JPH04352132A - Connection terminal array structure of electronic component, tape carrier package, and liquid crystal display using same package - Google Patents

Connection terminal array structure of electronic component, tape carrier package, and liquid crystal display using same package

Info

Publication number
JPH04352132A
JPH04352132A JP12725891A JP12725891A JPH04352132A JP H04352132 A JPH04352132 A JP H04352132A JP 12725891 A JP12725891 A JP 12725891A JP 12725891 A JP12725891 A JP 12725891A JP H04352132 A JPH04352132 A JP H04352132A
Authority
JP
Japan
Prior art keywords
liquid crystal
crystal display
connection terminals
connection terminal
tape carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12725891A
Other languages
Japanese (ja)
Other versions
JP3067038B2 (en
Inventor
Munehisa Kishimoto
岸本 宗久
Hiroyuki Tanaka
大之 田中
Koji Serizawa
弘二 芹沢
Toru Yamauchi
徹 山内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3127258A priority Critical patent/JP3067038B2/en
Publication of JPH04352132A publication Critical patent/JPH04352132A/en
Application granted granted Critical
Publication of JP3067038B2 publication Critical patent/JP3067038B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To easily position and connect multi-pin, narrow-pitch terminal groups with high accuracy even if they shift relatively in position. CONSTITUTION:The connection terminal array structure of the electronic component which has two parallel opposite sides and also has many connection terminals on the sides adjacently in parallel is constituted by slanting the connection terminals on one side slantingly at a specific angle to the connection terminals formed on the other side. The tape carrier package 3 is formed by forming a lead 1a on one side opposite the other side across a mounted LSI chip 2 slantingly at a specific angle to a lead 1b formed on the other side. Further, the liquid crystal display device is constituted by interposing the tape carrier package 3 between the connection terminals of a liquid crystal display element and the connection terminals of a printed circuit board corresponding to the connection terminals.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、電子部品の接続端子配
列構造およびテープキャリアパッケージ並びに該テープ
キャリアパッケージを使用した液晶表示装置に係わり、
特に、これら接続される多ピン・狭ピッチの端子群間に
、相対的な位置ずれがあっても、容易かつ高精度に位置
決めして接続するのに好適な接続端子の配列構造に関す
る。
[Field of Industrial Application] The present invention relates to a connecting terminal arrangement structure for electronic components, a tape carrier package, and a liquid crystal display device using the tape carrier package.
In particular, the present invention relates to a connection terminal arrangement structure suitable for easy and highly accurate positioning and connection even if there is a relative positional shift between these connected multi-pin, narrow-pitch terminal groups.

【0002】0002

【従来の技術】現在、パソコンを始めとする各種の電気
機器は小形化・軽量化・高性能化が加速されつつあり、
一方で、液晶表示装置のように表示の大画面化に伴う液
晶表示素子の大形化や表示画素数の増大化が加速されつ
つある。この対応として、TAB(Tape  Aut
omated  Bonding)実装技術により多ピ
ンのリードを有する配線パターンを形成したテープフィ
ルムに、金属性突起状電極のバンプを介してLSIチッ
プを接続し、樹脂で封止したテープキャリアパッケージ
(以下、TCPと略称する)を使用し、多ピン・狭ピッ
チの電子部品の端子接続を行うようにしている。例えば
、液晶表示装置における液晶表示素子と液晶駆動用のプ
リント回路基板との接続は、駆動用LSIチップを実装
したTCPを、前記液晶表示素子とプリント回路基板と
の間に介設し、介設したTCPの多数のリード(アウタ
ーリード)を前記液晶表示素子の接続端子および該接続
端子に対応するプリント回路基板の接続端子との双方に
接続する方法が広く行われている。この場合、TCP,
液晶表示素子およびプリント回路基板の各接続端子は、
いずれも同一方向に平行に配列されている。
[Prior Art] Currently, various electrical devices such as personal computers are becoming smaller, lighter, and more sophisticated.
On the other hand, along with larger display screens such as liquid crystal display devices, the size of liquid crystal display elements and the number of display pixels are increasing at an accelerated pace. In response to this, TAB (Tape Out
A tape carrier package (hereinafter referred to as TCP) is a tape carrier package (hereinafter referred to as TCP) in which an LSI chip is connected via bumps of metal protruding electrodes to a tape film on which a wiring pattern with multi-pin leads is formed using a tape carrier package (hereinafter referred to as TCP) that is sealed with a resin. ) is used to connect the terminals of multi-pin, narrow-pitch electronic components. For example, to connect a liquid crystal display element and a printed circuit board for driving the liquid crystal in a liquid crystal display device, a TCP on which a driving LSI chip is mounted is interposed between the liquid crystal display element and the printed circuit board. A widely used method is to connect a large number of leads (outer leads) of the TCP to both the connection terminals of the liquid crystal display element and the corresponding connection terminals of the printed circuit board. In this case, TCP,
Each connection terminal of the liquid crystal display element and printed circuit board is
Both are arranged in parallel in the same direction.

