KR950000902A - 고온의 무연 주석 기제 다-성분 납땜 합금 - Google Patents

고온의 무연 주석 기제 다-성분 납땜 합금 Download PDF

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Publication number
KR950000902A
KR950000902A KR1019940011745A KR19940011745A KR950000902A KR 950000902 A KR950000902 A KR 950000902A KR 1019940011745 A KR1019940011745 A KR 1019940011745A KR 19940011745 A KR19940011745 A KR 19940011745A KR 950000902 A KR950000902 A KR 950000902A
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KR
South Korea
Prior art keywords
alloy
integrated circuit
weight
electrical
circuit chip
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Application number
KR1019940011745A
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English (en)
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KR0124518B1 (ko
Inventor
길버트 고냐 스티븐
케네스 레이크 제임스
클링턴 롱 렌디
네일 와일드 로저
Original Assignee
윌리암 티. 엘리스
인터내셔널 비지네스 머신즈 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 윌리암 티. 엘리스, 인터내셔널 비지네스 머신즈 코포레이션 filed Critical 윌리암 티. 엘리스
Publication of KR950000902A publication Critical patent/KR950000902A/ko
Application granted granted Critical
Publication of KR0124518B1 publication Critical patent/KR0124518B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

Sn, Ag, Bi, 및 In를 포함하는 높은 고상 온도, 높은 적용온도 및 고강도의 다－성분 납땜 합금이 개시된다.

Description

고온의 무연 주석 기제 다－성분 납땜 합금
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (6)

  1. Sn, Ag, Bi 및 In를 포함하는 높은 고상 온도, 높은 적용온도 및 고강도의 다－성분 납땜 합금.
  2. 제 1 항에 있어서, Sn 약 78중량%, Ag 약 2.0중량%, Bi 약 9.8중량% 및 In 약 9.8중량%를 포함하는, 다－성분 납땜 합금.
  3. a. 직접 회로 칩의 전기적 접촉부상에 Sn, Ag, Bi 및 In을 포함하는 납땜 합금을 부착시키는 단계 ; b. 회로화된 기판의 전기적 리드를 직접 회로 칩의 전기적 접촉부상의 납땜 합금과 접촉시키는 단계 ; 및 c. 납땜 합금을 가열하여 납땜 합금을 회로화된 기판의 전기리드에 습윤 및 결합시키는 단계를 포함하는, 집적 회로 칩을 회로화된 기판에 전기 접속시키는 방법.
  4. 제 3 항에 있어서, 상기 회로화된 기판의 전기 리드가 패드, 와이드 리드 및 탭 내부 리드 접속체로 이루어진 그룹중에서 선택되는 방법.
  5. 제 3 항에 있어서, 상기 합금이 Sn 약 78중량%, Ag 약 2.0중량%, Bi 약 9.8중량% 및 In 약 9.8중량%를 포함하는, 방법.
  6. 회로화된 칩 캐리어, 반도체 집적 회로 칩 및 상기 회로화된 칩 캐리어와 상기 반도체 집적 회로 칩 간의 납땜 합금 결합 전기적 접속체(상기 합금은 Sn 약 78중량%, Ag 약 2.0중량%, Bi 약 9.8중량% 및 In 약 9.8중량%를 포함한)를 포함하는 집적 회로 칩 모듈.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940011745A 1993-06-16 1994-05-28 고온의 무연 주석 기재 다-성분 납땜 합금 KR0124518B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US079,111 1993-06-16
US08/079,111 US5328660A (en) 1993-06-16 1993-06-16 Lead-free, high temperature, tin based multi-component solder

Publications (2)

Publication Number Publication Date
KR950000902A true KR950000902A (ko) 1995-01-03
KR0124518B1 KR0124518B1 (ko) 1997-12-26

Family

ID=22148505

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940011745A KR0124518B1 (ko) 1993-06-16 1994-05-28 고온의 무연 주석 기재 다-성분 납땜 합금

Country Status (5)

Country Link
US (1) US5328660A (ko)
EP (1) EP0629463B1 (ko)
JP (1) JPH0815676B2 (ko)
KR (1) KR0124518B1 (ko)
DE (1) DE69418095D1 (ko)

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Also Published As

Publication number Publication date
JPH0788681A (ja) 1995-04-04
JPH0815676B2 (ja) 1996-02-21
KR0124518B1 (ko) 1997-12-26
EP0629463B1 (en) 1999-04-28
EP0629463A1 (en) 1994-12-21
DE69418095D1 (de) 1999-06-02
US5328660A (en) 1994-07-12

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