JPH11284304A - Connection terminal structure of circuit parts and terminal connecting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a connection terminal structure and a terminal connecting method by which the occurrence of such defective connection as the open/short, etc., can be prevented at the time of connecting circuit parts having connection terminals to each other. SOLUTION: Circuit parts have connection terminal line bundles each composed of a plurality of planar connection terminal lines 2 formed of conductive films on substrates A and B. At the time of connecting circuit parts to each other, the connection terminals 2 formed on the substrates A and B in such a way that the lengths of their connection terminal lines are made longer little by little as going toward the centers of the bundles the terminals 2 are bent to the outside of the bundles are superimposed upon the connection terminals 9 of an IC unit C which are formed in such a way that the lengths of their connection terminal lines are made shorter little by little as going toward the center of the bundle and the terminal 9 are bent to the inside of the bundle. In addition, the widths of the bent front end sections of the connection terminal lines are made broader than those of the other parts of the lines.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection terminal structure and a terminal connection method for circuit components, and more particularly, to a method for connecting a glass panel having wiring such as an optical sensor and a liquid crystal display element to an integrated circuit substrate. The present invention relates to a connection terminal structure and a terminal connection method for an integrated circuit component using a connection integrated circuit unit.

[0002]

2. Description of the Related Art For electrical connection between a glass panel having wiring such as an optical sensor and an integrated circuit board, a sheet-like integrated circuit unit for connection (IC chip or the like is formed on the upper surface of a resin film by a conductive film. A unit bonded to a metal lead foil, so-called TAB: Tape
It is known to use Automated Bonding), but this unit has a single-layer structure in which a conductive film is formed only on one surface of a resin film. The connection integrated circuit unit (hereinafter, IC)
The connection between the glass panel and the integrated circuit substrate by the unit) is required to maintain a reliable connection state in handling at the time of mounting, and therefore must be joined with high adhesive strength.

[0003] This point will be described in detail below with reference to the structure of the conventional example shown in FIGS.

FIG. 4 is a schematic cross-sectional view of a structure in which two substrates (a glass panel A and an integrated circuit substrate B) are connected by an IC unit C. In FIG.
The chip 11 is a conductive film.

FIG. 5 is an exploded perspective view of the connection structure of FIG. 4, in which a substrate (glass panel A and integrated circuit substrate B) is mounted on an IC.
FIG. 3 is an exploded view showing the structure connected by the unit C in an exploded manner. In the figure, reference numeral 1 denotes a connection terminal portion, and 2 denotes each connection terminal.

FIG. 6 is an enlarged plan view of the connection terminal structure of the substrate A or B and the connection terminal structure of the IC unit C. In FIG.
Is a connection terminal of the substrate A or B, 3 is a connection terminal of the IC unit, 4 is a connection terminal of the IC unit, and 5 is a sheet of the IC unit.

In each of the connection terminal portions 1 and 3 in FIG. 6, a large number of connection terminals 2 and 4 made of a conductive film are formed in a line, and correspond to each other on a one-to-one basis. These connection terminals 2 and 4 (for example, glass panel A and IC
The unit C or the connection terminals of the circuit board B and the IC unit C) are electrically connected to each other by maintaining their strength by bonding them together by thermocompression bonding or the like in a state where the respective terminal surfaces are overlapped.

[0008]

However, in the above conventional example, the area of the glass panel A and the integrated circuit board B is reduced; and the number of connection terminals 2 of the glass panel A and the integrated circuit board B is increased. Under the conditions, the number of connection terminals 2 per unit area increases,
As a result, the width of the connection terminal 2 itself or the distance between the adjacent connection terminals 2 becomes smaller. Therefore, the connection between the glass panel A and the integrated circuit board B and the IC unit C has the following disadvantages.

[0009] If a position shift occurs when connecting the connection terminals, the distance between the adjacent terminals is reduced, and short-circuit failure is likely to occur.

When connecting the connection terminals, the anisotropic conductive adhesive conventionally used does not match the width and pitch of the connection terminals 1 and 3 with the size of the conductive particles and the input pitch. Short-circuit defects are likely to occur.

[Object of the Invention] It is an object of the present invention to provide a connection terminal structure and a terminal connection method capable of preventing connection failure such as open / short when connecting circuit parts having connection terminals. .

In particular, by improving the glass panel A, the integrated circuit board B, and the edge of the IC unit (the connection terminals or the vicinity of the connection terminals) for connecting them, the substrates A, B and I
It is an object of the present invention to provide a circuit component connection terminal structure and a terminal connection method that solve the above-mentioned problems associated with the downsizing of the C unit C.

