JPH04185000A - Mounting method for electric component - Google Patents

Abstract

PURPOSE:To suppress a decline in mounting accuracy caused by heat by positioning the end section of the lead terminal group of electronic components to the end section of the electrode group of a substrate after recognition, and then, aligning the central part of the terminal group with the center electrode of the electrode group after detection. CONSTITUTION:The end section of the lead terminal group of mounted electronic components, such as IC, etc., is recognized through the first TV camera, etc., and aligned with the end section of the electrode group of a substrate, such as LCD, etc., by using the second TV camera, etc. After the alignment, the central part of the terminal group is detected and aligned with the center electrode of the electrode group. After confirming the end section of the terminal row, the central part of the terminal group is properly aligned with the central part of the terminal row and, after positioning, the terminal group is connected to the electrode row by thermocompression bonding by using a thermocompression bonding tool. Since the terminal group is finally aligned with the electrode group by means of the central part, a decline in accuracy caused by the bonding heat can be suppressed substantially without using any device having a high-accuracy structure.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides an IC on a circuit board having patterned electrodes.
The present invention relates to a method for aligning and mounting electrical components having a large number of lead terminals, such as the following.

[Prior Art] Conventionally, when mounting a packaged RC on a substrate with patterned electrodes, first the terminals of the substrate are recognized and transported to the bonding position. Separately, the lead terminals of the IC are recognized and transported to the bonding position. At this position, the IC is bonded onto the substrate using a thermocompression bonding tool or other bonding method to complete the mounting. Further, there are cases where detailed positioning of the substrate and the IC is performed at the bonding position before bonding. Note that the terminals are provided with connection means such as solder or ACF.

[Problems to be Solved by the Invention] However, in the conventional technique described above, as the pitch between the connection terminals between the board and the IC becomes smaller, high precision is also required of the mounting apparatus. However, the heat generated when the substrate stage and the IC transport stage are moved engraves the stage moving means (for example, a ball screw), deteriorating the transport accuracy, and furthermore, the heat of the crimping roots deteriorates the accuracy of the apparatus. As described above, even if an apparatus is originally highly accurate, if there is a factor that deteriorates the accuracy during use, the terminals of the board and the lead terminals of the IC cannot be accurately aligned at the bonding position.

Further, even when detailed positioning is performed again at the joining position, the terminal may be shifted by one position. If you align the terminals at the end of the terminal group to be connected, you can prevent the terminals from shifting by one month, but since the pitch of the terminals on the board and the pitch of the IC terminals do not necessarily match, For the terminals on the side, the positional deviation between the terminals on the board and the terminals on the IC becomes large. Therefore, when aligning a large, fine-pitch IC, it is desirable to align at the center of the terminal group.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a method for mounting electrical components that prevents deterioration in accuracy due to heat.

[Means and Effects for Solving the Problems] In order to achieve the above object, according to the present invention, the ends of a group of lead terminals of an electrical component are first recognized and positioned, and then the central portion of the group of lead terminals is recognized and positioned. Align the lead terminals and board terminals with.

Thereby, it is possible to suppress a decrease in accuracy due to heat. Furthermore, even if the mounting device is stretched by heat and its accuracy deteriorates, the transport distance that is affected by this is made as short as possible, and the board and IC can be bonded without being affected by the aforementioned deterioration of accuracy due to heat.

[Example] A first example of the present invention will be described using FIGS. 1 to 4. In FIG. 1, 1 is a liquid crystal display panel (LCD);
2 is a TAB-IC for driving the LCD, 3 is a first television camera for detecting the terminal position of the TAB-IC, and 4 is a second television camera for detecting the position of the LCD and the position of the LCD terminal and the TAB-IC terminal. TV camera. LCD and TAB
- The IC transport device is not shown. In addition, TAB-
An IC is an IC manufactured using a bonding method in which conductor leads repeatedly formed on a tape-like film and corresponding portions of electrodes on a semiconductor chip are overlapped and bonded using appropriate means to simultaneously connect multiple wiring lines. .

In the above configuration, the X, Y, and θ positions of the LCD 1 provided with the ACF on the terminal are confirmed by the first camera 4, and the TAB
- transported so that one end of the terminal group 5 (FIG. 4) to which the IC 2 is connected is located directly below the camera 4 (FIG. 1);
Here, the ends of the terminal group are confirmed again by image recognition.

