KR940007150A - 방사선에 의해 부분적으로 제거시킬 수 있는 자체 접착테이프(다이싱 테이프) - Google Patents

방사선에 의해 부분적으로 제거시킬 수 있는 자체 접착테이프(다이싱 테이프) Download PDF

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Publication number
KR940007150A
KR940007150A KR1019930018062A KR930018062A KR940007150A KR 940007150 A KR940007150 A KR 940007150A KR 1019930018062 A KR1019930018062 A KR 1019930018062A KR 930018062 A KR930018062 A KR 930018062A KR 940007150 A KR940007150 A KR 940007150A
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South Korea
Prior art keywords
self
adhesive tape
adhesive
radiation
tape
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KR1019930018062A
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English (en)
Inventor
슈피스 만프레드
하아더 크리스티안
구제 귄터
펠트 클라우디어
메이어 로버트
Original Assignee
딘네, 프라쉬
바이어스도르프 악티엔게젤샤프트
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Publication of KR940007150A publication Critical patent/KR940007150A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S522/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S522/904—Monomer or polymer contains initiating group
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof

Abstract

웨이퍼의 일시적 고정을 위하여 방사선에 의해 부분적으로 탈착될수 있으며, 방사선투과 필름 및 자체 접착성의 중합조성물을 포함하는 지지체를 가지는 자체접착 테이프(다이싱 테이프)로 자체 접착성 중합조성물이 공중합된 방사선 개시제를 포함하는 것을 특징으로 하는 자체 접착 테이프.

Description

방사선에 의해 부분적으로 제거시킬수 있는 자체 접착테이프(다이싱 테이프)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. 웨이퍼의 일시적 고정을 위하여 방사선에 의해 부분적으로 탈착될수 있으며, 방사선투과 필름 및 자체 접착성의 중합 조성물을 포함하는 지지체를 가지는 자체 접착 테이프(다이싱 테이프)로 자체 접착성 중합 조성물이 공중합된 방사선 감광제를 포함하는 것을 특징으로 하는 자체 접착 테이프.
  2. 제1항에 있어서, 상기 방사선이 UV방사선이며, 지지체 필름이 UV투과성이고, 자체 접착 조성물이 UV교차결합가능하며, 공중합된 감광제가 UV감광제인 것을 특징으로 하는 자체 접착 테이프.
  3. 제2항에 있어서, 상기 공중합된 감광제가 벤조인 아크릴레이트인 것을 특징으로 하는 자체 접착 테이프.
  4. 제1항에 있어서, 상기 지지체 필름이 유연한 PVC, 폴리부텐, 1,2-폴리부타디엔 또는 에틸 부틸이 아크릴레이트 공중합체인 것을 특징으로 하는 자체 접착 테이프.
  5. 제1항에 있어서, 상기 지지체 필름이 평면의 두 방향으로 모두 신장될 수 있으며, 이때 필름의 두께가 5-400㎛, 특히 20-80㎛일수 있는 자체 접착 테이프.
  6. 제1항에 있어서, 상기 지지체 필름이 에틸 부틸 아크릴레이트 공중합체이며, 자체 접착성 조성물이 폴리아크릴레이트 공중합체인 것을 특징으로 하는 자체 접착 테이프.
  7. 제1항에 있어서, 상기 자체 접착 조성물이 곁사슬 결정성을 가지는 폴리아크릴레이트 공중합체인 자체 접착 테이프.
  8. 웨이퍼를 일시적으로 고정시키기 위한 제1항 내지 제7항중 어느 한 항에 따른 자체 접착 테이프(다이싱 테이프)의 사용방법.
  9. 제8항에 있어서, 상기 웨이퍼가 자체 접착 조성물을 교차결합시키고, 따라서, 부착이 감소된 후 웨이퍼가 흡입파이프등에 의하여 제거될수 있도록 하기 위하여 지지체를 통해 자체 접착성 테이프를 조사함에 의하여 다시 제거됨을 특징으로 하는 자체 접착 테이프의 사용방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930018062A 1992-09-15 1993-09-09 방사선에 의해 부분적으로 제거시킬 수 있는 자체 접착테이프(다이싱 테이프) KR940007150A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4230784A DE4230784A1 (de) 1992-09-15 1992-09-15 Durch Strahlung partiell entklebendes Selbstklebeband (Dicing Tape)
DEP4230784.8 1992-09-15

Publications (1)

Publication Number Publication Date
KR940007150A true KR940007150A (ko) 1994-04-26

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ID=6467971

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930018062A KR940007150A (ko) 1992-09-15 1993-09-09 방사선에 의해 부분적으로 제거시킬 수 있는 자체 접착테이프(다이싱 테이프)

Country Status (9)

Country Link
US (1) US5525422A (ko)
EP (1) EP0588180B1 (ko)
JP (1) JPH06218879A (ko)
KR (1) KR940007150A (ko)
CN (1) CN1084870A (ko)
AT (1) ATE135033T1 (ko)
DE (2) DE4230784A1 (ko)
ES (1) ES2085085T3 (ko)
SG (1) SG43295A1 (ko)

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US11567247B2 (en) 2018-11-09 2023-01-31 Lg Chem, Ltd. Plasma etching method using faraday cage
US11932784B2 (en) 2019-09-26 2024-03-19 Lg Chem, Ltd. Adhesive composition for dicing tape and dicing tape comprising the same

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11567247B2 (en) 2018-11-09 2023-01-31 Lg Chem, Ltd. Plasma etching method using faraday cage
US11932784B2 (en) 2019-09-26 2024-03-19 Lg Chem, Ltd. Adhesive composition for dicing tape and dicing tape comprising the same

Also Published As

Publication number Publication date
ATE135033T1 (de) 1996-03-15
CN1084870A (zh) 1994-04-06
JPH06218879A (ja) 1994-08-09
DE4230784A1 (de) 1994-03-17
EP0588180B1 (de) 1996-03-06
DE59301780D1 (de) 1996-04-11
SG43295A1 (en) 1997-10-17
ES2085085T3 (es) 1996-05-16
US5525422A (en) 1996-06-11
EP0588180A1 (de) 1994-03-23

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