JPH04302200A - Component mounting device - Google Patents

Abstract

PURPOSE:To enable a row of leads and a row of terminals to be connected together keeping them accurately aligned with each other without slipping out of position. CONSTITUTION:A film carrier component 11 is made to stop on a liquid crystal cell 16, the image of the overlap of a row of leads 12 with a row of terminals 15 is picked up by a CCD camera 25 from below, and it is judged that the row of leads 12 deviates from the row of terminals 15 or not basing on the picture image data picked up by the camera 25. When it is found that the row of the leads 12 deviates from the row of the terminals 15, the film carrier component 11 is made to move by a mounting head basing on the detected amount of deviation to align the row of terminals 15 with the row of the leads 12.

Description

[Detailed description of the invention]

[Object of the invention]

0002

[Industrial Application Field] The present invention is directed to TAB (Tape Au
The present invention relates to a component mounting device that automatically mounts a film carrier component onto a board using a bonding technique.

0003

2. Description of the Related Art In recent years, component mounting apparatuses have been provided which automatically mount film carrier components (hereinafter referred to as TAB components) in which IC chips are mounted on carrier tapes onto substrates such as liquid crystal cells.

As shown in FIG. 8, this liquid crystal cell 2 has a terminal row 1 on its periphery, which is composed of a plurality of terminals 1a arranged in parallel, and a lead row 3 consisting of a plurality of leads 3a. The TAB component 4 having the above is adsorbed and transported by a mounting head (not shown), and mounted so that each terminal 1a and each lead 3a are connected to each other in an overlapping state via an anisotropic conductive film (not shown). It is supposed to be done.

In order to align each terminal 1a and each lead 3a during installation work, the liquid crystal cell 2 is set on a workbench in a positioned state.
At the same time, a TA punched from the carrier tape is placed at the component supply position where the mounting head obtains the TAB component 4.
In order to supply the B part 4 in a positioned state, a positioning mechanism including a CCD camera or the like is provided. With this configuration, each terminal 1a and each lead 3a are made to overlap each other without misalignment based on the TAB component 4 being attracted to the mounting head at a regular position.

[0006]

[Problems to be Solved by the Invention] However, if the TAB component 4 is simply positioned at the component supply position as described above, the TAB component 4 may become misaligned during subsequent movement of the TAB component 4, or Due to problems such as the accuracy of the stop position of the mounting head, the terminal row 1 and the lead row 3 may not always be connected in an accurate alignment state. In this case, there is a possibility that electrical connection failure between each terminal 1a and each lead 3a may occur.

In particular, as the pitch of the leads 3a of TAB components 4 has become narrower in recent years, there has been a demand for further improvement in mounting accuracy, and conventional devices have not been able to adequately meet this demand.

The present invention has been made in view of the above circumstances, and its object is to provide a component mounting apparatus that can improve mounting accuracy.

[Configuration of the invention]

0010

[Means for Solving the Problems] A component mounting apparatus of the present invention connects a film carrier component having a lead row to a board on which a terminal row is formed, with the lead row and the terminal row overlapping each other. and an imager that photographs the overlapping portion of the lead row and the terminal row when the lead row and the terminal row overlap, and detects the deviation between the lead row and the terminal row from the photographed image information obtained by this imager. It is characterized in that it is equipped with a judgment means for judging.

[0011]

According to the above means, the determining means determines the misalignment between the lead row and the terminal row based on the photographed image information of the overlapping portion of the lead row and the terminal row photographed by the image pickup device. In this case, the misalignment between the lead row and the terminal row is determined when they overlap, that is, when the connection is made, so the misalignment is determined in the so-called final state, where no misalignment will occur later. will be done. Therefore, for example, by correcting the position based on the judgment of this judgment means, accurate positioning can be performed.

0012

DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. 1 to 3. First, to briefly describe the film carrier component 11 (hereinafter referred to as TAB component 11) using TAB technology, as shown in FIG.
The component 11 is constructed by mounting an IC chip 14 onto a carrier tape 13 on which a lead array 12 made up of a large number of leads 12a is formed in advance. Although not shown in detail, a large number of TAB parts 11 are formed on one long carrier tape 13, and are separated and mounted individually by, for example, punching.

