JP4214357B2 - Manufacturing method of electronic device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic device, a manufacturing method thereof, a semiconductor device, and an electronic apparatus.
[0002]
[Background]
Conventionally, when a large number of electrodes are connected as in the case of COF mounting in which a flexible printed circuit board is connected to a liquid crystal panel, it becomes impossible to establish electrical continuity between the electrodes if a positional shift occurs. In particular, in an electrode formed on a thin resin film such as a flexible printed circuit board, it is difficult to eliminate displacement of the electrode because the resin film easily expands and contracts due to heat and moisture.
[0003]
The present invention solves this problem, and an object of the present invention is to provide an electronic device that secures electrical continuity, a manufacturing method thereof, a semiconductor device, and an electronic apparatus.
[0004]
[Means for Solving the Problems]
(1) A method of manufacturing an electronic device according to the present invention includes a first group of terminals including three or more terminals formed on a first electronic component, and three or more formed on a second electronic component. A second group of terminals consisting of a plurality of terminals, and overlapping and electrically connecting,
One of the first and second electronic components has a scale;
The other of the first and second electronic components has a reference mark,
The positioning of the terminals of the first and second groups is performed while measuring the relative positions of the first and second electronic components using the scale and the reference mark.
[0005]
According to the present invention, the first and second electronic components can be easily aligned by the scale and the reference mark, and accordingly, the alignment of the terminals of the first and second groups can be easily performed. It can be carried out.
[0006]
(2) In this electronic device manufacturing method,
The first and second groups of terminals may be aligned after the relative rotational positions of the first and second electronic components are aligned.
[0007]
(3) In this electronic device manufacturing method,
The relative rotational positions of the first and second electronic components may be aligned using the scale and the reference mark.
[0008]
(4) In this electronic device manufacturing method,
The first and second groups of terminals are aligned in a two-dimensional coordinate system, and the first and second electronic components are moved along one of the XY coordinate axes and then moved along the other of the XY coordinate axes. It may be moved.
[0009]
(5) In this electronic device manufacturing method,
The relative positions of the terminals of the first and second groups in a direction along one of the XY coordinate axes may be measured by the scale and the reference mark.
[0010]
(6) In this electronic device manufacturing method,
The relative position of the terminals of the first and second groups in the direction along both the XY coordinate axes may be measured by the scale and the reference mark.
[0011]
(7) In this electronic device manufacturing method,
The scale and the reference mark are
A first scale and a first reference mark for measuring a relative position of the first and second groups of terminals in a direction along one of the XY coordinate axes;
A second scale and a second reference mark for measuring a relative position of the first and second groups of terminals in a direction along the other of the XY coordinate axes;
May be included.
[0012]
(8) In this electronic device manufacturing method,
The first electronic component has a pair of first marks,
The second electronic component has a pair of second marks,
(A) At the design stage,
Each terminal of the first group is designed to extend along any one of a plurality of first lines through a first point;
The first group of terminals are designed to be arranged in line symmetry with respect to a first Y axis passing through the first point;
Each terminal of the second group is designed to extend along any of a plurality of second lines through a second point;
The second group of terminals are designed to be arranged in line symmetry with respect to a second Y axis passing through the second point;
The array of the plurality of first lines and the array of the plurality of second lines are designed to be the same,
The first mark is designed to be located on a first X axis perpendicular to the first Y axis and intersecting the first group of terminals;
The second mark is designed to be located on a second X axis perpendicular to the second Y axis and intersecting the second group of terminals;
Each of the first marks is designed to coincide with one second mark when the first and second groups of terminals in the design overlap,
(B) The step of aligning the terminals of the first and second groups includes:
The first and second electronic components are arranged such that the first and second X-axis coincide with each other and the first and second Y-axis coincide with each other;
The first and second electronic components are moved closer to the first and second points by the approximate distance between the first and second points in the direction in which the first and second points approach each other. May be moved along.
[0013]
According to this, even if the first or second electronic component expands or contracts and the terminals of the first and second groups cannot be aligned as designed, the first and second marks Can be used for simple alignment.
[0014]
(9) In this electronic device manufacturing method,
The pair of first marks are arranged at positions symmetrical with respect to the first Y axis,
The pair of second marks are arranged at positions symmetrical with respect to the second Y axis,
The step of arranging the first and second electronic components such that the first and second Y axes coincide with each other,
A first distance between one of the first marks and one of the second marks that overlap by design, and the other of the first mark and the other second mark that overlap by design The first and second electronic components may be moved so that the second distance therebetween is equal.