[0013]

According to the present invention, there is provided a circuit component having a bundle of a plurality of connection terminal lines formed two-dimensionally by a conductive film on a substrate. A terminal located at the center of the bundle of connection terminal wires, the length of which is slightly longer than a line located outside the bundle, and a tip end portion of the bundle is bent outward of the bundle. Provides structure.

[0014] A circuit component having a bundle of a plurality of connection terminal lines formed two-dimensionally by a conductive coating on a substrate, wherein a line located at the center of the bundle of the connection terminal lines is located outside of the bundle. A connection terminal structure for a circuit component, characterized in that the length is slightly shorter than the line to be positioned and the tip is bent inward of the bundle.

Further, there is provided a connection terminal structure for a circuit component, wherein the line width of the bent end portion of the connection terminal wire is made larger than the line width of other places.

Further, there is provided a connection terminal structure for circuit components, wherein the connection terminals of the above-mentioned two types of circuit components are overlapped and connected.

The circuit component to be connected is also a circuit board connection terminal structure, wherein the circuit component is an integrated circuit unit having a connection terminal portion formed on a sheet surface.

Further, the substrate is a glass panel having wiring and / or an integrated circuit substrate, and the integrated circuit unit is an integrated circuit unit for connection.

Further, there is provided a connection terminal structure for circuit components, wherein two or more reference marks serving as references for superposing the connection terminal portions between the circuit components are provided near the connection terminal portions.

The present invention also relates to a circuit component having a bundle of a plurality of connection terminal lines formed two-dimensionally by a conductive film on a substrate, wherein the line located at the center of the bundle of the connection terminal lines A wire bundle consisting of a plurality of connection terminal wires, each of which is slightly longer than a wire located outside the bundle and whose tip is bent to the outside of the bundle, and a plurality of connection terminal wires formed in a plane by a conductive coating on the substrate, is used. A circuit terminal having a connection terminal, wherein a line located at the center of the bundle of the connection terminal wires is slightly shorter than a line located outside the bundle, and a connection terminal having a tip portion bent inside the bundle. An object of the present invention is to solve the above-mentioned problem by a method of connecting terminals of circuit components, which is characterized by overlapping and connecting.

Further, there is provided a method for connecting terminals of a circuit component, wherein a line width of a bent end portion of the connection terminal line is made larger than a line width of other places.

Further, when the connection terminal portions of the circuit components are superposed, two or more superposition reference marks are provided near the connection portions of the circuit components, and the superposition reference marks are superposed. A method of connecting terminals of a circuit component, comprising positioning the connection terminal portion.

Also, one of the circuit components to be overlapped and connected is a glass panel or an integrated circuit board having wiring, and the other of the circuit components to be overlapped and connected is a connection integrated circuit unit. It is also a method of connecting terminals of a circuit component that is a feature.

[Operation] According to the present invention, the terminal portion formed on the substrate by the conductive film is correspondingly connected to the terminal portion formed on the sheet surface of the integrated circuit unit by the conductive film. In a method for connecting terminals of an integrated circuit, wherein the sheet of the unit is joined to the substrate,
The straight conductive film drawn outward on the substrate is bent at the edge (connection terminal or near the connection terminal), and the width of the connection terminal is increased from the line width of the electric circuit (conduction path). The sheet of the integrated circuit unit is also bent at the edge in the same manner as the substrate, and the width and spacing of the connection terminals can be increased by increasing the width of the connection terminals. Short failure can be prevented.

In addition, even if the pitch of the connection terminals is narrow, the width and the interval of the connection terminals can be increased, so that even if a conventional anisotropic conductive adhesive is used, an open / short defect hardly occurs.

When the substrate and the connection terminal portion of the integrated circuit unit are superimposed, two or more superposition reference marks are provided near the connection portion of the substrate or the unit. By overlaying the connection terminal portions by overlaying the image processing using the alignment reference mark, the displacement at the time of joining is reduced.

In the above preferred embodiment, the substrate is a glass panel having wiring and / or an integrated circuit substrate, and the unit is used to connect the substrate to another or to mutually connect leads. Integrated circuit unit for connection.

As described above, according to the present invention, by improving the edges (connection terminals or near the connection terminals) of the glass panel A, the integrated circuit substrate B and the IC unit C, the substrates A, B and the IC unit are improved. It is possible to provide a circuit component connection terminal structure and a terminal connection method that solve the above-described problems associated with the downsizing of C.

