KR101795904B1

KR101795904B1 - Board angle correction device

Info

Publication number: KR101795904B1
Application number: KR1020160009886A
Authority: KR
Inventors: 전병선
Original assignee: 스테코 주식회사
Priority date: 2016-01-27
Filing date: 2016-01-27
Publication date: 2017-11-08
Also published as: KR20170089541A

Abstract

The present invention relates to a substrate angle correcting apparatus (700) and a correction method, wherein the substrate angle correcting apparatus (700) includes needle pins each of which is connected to test pads arranged in a line on a substrate A probe unit, a vision unit for photographing the test pads and the needle pins, a calculation unit for calculating a tilt angle of one edge of the test pad and a reference line formed by connecting at least two of the needle pins, And a correction unit for correcting the angle formed by the reference line and the edge by rotating the substrate.

Description

[0001] BOARD ANGLE CORRECTION DEVICE [0002]

The present invention relates to a substrate angle correcting apparatus.

2. Description of the Related Art In recent years, a variety of functions have been added to electronic products to increase the number of input / output terminals, thereby developing a tape carrier package (TCP) technique in which integrated circuit (IC) chips are formed into a tape-shaped package.

The Tape Automated Bonding (TAB) package applies an adhesive on a tape used as a base film and bonds the copper foil with an adhesive. The bonded copper foil is wired in a designed pattern, and the lead wired on the tape is connected to the chip. These TAB packages are widely used in various fields such as a notebook computer to which a display is attached, a cell phone, a clock and an instrument.

The COF (Chip On Film) package includes a base film on which a plurality of electrode lines are formed and a chip bonded to the plurality of electrode lines. At this time, test pads are formed at each end of the plurality of electrode lines, and probes of the probe card are contacted to test pads.

However, since the pitch of the plurality of electrode lines is minute and the test pads are arranged in a limited area, it is difficult to identify the state where the probes of the probe card are in contact with the test pads. Therefore, there is a problem that the test person who performs the test misjudges the contact failure state on the test pad and performs the test, thereby causing the test failure that judges that the good product is defective.

In the positional correction, an accuracy of about 50 mu m is required for correcting the X-axis and Y-axis mismatch between the probe card and the test pad of the TAB. However, since the positional mismatch is manually corrected by rotating the knobs by visual observation, the manual operation is repeated until the probes are in proper contact with the test pads (IC), which takes a lot of time to perform the calibration there is a problem.

Also, when the test pads and the probe card are tilted and there is an angle, there is a problem in that correction can not be performed because the contact between the test pad and the probe card is not performed only by the correction of the X and Y axes.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to reduce the faulty judgment due to connection failure by correcting the angle between the test pad edge and the needle pin of the probe unit.

The technical object of the present invention is not limited to the above-mentioned technical objects and other technical objects which are not mentioned can be clearly understood by those skilled in the art from the following description will be.

In order to achieve the above object, the present invention provides a substrate angle correcting apparatus comprising: a probe unit including needle pins connected to test pads arranged in a line on a substrate to provide a test signal; A vision unit for photographing the pads and the needle pins, a calculation unit for calculating a tilt angle of one edge of the test pad, a reference line formed by connecting at least two of the needle pins, and a control unit And a correction unit for correcting an angle between the reference line and the edge.

The reference lines may be formed by connecting ends of a first needle pin and a second needle pin, which are in contact with first test pads and second test pads, respectively, located at the outermost sides of the test pads arranged in a row .

The edge may be formed at an acute angle with the baseline.

The correction unit may include a support plate for supporting the substrate, a rotation motor for rotating the support plate to correct the angle, and a fixing unit for fixing the substrate to the support plate.

The apparatus for correcting a substrate angle according to the present invention may further comprise an XY table for correcting the substrate in a direction perpendicular and / or parallel to the reference line.

The apparatus for correcting a substrate angle according to the present invention may further comprise a transfer unit for transferring the substrate.

A method for correcting a substrate angle according to the present invention comprises the steps of connecting probe pins of a probe unit to test pads in which a plurality of probes are arranged in a line on a substrate, photographing the test pads and needle pins, Calculating an angle formed between a reference line formed by connecting the reference line and the edge of the test pad and an edge formed on one side of the test pad, and correcting an angle formed by the reference line and the edge by rotating the substrate corresponding to the angle.