[0015]
(10) In this electronic device manufacturing method,
The step of arranging the first and second electronic components such that the first and second Y axes coincide with each other,
The first distance ΔW₁Measure and
The second distance ΔW₂Measure and
The first and second distances ΔW₁, ΔW₂But both
(ΔW₁+ ΔW₂) / 2
The first and second electronic components may be moved so that
[0016]
(11) In this electronic device manufacturing method,
The distance D between the intersection point of the first XY axis in the design and the first point with respect to the distance W between the pair of terminals located in line symmetry in the first group of terminals in the design And obtaining the ratio D / W of the first and second groups of terminals prior to the alignment step,
The distance W is also a distance between a pair of terminals located in a line-symmetric position among the second group of terminals in the design,
The ratio D / W is also a ratio of the distance D between the intersection point of the second XY axis and the second point in design,
The distance W ′ at the time of alignment of the pair of terminals, which is the reference of the distance W among the terminals of the first group, or a distance W that is an approximation thereof.₁And a distance W ″ at the time of alignment of the pair of terminals, which is the reference of the distance W among the terminals of the second group, or a distance W that is an approximation thereof.₂And the difference ΔW between
ΔY = (D / W) × ΔW
The approximate distance ΔY between the first and second points may be calculated by the following formula.
[0017]
(12) In this electronic device manufacturing method,
The calculated difference ΔW is the distance W₁And the distance W₂And the difference between
The distance W₁Is the distance between the pair of first marks,
The distance W₂May be a distance between the pair of second marks.
[0018]
(13) In this method of manufacturing an electronic device,
ΔW = ΔW₁+ ΔW₂
The difference ΔW may be calculated by the following formula.
[0019]
(14) In this electronic device manufacturing method,
The pair of first marks are arranged at positions closer to the pair of terminals that are the reference of the distance W among the terminals of the first group than other terminals.
The pair of second marks may be disposed at a position closer to the pair of terminals that are the reference of the distance W among the terminals of the second group.
[0020]
(15) In this electronic device manufacturing method,
The pair of first marks is disposed at an end of the first electronic component,
The pair of second marks may be disposed at an end portion of the second electronic component.
[0021]
(16) In this electronic device manufacturing method,
The calculated difference ΔW is a difference between the distance W ′ and the distance W ″.
Each of the pair of first marks is a part of each of the pair of terminals serving as a reference for the distance W among the terminals of the first group,
Each of the pair of second marks may be a part of each of the pair of terminals serving as a reference for the distance W among the terminals of the second group.
[0022]
(17) In this electronic device manufacturing method,
Among the terminals of the first group, a pair of terminals located at both ends in the arrangement direction serves as a reference for the distance W.
Of the second group of terminals, a pair of terminals located at both ends in the arrangement direction may serve as a reference for the distance W.
[0023]
(18) In this electronic device manufacturing method,
The design distance W of the first group of terminals is substantially equal to the distance W ′ during alignment,
The distance D between the intersection of the first XY axis and the first point in designing the terminals of the first group, the intersection of the first XY axis and the first The distance D ′ between the points is approximately equal,
W '= W
D '= D
And the difference ΔW may be calculated.
[0024]
(19) In this electronic device manufacturing method,
Before the first and second group terminal alignment step, the approximate distance ΔY between the first and second points is acquired in advance;
In the step of aligning the terminals of the first and second groups, the approximate distance ΔY between the first and second points may be read and used.
[0025]
(20) In this electronic device manufacturing method,
The first mark is formed of the same material as the first group of terminals;
The second mark may be formed of the same material as the second group of terminals.
[0026]
(21) In this electronic device manufacturing method,
The first and second electronic components may be aligned by automatic control.
[0027]
(22) An electronic device according to the present invention is manufactured by the above method.
[0028]
(23) An electronic apparatus according to the present invention includes the electronic device.
[0029]
(24) A semiconductor device according to the present invention is a semiconductor device including a substrate including three or more terminals, and a semiconductor chip mounted on the substrate,
The substrate includes a scale provided on the surface of the substrate.
[0030]
(25) In this semiconductor device,
The scale includes a first scale provided in a direction along the X axis among orthogonal XY coordinate axes and the second scale provided in a direction along the Y axis.
