KR880004733A - 필름 캐리어 및 이 필름 캐리어를 이용한 본딩 방법 - Google Patents

필름 캐리어 및 이 필름 캐리어를 이용한 본딩 방법 Download PDF

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KR880004733A
KR880004733A KR870010660A KR870010660A KR880004733A KR 880004733 A KR880004733 A KR 880004733A KR 870010660 A KR870010660 A KR 870010660A KR 870010660 A KR870010660 A KR 870010660A KR 880004733 A KR880004733 A KR 880004733A
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film carrier
low melting
conductor wiring
bonding
carrier according
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KR870010660A
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KR910002454B1 (ko
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히로다까. 나까노
쓰네까즈 요시노
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아오이 죠이찌
가부시끼가이샤 도시바
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Abstract

내용 없음

Description

필름 캐리어 및 이 필름 캐리어를 이용한 본딩방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도(a) 내지 제1도(d)는 본 발명의 한 실시예를 나타낸 간단한 모형도.
제2도(a) 내지 제2도(d)는 본 발명의 다른 실시예를 나타낸 간단한 모형도.
제3도(a) 내지 제3도(d)는 본 발명의 다른 실시예를 나타낸 간단한 모형도.
제4도(a) 및 제4도(b)는 본 발명의 다른 실시예를 나타낸 간단한 모형도.
제5도(a) 및 제5도(b)는 한 실시예에서 사용되는 가압기구의 설명도.
* 도면의 주요부분에 대한 부호의 설명
1 : 반도체 소자 2 : 필름 캐리어
12 : 전극단자 21 : 폴리이미드 수지 테이프
25 : 동박(銅箔=전극 리이드) 27, 27 : 활성 합금
125 : 시이트

Claims (21)