On the other hand, the liquid crystal cell 16, which is a substrate, has a terminal row 15 consisting of a large number of terminals 15a formed on its edge, and the TAB component 11 has a lead row 12 on one side thereof.
and the terminal row 15 are mounted so as to be electrically connected in a superimposed state via a transparent anisotropic conductive film (not shown).

Here, the TAB component 11 is attached to the liquid crystal cell 1.
The general structure of the entire component mounting apparatus 17 according to the present embodiment, which is mounted on the mounting device 6, will be briefly described with reference to FIG. Although not shown in detail, this component mounting device 17 includes a workbench 19 on which the liquid crystal cell 16 is set in a positioned state on a base 18, and a TAB component 11 supplied from a component supply mechanism 20, which will be described later, by suction. The device includes a mounting head (not shown) for mounting the liquid crystal cell 16 on the liquid crystal cell 16, a drive mechanism for moving the mounting head in the X and Y directions, and the like.

The component supply mechanism 20 supplies the TAB components 11
The carrier tape 13 is pulled out from a reel wound with a carrier tape 13 having a large number of carrier tapes, the TAB parts 11 are punched out from the carrier tape 13, and the punched TAB parts 11 are supplied to a supply position in a positioned state. There is. Each of the above-mentioned mechanisms is controlled by a control device 22 (see FIG. 2) mainly composed of a microcomputer according to a predetermined program, so that the mounting work of the TAB component 11 is automatically performed.

A visual recognition device 23 for positioning the lead row 12 and the terminal row 15 is incorporated in the component mounting apparatus 17 configured as described above. As shown in FIGS. 1 and 2, this visual recognition device 23 processes image information from an imager, for example, a CCD camera 25 equipped with a light source 24, which is disposed near the workbench 19. The image processing apparatus 26 includes an image processing device 26 and a monitor 27 that displays images taken by the camera 25.

The image processing device 26 includes the camera 25
An A/D converter circuit 28 that converts the image signal (analog signal) from the digital signal into a multi-gradation digital signal, an image memory 29 that stores the converted multi-gradation image signal, and an image memory 29 that stores the converted multi-gradation image signal. A D/A conversion circuit 30 that converts into a video signal (analog signal) for the monitor 27, a CPU 31 that executes control and processing, and a ROM 32 that stores programs and the like.
, a RAM 33, and an I/O 34 that interfaces with the control device 22.

Now, the component mounting apparatus 17 configured as described above transports the TAB component 11 to the top of the liquid crystal cell 16 using the mounting head based on a predetermined mounting program, so that the lead row 12 of the TAB component 11 is It is stopped so as to overlap the terminal row 15 of the liquid crystal cell 16 via an anisotropic conductive film,
In this state, crimping work is performed using a heating tool (not shown).

At this time, the visual recognition device 23
With the B component 11 stopped on the liquid crystal cell 16
As shown in FIG. 2, the overlapping portion of the lead row 12 and the terminal row 15 is photographed from below by the camera 25, and the misalignment between the lead row 12 and the terminal row 15 is determined from the photographed image information, that is, the presence or absence of misalignment (if the misalignment is acceptable). (whether or not it is within the range) and the amount of deviation. At this time, the RAM 33 of the image processing device 26 stores in advance data such as the number, width, and pitch of the leads 12a and terminals 15a for the lead row 12 and the terminal row 15 as reference values. The amount of deviation is detected by comparing the obtained photographed image information. In this way, the image processing device 26 functions as a determining means according to the present invention.

When a deviation is detected, the control device 22 causes the mounting head to move the TAB component 11 relative to the liquid crystal cell 16 based on the amount of deviation detected by the visual recognition device 23. The terminal row 15 and the lead row 12 are aligned by moving them. T.A.
After the B part 11 is moved, the same deviation as described above is detected again, and when the deviation disappears, the crimping operation using the heating tool is performed.

According to this embodiment, lead row 1
2 and the terminal row 15 are overlapped, that is, in a state where a connection is made, the amount of misalignment between the two is detected and aligned, so that the misalignment in the so-called final state where no misalignment occurs thereafter. The amount is detected and alignment is performed.