[0031]
(26) In this semiconductor device,
The scale is made of the same material as the terminal.
[0032]
(27) In this semiconductor device,
The scale is provided along two opposing sides at least on the outer periphery of the substrate.
[0033]
(28) An electronic device according to the present invention includes the semiconductor device.
[0034]
(29) An electronic apparatus according to the present invention includes the electronic device.
[0035]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0036]
(First embodiment)
FIG. 1A to FIG. 6 are diagrams for explaining an electronic device and a manufacturing method thereof according to the first embodiment of the present invention.
[0037]
(Design stage)
1A is an exploded view of an electronic device at the design stage, and FIG. 1B is a partially enlarged view of FIG. The electronic device has a plurality of electronic components (first and second electronic components 10 and 20). A first electronic component 10 shown in FIG. 1A is an electro-optical panel (for example, a liquid crystal panel or an electroluminescence panel). The first electronic component 10 has a first group of terminals 12. A first group of terminals 12 is formed on a substrate (for example, a glass substrate) 14 of the first electronic component 10. The substrate 14 is preferably a transparent substrate. The first group of terminals 12 includes three or more terminals and may be a part of a wiring pattern. The first electronic component 10 has a pair of first marks 16. The first mark 16 may be formed of the same material as the first group of terminals 12, or may be a through hole or a recess formed in the substrate 14. The pair of first marks 16 are arranged at the end of the first electronic component 10 (substrate 14) (for example, outside all the terminals 12 of the first group). For example, the scale is provided along two opposing sides of the outer periphery of the flexible substrate.
[0038]
The second electronic component 20 illustrated in FIG. 1A is a semiconductor device to which, for example, COF (Chip On Film) mounting or TCP (Tape Carrier Package) is applied. The second electronic component 20 may have an integrated circuit (for example, a semiconductor chip) 28. The integrated circuit 28 is for controlling the first electronic component 10. The second electronic component 20 has a second group of terminals 22. A second group of terminals 22 is formed on a substrate (for example, a flexible substrate made of resin) 24 of the second electronic component 20. In FIG. 1A, a second group of terminals 22 is formed on the back surface of the substrate 24. The second group of terminals 22 includes three or more terminals and may be a part of the wiring pattern. The second electronic component 20 has a pair of second marks 26. The second mark 26 may be formed of the same material as that of the second group of terminals 22, or may be a through hole or a recess formed in the substrate 24. The pair of second marks 26 is disposed at the end of the second electronic component 20 (substrate 24) (for example, outside of all the terminals 22 in the second group). The shape of each of the first and second marks 16 and 26 may be any of a ring shape, a square ring shape, a circular shape, and an X shape.
[0039]
One of the first and second electronic components 10 and 20 has a scale 30. In the present embodiment, the scale 30 is formed on the substrate 14. For example, in the substrate 14, scales 30 are formed at both ends in the direction (width direction) along the side overlapped with the substrate 24. The scale 30 may be formed of the same material as the first group of terminals 12 (for example, ITO (Indium Tin Oxide)). In this case, the substrate forming process can be simplified. As shown in FIG. 1B, the scale 30 measures the relative positions of the first and second groups of terminals 12 and 22 in the direction along one of the XY coordinate axes (for example, the Y axis). A first scale 32 and a second scale 34 for measuring the relative positions of the first and second groups of terminals 12 and 22 in the direction along the other of the XY coordinate axes (for example, the X axis). And may be included. In the present embodiment, the XY coordinate axes are two coordinate axes constituting a two-dimensional coordinate system, and the XY coordinate axes are orthogonal.
[0040]
The other of the first and second electronic components 10 and 20 has a reference mark 40. In the present embodiment, the reference mark 40 is formed on the substrate 24. For example, in the substrate 24, the reference marks 40 are formed at both ends in the direction (width direction) along the side overlapped with the substrate 14. As shown in FIG. 1B, the reference mark 40 may be formed of the same material as the second group of terminals 22 (for example, a metal such as copper or gold). The reference mark 40 includes a first reference mark 42 for measuring the relative positions of the first and second groups of terminals 12 and 22 in a direction along one of the XY coordinate axes (for example, the Y axis), And a second reference mark 44 for measuring a relative position of the first and second groups of terminals 12 and 22 in the direction along the other of the XY coordinate axes (for example, the X axis). The first and second reference marks 42 and 44 may be lines. The mark 40 may have a shape in which the first and second reference marks 42 and 44 are integrated.
