JP2004327925A - Joined substrate and driver module using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a joined substrate in which a yield of a substrate is improved and positioning is performed with a simple structure, and to provide a driver module using it. <P>SOLUTION: End surfaces of two partial substrates 2 and 3 are arranged while making adjacent and facing to each other, and both of the partial substrates 2 and 3 are fixed on a base plate 4, in a joined substrate 1. In the joined substrate 1, two points of protruding parts 12 and 13 protruding on one partial substrate 2 side are formed on the other partial substrate 3. On one partial substrate 2, two points of recessed parts 16 and 17 capable of housing the protruding parts 12 and 13 so as not to overlap are formed. When the other partial substrate 3 is moved, the end surfaces of the protruding part and the recessed part collide or overlap with each other, so that displacement of both the partial substrates 2 and 3 is prevented by determining it by visual observation and sense of hands. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a bonded board connecting a plurality of boards and a driver module using the same.
[0002]
[Prior art]
For example, as described in Patent Literature 1, a conventional driver module uses a structure in which an aluminum plate is bonded to one flexible substrate on which a wiring pattern is formed. An IC chip is arranged in a through hole formed in a flexible substrate and is directly adhered to an aluminum plate. The IC chip and the flexible substrate are wire-bonded with a gold wire, and thereafter, a resin is coated.
[0003]
However, in response to the recent miniaturization of electronic devices, the pattern pitch of the wiring board has also become narrower, and when a large-sized flexible board is used, if there is a defect such as a short circuit in a part thereof, There is a problem that waste increases. Further, when a large-sized substrate having an irregular shape is formed, there is a problem that the number of substrates to be removed from the base material is reduced and waste is increased.
[0004]
In order to increase the yield and improve the yield, it is conceivable to form the substrate by dividing it. However, accuracy in joining the divided substrates becomes a problem.
[0005]
Patent Literature 2 describes a method in which markings for alignment are formed on a hard substrate and a flexible substrate, respectively, and the markings are overlapped and crimped to connect terminals.
[0006]
[Patent Document 1]
JP 2000-299416 A (paragraph number 0002, FIG. 9)
[Patent Document 2]
JP-A-2002-9412 (Pages 2-4, FIG. 2)
[0007]
[Problems to be solved by the invention]
However, in the wiring board described in Patent Literature 2, since the pattern pitch is narrow, even if the markings are overlapped and pressed together, a shift may occur. To prevent the shift, increase the number of markings. Since it is necessary to perform the crimping operation after confirming that all the markings overlap, there is a problem that the operation takes time.
[0008]
In addition, when the marking is small, it cannot be confirmed visually, and it is necessary to perform alignment using image processing with a camera or the like, and the size of the equipment becomes large even when a small lot type is manufactured. There's a problem.
[0009]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a bonding substrate capable of improving the yield of the substrate and performing alignment with a simple structure, and a driver module using the same.
[0010]
[Means for Solving the Problems]
In the bonded substrate and the driver module using the same according to the present invention, the concave portion and the convex portion that match each other are formed on both partial substrates of the bonded substrate in which two partial substrates are fixed on a base plate.
[0011]
ADVANTAGE OF THE INVENTION According to this invention, while improving the yield of a board | substrate, the joining board | substrate which performs alignment with a simple structure, and the driver module using the same are obtained.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
The invention according to claim 1 is a joint substrate in which the end faces of two partial substrates are arranged close to and opposed to each other, and the partial substrates are fixed on a base plate. Two convex portions projecting toward the other partial substrate are formed, and two concave portions are formed on the other partial substrate so that the convex portions can be accommodated without overlapping. When trying to move one of the partial substrates, the end faces of the convex and concave portions collide or overlap, so this is judged visually or by hand and the position of both partial substrates is determined. It has the effect of preventing displacement.
[0013]
In the invention according to claim 2, the convex portion and the concave portion are formed in such a shape that the two concave portions are respectively engaged with the convex portions when the two partial substrates are separated from each other. The joining substrate according to claim 1, characterized in that, even if one of the partial substrates is moved in any direction, the end surfaces of the convex portion and the concave portion come into contact with each other. This has the effect of preventing relative displacement.
[0014]
The invention according to claim 3 is the joint substrate according to claim 1 or 2, wherein the two convex portions are formed in an L shape. It is easy to set the distance between the formed linear portion in the two directions of the convex portion and the concave portion adjacent to the linear portion, and it is possible to reliably prevent the displacement in the two directions.