【0003】0003

【発明が解決しようとする課題】しかし、従来の接続端
子の配列構造において、端子接続を高信頼度で実現する
ためにはきわめて高精度の実装技術および実装プロセス
を必要とする。例えば、液晶表示装置における液晶表示
素子と液晶駆動用のプリント回路基板との接続のように
、TCPを介して接続される場合には、TCPに形成さ
れたリードのピッチや線幅の精度,液晶表示素子パネル
およびプリント回路基板に形成される接続端子の位置精
度,液晶表示素子パネルとプリント回路基板との間にT
CPを実装する際の搭載精度等のすべての精度が、所定
の精度をクリアーしていなければ高信頼度の接続を実現
することは困難である。これらの各精度の向上には限界
があるが、各精度を高精度にするためには、各部品を製
作するための装置は勿論、計測装置,検査装置等の各種
装置のコストを増大させるとともに、製作時間の延長を
伴い製作効率を低下させる問題点があり、そして、これ
らの問題点は、接続端子が多ピン・狭ピッチ化するほど
ますます顕著になる問題点であり、その対応が求められ
ていた。
However, in the conventional arrangement structure of connection terminals, extremely high-precision mounting technology and mounting process are required in order to realize terminal connections with high reliability. For example, when connecting via TCP, such as the connection between a liquid crystal display element in a liquid crystal display device and a printed circuit board for driving the liquid crystal, the precision of the pitch and line width of the leads formed on the TCP, The positional accuracy of the connection terminals formed on the display element panel and the printed circuit board, and the T between the liquid crystal display element panel and the printed circuit board.
It is difficult to realize a highly reliable connection unless all the accuracy such as the mounting accuracy when mounting the CP clears a predetermined accuracy. There are limits to the improvement of each of these precisions, but in order to increase each precision, it is necessary to increase the cost of various equipment such as measurement equipment and inspection equipment as well as equipment for manufacturing each part. However, there are problems that prolong manufacturing time and reduce manufacturing efficiency, and these problems become more prominent as the number of pins and pitch of connection terminals becomes narrower. It was getting worse.

【0004】本発明は、上記従来技術の問題点に鑑み、
接続される多ピン・狭ピッチの端子群間に、たとえ相対
的な位置ずれを有していても、容易かつ高精度に位置決
めして接続することができる電子部品の接続端子配列構
造およびテープキャリアパッケージ並びに該テープキャ
リアパッケージを使用した液晶表示装置を提供すること
を目的とする。
[0004] In view of the problems of the above-mentioned prior art, the present invention
Connecting terminal arrangement structure and tape carrier for electronic components that enable easy and highly accurate positioning and connection between groups of multi-pin, narrow-pitch terminals to be connected, even if there is relative positional deviation An object of the present invention is to provide a package and a liquid crystal display device using the tape carrier package.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
、本発明は、平行に相対する2辺を有し、該各辺に多数
の接続端子を平行に隣接させて配列した電子部品におい
て、前記一方の辺の接続端子を、他方の辺に形成された
接続端子に対して所定の角度に傾斜させて形成する電子
部品の接続端子配列構造にしたものである。
[Means for Solving the Problems] In order to achieve the above object, the present invention provides an electronic component having two parallel opposing sides and in which a large number of connecting terminals are arranged adjacent to each other in parallel on each side. The electronic component has a connection terminal arrangement structure in which the connection terminals on one side are formed at a predetermined angle with respect to the connection terminals formed on the other side.