[0041]
Measuring the relative positions of the first and second groups of terminals 12 and 22 in the direction along one of the XY coordinate axes (for example, the Y axis) by the first scale 32 and the first reference mark 42. Can do. Measuring the relative positions of the first and second groups of terminals 12, 22 in the direction along the other of the XY coordinate axes (for example, the X axis) by the second scale 34 and the second reference mark 44. Can do.
[0042]
FIG. 2 is a diagram for explaining the design of the terminals of the first and second groups. Each of the first group of terminals 12 has a first point P₁A plurality of first lines L passing through₁It is designed to extend along any of the above. The first group of terminals 12 has a first point P₁The first Y axis through Y₁It is designed to be arranged in line symmetry. Each of the second group of terminals 22 has a second point P₂A plurality of second lines L through₂It is designed to extend along any of the above. The second group of terminals 22 has a second point P₂Second Y-axis through Y₂It is designed to be arranged in line symmetry. And a plurality of first lines L₁And a plurality of second lines L₂Is designed to be identical to the sequence of.
[0043]
The pair of first marks 16 has a first X axis X₁Designed to sit on top. First X axis X₁Is the first Y axis Y₁And intersects the first group of terminals 12. The pair of first marks 16 has a first Y axis Y₁Are arranged in line-symmetric positions.
[0044]
The pair of second marks 26 has a second X axis X₂Designed to sit on top. Second X axis X₂Is the second Y axis Y₂And intersect the second group of terminals 22. The pair of second marks 26 is a second Y-axis Y₂Are arranged in line-symmetric positions.
[0045]
Each first mark 16 is designed to coincide with one second mark 26 when the design first and second groups of terminals 12, 22 overlap. The distance W between the pair of terminals in the line-symmetric position of the design first group of terminals 12 is the distance W between the pair of terminals in the line-symmetric position of the design second group of terminals 22. It is also a distance. Of the first group of terminals 12, a pair of terminals located at both ends in the arrangement direction may serve as a reference for the distance W. Of the second group of terminals 22, a pair of terminals located at both ends in the arrangement direction may serve as a reference for the distance W. Design first XY axis X₁, Y₁Intersection point and first point P₁The distance D between the second and XY axes X₂, Y₂And the second point P₂It is also the distance between.
[0046]
The pair of first marks 16 are arranged at positions closer to the pair of terminals serving as the reference of the distance W among the terminals 12 of the first group than the other terminals. The pair of second marks 26 is arranged at a position closer to the pair of terminals serving as the reference of the distance W among the terminals 22 of the second group than the other terminals.
[0047]
(Positioning method)
FIG. 3A to FIG. 3C are diagrams illustrating a method of aligning the terminals of the first and second groups. At the design stage, when the first and second marks 16 and 26 are put together, the first and second groups of terminals 12 and 22 match. However, at the stage of actual alignment, the ratio of the member that supports the first group of terminals 12 (for example, the board 14) and the member that supports the second group of terminals 22 (for example, the board 24) is different. May expand or contract. The cause is the difference in the thermal expansion coefficient and hygroscopicity of the substrates 14 and 24. And when the board | substrates 14 and 24 expand | swell or shrink | contract in a different ratio, a shift | offset | difference arises in the terminal 12 and 22 of a 1st and 2nd group. The alignment method in that case will be described below.
[0048]
As shown in FIG. 3A, the relative rotational positions of the first and second electronic components 10 and 20 are matched. That is, if the first and second electronic components 10 and 20 are moved only along the XY coordinate axes in the two-dimensional coordinate system, the first and second electronic components 10 and 20 are arranged so as to be aligned without being rotated. The rotational position may be adjusted based on the scale 30 and the reference mark 40 at the design stage. Specifically, the first and second electronic components 10 are positioned at positions (measured values) measured by the scale 30 and the reference mark 40 when the terminals 12 and 22 of the first and second groups coincide in the design stage. , 20 are arranged.
[0049]
In the present embodiment, the first scale 32 and the first reference mark 42 are formed at both ends in the direction (width direction) along the side to be overlapped on the substrates 14 and 24. Therefore, a value measured at the design stage by the first scale 32 and the first reference mark 42 on one side, and a value measured at the design stage by the first scale 32 and the first reference mark 42 on the other side. The first and second electronic components 10 and 20 are arranged at positions where Thus, the relative rotational positions of the first and second electronic components 10 and 20 can be adjusted using the scale 30 and the reference mark 40. At this time, in the two-dimensional coordinate system, the first and second electronic components may be relatively displaced in the direction along the XY coordinate axes.
