KR880008427A - 표면 연삭기 - Google Patents
표면 연삭기 Download PDFInfo
- Publication number
- KR880008427A KR880008427A KR870013953A KR870013953A KR880008427A KR 880008427 A KR880008427 A KR 880008427A KR 870013953 A KR870013953 A KR 870013953A KR 870013953 A KR870013953 A KR 870013953A KR 880008427 A KR880008427 A KR 880008427A
- Authority
- KR
- South Korea
- Prior art keywords
- grinding machine
- wheel
- surface grinding
- machine according
- abrasive grain
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 표면 연삭기의 구조를 나타내는 다이어그램.
제2도는 표면 연삭기의 휘일 및 웨이퍼를 나타내는 평면도.
제3도는 표면 연삭기의 인덱스 테이블을 나타내는 평면도.
Claims (12)
- 표면 연삭기에 있어서, 수직방향에서 이동 가능하게 지탱된 적어도 하나의 휘일 헤드와, 휘일 헤드의 한 단부에서 회전식 휘일 축에 의해 지탱되며 하단부에서 연마 입자층을 가지는 적어도 하나의 컵형 다이아몬드 휘일과, 휘일 헤드의 다른 단부에서 지탱되며 컵형 다이아몬드 휘일을 회전시키는 적어도 하나의 휘일축 구동 모터와, 휘일 헤드를 수직이동하느 적어도 하나의 서보 모터와, 소자가 표면에 조립되어 있는 Ⅲ-Ⅴ족 혼합물 반도체 웨이퍼의 표면을 고정시키는 적어도 하나의 척 테이블과, 상기 척 테이블을 회전 가능하게 지탱하는 인덱스 테이블과, 척 테이블을 회전시키기 위한 척 테이블 구동 모터와, 휘일 축 구동 모터의 전류값을 감지하기 위한 주축 모터 전류값 분석회로와, 휘일 축 구동 모터의 회전수를 감지하기 위한 주축 회전수 분석회로와, 전류값 및 회전수로부터 연삭저항을 얻어서 연삭저항이 소정의 저항값보다 클 때 서보 모터가 아래로 이동하는 속도와 일치하도록 이송속도를 감소시키고 연삭저항이 소정의 저항값보다 작을 때는 이송속도를 증가시키는 방식으로 서보 모터를 제어하기 위한 이송속도 제어회로를 구비하는 것을 특징으로 하는 표면 연삭기.
- 제1항에 있어서, 연마 입자층의 중심은 연마 입자층을 편심적으로 회전시키기 위하여 휘일 축의 회전중심에서 벗어나 있는 것을 특징으로 하는 표면 연삭기.
- 제1항에 있어서, 인덱스 테이블에는 맞춤과 거친가공과 다듬질 가공 및 제거단계에서 사용하기 위해 4개의 척 테이블의 제공되고 각각의 단계에서 1/4회전만큼 회전되고, 그리고 표면 연삭기는 2개의 휘일 헤드와, 2개의 컵형 다이아몬드 휘일과, 2개의 휘일 구동 몽터 및 2개의 서보 모터를 구비하고, 휘일 헤드와 다이아몬드 휘일과 구동 모터와 서보 모터의 한 세트는 거친가공 단계에서 사용되고 다른 세트는 다듬질 가공단계에서 사용되는 것을 특징으로 하는 표면 연삭기.
- 제3항에 있어서, 거친가공 단계는 전체적으로 연삭하기 위해 웨이퍼의 대부분에 적용되고, 다듬질가공단계는 약 10㎛ 두께의 나머지 부분에 적용되는 것을 특징으로 하는 표면 연삭기.
- 제4항에 있어서, 다듬질 가공단계에서 이송속도의 기준값은 약 1㎛/분인 것을 특징으로 하는 표면연삭기.
- 제5항에 있어서, 다듬질 가공단계에서 이송속도는 0 내지 2㎛/분의 범위내에서 요동하도록 제한받는 것을 특지응로 하는 표면 연삭기.
- 제6항에 있어서, 상기 Ⅲ-Ⅴ족 혼합물 반도체 웨이퍼의 두께는 연삭된 후에 200㎛ 내지 100㎛의 범위에 속하는 것을 특징으로 하는 표면 연삭기.
- 제1항에 있어서, 연마 입자층은 연마 다이아몬드 입자와 충전재와 수지의 접착재료로 구성되고, 상기 연마 입자층의 영률은(10 내지 15)×104Kgf/㎠인 것을 특징으로 하는 표면 연삭기.