【0006】そして、多ピンのリードを有する配線パタ
ーンを形成したテープフィルムと、該テープフィルムに
金属性突起状電極のバンプを介して実装されたLSIチ
ップとからなるテープキャリアパッケージにおいて、前
記実装されたLSIチップを挾む一方の辺のリードを、
他方の辺に形成されたリードに対して所定の角度に傾斜
させて形成する構成にしたものである。
[0006] In a tape carrier package comprising a tape film on which a wiring pattern having multi-pin leads is formed, and an LSI chip mounted on the tape film via bumps of metal protruding electrodes, the mounted The leads on one side that sandwich the LSI chip,
The lead is formed so as to be inclined at a predetermined angle with respect to the lead formed on the other side.

【0007】また、液晶表示装置の構成を、上記構成か
らなるテープキャリアパッケージを、液晶表示素子の接
続端子と、該接続端子に対応するプリント回路基板の接
続端子との間に介設する構成にしたものである。
[0007] Furthermore, the structure of the liquid crystal display device is such that a tape carrier package having the above structure is interposed between the connection terminal of the liquid crystal display element and the connection terminal of the printed circuit board corresponding to the connection terminal. This is what I did.

【0008】[0008]

【作用】上記構成としたことにより、電子部品における
相対する平行な2辺に配列された接続端子群間に、相対
的な位置ずれを有している状態の場合には、前記傾斜さ
せた接続端子の傾斜角度をθ,前記2辺の接続端子群間
を結ぶ方向をY,該Y方向と直角の方向(端子の配列方
向で位置ずれの方向)をXとし、傾斜した接続端子の位
置ずれ量をxとすると、前記傾斜した接続端子群を、該
接続端子群とほぼ同角度に傾斜した接続すべき相手側接
続端子群に、前記位置ずれ量xを補正して正確に重ねる
ためのY方向の移動量yは、y=x・cot(θ)の関
係により決まり、接続端子群を、接続すべき相手側端子
群上を僅かにY方向へ移動するだけで、正確かつ容易に
位置合わせすることが可能になる。
[Operation] With the above configuration, in the case where there is a relative positional shift between the connection terminal groups arranged on two opposing parallel sides of the electronic component, the inclined connection The inclination angle of the terminal is θ, the direction connecting the connection terminal groups on the two sides is Y, and the direction perpendicular to the Y direction (the direction of positional deviation in the terminal arrangement direction) is X, and the positional deviation of the inclined connection terminal is If the amount is x, then Y is required to accurately stack the inclined connection terminal group on the mating connection terminal group to be connected which is inclined at approximately the same angle as the connection terminal group by correcting the positional deviation amount x. The amount of movement in the direction y is determined by the relationship y=x・cot(θ), and the positioning of the connection terminal group can be done accurately and easily by simply moving the connection terminal group slightly in the Y direction over the mating terminal group to be connected. It becomes possible to do so.

【0009】そして、TCPのリードの配列を上記構成
としたことにより、該TCPに接続される回路基板の接
続端子との間に、たとえ相対的な位置ずれがあっても、
前記電子部品の場合と同様に、TCPを、接続すべき相
手側端子上を僅かにY方向へ移動するだけで、正確かつ
容易に位置合わせすることが可能になる。
[0009] By arranging the leads of the TCP in the above configuration, even if there is a relative misalignment between the connection terminals of the circuit board connected to the TCP,
As in the case of the electronic component, simply by slightly moving the TCP in the Y direction over the mating terminal to be connected, it is possible to accurately and easily align the TCP.