Therefore, at the conventional parts supply position, T
To position AB part 4, then TAB part 4.
Unlike the case where there is a risk of misalignment, this allows accurate positioning without errors. As a result, we were able to sufficiently improve mounting accuracy, and TAB
This makes it possible to sufficiently cope with the narrowing of the pitch of the leads 12a of the component 11.

Next, FIG. 4 shows a second embodiment of the present invention.
This will be described with reference to FIGS. Note that the same parts as in the first embodiment are given the same reference numerals, new illustrations and detailed explanations are omitted, and different points will be explained below.

This embodiment differs from the first embodiment in that a line sensor 41 as an imager is incorporated into the mounting head 42 instead of the CCD camera 25. As shown in FIG. 5, the bottom surface of the mounting head 42 is provided with an escape hole 43 in the center for allowing the IC chip 13 of the TAB component 11 to escape, and on both sides thereof.
A plurality of suction holes 44 are provided for suctioning one carrier tape 13 portion. And line sensor 4
1 is installed so as to extend along one side edge of the bottom surface of the mounting head 42 and not protrude from the bottom surface.

Thereby, the line sensor 41 is configured to take an image from above of the overlapping portion of the lead row 12 and the terminal row 15 extending in the direction in which the leads 12a are arranged, as shown in FIG. In this case, line sensor 41
That is, after the mounting head 42 has completed the crimping operation between the lead row 12 and the terminal row 15 and released the suction from the TAB component 11, it is moved above the overlapping portion.

The photographed image information obtained by this line sensor 41 is input to the image processing device 26 as in the first embodiment, and the deviation between the lead row 12 and the terminal row 15 is determined as shown in FIG. It is determined whether the product is within the allowable range (acceptable product) as shown in FIG. 7, or whether it is beyond the allowable range (rejected product) as shown in FIG. For rejected products, the installation work is performed again.

In this embodiment as well, since the amount of deviation is detected in the final state where the lead row 12 and the terminal row 15 are connected, the mounting accuracy can be sufficiently improved. It is something that can be done. Moreover, in this example,
Since the line sensor 41 is built into the mounting head 42, the device can be made more compact, and
Another advantage is that there is no need to separately provide a drive mechanism for moving the line sensor 41.

It should be noted that the present invention is not limited to the above-mentioned embodiments, but can be practiced with appropriate modifications within the scope of the gist.

[0029]

Effects of the Invention As is clear from the above description, the component mounting apparatus of the present invention includes an imager for photographing the overlapping portion of a lead row and a terminal row in an overlapping state, and the advantages obtained by this imager. Since the present invention is provided with a determining means for determining the misalignment between the lead row and the terminal row based on the captured image information, it is possible to improve the mounting accuracy.

[Brief explanation of the drawing]

FIG. 1 is an enlarged perspective view of essential parts showing a first embodiment of the present invention.

[Figure 2] Diagram schematically showing the overall configuration

[Figure 3] A perspective view showing the appearance of the component mounting device

FIG. 4 is an enlarged perspective view of main parts showing a second embodiment of the present invention.

[Figure 5] Bottom view of the mounting head

[Figure 6] Top view of the overlapping portion showing no misalignment between the lead row and the terminal row

[Fig. 7] A diagram equivalent to Fig. 6 showing the state of deviation.

[Fig. 8] Enlarged perspective view of main parts showing a conventional example

[Explanation of symbols]

11 is a film carrier component, 12 is a lead row, 15 is a terminal row, 16 is a liquid crystal cell (board), 17 is a component mounting device, 22 is a control device, 23 is a visual recognition device, 25 is a CCD
A camera (imaging device), 26 an image processing device (determination means),
41 is a line sensor (image pickup device), and 42 is a mounting head.

Claims (1)

[Claims] 1. An apparatus for mounting a film carrier component having a lead row on a board on which a terminal row is formed such that the lead row and the terminal row are connected in an overlapping state, wherein the lead row and the terminal row are connected to each other in an overlapping state. The lead array is characterized by comprising an imager that photographs the overlapping portion of the terminal array when the lead array is overlapped with the terminal array, and a determination means that determines the misalignment between the lead array and the terminal array from the photographed image information obtained by the imager. Component mounting equipment.