JPH07134304A - Production of liquid crystal module - Google Patents

Abstract

PURPOSE:To improve the mass productivity of a liquid crystal module. CONSTITUTION:A driving circuit part is integrally formed on a carrier tape by aligning a row driver IC and a column driver IC respectively to the respective ILB terminal parts of wiring patterns formed in plurality at prescribed intervals to the carrier tape and packaging these ICs thereto (step 1). An operating device for inspection is connected in this state to the terminal part for inspection and the operation of the driving circuit part is inspected (step 2). Liquid crystal cells are then aligned and packaged to the respective OLB terminal parts (step 3). The operating device for inspection is connected to the respective terminal parts for inspection in this state and the operations of the driving circuit part and the liquid crystal cells are inspected (step 4). This carrier tape is blanked along a prescribed outside shape line and the blanked parts are separated from the carrier tape, thereby the liquid crystal module is constituted (step 5). As a result, the integrated circuits for driving and the liquid crystal cells are easily and exactly aligned.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a liquid crystal module in which a liquid crystal cell is connected to a drive circuit portion formed on a base material.

[0002]

2. Description of the Related Art Conventionally, for example, as shown in the flow chart of FIG. 3, a method of manufacturing a liquid crystal module in which a liquid crystal cell is connected to a drive circuit portion formed on a base material is known.

In this manufacturing method, first, a strip-shaped film having a plurality of circuit patterns formed at predetermined intervals is prepared, and the so-called row driver I is formed on the strip-shaped film.
A so-called IL that mounts a driving integrated circuit such as a C and a column driver IC by aligning them.
A B (Inner Lead Bonding) process is performed to integrally form a drive circuit portion on the film (step 1). Then, the operation of the drive circuit unit is inspected by using the inspection operation device (step 2). Next, this band-shaped film is punched at a predetermined position, and the drive circuit section is contacted and separated from this film, so-called TAB (Tape Automated Bonding) -IC.
Form (step 3).

A so-called OLB (Outer Lead Bonding) process for aligning and mounting a liquid crystal cell in which a liquid crystal is sealed in the TAB-IC type drive circuit section through an ACF (Anisotropic Condlictive Film) or the like is mounted. Then, a liquid crystal module (liquid crystal cell with TAB) is formed (step 4). Next, the operation of the liquid crystal module is inspected using the inspection operation device (step 5).

[0005]

However, in the above-mentioned conventional structure, when the liquid crystal cell is aligned and mounted on the drive circuit section of the TAB-IC type separated from the film, the drive circuit section and the liquid crystal are mounted. Although it is necessary to align the cells with each other, this drive circuit unit and the liquid crystal cells are aligned with each other by a band-shaped film having a circuit pattern formed thereon,
The problem is that it is more complicated than alignment with the driving integrated circuit and the mass productivity of the liquid crystal module is reduced.

The present invention has been made in view of the above circumstances, and provides a method of manufacturing a liquid crystal module in which a driving integrated circuit and a liquid crystal cell are easily and accurately aligned to improve mass productivity. With the goal.

[0007]

According to a method of manufacturing a liquid crystal module of the present invention, a driving circuit part is integrally formed with the base material by connecting a driving circuit component to a circuit pattern formed on the base material. A liquid crystal cell is connected to the drive circuit section, and after the liquid crystal cell is connected, the base material of the drive circuit section is cut at a predetermined position to form a liquid crystal module.

[0008]

In the liquid crystal module manufacturing method of the present invention, the liquid crystal cell is formed by connecting the liquid crystal cell to the drive circuit portion integrally formed with the base material and then cutting the base material at a predetermined position. The alignment at the time of connecting the liquid crystal cell to the drive circuit portion is performed in the same manner as the alignment at the time of connecting the drive circuit component to the circuit pattern formed on the base material.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The construction of one embodiment of the method for manufacturing a liquid crystal module of the present invention will be described below with reference to the drawings.

In FIG. 2, reference numeral 1 is a carrier tape as a base material, and this carrier tape 1 is formed in a strip shape from a flexible polyimide film or the like. Then, in the vicinity of both side edges of the carrier tape 1, feed holes 2 that engage with feed pawls of a not-shown feeding device are formed at predetermined intervals along the feeding direction.