Next, the TAB-ICs 2, which are individually separated from the long tape by known means, are transported directly below the second camera 3 by a transport means (not shown), and the X, Y, and θ positions of the IC terminals are determined. Thereafter, the terminals are transported so that one end of the row of terminals is directly below the first camera 4 (FIG. 2). At this position, the position of one end of the terminal row of the TAB-IC 2 is confirmed again.

Next, T
The AB-IC 2 is moved and transported so that the center of the terminal row is directly below the first camera 4 (FIG. 3). At the same time, the LCD 1 is transported so that the center of the terminal group 5 is directly below the camera 4. Here, the center terminal of the terminal group 5 of the LCD and the center terminal of the terminal row of the TAB-IC 2 are roughly aligned accurately, and then they are heat-pressed by a thermocompression tool to complete the bonding.

5, 6 and 7 show a second embodiment of the invention. 6 is a circuit board (PCB) with patterned electrodes.
), 7 is the QFP-IC to be mounted on the PCB 6, 8 is the first television camera for detecting the position of the lead terminal of the QFP-IC 7, 9 is the position detection of the PCB 6 and the terminal of the PCB and Q
This is a second television camera that detects the terminal of the FP-IC. Here, the transport mechanism for the PCB 6 and QFP-IC 7 and the movement mechanism for the television camera 9 are omitted.

In the above configuration, the second camera 9 detects x, y of the PCB 6 with preliminary solder and flux provided on the connection terminals.
, θ are confirmed, and the PCBS is transported so that one end of the terminal group to which the QFP-IC 7 is connected is directly below the camera 9 (FIG. 5). Next, the QFP-IC 7 is taken out from the IC tray by a transport means (not shown) and transported directly below the first camera 8 . Here, the X, Y, and θ positions of the terminal row are confirmed, and then the terminal row is transported so that one end is directly below the second camera 9 (FIG. 6).

At this position, connect the ends of the terminal group on the PCBS and the QFP-IC7.
Align the ends of the terminal rows. Next, the camera 9 is moved to the center of the terminal row.

(Fig. 7), at this position, connect the terminal of PCB6 again to QFP-
Align the terminals of IC7 accurately. Furthermore, QFP-IC
Regarding the terminal row in the direction perpendicular to the above-mentioned terminal row, similarly, look at the center of the terminal row with a camera and connect the terminals of PCB6 and QFP-I.
Align the C7 terminal accurately. After the alignment is completed, heat and pressure bonding is performed using a thermocompression bonding tool to complete the bonding.

C Effects of the Invention C As explained above, by first checking the ends of the terminal row and then performing final alignment at the center of the terminal row,
Inugi〈Without requiring high precision in the position after moving,
Deterioration of accuracy such as elongation due to heat of the mounting device can be avoided.

This allows high-precision mounting with inexpensive equipment without using equipment with a high-precision structure.

[Brief explanation of the drawing]

Figure 1 shows the first step in implementing the present invention, which is an LCD.
and TAB-IC position detection, Figure 2 is an explanatory diagram of the second process of confirming the ends of the LCD terminal group and the TAB-IC terminals, and Figure 3 is an illustration of the detection of the terminals at the center of the terminal row. 4 is a plan view of the LCD, FIG. 5 is an explanatory diagram of the first step of the second embodiment, and FIG. 6 is a plan view of the LCD.
FIG. 7 is an explanatory diagram of the second step of the embodiment, and FIG. 7 is an explanatory diagram of center alignment in the second embodiment. 1: LCD. 2: TAB-IC 3: First television camera; 4: Second television camera; 5: LCD connection terminal group; 6: PCB. 7: QFP-IC. 8: first television camera; 9: second television camera.

Claims (3)

[Claims] (1) In an electrode component mounting method in which each lead terminal of an electrical component having a group of lead terminals is aligned and bonded to an electrode group provided on a board, the ends of the group of lead terminals of the electrical component are first Detect the center of the lead terminal group and align the end with the end of the electrode group of the board to be bonded, then detect the center of the lead terminal group and align the lead terminal in the center with the electrode to be bonded in the center of the board. A mounting method for electrical components characterized by alignment. (2) The method for mounting an electrical component according to claim 1, wherein the electrical component is an IC component, and the substrate is a printed board or a liquid crystal display panel. (3) The method for mounting electrical components according to claim 1, characterized in that positioning is performed using an imaging means.