In the correction step, the rotation motor may rotate the support plate supporting the substrate to correct the angle.

The substrate angle correcting method according to the present invention may further include the step of photographing the test pads and the needle pins again to confirm the correction after the correcting step.

X axis After Y-axis correction, the test pads and needle pins are photographed by the vision unit. If the needle pins and test pads are tilted and connection is poor, the test is performed based on the reference line connecting the needle pins to the output unit and the test pad edge The angle between the pad edge and the reference line can be calculated.

The correction unit corrects the angle between the test pad edge and the reference line to improve the yield of the product by reducing the case of bad connection between the needle pin and the test pad due to the angle between the test pad and the needle pin. .

In addition, a rotational motor can be used to automatically calibrate the angle between the test pads and the needle pins to mechanize, quantify, and automate work, improving process speed and accuracy.

1 is a cross-sectional view of a substrate angle correcting apparatus according to an embodiment of the present invention.
2 is a schematic view of a substrate and a needle pin of a substrate angle correcting apparatus according to an embodiment of the present invention.
3 and 4 are cross-sectional views illustrating an angle between a reference line and a test pad edge of the apparatus for correcting a substrate angle according to an embodiment of the present invention.
5 is a plan view including the motor of the substrate angle correcting device according to the embodiment of the present invention.
Fig. 6 is an enlarged view of a portion A of Fig. 5 of the present invention.
7 is a plan view of the substrate angle correcting device according to the embodiment of the present invention after angle correction.
8 is a flowchart of a method for correcting a substrate angle according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The invention, which is set forth below, may be embodied with various changes and may have various embodiments, and specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail.

It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Also, the terms first, second, etc. may be used to distinguish between various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

Hereinafter, a configuration of a substrate angle correcting apparatus 700 according to an embodiment of the present invention will be described in detail.

The substrate 10 is a substrate in which the semiconductor chip 30 and the test pad 100 are mounted. In one embodiment, as can be seen in the illustration of FIG. 1, the substrate 10 may be a film in the form of a reel-to-reel 20 reel tape.

The test pad 100 is connected to the semiconductor chip 30 mounted on the substrate 10 and a plurality of the test pads 100 are arranged in a line and contact the needle pins 210 of the probe unit 200 to be described later, It is possible to determine whether the mounted semiconductor chip 30 is good or not.

FIG. 1 is a cross-sectional view of a substrate angle correcting apparatus according to an embodiment of the present invention, FIG. 2 is a schematic view of a substrate and a needle pin of a substrate angle correcting apparatus according to an embodiment of the present invention, and FIGS. Sectional view showing the angle between the reference line L1 and the test pad edge of the substrate angle correcting apparatus according to the embodiment.

A substrate angle correcting apparatus 700 according to an embodiment of the present invention includes a probe unit 200, a vision unit 300, a calculation unit 400, a correction unit 500, a transfer unit, and an XY table 600 can do.

The probe unit 200 is connected to the test pad 100 mounted on the substrate 10 to determine whether the chip 30 mounted on the substrate 10 is good or not and includes a needle pin 210 .

The needle pin 210 protrudes from the probe unit 200 so that an end of the needle pin 210 contacts the test pad 100 to provide or receive an electrical signal. 2, when the needle pins 210 are all connected to the test pads 100, the probe unit 200 applies a signal (not shown) to the test pads 100 mounted on the substrate 10, And outputs a signal from the test pads 100 to determine whether the chip 30 is defective or not.

The vision unit 300 photographs the substrate 10 and photographs the test pads 100 of the substrate 10 and the needle pins 210 of the probe unit 200 described above, It is possible to check whether the test pads 100 are in contact with each other.

The calculation unit 400 can calculate the angle between the reference line L1 and the test pad 100 edge 150, which will be described later.

2 and 3, at least two of the plurality of needle pins 210 arranged in a line are selected and the tip 220 of the selected first needle pin Is an imaginary line connecting the ends 230 of the second needle pins. The reference line L1 may be a reference for determining whether the test pads 100 are inclined with respect to the reference line L1.