[0050]
Next, the first and second electronic components 10 and 20 are relatively moved along at least one of the XY coordinate axes in the two-dimensional coordinate system. For example, as shown in FIG. 3B, the first and second electronic components 10 and 20 are relatively moved along the X coordinate axis (the direction along the side where the substrates 14 and 24 are superposed (width direction)). Move. For example, the first and second electronic components 10 and 20 are aligned so that the centers in the direction (width direction) along the side where the substrates 14 and 24 are overlapped coincide with each other.
[0051]
Specifically, in the state shown in FIG. 3A, the position is measured by the first scale 32 and the first reference mark 42 on one side to obtain the first measured value, and the first value on the other side. The position is measured by the scale 32 and the first reference mark 42 to obtain a second measurement value. Then, from the first and second measured values, it is calculated how much the first and second electronic components 10 and 20 should be moved in which direction. For example, an average value of the first and second measurement values is calculated. According to the calculated value, the first and second electronic components 10 and 20 are relatively moved, and as shown in FIG. Align.
[0052]
Next, as shown in FIG. 3C, the first and second electronic components 10 and 20 are moved along the Y coordinate axis (a direction intersecting (for example, orthogonal to) the sides overlapped on the substrates 14 and 24). Move relative. In this way, the terminals 12 and 22 of the first and second groups are aligned. Here, the movement amount (movement distance) necessary for alignment may be set as the approximate distance ΔY. The approximate distance ΔY is obtained by calculation. The calculation method will be described below.
[0053]
(Calculation method of approximate distance ΔY)
In the present embodiment, the approximate distance ΔY is acquired in advance, and is read and used when performing alignment. Therefore, the following steps are performed in advance before performing the alignment step described above.
[0054]
FIG. 4 is a diagram for explaining the terminals of the first and second groups at the alignment stage. For example, in the first electronic component 10, the above-described distance W (see FIG. 2) at the design stage is the distance W ′ at the alignment stage. Further, the above-mentioned distance D at the design stage is the distance D ′ at the alignment stage. In the second electronic component 20, the above-described distance W at the design stage is the distance W ″ at the alignment stage. The above-mentioned distance D at the design stage is the distance D at the alignment stage. ″.
[0055]
In the present embodiment, in the first electronic component 10, the member (substrate 14) that supports the first group of terminals 12 is formed of a material (for example, glass) that is not easily deformed by heat, moisture, or the like. Therefore, the distances W and W ′ are almost equal and the distances D and D ′ are approximated.
W '= W
D '= D
It is considered that there is a relationship.
[0056]
On the other hand, in the second electronic component 20, the member (substrate 24) that supports the second group of terminals 22 is more easily deformed by heat, moisture, or the like than the substrate 14 (for example, resin such as polyimide). It is formed with. Therefore, the distances W and W ″ are different, and the distances D and D ″ are different.
W ″ ≠ W
D ″ ≠ D
There is a relationship.
[0057]
The first and second marks 16 and 26 are formed at positions close to the terminals 12 and 22 of the first and second groups, respectively. Therefore, the distance W between the pair of first marks 16₁Is an approximate distance of the distance W ′, and the distance W between the pair of second marks 26₂Is used as an approximate distance of the distance W ″, ie
W '= W₁
W ″ = W₂
It is considered that there is a relationship.
[0058]
In the present embodiment, the approximate distance W ′ is used as the distance W ′.₁And the approximate distance W ″ as the distance W ″.₂Is used. Further, before the alignment, a ratio D / W of the distance D (see FIG. 2) to the distance W is acquired.
[0059]
As shown in FIG. 5, the first and second electronic components 10 and 20 are connected to the first and second X-axis X.₁, X₂Place so that they match. For example, if the first and second marks 16 and 26 are arranged on the X axis in the XY coordinate system of the alignment apparatus (manufacturing apparatus), the first and second X axes X₁, X₂Match. When the alignment is performed by automatic control, the first and second marks 16 and 26 are imaged by at least one (for example, a pair of) cameras (not shown), and the image is recognized. The amount and direction of movement of the first and second electronic components 10 and 20 are calculated.