[0029]

(Embodiment 1) Hereinafter, a preferred embodiment of the present invention will be specifically described. FIG.
Is a glass panel A showing the terminal connection structure of the present embodiment,
Circuit board B and IC unit C for connecting them
It is a perspective view of. FIG. 2 shows a glass panel A and an IC.
It is an enlarged plan view of the connection terminal part of the unit C.

1 and 2, A is a glass panel provided with an optical sensor and the like, and 1 is a glass panel A.
The connection terminal portion 1 has a large number of connection terminals 2, and a bundle 7 of connection terminal wires is formed from a center 8 of the bundle.
The outer line is formed so as to be shorter, and the end portions are bent outward (opposite) from each other, and the line width of the bent end portion is formed larger than the line width of the other places.

Reference numeral B denotes an integrated circuit board on the control side, which is an integrated circuit board for controlling the signal of the connection terminal 2 of the glass panel A with the IC chip 10 interposed therebetween.
Connection terminals similar to those of the glass panel A are also formed on the connection terminal portions (edges) 6.

As shown in FIG. 2, C is an IC unit for connecting the glass panel A and / or the integrated circuit board B (in this embodiment, it is used for bridging the two. , Etc. can be adopted for connection between any one of them and another integrated circuit).

This IC unit C is mounted on one side of a sheet.
IC placed in the center of the sheet by conductive coating 11
Leads connected to the chip 10 are formed, and connection terminals 9 corresponding to the edges of the glass panel A and / or the integrated circuit board B are formed at the edges.

The connection terminal 9 divides the bundle of connection terminal wires from the center 8, and makes the line located at the center slightly shorter than the line located on the outside, and the tip of the connection terminal 9 is placed inside the wire bundle. And the line width of the bent end portion is formed to be larger than the line width of other places.

In this embodiment, the line width of the bent front end portion is made large to make it easy to make contact. However, even if the line is bent at the same line width, the interval between the lines can be made large.
The effect that short-circuit is easily prevented can be obtained.

In the vicinity of the connection terminals 2 of the glass panel A and the substrate B, two or more overlay reference marks 12 are provided to overlap the reference points on the mounting device.
2 is read, and the coordinate positions of the mounting unit supporting portion that lifts the IC unit C and the connection terminals 9 of the IC unit C are read, and the connection terminals 2 and 9 of the glass panel A and the substrate B and the IC unit C are accurately overlapped. .

(Embodiment 2) FIG. 3 is a perspective view showing another embodiment of the present invention. As shown in FIG.
The bending direction of the distal end portion of the connection terminal of the C unit C may be opposite to that of the first embodiment (the substrates A and B: bent inward, and the IC unit C: bent outward).

Further, two or more overlay reference marks 13 are provided near the connection terminals 9 of the IC unit C to read the coordinate position, and the marks 12 and 13 are overlapped. The connection terminals 2 and 9 may be overlapped.

In this embodiment, the following advantages are obtained by the above-described configuration.

As a result of bending the connection terminals (or the vicinity of the connection terminals) of the substrates A and B and the IC unit C outward, for example, by allocating them to the center, the line widths 2a, 2a, The distances 2b and 9b between 9a and each other can be made larger than other parts.

Further, when the bending angle is 90 °, the connection terminal widths 2a, 9a and the intervals 2b, 9b between them can be set to arbitrary sizes.

When the connection terminals 2 and 9 of the IC units C are superimposed on the substrates A and B, the superposition reference mark 12 and the connection terminals 9 of the IC unit C are optically read, image-processed, and the marks 12 and 13 are processed. Are superimposed, the connection terminals 2 and 9 of the boards A and B and the IC unit C can be accurately overlapped.

[0043]

As described above, according to the present invention, the terminal portion formed on the substrate by the conductive film is correspondingly formed on the sheet surface of the integrated circuit unit by the conductive film. In the terminal connection method for an integrated circuit in which the unit sheet is joined to the substrate, the connection terminal line is formed in the vicinity of the connection terminal by a straight conductive film drawn outward on the substrate. The tip of the integrated circuit unit is bent more than the line width of the part just before the bend, and the sheet of the integrated circuit unit is also bent at the tip like the substrate to expand the connection terminal width. By joining, the width and spacing of the connection terminals can be increased, so that short-circuit failure with adjacent terminals due to displacement during joining can be prevented.

Further, even if the pitch of the connection terminals is narrow, the width and the interval of the connection terminals can be increased. Therefore, even if a conventional anisotropic conductive adhesive is used, an open / short defect hardly occurs.

