JPH0271143A - Checking method of tape carrier - Google Patents

Abstract

PURPOSE:To allow a correct contact between an electrode terminal of a carrier and a probe body thereby to check a tape carrier with high accuracy by determining a transfer route of said tape carrier in advance before checking. CONSTITUTION:A feed roll wound with a tape carrier 1 is set in a predetermined rotary shaft. The carrier 1 is then set at a predetermined position. Thereafter, the carrier is positioned in a direction perpendicular to a transfer direction 14 thereof. In other words, a transfer route of the carrier 1 is determined. Subsequently, in order to correct the positional deviation of a probe needle of a probe unit 15 and an electrode terminal 5 of the carrier 1 from the transfer direction 14, the carrier is positioned in the transfer direction 14. The carrier 1 mounted with an IC chip 4 is checked. When it is detected that no carrier 1 remains to be checked, the check is completed. A correct check of the tape carrier is thus realized.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a tape carrier inspection method.

(Conventional technology) In recent years, watches, calculators, computer memories, etc. have become smaller and smaller.
The tape carrier method for IC mounting has entered the stage of full-scale practical use due to the need for thinner and lighter packaging and for mounting on specially shaped equipment such as cameras and OA equipment. A tape carrier has a lead pattern matching the electrode arrangement of an IC chip formed on a plastic film having sprocket holes and device holes. Such a tape carrier is continuously formed into a tape shape, and an IC chip is bonded to each device hole portion by, for example, a bump method. There is a need for an apparatus that connects the lead pattern of the tape carrier to each electrode pad of an IC chip and feeds the tape in a pitched manner to sequentially test the electrical characteristics of each chip. Furthermore, as mentioned above, devices for mounting an IC chip on a tape carrier and testing the electrical characteristics of the IC chip while it is in tape form are disclosed in Japanese Patent Publication No. 62-575, Japanese Patent Application Laid-open No. 54-57968, and Japanese Patent Application Publication No. 54-57968. 5
It is disclosed in Japanese Patent No. 7-49245. Furthermore, an apparatus including the above-mentioned inspection of the tape carrier as it is is disclosed in Japanese Patent Laid-Open No. 53-27364.

In such devices, a tape carrier is set between two reels. A sprocket for rotating and transporting the tape carrier and an inspection section are provided between the two reels. Then, by controlling the amount of rotation of the sprocket, the tape carriers are sequentially transferred to predetermined positions in the inspection section. Then, perform the inspection. In this way, the tape carrier was continuously and automatically inspected.

(Problems to be Solved by the Invention) However, the above-mentioned conventional technology has the following interlayer points.

Formed on a tape carrier equipped with electronic components'! !
The pole terminal may be extremely small, for example, 100 μm square.

For this reason, high precision, for example, precision on the order of microns, is required for positioning the probe body, which is a connection terminal connected to the tester. Alignment using conventional equipment is
This is done by controlling the amount of rotation of the sprocket. For this reason, a deviation may occur in the feed amount due to the mechanical accuracy of the rotational drive of the sprocket. Then, the probe body may not be able to accurately contact the electrode terminal of the tape carrier. Even if the test is performed in such a non-contact state, accurate test results cannot be obtained. For example, a good product may be determined to be defective. This results in a decrease in yield.

Further, the sprocket holes provided on both side edges of the tape carrier may be slightly shifted parallel to the width direction depending on the type of tape carrier.

That is, even if tape carriers are transported in the same state, the transport route will be slightly different depending on the type of tape carrier.

As a result, even if the probe body is placed in an accurate position, depending on the type of product, the probe body and the electrode terminal of the tape carrier cannot be accurately contacted, and accurate test results cannot be obtained.

This invention has been made in view of the above-mentioned problems, and allows for accurate contact between the electrode terminals of the tape carrier and the probe body, obtaining accurate test results, and improving the yield. The present invention provides a method.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides a means for transporting a tape carrier to an inspection section along a predetermined guide, a means for taking an image of the tape carrier in the inspection section using a TV camera, and a method using this means. It is characterized by comprising means for comparing the imaging output with pre-stored reference data, and means for aligning the electrode terminals of the tape carrier and the probe body in the transport direction based on the results of this means.