[0015]
According to a fourth aspect of the present invention, two opposing sides of the two convex portions are each formed in a straight line, and are arranged so as to intersect when extending in the projecting direction of the convex portion. A bonding substrate according to any one of claims 1 to 3, characterized in that the shape of the projection is simplified, and the production error is reduced.
[0016]
According to a fifth aspect of the present invention, the partial substrate is a flexible substrate, which is the bonding substrate according to any one of the first to fourth aspects, such as a connector for connection or a driver module. And has the effect of improving versatility.
[0017]
According to a sixth aspect of the present invention, there is provided a driver module using the bonding substrate according to any one of the first to fifth aspects, comprising a semiconductor device fixed to a base plate together with two partial substrates, The semiconductor device is a driver module characterized by being wire-bonded to each of the two partial substrates. Since the connectable range by wire bonding is wider than the pattern pitch of the wiring substrate, the semiconductor device is convex. The gap between the portion and the concave portion can be widened, and has an effect of simplifying the assembly and shortening the manufacturing time.
[0018]
(First Embodiment)
FIG. 1 is a plan view of a bonded substrate according to the first embodiment of the present invention. As shown in FIG. 1, a bonded substrate 1 according to a first embodiment of the present invention has two partial substrates 2 and 3 with their end faces arranged close to and opposed to each other. It is bonded and fixed on the base plate 4.
[0019]
The partial substrates 2 and 3 are flexible substrates in which a circuit pattern made of copper foil is formed on a base film made of a flexible plastic material such as polyimide. The pitch between the circuit patterns of the partial substrates 2 and 3 is, for example, 0.1 to 0.13 mm.
[0020]
The base plate 4 is made of a rectangular aluminum alloy having a predetermined thickness, and has heat dissipation and electrical conductivity. In the description of the shapes of the partial substrates 2 and 3, the longitudinal direction of the base plate 4 is defined as the X direction, the direction orthogonal to the X direction is defined as the Y direction, and the direction approaching the center of the base plate 4 is separated from the inside. The direction is outward.
[0021]
The partial substrate 2 is formed in a rectangular bonding portion 6 formed to have a length slightly shorter than the long side of the base plate 4 and in a trapezoidal shape in which the width of the bonding portion 6 gradually increases from the outer end in the Y direction to the outside. A terminal portion 8 having a large number of connection terminals 7 is provided integrally on the outer end thereof.
[0022]
The partial substrate 3 is formed such that its long side is formed in a rectangular bonding portion 9 having the same length as the bonding portion 6 of the partial substrate 2, and protrudes outward from an outer end of the bonding portion 9 in the Y direction. A rectangular terminal portion 11 having a large number of connection terminals 10 at its ends and having a long side shorter than the length of the joint portion 9 is integrally provided.
[0023]
L-shaped protrusions 12 and 13 projecting toward the partial substrate 2 are formed at both ends of the joint 9 of the partial substrate 3. The protrusions 12 and 13 have a rectangular first protrusion 14 integrally connected to an end face of the joint 9 on the side of the partial substrate 2 and protruded in the Y direction, and a front end of each of the first protrusions 14. And the second protrusions 15 of rectangular shape protruding inward in the X direction.
[0024]
Both corners of the joining portion 6 of the partial substrate 2 are cut out in an L-shape, and concave portions 16 and 17 that can be stored so that the convex portions 12 and 13 do not overlap each other are formed. The recesses 16 and 17 have rectangular first storage portions 18 and second storage portions 19 for storing the first protrusions 14 and the second protrusions 15 of the protrusions 12 and 13, respectively.
[0025]
In order to adjust the relative positions of the partial substrates 2 and 3 in the X direction, the first storage portions 18 of the recesses 16 and 17 are located at positions adjacent to the first protrusions 14 of the projections 12 and 13 in the X direction. Gaps 20, 20a are respectively formed. In order to adjust the relative positions of the partial substrates 2 and 3 in the Y direction, the second storage portions 19 of the concave portions 16 and 17 are positioned adjacent to both sides of the second protrusion 15 of the convex portions 12 and 13 in the Y direction. Are formed with gaps 21 and 22, respectively. The width of each of the gaps 20, 20a, 21, 22 is, for example, 0.25 mm. That is, the displacement of the partial substrate 2 with respect to the partial substrate 3 is suppressed to a range within 0.5 mm in both the X and Y directions.