【0010】また、上記構成からなるTCPを、液晶表
示素子の接続端子と、該接続端子に対応するプリント回
路基板の接続端子との間に介設する液晶表示装置とした
ことにより、前記電子部品の場合と同様に、正確かつ容
易に位置合わせして端子接続することが可能になり、実
装コストを低下させるとともに製作効率を向上させ、し
かも多ピン・狭ピッチ化にも対応することが可能になっ
た。
[0010] Furthermore, by using the TCP having the above structure as a liquid crystal display device interposed between a connection terminal of a liquid crystal display element and a connection terminal of a printed circuit board corresponding to the connection terminal, the electronic component As in the case of , it is now possible to accurately and easily align and connect terminals, lowering mounting costs and improving manufacturing efficiency, and also making it possible to support higher pin counts and narrower pitches. became.

【0011】[0011]

【実施例】以下、本発明の実施例を図1ないし図6を参
照して説明する。図1はTCPの一実施例を示す図、図
2は図1のリードのみの配列状態を示す図、図3は液晶
表示素子とプリント回路基板との接続端子のみの配列状
態を示す図、図4は図2に示すリードと図3に示す接続
端子との位置ずれのある配列状態を示す図、図5は図4
の位置ずれを補正した後の接続状態を示す図、図6は図
1に示すTCPを実装した液晶表示装置の一例を示す図
である。
Embodiments Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 6. FIG. 1 is a diagram showing an example of TCP, FIG. 2 is a diagram showing the arrangement of only the leads in FIG. 1, and FIG. 3 is a diagram showing the arrangement of only the connection terminals between the liquid crystal display element and the printed circuit board. 4 is a diagram showing a misaligned arrangement of the leads shown in FIG. 2 and the connection terminals shown in FIG. 3, and FIG.
FIG. 6 is a diagram showing an example of a liquid crystal display device in which the TCP shown in FIG. 1 is mounted.

【0012】図1において、1はテープフィルムで、テ
ープフィルム1は、配線パターン1dを形成したポリイ
ミドからなるベースフィルム1c、LSIチップ2を挾
んでベースフィルム1cの一方の辺に形成された多ピン
の入力側のリード1a、ベースフィルム1cの他方の辺
に形成されている多ピンの出力側のリード1bで構成さ
れている。3はテープフィルム1のインナーリードにL
SIチップ2を接続してなるTCPである。リード1a
,1bはそれぞれ平行に隣接して配列されているが、こ
の場合、リード1aは図に示すように、リード1bに対
して所定の角度θだけ傾斜させて形成されている。つぎ
に、図2に示すTCPのリードのみの配列において、実
際の製品においてはリード1aとリード1bとのピッチ
は異なるが、ここでは本発明の理解を容易にするため、
同一ピッチp0で対応させて示している。図3において
、4は液晶表示素子、4bは液晶表示素子4の接続端子
、5はプリント回路基板、5aはプリント回路基板5の
接続端子である。ここで接続端子5a,4bは、図2に
おけるリード1a,1bと対応するように、同一のピッ
チp0および傾斜角度θで配列されているが、図3に示
すように接続端子5aと4bとは、相対的に端子の配列
方向(X方向)に該端子の面積中心間がx(mm)位置
ずれした状態になっている。
In FIG. 1, 1 is a tape film, and the tape film 1 includes a base film 1c made of polyimide on which a wiring pattern 1d is formed, and a multi-pin structure formed on one side of the base film 1c with an LSI chip 2 sandwiched therebetween. It consists of an input side lead 1a and a multi-pin output side lead 1b formed on the other side of the base film 1c. 3 is L to the inner lead of tape film 1
This is a TCP formed by connecting SI chip 2. Lead 1a
, 1b are arranged adjacent to each other in parallel, but in this case, as shown in the figure, the leads 1a are formed to be inclined at a predetermined angle θ with respect to the leads 1b. Next, in the arrangement of only the TCP leads shown in FIG. 2, the pitch between the leads 1a and 1b is different in an actual product, but in order to facilitate understanding of the present invention,
They are shown in correspondence with the same pitch p0. In FIG. 3, 4 is a liquid crystal display element, 4b is a connection terminal of the liquid crystal display element 4, 5 is a printed circuit board, and 5a is a connection terminal of the printed circuit board 5. Here, the connecting terminals 5a and 4b are arranged at the same pitch p0 and the same inclination angle θ so as to correspond to the leads 1a and 1b in FIG. 2, but as shown in FIG. 3, the connecting terminals 5a and 4b are , the area centers of the terminals are relatively shifted by x (mm) in the terminal arrangement direction (X direction).