As can be seen in the example of FIG. 2, in one embodiment, the baseline L1 includes an end of a first needle pin connected to a first test pad 110 located at the top of the test pads 100 arranged in a line, And a second needle pin 230 connected to the second test pad 120 positioned at the bottom of the second test pin 220. [

As can be seen from the example of FIG. 3 or 4, the edge 150 of the test pad 100 may be four in the rectangular test pad 100. In one embodiment, a line passing through the edge 150 of the test pad 100 located near the chip 30 to be tested among the four edges 150 of the rectangular test pad 100 is referred to as L2 And the line passing through the edge 150 of the test pad 100 orthogonal to L2 is L3 and the angle formed by the edge 150 of the test pad 100 parallel to L2 and the reference line L1 is L2 and the angle And the angle formed by the edge 150 of the test pad 100 parallel to L3 and the reference line L1 is equal to the angle formed by L3 and the reference line L1.

The angle formed by the edge 150 of the test pad 100 and the reference line L1 may be an acute angle formed by the edge 150 of the test pad 100 and the reference line L1. When the acute angle formed by L2 and the reference line L1 is θ1 and the acute angle formed by L3 and the reference line L1 is θ2, θ1 + θ2 = 90 ° is satisfied.

5 is a plan view including a motor of a substrate angle correcting apparatus according to an embodiment of the present invention. FIG. 6 is an enlarged view of a portion A of FIG. 5 of the present invention, And Fig.

The correction unit 500 corrects an angle between the test pad 100 edge 150 and the reference line L1 as described above and includes a support plate 510, a rotation motor 520, and a fixed unit (not shown) .

The support plate 510 supports the substrate 10 so that the substrate 10 can be placed on the support plate 510. In one embodiment, the support plate 510 may be in the form of a disc, but is not limited in shape.

The rotation motor 520 is connected to the support plate 510 to rotate the support plate 510 and may serve to correct the angle between the edge 150 of the test pad 100 and the reference line L1.

The fixing unit (not shown) may serve to fix the substrate 10 to the support plate 510.

6, the rotary motor 520 rotates the support plate 510 by? 1 to correct the angle? 1 between the reference line L1 and the test pad 100 edge 150 have.

The XY table 600 serves to move the substrate 10 in a direction orthogonal to or parallel to the reference line L1 or to move the substrate 10 in a direction orthogonal to and parallel to the reference line L1 can do.

The transfer unit (not shown) serves to transfer the substrate 10, and the substrate 10 moves or tilts in a direction parallel or orthogonal to the reference line L1 while moving through the transfer unit, Causes can be provided.

Hereinafter, a substrate angle correcting method according to an embodiment of the present invention will be described in detail with reference to the drawings.

8 is a flowchart of a method for correcting a substrate angle according to an embodiment of the present invention.

The substrate angle correcting method for correcting the angle of the substrate 10 using the above-described substrate angle correcting apparatus 700 includes a probe unit 200, a vision unit 300, a calculating unit 400, a correcting unit 500, Unit, the XY table 600, and the like, the description of the substrate angle correcting apparatus 700 according to the embodiment of the present invention can be applied analogously.

The method of correcting the angle of the substrate 10 using the substrate angle correcting apparatus 700 described above is a step of connecting the needle pin 210 to the test pad 100 in step S1. At this time, the needle pin 210 must be connected to the central portion of the test pad 100 to reduce the probability of determining that the good product is defective due to poor connection.

Next, the step S2 is to photograph the test pads 100 and the needle pins 210 with the vision unit 300 to determine the contact state between the test pads 100 and the needle pins 210 .

Next, in step S3, when both the test pads 100 and the pin pins 210 are not connected to each other, the first motor 610 and the second motor 620 connected to the XY table 600 The substrate 10 is moved in a direction orthogonal to or parallel to the reference line L1.

5, when the connection is poor in the orthogonal direction (X-axis direction) to the reference line L1, it is corrected using the first motor 610, and when the connection is poor in the direction parallel to the reference line L1 Axis direction), the second motor 620 can be used for correction.

