EP3640980A4 - Array substrate, chip on film, display apparatus and alignment method - Google Patents

Array substrate, chip on film, display apparatus and alignment method Download PDF

Info

Publication number
EP3640980A4
EP3640980A4 EP18913777.1A EP18913777A EP3640980A4 EP 3640980 A4 EP3640980 A4 EP 3640980A4 EP 18913777 A EP18913777 A EP 18913777A EP 3640980 A4 EP3640980 A4 EP 3640980A4
Authority
EP
European Patent Office
Prior art keywords
chip
film
display apparatus
array substrate
alignment method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP18913777.1A
Other languages
German (de)
French (fr)
Other versions
EP3640980A1 (en
Inventor
Renjie Liu
Xiangqian WANG
Lingyan Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Govisionox Optoelectronics Co Ltd
Original Assignee
Kunshan Govisionox Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Govisionox Optoelectronics Co Ltd filed Critical Kunshan Govisionox Optoelectronics Co Ltd
Publication of EP3640980A1 publication Critical patent/EP3640980A1/en
Publication of EP3640980A4 publication Critical patent/EP3640980A4/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8113—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/81132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8513—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
EP18913777.1A 2018-04-02 2018-08-28 Array substrate, chip on film, display apparatus and alignment method Pending EP3640980A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810283325.3A CN108493183B (en) 2018-04-02 2018-04-02 Array substrate, chip on film, alignment method of chip on film and display device
PCT/CN2018/102687 WO2019192137A1 (en) 2018-04-02 2018-08-28 Array substrate, chip on film, display apparatus and alignment method

Publications (2)

Publication Number Publication Date
EP3640980A1 EP3640980A1 (en) 2020-04-22
EP3640980A4 true EP3640980A4 (en) 2020-10-28

Family

ID=63318062

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18913777.1A Pending EP3640980A4 (en) 2018-04-02 2018-08-28 Array substrate, chip on film, display apparatus and alignment method

Country Status (6)

Country Link
EP (1) EP3640980A4 (en)
JP (1) JP7058319B2 (en)
KR (1) KR20200008655A (en)
CN (1) CN108493183B (en)
TW (1) TWI659513B (en)
WO (1) WO2019192137A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110097823B (en) * 2019-04-09 2021-02-02 深圳市华星光电半导体显示技术有限公司 Display panel and display module
CN110930866B (en) * 2019-11-26 2021-07-06 Tcl华星光电技术有限公司 Chip on film and display device
CN111081151A (en) * 2020-01-08 2020-04-28 深圳市华星光电半导体显示技术有限公司 Display panel

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030053056A1 (en) * 2001-09-14 2003-03-20 Tohoku Pioneer Corporation Mark for visual inspection upon assembling a display
JP2006119321A (en) * 2004-10-21 2006-05-11 Kofu Casio Co Ltd Electrically conductive connection structure between electric circuits
JP2006245514A (en) * 2005-03-07 2006-09-14 Hitachi Media Electoronics Co Ltd Connection method for flexible substrates
US20180090442A1 (en) * 2016-02-04 2018-03-29 Boe Technology Group Co., Ltd. Chip-on-film, flexible display panel and display device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274670A (en) * 1998-03-19 1999-10-08 Kyocera Corp Stacked substrate
JP4214357B2 (en) * 2002-02-28 2009-01-28 セイコーエプソン株式会社 Manufacturing method of electronic device
JP3544970B2 (en) * 2002-09-30 2004-07-21 沖電気工業株式会社 COF tape carrier, semiconductor element, semiconductor device
CN100461984C (en) * 2005-09-30 2009-02-11 友达光电股份有限公司 Circuit assembling structure
TWI292936B (en) * 2006-03-24 2008-01-21 Chipmos Technologies Inc Inner lead bonding tape and tape carrier package utilizing the tape
TW200822303A (en) * 2006-11-07 2008-05-16 Chipmos Technologies Inc Substrate for chip on film packages
CN100545890C (en) * 2007-03-22 2009-09-30 中华映管股份有限公司 The pin of display panel, display panel engages and detection method
TWI343090B (en) * 2007-05-18 2011-06-01 Au Optronics Corp System and method for alignment
CN101060112B (en) * 2007-06-11 2010-10-06 友达光电股份有限公司 Baseplate alignment system and its alignment method
JP2012013719A (en) * 2010-06-29 2012-01-19 Funai Electric Co Ltd Cof alignment mark
US8994898B2 (en) * 2012-10-18 2015-03-31 Shenzhen China Star Optoelectronics Technology Co., Ltd COF base tape and manufacturing method thereof and liquid crystal display module comprising same
CN203365865U (en) * 2013-07-04 2013-12-25 京东方科技集团股份有限公司 Array substrate, chip on film and displaying device
CN106783664B (en) * 2017-01-03 2020-04-21 京东方科技集团股份有限公司 Display module, binding detection method and binding system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030053056A1 (en) * 2001-09-14 2003-03-20 Tohoku Pioneer Corporation Mark for visual inspection upon assembling a display
JP2006119321A (en) * 2004-10-21 2006-05-11 Kofu Casio Co Ltd Electrically conductive connection structure between electric circuits
JP2006245514A (en) * 2005-03-07 2006-09-14 Hitachi Media Electoronics Co Ltd Connection method for flexible substrates
US20180090442A1 (en) * 2016-02-04 2018-03-29 Boe Technology Group Co., Ltd. Chip-on-film, flexible display panel and display device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2019192137A1 *