[0060]
Further, the first and second electronic components 10 and 20 are connected to the first and second Y-axis Y.₁, Y₂Place so that they match. Specifically, the first distance ΔW between one first mark 16 and one second mark 26 that overlap in design.₁And a second distance ΔW between the other first mark 16 and the other second mark 26 that overlap in design.₂And the first and second electronic components 10 and 20 are moved so as to be equal to each other. For example, the first distance ΔW₁And the second distance ΔW₂And the first and second distances ΔW₁, ΔW₂But both
(ΔW₁+ ΔW₂) / 2
The first and second electronic components 10 and 20 are moved so that The calculation here may also be performed by a computer.
[0061]
Next, the first and second points P₁, P₂Is calculated (for example, approximate distance ΔY). For example, the distance W that is an approximate value of the distance W ′ when the pair of terminals serving as the reference of the distance W among the terminals 12 of the first group is aligned.₁And a distance W that is an approximate value of the distance W ″ at the time of alignment of the pair of terminals serving as the reference of the distance W among the terminals 22 of the second group.₂A difference ΔW is calculated. The difference ΔW is the distance W₁And distance W₂You may calculate from the difference with. Or
ΔW = ΔW₁+ ΔW₂
The difference ΔW may be calculated by the following formula.
[0062]
And
ΔY = (D / W) × ΔW
The approximate distance ΔY between the first and second points can be calculated by the following equation. The calculation here may also be performed by a computer. The obtained approximate distance ΔY can be used repeatedly in the subsequent alignment process.
[0063]
When the approximate distance ΔY is calculated, this is used to move the first and second electronic components 10 and 20 as shown in FIG. In other words, as shown in FIG. 5, the first and second points P₁, P₂Between the first and second electronic components 10 and 20 by the distance between them (approximate distance ΔY in the present embodiment).₁, P₂And the first and second Y axes Y₁, Y₂Move along. Thus, the first and second points P₁, P₂Are matched, a part of each terminal 12 of the first group overlaps a part of one of the terminals 22 of the second group. That is, the first and second groups of terminals 12 and 22 can be aligned.
[0064]
(Electrical connection)
Then, the terminals 12 and 22 of the first and second groups are electrically connected. For the electrical connection, an anisotropic conductive film or anisotropic conductive paste may be used, metal bonding may be applied, or crimping with an insulating adhesive may be applied. . Through the above steps, the first and second electronic components 10 and 20 can be electrically connected, and an electronic device is obtained as shown in FIG.
[0065]
According to the present embodiment, the first or second electronic components 10 and 20 are expanded or contracted at different ratios, and the first and second groups of terminals 12 and 22 can be aligned as designed. Even if it is not possible, alignment can be performed with a simple operation. This embodiment can be applied when manual alignment is performed. In addition, when the alignment is automated, it is possible to inspect whether the alignment is correctly performed by applying this embodiment. Furthermore, in this embodiment, the terminals 12 and 22 of the first and second groups are arranged so as not to be parallel, but this embodiment is applied when these terminals are arranged in parallel. May be.
[0066]
(Second Embodiment)
FIG. 7A to FIG. 7B are diagrams for explaining a method for manufacturing an electronic device according to the second embodiment of the present invention. Specifically, FIG. 7A is a diagram illustrating the first and second group terminals and the first and second marks at the design stage. FIG. 7B is a diagram for explaining the first and second group terminals and the first and second marks at the alignment stage.
[0067]
In the present embodiment, in the first electronic component 50, each of the pair of first marks 56 is a part of each of the pair of terminals serving as the reference of the distance W among the terminals 52 of the first group. is there. That is, the first mark 56 is positioned on any terminal 52 of the first group. Further, in the second electronic component 60, each of the pair of second marks 66 is a part of each of the pair of terminals serving as a reference for the distance W among the terminals 62 of the second group. That is, the second mark 66 is positioned on any terminal 62 of the second group. Other configurations are the same as those described in the first embodiment.
[0068]
In the first embodiment described above, the difference ΔW is equal to the distance W.₁And distance W₂Or the first distance ΔW₁And the second distance ΔW₂Calculated from On the other hand, in the present embodiment, the calculated difference ΔW is the difference between the distance W ′ and the distance W ″. Therefore, the approximate distance ΔY is equal to the first and second points P.₁, P₂Close to the true distance between. About the effect of other than that, the content demonstrated in 1st Embodiment corresponds.