(Operation and Effect) A means for transporting the tape carrier to the inspection section along a predetermined guide, and a means for transporting the tape carrier to the TV in the inspection section.
means for taking an image with a camera; means for comparing the image output from this means with pre-stored reference data; and means for aligning the electrode terminal of the tape carrier with the direction of blowing and transporting the tape body based on the results of the means. By providing this, it is possible to accurately make electrical contact between the electrode terminals of the tape carrier and the probe body connected to the tester, thereby obtaining accurate test results, which in turn has the effect of improving yield.

(Embodiment) Next, an embodiment in which the method of the present invention is applied to a method of inspecting a tape carrier on which an IC is mounted using a probe device will be described with reference to the drawings.

As shown in Figure 3, the tape carrier which is the object to be inspected
is made of a plastic film, such as a polyimide film, having a width of, for example, 35 m and a thickness of, for example, 1251 m. A large number of rectangular through holes (3), such as rectangular sprocket holes (3), are provided at predetermined intervals on both longitudinal edges of the tape carrier (2). Furthermore, device holes (not shown), which are through holes, are provided in a rectangular shape, for example, at predetermined intervals at the center band position in the longitudinal direction, that is, at the mounting position of an electronic component such as an IC chip C4. This device hole has a connecting terminal (
(not shown) is provided. The connection terminals are arranged to correspond to the electrode pad arrangement of the IC chip. Further, the tape carrier (1) is provided with an electrode terminal (2) for making electrical contact with a probe body to be described later. A conductive lead pattern 0 is formed to connect this electrode terminal 0 and the connection terminal. The device hole of such a tape carrier (1) has an IC.
The chip (a) is mounted by an inner lead bonding method or the like, and at this time, each electrode pad of the ICC chip and each of the corresponding lead patterns 0 are electrically wired.

The configuration of the probe device for inspecting the tape carrier (2) on which the IC chip (a) is mounted as described above will now be described.

As shown in FIG. 1, this probe device is provided with a supply reel (2) rotatable around a rotation axis 0. As shown in FIG. A tape carrier (2) on which an IC chip (G) is mounted is wound around the supply reel (2). This tape carrier (1) is transferred to a storage reel (1) provided on a rotation 1jllll (11) via an inspection section (9) and tape carrier feeding sprockets (10) provided before and after this inspection section (9).
2). The sprockets 1 to (10) are engaged with a motor, which is a drive device (not shown), and by selectively rotating this motor in forward and reverse directions, the sprocket (10) can be rotated in a desired rotation direction. .

Also, the tape carrier (1) is attached to the sprocket (10).
A protrusion, for example a tractor (13), is provided at a position corresponding to the sprocket hole (3). This tractor (13) is provided in a state where it is engaged when inserted into the sprocket hole (2). The tractor (13) on the feed direction (14) side and the sprocket hole (3) on the feed direction (14) side can be fed while being aligned. Such sprockets (10) are provided before and after the inspection section 0). In order to run the tape carrier 0) in the feeding direction (14) during inspection, the following steps are required for the feeding direction (14):
The sprocket (1) provided at the rear of the inspection section (9)
0). Second time.

The sprocket (10) provided at the front is left in a free state. Also, move the tape carrier (1) in the feeding direction (14
) To unwind in the opposite direction, reverse the above.

This is done by driving the front sprocket (10), and the rear sprocket (10) is left in a free state.

In addition, in the inspection section 0, as shown in FIG. 2, a probe unit (15) is first provided above the transport route of the tape carrier ω in the feeding direction (14) of the tape carrier ω. This probe unit (15) includes
An opening (17) is provided in the center of an insulating substrate (16) made of insulating synthetic resin.

Then, printed wires are printed radially from this opening (17) in an insulated state. This printed wiring is configured such that one end is connected to a tester (not shown), which is an inspection device for the object to be inspected, and the other end is connected to a probe body, such as a probe needle (18), which is a contact terminal. .

Further, the probe needles (18) are arranged so as to correspond to the arrangement pattern of the electrode terminals (2) formed on the tape carrier (2). Furthermore, a TV camera (19) is provided above the opening (17) of the probe unit (15). With this TV camera (19), through pattern recognition,
Connect each electrode terminal ■ of the tape carrier (1) and each probe needle (
19) Image processing alignment is performed.

Further, at a position facing the probe unit (15) and below the tape carrier (1), there is a tape carrier (1).
A mounting table (20) for mounting and fixing is installed. A vacuum hole (not shown) is provided on the upper surface of this mounting table (20). This vacuum hole is connected to a vacuum device (not shown) via a tube or the like.