- 제8항에 있어서, 상기 접속재료는 페놀수지인 것을 특징으로 하는 표면 연삭기.
- 제8항에 있어서, 상기 충전재는 칼슘 카보네이트인 것을 특징으로 하는 표면 연삭기.
- 제8항에 있어서, 연마 다이아몬드 입자의 입자치수는 2.5㎛ 내지 6㎛의 범위에 속하는 것을 특징으로 하는 표면 연삭기.
- 제8항에 있어서, 다이아몬드 입자의 농도는 100인 것을 특징으로 하는 표면 연삭기.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61-291901 | 1986-12-08 | ||
JP61291901A JPH0632905B2 (ja) | 1986-12-08 | 1986-12-08 | ▲iii▼―v族化合物半導体ウエハ薄層化処理方法 |
JP291901 | 1986-12-08 | ||
JP294351 | 1986-12-10 | ||
JP61294351A JPS63150158A (ja) | 1986-12-10 | 1986-12-10 | 端面研削盤切込み装置 |
JP61-294351 | 1986-12-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880008427A true KR880008427A (ko) | 1988-08-31 |
KR960015957B1 KR960015957B1 (ko) | 1996-11-25 |
Family
ID=26558752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870013953A KR960015957B1 (ko) | 1986-12-08 | 1987-12-08 | 표면 연삭기 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5035087A (ko) |
EP (1) | EP0272531B1 (ko) |
KR (1) | KR960015957B1 (ko) |
CA (1) | CA1307116C (ko) |
DE (1) | DE3771857D1 (ko) |
Cited By (1)
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US3698138A (en) * | 1969-08-13 | 1972-10-17 | Toyoda Machine Works Ltd | Grinding machine with adaptive control system |
CA962751A (en) * | 1972-03-07 | 1975-02-11 | Roderick L. Smith | Grinding system and method |
US3939610A (en) * | 1973-07-30 | 1976-02-24 | Shatai Kogiyo Co. Ltd. | Device and method of grinding metallic molds and products automatically |
GB1523935A (en) * | 1975-08-04 | 1978-09-06 | Norton Co | Resinoid bonded abrasive products |
JPS6043273B2 (ja) * | 1976-03-01 | 1985-09-27 | マツダ株式会社 | 砥石経変化による研削力を補償した研削盤 |
US4478009A (en) * | 1978-05-09 | 1984-10-23 | Rukavina Daniel M | Automatic control system for machine tools |
DD142309A1 (de) * | 1979-03-19 | 1980-06-18 | Wolfgang Lorenz | Verfahren zum schonenden einsatz von schleifwerkzeugen,insbesondere diamantwerkzeugen |
JPS598506B2 (ja) * | 1981-02-03 | 1984-02-24 | 工業技術院長 | トラバ−ス研削抵抗測定装置 |
JPS609660A (ja) * | 1983-06-27 | 1985-01-18 | Toshiba Corp | 砥石 |
US4575384A (en) * | 1984-05-31 | 1986-03-11 | Norton Company | Grinding wheel for grinding titanium |
JPS6195866A (ja) * | 1984-10-15 | 1986-05-14 | Nisshin Kogyo Kk | 端面研削盤 |
JPS61109656A (ja) * | 1984-10-30 | 1986-05-28 | Disco Abrasive Sys Ltd | 表面研削装置 |
JPS61164773A (ja) * | 1985-01-18 | 1986-07-25 | Hitachi Ltd | ウエハ研削方法および装置 |
-
1987
- 1987-12-07 US US07/129,487 patent/US5035087A/en not_active Expired - Fee Related
- 1987-12-07 EP EP87118077A patent/EP0272531B1/en not_active Expired - Lifetime
- 1987-12-07 DE DE8787118077T patent/DE3771857D1/de not_active Expired - Lifetime
- 1987-12-08 CA CA000553778A patent/CA1307116C/en not_active Expired - Lifetime
- 1987-12-08 KR KR1019870013953A patent/KR960015957B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100392239B1 (ko) * | 1995-09-13 | 2003-11-28 | 가부시끼가이샤 히다치 세이사꾸쇼 | 연마방법 및 연마장치 |
Also Published As
Publication number | Publication date |
---|---|
EP0272531B1 (en) | 1991-07-31 |
US5035087A (en) | 1991-07-30 |
CA1307116C (en) | 1992-09-08 |
KR960015957B1 (ko) | 1996-11-25 |
DE3771857D1 (de) | 1991-09-05 |
EP0272531A1 (en) | 1988-06-29 |
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