[0069]
As an electronic apparatus having the above-described electronic device, a notebook personal computer 1000 is shown in FIG. 8, and a mobile phone 2000 is shown in FIG.
[0070]
The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same purposes and results). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.
[Brief description of the drawings]
FIGS. 1A and 1B are diagrams illustrating a method for manufacturing an electronic device according to a first embodiment of the invention.
FIG. 2 is a diagram for explaining a method of manufacturing an electronic device according to the first embodiment of the invention.
FIGS. 3A to 3C are diagrams illustrating a method for manufacturing an electronic device according to the first embodiment of the invention. FIGS.
FIG. 4 is a diagram for explaining the method for manufacturing the electronic device according to the first embodiment of the invention.
FIG. 5 is a diagram illustrating a method for manufacturing the electronic device according to the first embodiment of the invention.
FIG. 6 is a diagram showing an electronic device according to the first embodiment of the present invention.
FIGS. 7A and 7B are diagrams illustrating a method for manufacturing an electronic device according to a second embodiment of the invention. FIGS.
FIG. 8 is a diagram showing an electronic apparatus according to an embodiment of the present invention.
FIG. 9 is a diagram showing an electronic apparatus according to an embodiment of the present invention.
[Explanation of symbols]
10 First electronic component
12 First group of terminals
16 First mark
20 Second electronic component
22 Second group of terminals
26 Second mark
30 scale
32 First scale
34 Second scale
40 fiducial mark
42 First fiducial mark
44 Second fiducial mark
50 First electronic component
52 First group of terminals
56 First mark
60 Second electronic component
62 Second group of terminals
66 Second mark

Claims (16)

A first group of terminals composed of three or more terminals formed on the first electronic component and a second group of terminals composed of three or more terminals formed on the second electronic component Aligning and electrically connecting to wrap,
One of the first and second electronic components has a scale;
The other of the first and second electronic components has a reference mark,
The first electronic component has a pair of first marks,
The second electronic component has a pair of second marks ,
At the stage of design,
Each terminal of the first group is designed to extend along any of a plurality of first lines passing through a first point;
The first group of terminals are designed to be arranged in line symmetry with respect to a first Y axis passing through the first point;
Each terminal of the second group is designed to extend along any of a plurality of second lines through a second point;
The second group of terminals are designed to be arranged in line symmetry with respect to a second Y axis passing through the second point;
The array of the plurality of first lines and the array of the plurality of second lines are designed to be the same,
The first mark is designed to be located on a first X axis perpendicular to the first Y axis and intersecting the first group of terminals;
The second mark is designed to be located on a second X axis perpendicular to the second Y axis and intersecting the second group of terminals;
Each of the first marks is designed to coincide with one second mark when the first and second groups of terminals in the design overlap,
The pair of first marks are arranged at positions symmetrical with respect to the first Y axis, and the pair of second marks are arranged at positions symmetrical with respect to the second Y axis. And
The step of aligning the terminals of the first and second groups includes:
Aligning the relative rotational positions of the first and second electronic components;
After the step of aligning the relative rotational positions,
Said first and second electronic component, a step of the first and second X-axis match and, arranged such that the first and second Y-axis coincide,
The first and second electronic components are moved closer to the first and second points by the approximate distance between the first and second points in the direction in which the first and second points approach each other. anda step of moving along,
The pre-Symbol first and second electronic component, placing as the first and second Y-axis coincide,
Measuring a _first distance ΔW ₁ between one of the first marks and one of the second marks overlapping in design;
Measuring a second distance [Delta] W ₂ between the second mark of the other of the first mark and the other overlapping the design,
The first and second distances ΔW ₁ and ΔW ₂ are both
(ΔW ₁ + ΔW ₂ ) / 2
Look including moving the first and second electronic component so that,
Moving the first and second electronic components along the first and second Y-axis,
A method of manufacturing an electronic device, which is performed while measuring a relative position of the first and second electronic components by the scale and the reference mark . In the manufacturing method of the electronic device of Claim 1,
A method for manufacturing an electronic device, wherein the relative rotational positions of the first and second electronic components are aligned using the scale and the reference mark. In the manufacturing method of the electronic device of Claim 1 or Claim 2,
A method for manufacturing an electronic device, wherein the relative position of the first and second group terminals in a direction along one of the XY coordinate axes is measured by the scale and the reference mark. In the manufacturing method of the electronic device of Claim 1 or Claim 2,