The steps S2 and S4 may be omitted if the test pad 100 does not move in the X axis direction or the Y axis direction with respect to the reference line L1.

Next, the step S4 is the same as the step S2 of photographing the needle pins 210 and the corrected test pads 100 to the vision unit 300.

Next, in step S5, when an angle? Is formed between the reference line L1 and one edge 150 of the test pad 100 by tilting the test pad 100 edge 150 with respect to the reference line L1 , And calculating the angle?. The angle θ between the reference line L1 and one edge 150 of the test pad 100 is greater than the angle between the reference line L1 and the lines L2 and L3 passing through one edge 150 of the test pad 100 ) And the acute angle of

This step can be performed in the case where the test pad 100 and the needle pin 210 can not be connected only by correcting in the X-axis and Y-axis directions in step S3. The angle calculation between the reference line L1 and the test pad 100 edge 150 may be performed in the calculation unit 400 provided in the vision unit 300 described above.

Next, the step S6 is a correction step of aligning the edge 150 of the test pad 100 with the reference line L1 by rotating the substrate 10 in accordance with the angle calculated in the above step S5.

5 and 6, when the fixing unit fixes the substrate 10 to the support plate 510 and the rotation motor 520 rotates the support plate 510, 10 may be rotated so that the angle between the reference line L1 and the test pad 100 edge 150 can be corrected. 7, when the correction is performed, the reference line L1 and the central portion of the test pad 100 coincide with each other, so that the ends of the needle pins 210 are connected to the vicinity of the center of the test pad 100 .

The test pad 100 and the needle pin 210 may not be connected even if the angle between the test pad 100 edge 150 and the needle pin 210 is only about 0.13 degrees. Also, in one embodiment, the substrate 10 can be twisted about 2 degrees with respect to the needle pins 210, so that the angle correction by the rotation motor 520 can be within 5 degrees.

Next, in step S7, the test pads 100 and the needle pins 210 are photographed by the vision unit 300 after the step S6. If the needle pin 210 can not be connected to the test pad 100, it is possible to selectively correct the position of the test pad 100 through the steps S2 through S7.

If the needle pins 210 of the probe unit 200 are aligned with the central portion of the test pad 100 according to the present invention, it is possible to prevent the test chip 100 from being judged to be defective And the yield of good products can be improved. The tilt angles between the needle pins 210 and the test pads 100 are calculated by the calculating unit 400 and automatically corrected by the correcting unit 500 to automate, It can improve the speed and reduce the production cost.

It should be noted that the embodiments disclosed in the drawings are merely examples of specific examples for the purpose of understanding, and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

10: substrate 100: test pad
110: first test pad 120: second test pad
150: Test pad edge 200: Probe unit
210: Needle pin 220: End of first needle pin
230: end of second needle pin 300: vision unit
400: calculation unit 500: correction unit
510: support plate 520: rotary motor
600: XY table 700: substrate angle correcting device
L1: Baseline

Claims

A probe unit including needle pins each connected to test pads arranged in a line on a substrate to provide a test signal;
A vision unit for photographing the test pads and the needle pins;
A calculation unit that calculates a tilted acute angle of a reference line formed by connecting at least two of the needle pins and a virtual line connecting one side edge of the test pad; And
And a correction unit for correcting an angle formed by the reference line and the imaginary line by rotating the substrate corresponding to the acute angle,
The reference line is formed virtually by connecting a first needle pin disposed at one end of the needle pins and a second needle pin disposed at the other end opposite to the one end of the needle pins,
The virtual line may be an edge formed adjacent to a chip disposed on the substrate among the first test pads connected to the first needle pin among the test pads and a second test pad connected to the second needle pin, And formed virtually by connecting edges formed adjacent to each other,
Wherein the correction unit corrects the angle of the substrate so that the reference line and the imaginary line are parallel to each other.

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The apparatus of claim 1,
A support plate for supporting the substrate;
A rotation motor for rotating the support plate to correct the angle; And
And a fixing unit for fixing the substrate to the support plate.

The method according to claim 1,
And an XY table for correcting the substrate in a direction orthogonal to and parallel to the reference line.

The method according to claim 1,
And a transfer unit for transferring the substrate.

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