【0013】図4は、図2に示すTCPのリード1a,
1bの配列と、図3に示すプリント回路基板5の接続端
子5a,液晶表示素子4の接続端子4bの配列とを、互
いに接続するために重ね合わせた状態を示している。こ
の場合、両者の配列は、同一のピッチp0および傾斜角
度θで配列されているから、相対的に位置ずれのない場
合には、接続される端子同士は完全に重なり合うが、こ
こでは接続端子5aと4bとが、相対的に端子の配列方
向にx(mm)位置ずれした状態になっているため、接
続時にx(mm)の位置ずれがそのまま残り、リード1
bと接続端子4bとは完全に重なり合うものの、リード
1aと接続端子5aとの全接続個所が位置ずれした状態
になる。
FIG. 4 shows the TCP leads 1a and 1a shown in FIG.
1b and the arrangement of the connecting terminals 5a of the printed circuit board 5 and the connecting terminals 4b of the liquid crystal display element 4 shown in FIG. 3 are shown superimposed for connection to each other. In this case, since both are arranged with the same pitch p0 and the same inclination angle θ, if there is no relative positional shift, the connected terminals would completely overlap each other, but here, the connecting terminal 5a and 4b are relatively shifted by x (mm) in the terminal arrangement direction, so the x (mm) positional shift remains as is when connecting, and lead 1
Although the leads 1a and the connecting terminals 4b completely overlap each other, all the connection points between the leads 1a and the connecting terminals 5a are misaligned.

【0014】図5は、図4に示す位置ずれした接続状態
から、TCPをリード1a,1b間を結ぶY方向へy(
mm)移動させて、リード1bと接続端子4b間および
リード1aと接続端子5a間を、前記x(mm)の位置
ずれを解消して完全に重なり合うように位置補正した状
態を示したものである。このように、一方の辺の接続端
子(1a,5a)の配列を、他方の辺に形成された接続
端子(1b,4a)の配列に対して所定の角度θだけ傾
斜させて形成する接続端子配列構造としたことにより、
前記接続端子の配列間にX方向に相対的な位置ずれを有
していても、TCPのリード1a,1bを端子の接続部
において前記Y方向へ移動するだけで前記X方向の位置
ずれを解消し、容易に、しかも高精度に位置決めして接
続をすることが可能になる。
FIG. 5 shows how the TCP is moved from the misaligned connection state shown in FIG.
This figure shows a state in which the positions have been corrected by moving the lead 1b and the connecting terminal 4b and between the lead 1a and the connecting terminal 5a so that they completely overlap by eliminating the positional deviation of x (mm). . In this way, the connection terminal is formed by tilting the arrangement of the connection terminals (1a, 5a) on one side by a predetermined angle θ with respect to the arrangement of the connection terminals (1b, 4a) formed on the other side. By using an array structure,
Even if there is a relative positional deviation in the X direction between the arrangement of the connection terminals, the positional deviation in the X direction can be resolved by simply moving the TCP leads 1a and 1b in the Y direction at the terminal connection part. This makes it possible to easily and accurately position and connect.