[0026]
When performing positioning in the X direction, the gaps 20 and 20a formed on both sides in the X direction are determined as one set. For example, when the partial substrate 3 is shifted from the partial substrate 2 to the convex portion 12 side in the X direction, the gap 20 on the convex portion 12 side becomes narrow and the gap 20a on the convex portion 13 side becomes wide. When the gap is shifted in the opposite direction, the gap 20 on the convex portion 12 side is widened, and the gap 20a on the convex portion 13 side is narrowed.
[0027]
When performing the alignment in the Y direction, determination is made for each of the gaps 21 and 22 formed on both sides of the convex portions 12 and 13 in the Y direction. For example, when the partial substrate 3 is displaced in the direction in which the partial substrate 3 approaches the partial substrate 2, the gap 21 of each of the protrusions 12 and 13 becomes narrow, and each gap 22 becomes wide. When the gap is shifted in the opposite direction, the gap 21 becomes wider and the gap 22 becomes narrower.
[0028]
Further, when the partial substrate 3 is displaced in the direction of rotation with respect to the partial substrate 2, one gap 21 of the projections 12 and 13 becomes narrow and the other gap 21 becomes wide. In addition, one gap 22 of the protrusions 12 and 13 is widened, and the other gap 22 is narrowed.
[0029]
If the displacement exceeds 0.25 mm, one of the projections 12 and 13 of the partial substrate 3 overlaps with one of both ends of the partial substrate 2, so that the operator can easily determine the position correction. It can be performed. The flexible substrate has a thickness of about 0.05 mm. For example, when the two partial substrates 2 and 3 are moved in a direction away from each other, the concave portions 16 and 17 lock the convex portions 12 and 13. Thus, it is possible to prevent the two partial substrates 2 and 3 from overlapping.
[0030]
In this manner, even if the relative positions of the partial substrates 2 and 3 are shifted in any of the X and Y directions, the position shift can be detected and quick correction can be performed.
[0031]
Next, a manufacturing procedure of the bonding substrate 1 will be described.
[0032]
First, one of the partial substrates 2 and 3 is bonded to the base plate 4 using a bonding means such as an adhesive or a double-sided tape, and then the other of the partial substrates 2 and 3 is It arrange | positions so that it may be accommodated so that it may not overlap with the recessed parts 16 and 17, and may join using the same joining means as one.
[0033]
Thus, the partial substrates 2 and 3 can be joined. The electrical bonding can be performed using, for example, a bonding wire, and when the pitch of the terminals of the bonding portions 6 and 9 is large, it is also possible to superimpose the two partial substrates and to perform pressure bonding. It is.
[0034]
(Second embodiment)
FIG. 2 is a plan view of a bonded substrate according to the second embodiment. As shown in FIG. 2, the bonding substrate 25 according to the second embodiment of the present invention has an outer shape when bonded to the outer shape when the partial substrates 2 and 3 according to the first embodiment are bonded. Substantially equal partial substrates 26 and 27 are joined by a base plate 28.
[0035]
The protruding portions 29 and 30 formed at two positions at both ends in the X direction of the partial substrate 26 are formed in a trapezoidal shape that gradually widens toward the front side, and the opposing two sides of the protruding portions 29 and 30 are formed. 41 and 42 are each formed in a straight line, and are arranged so as to intersect when extending in the projecting direction of the projection.
[0036]
The concave portions 31 and 32 for housing the convex portions 29 and 30 so as not to overlap the partial substrate 27 are provided so that the partial substrate 26 can move up to 0.25 mm in the X direction and the Y direction with respect to the partial substrate 27, respectively. A gap 33 in the X direction adjacent to the two sides 41 and 42 and a gap 34 in the Y direction are formed. With such a configuration, it is possible to perform the alignment in the X direction and the Y direction while simplifying the shapes of the convex portions 29, 30 and the concave portions 31, 32.
[0037]
(Third embodiment)
FIG. 3 is a plan view of a driver module using a bonding substrate. As shown in FIG. 3, the driver module 35 has a semiconductor device 36 fixed to the base plate 4 of the bonding substrate 1 according to the first embodiment.
[0038]
The semiconductor device 36 is disposed on two mounting portions 37 and 38 (see hatched portions in FIG. 1) formed by cutting out the end surfaces of the partial substrate 3 on the partial substrate 2 side in a rectangular shape, and directly on the base plate 4 or It is indirectly bonded and fixed via an FPC (flexible substrate).