  1. 기판과, 이 기판에 설치된 도체 배선과, 이 도체 배선의 적어도 한쪽끝 부위에 배치된 저융점 접합용금속을 구비한 것올 특징으로 하는 필름 캐리어.
  2. 제1항에 있어서, 전술한 저융점 접합용 금속이 배치된 한쪽끝부분이 본딩부인 것을 특징으로 하는 필름 캐리어.
  3. 제2항에 있어서, 전술한 본딩부는 전술한 도체 배선의 이너 리이드부 또는 아우터 리이드부인 것을 특징으로 하는 필름 캐리어.
  4. 제3항에 있어서, 전술한 도체 배선의 이너 리이드부와 아우터 리이드부의 어느 하나의 입력단자부 이외의 부분에는 도료 또는 기체가 배치되어 있는 것을 특징으로 하는 필름 캐리어.
  5. 제3항에 있어서, 전술한 이너 리이드부는 오목헝상으로 되어 있는 것을 특징으로 하는 필름 캐리어.
  6. 제1항에 있어서, 전술한 도체 배선의 일단부를 A로 하고, 전술한 A에 연속해서 피착체와 대향하는 전술한 도체 배선의 부분을 B로 하고, 전술한 B에 연속하여 전술한 피착체와 대향하지 않는 전술한 도체배선부분을 C로하며, 전술한 A의 높이를 hA, 전술한 B의 높이를 hB, 전술한 C의 높이를 hC로하였을 경우, hB＜hC≤hA가 성립되는 것을 특징으로 하는 필름 캐리어.
  7. 제1항에 있어서, 전술한 도체 배선은 저융점 접합용 금속으로 된 것을 특징으로 하는 필름 캐리어.
  8. 제1항에 있어서, 전술한 저융점 접합금속은 저융점 땜납합금과 계면의 결합성을 향상시키는 원소를 주성분으로 하는 금속으로되어 있는 것을 특징으로 하는 필름 캐리어.
  9. 제8항에 있어서, 전술한 저융점 접합금속은 저융점 땜납 합금과 산소와 친화력이 강한 원소와 계면 결합성을 향상시키는 원소를 주성분으로 하는 금속으로 되어 있는 것을 특징으로 하는 필름 캐리어.
  10. 제8항 또는 제9항에 있어서, 전술한 저융점 땜납합금은 Pb, Sn, Zn, Cd, Bi중 둘을 선택한 원소와 In을 주성분으로 하는 합금인 것을 특징으로 하는 필름 캐리어.
  11. 제8항 또는 제9항에 있어서, 전술한 계면의 결합성을 향상시키는 원소는 Sb인 것을 특징으로 하는 필름 캐리어.
  12. 제9항에있어서, 전술한 산소와 친화력이 강한 원소는 Zn, Al, Ti, Si, Cr, Be, 희토류 원소중에서 적어도 하나를 선택하여서 된 것을 특징으로 하는 필름 캐리어.
  13. 제9항에 있어서, 전술한 저융점 활성 금속이라 함은 Pb-Sn-In 이 주성분, Zn-Sb가 부첨가물, Al, Ti, Si, Cr, Be를 미량의 첨가물로 한 합금인 것을 특징으로 하는 필름 캐리어.
  14. 기판에 형성된 도체 배선상에 저융점 접합용 금속을 배치하는 제1의 공정과, 전자부품의 전극단자와 이 기판의 도체 배선의 저융점 접합용 금속을 위치 맞춤하는 제2의 공정과, 전술한 전자부품의 전극단자와 전술한 기판의 도체 배선을 전기적으로 접합하는 제3의 공정을 구비한 것을 특징으로 하는 필름 캐리어를 이용한 본딩방법.
  15. 제14항에 있어서, 전술한 제1의 공정은 전술한 기판에 형성된 도체의 배선상의 적어도 이너 리이드부를 볼록형으로 하고 또한 적어도 이 볼록형위에 저융점 접합용 금속을 배치하는 공정으로 된 것을 특징으로 하는 필름 캐리어를 이용한 본딩방법.
  16. 제14항에 있어서, 전술한 제1의 공정은 전술한 기판에 형성된 도체 배선에 계면의 결합성을 향상시키는 원소와 저융점 땜납 합금을 주성분으로 하는 금속 조성물을 배치하는 것을 특징으로 하는 필름 캐리어를 이용한 본딩방법.
  17. 제14항에 있어서, 전술한 제1의 공정은 전술한 기판에 형성된 도체 배선에 산소와 친화력이 강한 원소와, 저융점 땜납합금과, 계면의 결합성을 향상시키는 원소를 주성분으로 하는 금속 조성물을 배치하는 것을 특징으로 하는 필름 캐리어를 이용한 본딩방법.
  18. 제17항 또는 제18항에 있어서, 전술한 제1의 공정에서의 저융점 땜납합금은 Pb, Sn, Zn, Cd, Bi중 적어도 두가지가 선택된 원소와 In을 주성분으로 하는 합금인 것을 특징으로 하는 필름 캐리어를 이용한 본딩방법.
  19. 제17항 또는 제18항에 있어서, 전술한 제1의 공정에서의 계면의 결합성을 향상시키는 원소는 Sb인 것을 특징으로 하는 필름 캐리어를 이용한 본딩방법.
  20. 제18항에 있어서, 전술한 제1의 공정에서의 산소와 친화력이 강한 원소는 Zn, Al, Ti, Si, Cr, Be, 희토류 원소에서 선택된 적어도 하나로 된 것을 특징으로 하는 필름 캐리어를 이용한 본딩방법.
  21. 제18항에 있어서, 전술한 제1의 공정은 전술한 기판에 형성된 도체 배선에 Pb-Sn-In가 주성분, Zn-Sb가 부첨가물, Al, Ti, Si, Cr, Be를 미량의 첨가물로 하는 합금 조성물을 배치하는 것을 특징으로 하는 필름 캐리어를 이용한 본딩방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870010660A 1986-09-25 1987-09-25 필름 캐리어 및 이 필름 캐리어를 이용한 본딩방법 KR910002454B1 (ko)

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DE3785720T2 (de) 1993-08-12
DE3785720D1 (de) 1993-06-09
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