【0015】なお、前記位置補正のためのTCPの移動
は、従来の通常のTCPの移動装置を使用することによ
り容易に可能であり、また、前記移動量yと位置ずれ量
xとの間には、y=x・cot(θ)の関係がある。こ
こで、角度θは、規定されたり制限されたりするもので
はないが、図2に示すように、角度θのときの隣接する
各リード1a間のピッチpは、θ=0のときのピッチp
0より短くなり、両者の関係はp=p0・cos(θ)
となる。このことから例えば、cos(θ)>0.9と
するためには、θ<25.8°の条件を満たすようにす
ればよい。一方、角度θを、例えば1°或るいは2°の
ように非常に小さくした場合には、前記したy=x・c
ot(θ)の関係から、ずれ量xが小さくても移動量y
が非常に大きくなる。このため、移動量yはそれ程大き
くしないようにすることが望ましく、1例として、co
t(θ)<10としてθ>5.7°の条件とすると、ず
れ量xが0.1mmの場合に、移動量yは1.0mm以
下となる。
[0015] The movement of the TCP for the position correction is easily possible by using a conventional normal TCP movement device, and there is also a difference between the movement amount y and the positional deviation amount x. has the relationship y=x·cot(θ). Here, the angle θ is not specified or limited, but as shown in FIG. 2, the pitch p between adjacent leads 1a when the angle θ is equal to the pitch p when θ=0.
It becomes shorter than 0, and the relationship between the two is p=p0・cos(θ)
becomes. From this, for example, in order to set cos(θ)>0.9, it is sufficient to satisfy the condition θ<25.8°. On the other hand, when the angle θ is made very small, for example 1° or 2°, the above-mentioned y=x・c
From the relationship ot(θ), even if the amount of deviation x is small, the amount of movement y
becomes very large. For this reason, it is desirable that the amount of movement y is not so large; for example, co
Assuming that t(θ)<10 and θ>5.7°, when the amount of deviation x is 0.1 mm, the amount of movement y will be 1.0 mm or less.

【0016】つぎに、図6は液晶表示装置の概略図で、
前記図1に示すTCP3を順次実装している状態を示す
図である。端子接続は、TCP3における一方の辺に傾
斜させて配列したリード1aとプリント回路基板5にお
ける同じ角度に傾斜させて配列した接続端子5a(図示
していない)とを接続し、同時に、TCP3における他
方の辺に傾斜させないで配列したリード1bと液晶表示
素子4に配列した接続端子4b(図示していない)とが
接続される。本液晶表示装置においても、前記図1ない
し図5において説明したと同様の作用・効果を奏するか
ら、位置決め作業が容易でしかも作業時間を短縮するこ
とができ、実装コストを低減させるとともに製作効率を
向上させ、しかも多ピン・狭ピッチ化にも対応すること
が可能になる。また、液晶表示素子4およびプリント回
路基板5の接続端子パターンに要求される形成精度を高
くする必要がなく、このため、低コストの液晶表示素子
4およびプリント回路基板5を使用することができる効
果も有する。
Next, FIG. 6 is a schematic diagram of a liquid crystal display device.
FIG. 2 is a diagram showing a state in which TCP3 shown in FIG. 1 is sequentially implemented. Terminal connection is performed by connecting the leads 1a arranged at an angle on one side of the TCP 3 to connection terminals 5a (not shown) arranged at an angle at the same angle on the printed circuit board 5, and at the same time connecting the leads 1a arranged at an angle on one side of the TCP 3 to the connection terminals 5a (not shown) arranged at an angle at the same angle on the printed circuit board 5. The leads 1b arranged without being inclined on the sides are connected to connection terminals 4b (not shown) arranged on the liquid crystal display element 4. This liquid crystal display device also has the same functions and effects as explained in FIGS. 1 to 5 above, so positioning work is easy and work time can be shortened, reducing mounting costs and manufacturing efficiency. Moreover, it becomes possible to cope with a large number of pins and a narrower pitch. Further, there is no need to increase the formation accuracy required for the connection terminal patterns of the liquid crystal display element 4 and the printed circuit board 5, and therefore, the effect is that low-cost liquid crystal display elements 4 and the printed circuit board 5 can be used. It also has

【0017】なお、図示しないが、前記図6に示すTC
Pを実装した液晶表示装置のほかに、対向している回路
基板の入出力端子を互いに接続するための部材、例えば
、内部に狭ピッチの多数の接続用端子および端子間配線
の形成されたフレキシブル回路基板等においても、前記
対向する一方の回路基板に接続する接続端子を、他方の
回路基板に接続する接続端子に対して所定の角度に傾斜
させて形成することにより、前述したと同様の作用・効
果を奏することができる。
Although not shown, the TC shown in FIG.
In addition to liquid crystal display devices mounted with P, there are also members for connecting the input and output terminals of opposing circuit boards to each other, such as flexible panels with a large number of narrow-pitch connection terminals and inter-terminal wiring formed inside. In circuit boards, etc., the same effect as described above can be achieved by forming the connection terminals connected to one of the opposing circuit boards at a predetermined angle with respect to the connection terminals connected to the other circuit board.・It can be effective.