Also Published As

Publication number Publication date
JP2020526934A (en) 2020-08-31
CN108493183A (en) 2018-09-04
KR20200008655A (en) 2020-01-28
EP3640980A1 (en) 2020-04-22
TWI659513B (en) 2019-05-11
WO2019192137A1 (en) 2019-10-10
JP7058319B2 (en) 2022-04-21
CN108493183B (en) 2020-05-08
TW201943044A (en) 2019-11-01

Similar Documents

Publication Publication Date Title
EP4067987A4 (en) Array substrate, manufacturing method therefor, display apparatus, and display substrate
EP3796385A4 (en) Array substrate and manufacturing method thereof, display panel, and display device
EP3893278A4 (en) Array substrate and manufacturing method therefor, and display device
EP3767673A4 (en) Array substrate, manufacturing method therefor, and display apparatus
EP3859783A4 (en) Array substrate, display panel and display apparatus
EP3767675A4 (en) Array substrate and method for manufacturing same, and display device
EP3843146A4 (en) Array substrate, detection method thereof, display panel, and display device
EP3278368A4 (en) Thin film transistor, array substrate, and fabrication method thereof, and display apparatus
EP3514786A4 (en) Pixel drive circuit and pixel drive method, array substrate and display apparatus
EP3285303A4 (en) Thin film transistor and array substrate, and fabrication method thereof and display device thereof
EP3459119A4 (en) Thin film transistor, array substrate, and display apparatus, and fabrication methods thereof
EP4057263A4 (en) Array substrate, fabrication method therefor, and display device
EP3826069A4 (en) Array substrate, fabrication method therefor, and display device
EP3723130A4 (en) Array substrate and manufacturing method therefor, and display apparatus
EP3306648A4 (en) Film transistor and manufacturing method therefor, array substrate and manufacturing method therefor, and display apparatus
EP3457441A4 (en) Thin film transistor and manufacturing method therefor, array substrate and manufacturing method therefor, and display apparatus
EP3273485A4 (en) Thin film transistor and manufacturing method therefor, array substrate and display apparatus
EP3779942A4 (en) Display substrate and detection method thereof, and display device
EP3871041A4 (en) Array substrate and display apparatus
EP3736870A4 (en) Manufacturing method for array substrate, array substrate and display device
EP3904951A4 (en) Display substrate, display device, and test method for display substrate
EP3621120A4 (en) Thin film transistor and preparation method therefor, array substrate and preparation method therefor
EP4057056A4 (en) Array substrate and display apparatus
EP3701565A4 (en) Array substrate, manufacturing method thereof, and display apparatus
EP4012497A4 (en) Method for manufacturing display device, and transfer substrate for manufacturing display device

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20200114

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

A4 Supplementary search report drawn up and despatched

Effective date: 20200929

RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 3/36 20060101ALI20200923BHEP

Ipc: H01L 23/544 20060101AFI20200923BHEP

Ipc: H05K 1/02 20060101ALI20200923BHEP

Ipc: H01L 21/60 20060101ALI20200923BHEP

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)