Further, display holes (device holes) 3 for a display screen are located at one side portion between the feed holes 2 facing each other in the width direction of the carrier tape 1 at predetermined intervals along the transport direction. A liquid crystal cell (not shown) in which liquid crystal is injected between transparent substrates having transparent electrodes is mounted in the display hole 3. Furthermore, the wiring pattern (lead frame) 5 is formed so as to surround each display hole 3.
Are integrally formed on the carrier tape 1.

The wiring pattern 5 includes a row driver IC circuit pattern 6 forming a circuit pattern formed on the other side of each display hole 3, and a circuit pattern formed above and below each display hole 3. The circuit pattern 7 for the column driver IC to be configured is provided. Furthermore, each circuit pattern 6 and 7 has an OLB (Outer LeadBoard) facing each display hole 3.
nding) terminal portions 6a, 7a and these OLB terminal portions 6a, 7a
ILB (Inner Lead Bonding) terminal part partially connected to
6b, 7b and interface terminal portions 6c, 7c partially connected to the respective ILB terminal portions 6b, 7b are formed, and the inspection terminal portion 8 is extended from each of the interface terminal portions 6c, 7c. Has been done.

The inspection terminal portion 8 is formed so as to expand from the interface terminal portions 6c and 7c, and has a pitch dimension larger than the pitch dimension of the interface terminal portions 6c and 7c. Therefore, the inspection operation device can be easily connected.

Then, each IL is attached to the carrier tape 1.
By mounting a driving integrated circuit such as a row driver IC11 and a column driver IC12, which form a driving circuit component in a state of being connected to the B terminal portions 6b and 7b, respectively,
The drive circuit unit 14 is formed. Further, by mounting a liquid crystal cell on the carrier tape 1 in a state of being connected to each of the OLB terminal portions 6a and 7a, and punching the carrier tape 1 along a predetermined outline 15 having a substantially rectangular shape,
Liquid crystal module (display module) connected to an external device via each interface terminal 6c, 7c
Is configured.

Next, the manufacturing process of the above embodiment will be described with reference to the flow chart shown in FIG.

First, the respective ILB terminal portions 6b and 7b of the respective circuit patterns 6 and 7 formed on the carrier tape 1 at predetermined intervals.
Then, the row driver IC 11 and the column driver IC 12 are aligned with each other and connected by a so-called ILB process to integrally form the drive circuit portion 14 on the carrier tape 1 (step 1).

In this state, an inspection operating device (not shown) is connected to each inspection terminal portion 8 to inspect the operation of the drive circuit portion 14 (step 2).

Then, the OLB terminal portions 6a and 7a of the circuit patterns 6 and 7 are aligned with the terminals of the liquid crystal cell, and the AC
Connection is made by a so-called OLB process via F (Anisotropic Condlictive Film) or the like (step 3).

In this state, the above-mentioned operation device for inspection is connected to each inspection terminal portion 8 to inspect the operation of the drive circuit portion 14 and the liquid crystal cell (step 4).

Then, the carrier tape 1 is punched along a predetermined outline 15 and is brought into contact with and separated from the carrier tape 1, so that the liquid crystal module connected to an external device by the interface terminal portions 6c and 7c ( A liquid crystal cell with TAB) is constructed (step 5).

In this state, each inspection terminal portion 8 to which the inspection operation device is connected is cut from the interface terminal portions 6c and 7c and left on the carrier tape 1 side.

According to the manufacturing method of this embodiment, the drive circuit portion 14 formed integrally with the carrier tape 1 is
After connecting the liquid crystal cells, the carrier tape 1 is punched along a predetermined outline 15 to form a liquid crystal module. Therefore, when the liquid crystal cells are connected to the drive circuit section 14, the carrier tape 1 is aligned. This can be performed in the same manner as the alignment when connecting the driver ICs 11 and 12 to the formed circuit patterns 6 and 7.