【0018】[0018]

【発明の効果】以上説明したように本発明は、一方の辺
の接続端子の配列を、他方の辺に形成された接続端子の
配列に対して所定の角度θだけ傾斜させて形成する接続
端子配列構造としたから、接続される多ピン・狭ピッチ
の端子群間に、たとえ相対的な位置ずれを有していても
、容易かつ高精度に位置決めして接続することができる
効果を奏する。
As explained above, the present invention provides a connection terminal in which the arrangement of connection terminals on one side is inclined by a predetermined angle θ with respect to the arrangement of connection terminals formed on the other side. Because of the arrangement structure, even if there is a relative positional shift between the multiple-pin, narrow-pitch terminal groups to be connected, it is possible to easily and accurately position and connect them.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明のテープキャリアパッケージの一実施例
を示す図である。
FIG. 1 is a diagram showing an embodiment of a tape carrier package of the present invention.

【図2】図1のリードのみの配列状態を示す図である。FIG. 2 is a diagram showing an arrangement state of only the leads in FIG. 1;

【図3】液晶表示素子とプリント回路基板との接続端子
のみの配列状態を示す図である。
FIG. 3 is a diagram showing the arrangement of only connection terminals between a liquid crystal display element and a printed circuit board.

【図4】図2に示すリードと図3に示す接続端子との位
置ずれのある配列状態を示す図である。
4 is a diagram showing an arrangement state in which the leads shown in FIG. 2 and the connection terminals shown in FIG. 3 are misaligned; FIG.

【図5】図4の位置ずれを補正した後の接続状態を示す
図である。
FIG. 5 is a diagram showing a connection state after correcting the positional deviation in FIG. 4;

【図6】図1に示すTCPを実装した液晶表示装置の一
例を示す図である。
FIG. 6 is a diagram showing an example of a liquid crystal display device in which the TCP shown in FIG. 1 is mounted.

【符号の説明】[Explanation of symbols]

1…テープフィルム、1a…リード(入力側)、1b…
(出力側)、1c…ベースフィルム、1d…配線パター
ン、2…LSIチップ、3…テープキャリアパッケージ
(TCP)、4…液晶表示素子、4b…液晶表示素子の
接続端子、5…プリント配線基板、5a…プリント配線
基板の接続端子。
1...Tape film, 1a...Lead (input side), 1b...
(Output side), 1c... Base film, 1d... Wiring pattern, 2... LSI chip, 3... Tape carrier package (TCP), 4... Liquid crystal display element, 4b... Connection terminal of liquid crystal display element, 5... Printed wiring board, 5a...Connection terminal of printed wiring board.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】  平行に相対する2辺を有し、該各辺に
多数の接続端子を平行に隣接させて配列した電子部品に
おいて、前記一方の辺の接続端子を、他方の辺に形成さ
れた接続端子に対して所定の角度に傾斜させて形成した
ことを特徴とする電子部品の接続端子配列構造。
1. An electronic component having two parallel opposing sides and in which a large number of connection terminals are arranged adjacent to each other in parallel on each side, wherein the connection terminals on one side are formed on the other side. 1. A connection terminal array structure for electronic components, characterized in that the connection terminals are formed at a predetermined angle with respect to the connection terminals.
【請求項2】  多ピンのリードを有する配線パターン
を形成したテープフィルムと、該テープフィルムに金属
性突起状電極のバンプを介して実装されたLSIチップ
とからなるテープキャリアパッケージにおいて、前記実
装されたLSIチップを挾む一方の辺のリードを、他方
の辺に形成されたリードに対して所定の角度に傾斜させ
て形成したことを特徴とするテープキャリアパッケージ
2. A tape carrier package comprising a tape film on which a wiring pattern having multi-pin leads is formed, and an LSI chip mounted on the tape film via bumps of metal protruding electrodes, wherein the mounted A tape carrier package characterized in that the leads on one side that sandwich an LSI chip are formed to be inclined at a predetermined angle with respect to the leads formed on the other side.
【請求項3】  請求項2記載のテープキャリアパッケ
ージを、液晶表示素子の接続端子と、該接続端子に対応
するプリント回路基板の接続端子との間に介設してなる
液晶表示装置。
3. A liquid crystal display device comprising the tape carrier package according to claim 2 interposed between a connection terminal of a liquid crystal display element and a connection terminal of a printed circuit board corresponding to the connection terminal.
JP3127258A 1991-05-30 1991-05-30 Connection terminal arrangement structure of electronic components, tape carrier package, and liquid crystal display device using the tape carrier package Expired - Fee Related JP3067038B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3127258A JP3067038B2 (en) 1991-05-30 1991-05-30 Connection terminal arrangement structure of electronic components, tape carrier package, and liquid crystal display device using the tape carrier package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3127258A JP3067038B2 (en) 1991-05-30 1991-05-30 Connection terminal arrangement structure of electronic components, tape carrier package, and liquid crystal display device using the tape carrier package

