KR870006156A - 접착시이트 - Google Patents

접착시이트 Download PDF

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Publication number
KR870006156A
KR870006156A KR860010787A KR860010787A KR870006156A KR 870006156 A KR870006156 A KR 870006156A KR 860010787 A KR860010787 A KR 860010787A KR 860010787 A KR860010787 A KR 860010787A KR 870006156 A KR870006156 A KR 870006156A
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South Korea
Prior art keywords
adhesive sheet
adhesive
compound
sheet according
substrate
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KR860010787A
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KR910007086B1 (ko
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가즈요시 에베
히로아끼 나리따
가쓰히사 다구찌
요시다까 아께다
다까노리 사이또
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에프 에스 케이 가부시끼가이샤
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Priority claimed from JP60295188A external-priority patent/JPS62153375A/ja
Priority claimed from JP60295189A external-priority patent/JPS62153376A/ja
Priority claimed from JP60295190A external-priority patent/JPS62153377A/ja
Priority claimed from JP61045786A external-priority patent/JPS62205180A/ja
Priority claimed from JP61045785A external-priority patent/JPS62205179A/ja
Priority claimed from JP61161680A external-priority patent/JPS6317980A/ja
Application filed by 에프 에스 케이 가부시끼가이샤 filed Critical 에프 에스 케이 가부시끼가이샤
Publication of KR870006156A publication Critical patent/KR870006156A/ko
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Publication of KR910007086B1 publication Critical patent/KR910007086B1/ko

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    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
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    • C09J7/00—Adhesives in the form of films or foils
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    • C09J7/22—Plastics; Metallised plastics
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    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • General Physics & Mathematics (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
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Abstract

내용 없음

Description

접착 시이트
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 및 제4도는 본 발명에 따른 접착 사이트의 단면도.
제3도에서 제5도는 반도체 웨이퍼를 다이스 하는 단계에서부터 다이스된 웨이퍼를 픽업하는 단계까지 사용된 상기 접착 시이트를 나타낸 예시도.
＊ 도면의 주요부분에 대한 부호의 설명
1:접착 시이트, 2:기판, 3:접착층, 4:스티리퍼블 시이트(strippable sheet), 5:푸싱 로드(pushing rod), 7:방사선 원

Claims (28)