A method of manufacturing an electronic device, wherein the relative position of the first and second groups of terminals in a direction along both the XY coordinate axes is measured by the scale and the reference mark. In the manufacturing method of the electronic device of Claim 4,
The scale and the reference mark are
A first scale and a first reference mark for measuring a relative position of the first and second groups of terminals in a direction along one of the XY coordinate axes;
A second scale and a second reference mark for measuring a relative position of the first and second groups of terminals in a direction along the other of the XY coordinate axes;
A method of manufacturing an electronic device comprising: In the manufacturing method of the electronic device in any one of Claims 1-5,
The distance D between the intersection point of the first XY axis in the design and the first point with respect to the distance W between the pair of terminals located in line symmetry in the first group of terminals in the design And obtaining the ratio D / W of the first and second groups of terminals prior to the alignment step,
The distance W is also a distance between a pair of terminals located in a line-symmetric position among the second group of terminals in the design,
The ratio D / W is also a ratio of the distance D between the intersection point of the second XY axis and the second point in design,
Of the first group of terminals, the distance W ′ at the time of alignment of the pair of terminals, which is the reference of the distance W, or a distance W ₁ that is an approximate value thereof, and of the second group of terminals, the Calculating a difference ΔW between the distance W ″ at the time of alignment of the pair of terminals which is a reference of the distance W or a distance W _{2 which} is an approximate value thereof;
ΔY = (D / W) × ΔW
An electronic device manufacturing method for calculating an approximate distance ΔY between the first and second points by the formula: In the manufacturing method of the electronic device of Claim 6,
The calculated difference ΔW is a difference between the distance W ₁ and the distance W ₂ .
The distance W ₁ is a distance between the pair of first marks,
The distance W ₂ is a method for manufacturing an electronic device, which is a distance between the pair of second marks. In the manufacturing method of the electronic device of Claim 7,
ΔW = ΔW ₁ + ΔW ₂
An electronic device manufacturing method for calculating the difference ΔW according to the formula: In the manufacturing method of the electronic device of Claim 7 or Claim 8,
The pair of first marks are arranged at positions closer to the pair of terminals that are the reference of the distance W among the terminals of the first group than other terminals.
Manufacture of an electronic device in which the pair of second marks are arranged at positions closer to the pair of terminals that are the reference of the distance W among the terminals of the second group. Method. In the manufacturing method of the electronic device in any one of Claims 6-9,
The pair of first marks is disposed at an end of the first electronic component,
The pair of second marks is a method of manufacturing an electronic device disposed at an end of the second electronic component. In the manufacturing method of the electronic device of Claim 6,
The calculated difference ΔW is a difference between the distance W ′ and the distance W ″.
Each of the pair of first marks is a part of each of the pair of terminals serving as a reference for the distance W among the terminals of the first group,
Each of said pair of 2nd marks is a manufacturing method of the electronic device which is a part of each of said pair of terminals used as the standard of said distance W among the terminals of said 2nd group. In the manufacturing method of the electronic device in any one of Claims 6-11,
Among the terminals of the first group, a pair of terminals located at both ends in the arrangement direction serves as a reference for the distance W.
A manufacturing method of an electronic device in which a pair of terminals located at both ends in the arrangement direction among the terminals of the second group serves as a reference for the distance W. In the manufacturing method of the electronic device in any one of Claims 6-12,
The design distance W of the first group of terminals is substantially equal to the distance W ′ during alignment,
The distance D between the intersection of the first XY axis and the first point in designing the terminals of the first group, the intersection of the first XY axis and the first The distance D ′ between the points is approximately equal,
W '= W
D '= D
The electronic device manufacturing method for calculating the difference ΔW. In the manufacturing method of the electronic device in any one of Claims 6-13,
Before the first and second group terminal alignment step, the approximate distance ΔY between the first and second points is acquired in advance;
A method of manufacturing an electronic device that reads and uses the approximate distance ΔY between the first and second points in the step of aligning the terminals of the first and second groups. In the manufacturing method of the electronic device in any one of Claims 1-14,
The first mark is formed of the same material as the first group of terminals;
The method of manufacturing an electronic device, wherein the second mark is made of the same material as the second group of terminals. In the manufacturing method of the electronic device in any one of Claims 1-15,
A method for manufacturing an electronic device, wherein the first and second electronic components are aligned by automatic control.

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