Publications (2)

Publication Number Publication Date
JPH04352132A true JPH04352132A (en) 1992-12-07
JP3067038B2 JP3067038B2 (en) 2000-07-17

Family

ID=14955596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3127258A Expired - Fee Related JP3067038B2 (en) 1991-05-30 1991-05-30 Connection terminal arrangement structure of electronic components, tape carrier package, and liquid crystal display device using the tape carrier package

Country Status (1)

Country Link
JP (1) JP3067038B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6822720B2 (en) * 2000-03-09 2004-11-23 Advanced Display Inc. Liquid crystal display having improved connection between TFT and TCP
US7154187B2 (en) 2003-12-24 2006-12-26 Seiko Epson Corporation Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
JP2007156448A (en) * 2005-12-07 2007-06-21 Lg Phillips Lcd Co Ltd Liquid crystal display device
US7279794B2 (en) 2003-12-12 2007-10-09 Seiko Epson Corporation Semiconductor device and electronic device, and methods for manufacturing thereof
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6822720B2 (en) * 2000-03-09 2004-11-23 Advanced Display Inc. Liquid crystal display having improved connection between TFT and TCP
US7102721B2 (en) 2000-03-09 2006-09-05 Advanced Display Inc. Liquid crystal display having different shaped terminals configured to become substantially aligned
US7279794B2 (en) 2003-12-12 2007-10-09 Seiko Epson Corporation Semiconductor device and electronic device, and methods for manufacturing thereof
US7154187B2 (en) 2003-12-24 2006-12-26 Seiko Epson Corporation Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
US7525200B2 (en) 2003-12-24 2009-04-28 Seiko Epson Corporation Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
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US7872358B2 (en) 2003-12-24 2011-01-18 Seiko Epson Corporation Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
US8338965B2 (en) 2003-12-24 2012-12-25 Seiko Epson Corporation Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
JP2007156448A (en) * 2005-12-07 2007-06-21 Lg Phillips Lcd Co Ltd Liquid crystal display device
JP4554584B2 (en) * 2005-12-07 2010-09-29 エルジー ディスプレイ カンパニー リミテッド Liquid crystal display
EP2957951A1 (en) * 2014-06-17 2015-12-23 Samsung Display Co., Ltd. Array substrate and method of mounting integrated circuit using the same
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US9591754B2 (en) 2014-06-17 2017-03-07 Samsung Display Co., Ltd. Array substrate and method of mounting integrated circuit using the same
US9917113B2 (en) 2014-06-17 2018-03-13 Samsung Display Co., Ltd. Array substrate and method of mounting integrated circuit using the same
US10373987B2 (en) 2014-06-17 2019-08-06 Samsung Display Co., Ltd. Array substrate and method of mounting integrated circuit using the same
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US11081503B2 (en) 2014-06-17 2021-08-03 Samsung Display Co., Ltd. Array substrate and method of mounting integrated circuit using the same
US11967597B2 (en) 2014-06-17 2024-04-23 Samsung Display Co., Ltd. Array substrate and method of mounting integrated circuit using the same
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