KR20200008655A - 어레이 기판, 칩 온 필름, 표시 장치 및 얼라인먼트 방법 - Google Patents

어레이 기판, 칩 온 필름, 표시 장치 및 얼라인먼트 방법 Download PDF

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Publication number
KR20200008655A
KR20200008655A KR1020207000274A KR20207000274A KR20200008655A KR 20200008655 A KR20200008655 A KR 20200008655A KR 1020207000274 A KR1020207000274 A KR 1020207000274A KR 20207000274 A KR20207000274 A KR 20207000274A KR 20200008655 A KR20200008655 A KR 20200008655A
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KR
South Korea
Prior art keywords
alignment
pin
mark
chip
film
Prior art date
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Ceased
Application number
KR1020207000274A
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English (en)
Korean (ko)
Inventor
런제 류
샹첸 왕
링옌 천
Original Assignee
쿤산 고-비젼녹스 옵토-일렉트로닉스 씨오., 엘티디.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 쿤산 고-비젼녹스 옵토-일렉트로닉스 씨오., 엘티디. filed Critical 쿤산 고-비젼녹스 옵토-일렉트로닉스 씨오., 엘티디.
Publication of KR20200008655A publication Critical patent/KR20200008655A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H01L23/544—
    • H01L21/68—
    • H01L24/85—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H01L2223/54426—
    • H01L2224/8513—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H10W46/607—Located on parts of packages, e.g. on encapsulations or on package substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07223—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H10W72/07523—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020207000274A 2018-04-02 2018-08-28 어레이 기판, 칩 온 필름, 표시 장치 및 얼라인먼트 방법 Ceased KR20200008655A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201810283325.3A CN108493183B (zh) 2018-04-02 2018-04-02 一种阵列基板、覆晶薄膜及其对位方法及显示装置
CN201810283325.3 2018-04-02
PCT/CN2018/102687 WO2019192137A1 (zh) 2018-04-02 2018-08-28 阵列基板、覆晶薄膜、显示装置及对位方法

Publications (1)

Publication Number Publication Date
KR20200008655A true KR20200008655A (ko) 2020-01-28

Family

ID=63318062

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207000274A Ceased KR20200008655A (ko) 2018-04-02 2018-08-28 어레이 기판, 칩 온 필름, 표시 장치 및 얼라인먼트 방법

Country Status (6)

Country Link
EP (1) EP3640980A4 (https=)
JP (1) JP7058319B2 (https=)
KR (1) KR20200008655A (https=)
CN (1) CN108493183B (https=)
TW (1) TWI659513B (https=)
WO (1) WO2019192137A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240057501A (ko) * 2022-10-24 2024-05-03 세메스 주식회사 반도체 기판 장치와, 반도체 처리 방법 및 반도체 처리 장치

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110097823B (zh) * 2019-04-09 2021-02-02 深圳市华星光电半导体显示技术有限公司 显示面板及显示模组
CN110930866B (zh) * 2019-11-26 2021-07-06 Tcl华星光电技术有限公司 覆晶薄膜及显示装置
CN111081151A (zh) * 2020-01-08 2020-04-28 深圳市华星光电半导体显示技术有限公司 显示面板
CN114696129B (zh) * 2020-12-28 2026-03-20 超聚变数字技术股份有限公司 显示模组及电子设备
WO2022236780A1 (zh) * 2021-05-13 2022-11-17 京东方科技集团股份有限公司 电路板、覆晶膜、显示装置和绑定方法

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JPH11274670A (ja) * 1998-03-19 1999-10-08 Kyocera Corp 積層基板
JP4651886B2 (ja) * 2001-09-14 2011-03-16 東北パイオニア株式会社 電子機器及び電子機器の製造方法
JP4214357B2 (ja) * 2002-02-28 2009-01-28 セイコーエプソン株式会社 電子デバイスの製造方法
JP3544970B2 (ja) * 2002-09-30 2004-07-21 沖電気工業株式会社 Ｃｏｆテープキャリア、半導体素子、半導体装置
JP2006119321A (ja) * 2004-10-21 2006-05-11 Kofu Casio Co Ltd 電気回路間の導通接続構造
JP2006245514A (ja) * 2005-03-07 2006-09-14 Hitachi Media Electoronics Co Ltd フレキシブル基板同士の接続方法
CN100461984C (zh) * 2005-09-30 2009-02-11 友达光电股份有限公司 电路组装结构
TWI292936B (en) * 2006-03-24 2008-01-21 Chipmos Technologies Inc Inner lead bonding tape and tape carrier package utilizing the tape
TW200822303A (en) * 2006-11-07 2008-05-16 Chipmos Technologies Inc Substrate for chip on film packages
CN100545890C (zh) * 2007-03-22 2009-09-30 中华映管股份有限公司 显示面板、显示面板的引脚接合及检测方法
TWI343090B (en) * 2007-05-18 2011-06-01 Au Optronics Corp System and method for alignment
CN101060112B (zh) * 2007-06-11 2010-10-06 友达光电股份有限公司 基板对位系统及其对位方法
JP2012013719A (ja) * 2010-06-29 2012-01-19 Funai Electric Co Ltd Ｃｏｆアライメントマーク
US8994898B2 (en) * 2012-10-18 2015-03-31 Shenzhen China Star Optoelectronics Technology Co., Ltd COF base tape and manufacturing method thereof and liquid crystal display module comprising same
CN203365865U (zh) * 2013-07-04 2013-12-25 京东方科技集团股份有限公司 一种阵列基板、覆晶薄膜和显示装置
CN105551378A (zh) * 2016-02-04 2016-05-04 京东方科技集团股份有限公司 一种覆晶薄膜、柔性显示面板及显示装置
CN106783664B (zh) * 2017-01-03 2020-04-21 京东方科技集团股份有限公司 一种显示模组、绑定检测方法及绑定系统

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240057501A (ko) * 2022-10-24 2024-05-03 세메스 주식회사 반도체 기판 장치와, 반도체 처리 방법 및 반도체 처리 장치

Also Published As

Publication number Publication date
TWI659513B (zh) 2019-05-11
EP3640980A1 (en) 2020-04-22
JP2020526934A (ja) 2020-08-31
TW201943044A (zh) 2019-11-01
EP3640980A4 (en) 2020-10-28
CN108493183A (zh) 2018-09-04
CN108493183B (zh) 2020-05-08
JP7058319B2 (ja) 2022-04-21
WO2019192137A1 (zh) 2019-10-10

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