993-05-28 1994-10-04 International Business Machines Corporation Process for manufacturing metalized ceramic substrates
TW290583B (enrdf_load_stackoverflow) * 1993-10-14 1996-11-11 Alpha Metals Ltd
JP4126793B2 (ja) * 1998-10-09 2008-07-30 チッソ株式会社 カラーフィルター用樹脂組成物
JP4715234B2 (ja) * 2005-02-28 2011-07-06 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法並びに光硬化物の除去方法
DE102020215812A1 (de) 2020-12-14 2022-06-15 Robert Bosch Gesellschaft mit beschränkter Haftung Leistungsmodul

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1548401A (enrdf_load_stackoverflow) * 1967-08-16 1968-12-06
GB1414453A (en) * 1971-09-03 1975-11-19 Ici Ltd Recording material
DE2406400B2 (de) * 1973-02-14 1977-04-28 Hitachi Chemical Co., Ltd., Tokio Lichtempfindliche harzzusammensetzungen auf der basis von verbindungen mit epoxy- bzw. photopolymerisierbaren acrylgruppen
US4089686A (en) * 1976-04-19 1978-05-16 Western Electric Company, Inc. Method of depositing a metal on a surface
JPS5619752A (en) * 1979-07-27 1981-02-24 Hitachi Chemical Co Ltd Photosensitive resin composition laminate
US4394434A (en) * 1980-12-08 1983-07-19 Minnesota Mining And Manufacturing Company Plating resist with improved resistance to extraneous plating
US4454219A (en) * 1981-04-27 1984-06-12 Hitachi Chemical Company, Ltd. Photosensitive resin composition comprised of a polymer obtained from an aliphatic amino group-containing monomer as a comonomer
US4411980A (en) * 1981-09-21 1983-10-25 E. I. Du Pont De Nemours And Company Process for the preparation of flexible circuits
JPS5888741A (ja) * 1981-11-20 1983-05-26 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性樹脂組成物積層体
US4448804A (en) * 1983-10-11 1984-05-15 International Business Machines Corporation Method for selective electroless plating of copper onto a non-conductive substrate surface
GB2150596A (en) * 1983-11-30 1985-07-03 Pa Consulting Services Mesh structures especially for use in television camera tubes
JPH0642073B2 (ja) * 1984-04-10 1994-06-01 三菱レイヨン株式会社 光重合性樹脂組成物
JPH0731399B2 (ja) * 1984-12-21 1995-04-10 三菱化学株式会社 光重合性組成物

Also Published As

Publication number Publication date
JPH0344432B2 (enrdf_load_stackoverflow) 1991-07-05
GB2193730B (en) 1991-04-03
DE3722749C2 (de) 1994-09-15
KR880002416A (ko) 1988-04-30
GB8715744D0 (en) 1987-08-12
GB2193730A (en) 1988-02-17
DE3722749A1 (de) 1988-01-21
JPS6318692A (ja) 1988-01-26

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