  1. 기판의 표면에 접착제와 광중합 화합물로 된 접착층을 피복한 기판으로 된 접착시이트에 있어서, 상기 화합물은 분자량이 3000∼10000인 우레탄 아크릴레이트 올리고머인 것을 특징으로 하는 접착 시이트.
  2. 제1항에 있어서, 우레탄 아크릴레이트 올리고머의 분자량이 4000∼8000인 것을 특징으로 하는 접착 시이트.
  3. 기판의 표면에 접착제와 광중합 화합물로된 접착층을 피복한 기판으로된 접착 시이트에 있어서, 접착층에 방사선으로 색을 현상할 수 있는 화합물을 첨가한 것을 특징으로 하는 접착 시이트.
  4. 제3항에 있어서, 방사선으로 색을 현상할 수 있는 화합물이 류코 염료인 것을 특징으로 하는 접착 시이트.
  5. 제4항에 있어서, 류코 염료가 4,4',4˝-트리스디메틸아미노트리페닐메탄인 것을 특징으로 하는 접착 시이트.
  6. 제3항에 있어서, 방사선으로 색을 현상할 수 있는 화합물이 우레탄 아크릴레이트 올리고머인 것을 특징으로 하는 접착 시이트.
  7. 제6항에 있어서, 방사선으로 색을 현상할 수 있는 화합물이 분자량이 3000∼10000인 우레탄 아크릴레이트 올리고머인 것을 특징으로 하는 접착 시이트.
  8. 기판의 표면에 접착제와 광중합 화합물로된 접착층을 피복한 기판으로 된 접착 시이트에 있어서, 기판의 최소한 한면에 방사선으로 색을 현상할 수 있는 화합물을 피복한 것을 특징으로 하는 접착 시이트.
  9. 제8항에 있어서, 방사선으로 색을 현상할 수 있는 화합물이 류코 염료인 것을 특징으로 하는 접착 시이트.
  10. 제9항에 있어서, 류코 염료가 4,4',4˝-트리스 디메틸아미노트리페닐메탄인 것을 특징으로 하는 접착 시이트.
  11. 제8항에 있어서, 방사선으로 색을 현상할 수 있는 화합물이 우레탄 아크릴레이트 올리고머인 것을 특징으로 하는 접착 시이트.
  12. 제11항에 있어서, 방사선으로 색을 현상할 수 있는 화합물이 분자량이 3000∼10000인 우레탄 아크릴레이트 올리고머인 것을 특징으로 하는 접착 시이트.
  13. 기판의 표면에 접착제와 광중합 호합물로된 접착층을 피복한 기판으로 된 접착 시이트에 있어서, 기판에 방사선으로 색을 현상할 수 있는 화합물을 첨가한 것을 특징으로 하는 접착 시이트.
  14. 제13항에 있어서, 방사선으로 색을 현상할 수 있는 화합물이 류코 염료인 것을 특징으로 하는 접착 시이트.
  15. 제14항에 있어서, 류코염료가 4,4',4˝-트리스디메틸아미노트리페넬메탄인 것을 특징으로 하는 접착 시이트.
  16. 제13항에 있어서, 방사선으로 색을 현상할 수 있는 화합물이 우레탄 아크릴레이트 올리고머인 것을 특징으로 하는 접착 시이트.
  17. 제16항에 있어서, 방사선으로 색을 현상할 수 있는 화합물이 분자량이 3000∼10000인 우레탄 아크릴레이트 올리고머인 것을 특징으로 하는 접착 시이트.
  18. 기판의 표면에 접착제와 광중합 화합물로된 접착층을 피복한 기판으로 된 접착 시이트에 있어서, 접착층에 빛을 분산하는 무기 화합물 분말을 첨가한 것을 특징으로 하는 접착 시이트.
  19. 제18항에 있어서, 빛을 분산하는 무기 화합물이 실리카 분말, 알루미나분말, 실리카-알루미나 분말 또는 운모분말인 것을 특징으로 하는 접착시이트
  20. 제18항에 있어서, 광중합 화합물이 우레탄 아크릴레이트 올리고머인 것을 특징으로 하는 접착 시이트.
  21. 제20항에 있어서, 광중합 화합물이 분자량이 3000∼10000인 우레탄 아크릴레이트 올리고머인 것을 특징으로 하는 접착 시이트.
  22. 기판의 표면에 접착제와 광중합 화합물로된 접착층을 피복한 기판으로된 접착 시이트에 있어서, 기판이 교차 결합된 필름인 것을 특징으로 하는 접착 시이트.
  23. 제22항에 있어서, 교차 결합된 필름이 교차 결합된 폴리올레핀 필름인 것을 특징으로 하는 접착 시이트.
  24. 제23항에 있어서, 교차 결합된 폴리올레핀 필름이 교차 결합된 폴리에틸렌 필름인 것을 특징으로 하는 접착 시이트.
  25. 제22항에 있어서, 광중합 화합물이 분자량이 3000∼10000인 것을 특징으로 하는 접착 시이트.
  26. 기판의 표면에 접착제와 광중합 화합물로 된 접착층을 피복한 기판으로 된 접착 시이트에 있어서, 기판이 주구성 단량체 단위로 카르복실기를 갖는 합성수지필름인 것을 특징으로 하는 접착시이트.
  27. 제26항에 있어서, 합성수지필름이 에틸렌-(메타) 아크릴산 공중합체 필름인 것을 특징으로 하는 접착시이트.
  28. 제26항에 있어서, 광중합 화합물이 분자량이 3000∼10000인 우레탄 아크릴레이트 올리고머인 것을 특징으로 하는 접착 시이트.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860010787A 1985-12-27 1986-12-15 점착시이트 KR910007086B1 (ko)

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Application Number Priority Date Filing Date Title
JP???? 1985-04-10
JP295189 1985-12-27
JP60295188A JPS62153375A (ja) 1985-12-27 1985-12-27 ウエハダイシング用粘着シート
JP60295189A JPS62153376A (ja) 1985-12-27 1985-12-27 ウェハダイシング用粘着シート
JP295188 1985-12-27
JP295190 1985-12-27
JP60295190A JPS62153377A (ja) 1985-12-27 1985-12-27 ウェハダイシング用粘着シート
JP45786 1986-03-03
JP45785 1986-03-03
JP61045786A JPS62205180A (ja) 1986-03-03 1986-03-03 粘着シ−ト
JP61045785A JPS62205179A (ja) 1986-03-03 1986-03-03 ウエハ貼着用粘着シ−ト
JP61161680A JPS6317980A (ja) 1986-07-09 1986-07-09 ウエハ貼着用粘着シ−ト
JP161680 1986-07-09

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GB2184741A (en) 1987-07-01
FR2592390A1 (fr) 1987-07-03
SG114492G (en) 1992-12-24
FR2592390B1 (fr) 1993-03-12
MY100214A (en) 1990-05-29
US4756968A (en) 1988-07-12
NL9302148A (nl) 1994-04-05
NL9302149A (nl) 1994-04-05
KR910007086B1 (ko) 1991-09-16
NL8603269A (nl) 1987-07-16
DE3639266A1 (de) 1987-07-02
PH23580A (en) 1989-09-11
NL191241C (nl) 1995-04-03
HK105792A (en) 1993-01-08
DE3639266C2 (ko) 1990-02-08
MY104709A (en) 1994-05-31
GB2184741B (en) 1990-09-05
HK105592A (en) 1993-01-08
NL9302147A (nl) 1994-04-05
GB8630956D0 (en) 1987-02-04
NL191241B (nl) 1994-11-01
HK105492A (en) 1993-01-08
HK105692A (en) 1993-01-08
US4965127A (en) 1990-10-23

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