That is, as in the conventional case, each O of the drive circuit section of the TAB-IC type which is contacted and separated from the carrier tape 1.
It is not necessary to align and connect the liquid crystal cells for each of the LB terminal portions 6a and 7a, and only align the liquid crystal cells in the vertical direction and the horizontal direction with respect to the carrier tape 1. 14 and the liquid crystal cell can be aligned. Therefore, the number of steps for aligning the liquid crystal cell and the drive circuit unit 14 can be reduced and facilitated, and the precision in aligning the liquid crystal cell and the drive circuit unit 14 can be improved, thereby improving the mass productivity of the liquid crystal module. Can be improved.

The drive circuit section 14 is attached to the carrier tape 1.
Since the liquid crystal cell is connected to the drive circuit section 14 in a state where the liquid crystal cell is integrally formed with the carrier tape 1, if the liquid crystal cell is aligned with the carrier tape 1, the positional relationship between the liquid crystal cell and the drive circuit section 14 becomes The dimensional accuracy is affected only by the expansion and contraction of the carrier tape 1 made of a polyimide film and the positional accuracy of the wiring pattern 5 formed on the carrier tape 1. Therefore, the liquid crystal cell and drive circuit section
The accuracy of alignment with 14 can be greatly improved.

Further, according to the manufacturing method of this embodiment, before and after mounting the liquid crystal cell, the operation inspection of the drive circuit section 14 and the liquid crystal cell can be performed using the same inspection terminal portion 8. That is, in the conventional configuration, although the input / output electric signal for inspection of the drive circuit unit 14 is common before and after mounting the liquid crystal cell, at the time when the drive circuit unit 14 is punched out, the inspection terminal unit 8 Are disconnected from the drive circuit unit 14. Therefore, in the inspection after mounting the liquid crystal cell, it is necessary to prepare a dedicated operating device for inspection that can be connected to the interface terminal portions 6c and 7c. On the other hand, in the configuration of the present embodiment, almost the same operating device for inspection connected to the inspection terminal portion 8 can be used before and after mounting the liquid crystal cell, and the facility cost can be reduced.

Further, according to the manufacturing method of this embodiment, the inspection terminal portion 8 having a larger pitch dimension than the interface terminal portions 6c and 7c can be used even in the operation inspection after mounting the liquid crystal cell. It is possible to easily connect the inspection operation device and prevent the interface terminal portions 6c and 7c from being damaged during the operation inspection.

In the above embodiment, the liquid crystal cell type with TAB is explained, but in addition, COF
(Chip On FPC) and the like can be applied to all methods of manufacturing a liquid crystal module in which an integrated circuit is once mounted on a film and connected to a liquid crystal cell.

[0028]

According to the method of manufacturing a liquid crystal module of the present invention, after connecting the liquid crystal cell to the drive circuit portion formed integrally with the base material, the base material is cut at a predetermined position. Therefore, the alignment when connecting the liquid crystal cell to the drive circuit unit can be performed in the same manner as the alignment when connecting the drive circuit component to the circuit pattern formed on the base material. Therefore, the alignment of the liquid crystal cell and the drive circuit unit can be facilitated, the alignment precision of the liquid crystal cell and the drive circuit unit can be improved, and the mass productivity of the liquid crystal module can be improved.

[Brief description of drawings]

FIG. 1 is a flowchart showing an embodiment of a method of manufacturing a liquid crystal module of the present invention.

FIG. 2 is a plan view showing a manufacturing process of the same liquid crystal module.

FIG. 3 is a flowchart showing a conventional method for manufacturing a liquid crystal module.

[Explanation of reference numerals] 1 carrier tape as a base material 6 circuit pattern for row driver IC which constitutes a circuit pattern 7 circuit pattern for column driver IC which constitutes a circuit pattern 11 row driver IC 12 which constitutes a driving circuit component 12 for driving Column driver IC that constitutes circuit parts 14 Drive circuit

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Daisuke Nakajima Inventor, Daisuke Nakajima 7-1, Nisshin-cho, Kawasaki-ku, Kawasaki-shi, Kanagawa Toshiba Electronics Engineering Co., Ltd.

Claims (1)

[Claims] 1. A drive circuit part is connected to a circuit pattern formed on a base material to form a drive circuit part integrally with the base material, and a liquid crystal cell is connected to the drive circuit part. A method for manufacturing a liquid crystal module, comprising forming the liquid crystal module by cutting the base material of the drive circuit section at a predetermined position after connecting the cells.