[0039]
The semiconductor device 36 is conductively connected by wire bonding to terminal portions 39, 40 formed on the joint portions 6, 9 of the partial substrates 2, 3. Wire bonding is performed by a special-purpose machine provided with a means for determining a position by a camera, but if the error is about 0.5 mm, the wires can be correctly connected. Therefore, in the case of connection by wire bonding, even if the pitch of the circuit patterns formed on the partial substrates 2 and 3 is smaller than 0.5 mm, the positioning accuracy of the partial substrates 2 and 3 is about 0.5 mm. Even when the positioning is performed manually without using an automatic machine, the operation can be easily performed.
[0040]
【The invention's effect】
As described above, according to the bonded substrate of the present invention, in the bonded substrate in which the end surfaces of the two partial substrates are fixed on the base plate, two convex portions protruding toward one partial substrate are provided on one partial substrate. Part is formed, and the other partial substrate is formed with two concave portions that can be accommodated without overlapping the convex portion, so if one of the partial substrates is moved, the end surfaces of the convex portion and the concave portion collide with each other, Since they overlap, it is possible to judge this visually or with the sensation of the hand, thereby improving the yield of the substrate and performing alignment with a simple structure.
[0041]
When the two partial substrates are separated from each other, if the two concave portions are formed so as to hook the convex portions, the end surfaces of the convex portions and the concave portions will come into contact regardless of the direction in which one of the partial substrates is moved. In addition, the relative positional deviation of both partial substrates in all directions is prevented, and the alignment can be easily performed.
[0042]
When the two convex portions are formed in an L-shape, it is easy to set a distance between a linear portion in two directions of the L-shaped convex portion and a concave portion adjacent thereto. The displacement in the direction can be reliably prevented, and the alignment is facilitated.
[0043]
When the two convex portions are formed in a straight line in which opposing sides intersect, the shape of the convex portions is simplified, and manufacturing errors are reduced, so that the yield is improved.
[0044]
When the partial substrate is a flexible substrate, the bonding substrate can be used for a connector for connection, a driver module, and the like, and versatility is improved.
[0045]
The driver module according to the present invention includes a semiconductor device fixed to a base plate together with two partial substrates, and the semiconductor device is wire-bonded to the two partial substrates, respectively, and a connectable range by wire bonding is a wiring substrate. Since the pitch is wider than the above pattern pitch, the gap between the convex portion and the concave portion can be formed wide, and the assembling is simplified, the manufacturing time is shortened, and the yield is improved.
[Brief description of the drawings]
FIG. 1 is a plan view of a bonding substrate according to a first embodiment. FIG. 2 is a plan view of a bonding substrate according to a second embodiment. FIG. 3 is a plan view of a driver module using the bonding substrate. ]
REFERENCE SIGNS LIST 1 bonding substrates 2, 3 partial substrate 4 base plate 6 bonding portion 7 connecting terminal 8 terminal portion 9 bonding portion 10 connecting terminal 11 terminal portion 12, 13 convex portion 14 first protrusion 15 second protrusion 16, 17 recess 18 1 storage section 19 second storage section 20 gap 20a gap 21 gap 22 gap 25 bonding substrate 26, 27 partial substrate 28 base plate 29, 30 convex portion 31, 32 concave portion 33, 34 gap 35 driver module 36 semiconductor device 37, 38 mounting Parts 39, 40 Terminal parts 41, 42 sides

Claims (6)

In a bonded substrate in which the end faces of two partial substrates are arranged close to and opposed to each other, and the partial substrates are fixed on a base plate,
On one of the partial substrates, two convex portions protruding toward the other partial substrate are formed,
The bonding substrate according to claim 1, wherein the other partial substrate is formed with two concave portions that can be accommodated without overlapping the convex portions. The said convex part and the said recessed part are the two said recessed parts formed in the shape which respectively latches the said convex part, when the said two partial substrates are made to separate from each other, The Claim 1 characterized by the above-mentioned. Bonding board. The bonding substrate according to claim 1, wherein the two convex portions are formed in an L shape. The two opposing sides of the two convex portions are each formed in a straight line, and are arranged so as to intersect when extending in the projecting direction of the convex portion. The bonding substrate according to any one of the above items. The bonding substrate according to claim 1, wherein the partial substrate is a flexible substrate. A driver module using the bonding substrate according to any one of claims 1 to 5,
A semiconductor device fixed to a base plate together with two partial substrates,
A driver module, wherein the semiconductor device is wire-bonded to each of the two partial substrates.

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