Furthermore, at the time of superimposing the connection terminal portion of the substrate and the unit, two or more superposition reference marks are provided near the connection portion of the substrate or the unit, and the superposition mark is read and the connection terminal is read. By overlapping the parts, the displacement during joining is reduced.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a connection structure between a glass panel, a circuit board, and an IC unit according to a first embodiment of the present invention.

FIG. 2 is an enlarged plan view of a connection terminal portion of a glass panel, a circuit board, and an IC unit of the present invention.

FIG. 3 is an exploded perspective view showing a connection structure between a glass panel, a circuit board, and an IC unit according to a second embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view of a conventional structure in which a glass panel and a circuit board are connected by an IC unit.

FIG. 5 is an exploded perspective view showing a connection structure between a conventional glass panel and a circuit board and an IC unit.

FIG. 6 is an enlarged plan view of a conventional glass panel, a circuit board, and connection terminal portions of an IC unit.

[Explanation of symbols]

 Reference Signs List A Glass panel B Circuit board C IC unit 1 Connection terminal portion (of glass panel or circuit board) 2 Connection terminal (of glass panel or circuit board) 2a Connection terminal width (of glass panel or circuit board) 2b (Glass panel or circuit) Connection terminal spacing (of substrate) 3 Connection terminal (of IC unit) 4 Connection terminal (of IC unit) 5 Sheet (resin film for holding connection terminal) 6 Connection terminal (of circuit board) 7 Bundle of connection terminal wires 8 Center Sorting line 9 Connection terminal (of IC unit) 9a Connection terminal width (of IC unit) 9b Spacing of connection terminal (of IC unit) 10 IC chip 11 Conductive coating (of IC unit) 12,13 Registration reference mark

Claims (11)

[Claims] 1. A circuit component having a bundle of a plurality of connection terminal lines formed two-dimensionally on a substrate by a conductive coating, wherein the line located at the center of the bundle of the connection terminal lines is located outside the bundle. A connection terminal structure for a circuit component, wherein the connection terminal structure has a length slightly longer than a line to be positioned and a front end portion is bent to the outside of the bundle. 2. A circuit component having a bundle of a plurality of connection terminal lines formed two-dimensionally by a conductive coating on a substrate, wherein a line located at the center of the bundle of the connection terminal lines is located outside of the bundle. A connection terminal structure for a circuit component, wherein the connection terminal structure is made slightly shorter than a line to be positioned, and a tip portion is bent inward of a bundle. 3. The connection terminal structure for a circuit component according to claim 1, wherein a line width of the bent end portion of the connection terminal line is larger than a line width of other portions. 4. A connection terminal structure for a circuit component, wherein the connection terminal of the circuit component according to claim 1 and the connection terminal of the circuit component according to claim 2 are overlapped and connected. 5. The connection terminal structure according to claim 4, wherein the circuit components to be connected are a circuit board and an integrated circuit unit having a connection terminal formed on a sheet surface. 6. The connection terminal according to claim 5, wherein the substrate is a glass panel having wiring and / or an integrated circuit substrate, and the integrated circuit unit is a connection integrated circuit unit. Construction. 7. The method according to claim 4, wherein two or more reference marks serving as references for superposing the connection terminals of the circuit components are provided near the connection terminals. Connection terminal structure of the described circuit component. 8. A circuit component having a bundle of a plurality of connection terminal lines formed two-dimensionally by a conductive coating on a base, wherein the line located at the center of the bundle of the connection terminal lines is located outside of the bundle. A circuit component that has a connection terminal whose length is slightly longer than the positioned line and whose tip is bent to the outside of the bundle, and a wire bundle of a plurality of connection terminal wires formed two-dimensionally by a conductive coating on the base. A line located at the center of the bundle of the connection terminal wires is slightly shorter than a line located outside the bundle, and a connection terminal having a tip portion bent inside the bundle is overlapped and connected. A method for connecting terminals of a circuit component. 9. The method according to claim 8, wherein a line width of the bent end portion of the connection terminal line is larger than a line width of the other portion. 10. At the time of superposing connection terminals of said circuit components, two or more superposition reference marks are provided in the vicinity of the connection portion of each of said circuit components, and said superposition reference marks are superposed. The method according to claim 8, wherein the connection terminal is positioned. 11. One of the circuit components to be overlapped and connected is a glass panel or an integrated circuit board having wiring, and the other of the circuit components to be overlapped and connected is a connection integrated circuit unit. Claims 8 to 10 characterized by the above-mentioned.
The method for connecting terminals of circuit components according to any one of the above.