Thereby, the tape carrier (1) placed on the upper surface of the mounting table (20) can be vacuum-adsorbed. In this suction, it is desirable to suction the tape carrier (1) at the position (2) on both side edges near the target chip. Further, the stand (20) 1 is engaged with a lifting mechanism (not shown) and can be moved in a direction perpendicular to the tape carrier (2). In addition, a mounting table (
20) is engaged with a two-axis drive mechanism (not shown) that can be controlled with high precision and can move within a horizontal plane. That is, it is slidable on a horizontal plane at right angles and parallel to the feeding direction (14) of the tape carrier (g).

Furthermore, a tape carrier (
The guide (21) of 1) is provided. This guide (
21) is for guiding the tape carrier (1) to a predetermined transfer route as shown in FIG. The distance between the guides can be set according to the width of the six-pronged tape carrier (1) installed in the tape carrier (1). Next, a marking device (22) is provided which adds marks to defective products after contact testing each tape carrier with the probe unit (15). This marking device (22) may be one that makes holes by punching, for example, or one that adds quick-drying ink or tape.

When the tape carrier (1) to which the IC chip (a) is attached and connected is wound around the supply reel (2) and the storage reel (12), the IC chip (h) and the tape carrier (0)
), a spacer (23) is wound between the tape carriers (1). This spacer (23) is
The sprocket hole (3) is provided at both ends of this spacer (23), that is, the sprocket hole (3) of the tape carrier α), which has the same width as the tape carrier α), for example, 35R11.
Protrusions are provided alternately on the front and back at positions corresponding to . This projection prevents other objects from coming into contact with the IC chip Ω) when the tape carrier (2) is wound around the supply reel (2) and the storage reel (12). Further, as the tape carrier (1) moves, the spacer (23) leaves the tape carrier (2) and is wound onto the storage reel (12) from the supply reel (2) via, for example, two guide rollers (24). It will be done. At this point in time, the spacer (23) is re-inspected tape carrier (1).
) for protection. As described above, an apparatus is configured that transports the tape carrier (1) in a reel-to-reel manner and tests the electrical characteristics of the IC chip 0).

In the probe device configured as described above, operation and setting control are performed by a control section (25) provided within or outside the device.

Next, the tape carrier (υ
A method for inspecting an IC chip (a) mounted on a device will be explained with reference to the flowchart in FIG.

The supply reel (2) wound with the tape carrier (1) is set on a predetermined rotating shaft (8) (A). Next, the tape carrier (D) is set at a predetermined position (B). After this, the tape carrier α) is aligned in a direction perpendicular to the transport direction (14). That is, the transport route of the tape carrier (1) is determined (C).

For the above positioning, first, the back surface of the tape carrier 0) is vacuum-suctioned on the mounting table (20). Here, with a microscope (not shown) provided above the probe unit (15),
Connect each electrode terminal 0 and each probe needle (18
) are correct. As a result, if there is a misalignment, the operator moves the mounting table (20) in a direction perpendicular to the transfer direction (14) to align the tape carrier (2) so that it follows the predetermined transfer route. Then, even if the tape carrier (1) is transported from now on, the tape carrier (υ) will be transported along the same route along the guide (21).In other words, the transport route of the tape carrier (g) will be determined. Next, attach the tape carrier (υ,
They will be transported to Europe along the above-mentioned transport route. By this transfer, the tape carrier 0) on which the IC chip to be tested G) is mounted is set below the probe unit (15). Then, the tape carrier (1) is vacuum-adsorbed on the mounting table (20). However, the above transfer amount is achieved by controlling the rotation of the sprocket (10). Therefore, a deviation in mechanical accuracy occurs, and a positional deviation occurs between the probe needle (18) of the probe unit (15) and the electrode terminal (2) of the tape carrier α) in the feeding direction (14).

In order to correct this positional deviation, alignment in the transport direction (14) is performed (D). For this positioning, first
The tape carrier (2) installed at the imaging position of the camera (19) is imaged. This imaging output is stored in advance.
Compare with reference data. In this case, the reference data is 1. For example, the state of the tape carrier (1) when the probe needle (18) arrangement of the probe unit (15) and the electrode terminal arrangement of the tape carrier (0) are accurately aligned. It is a memorization of images. Pattern recognition as described above is performed through feature extraction. Through this pattern recognition, the base i
%Q Determine whether the theta pattern and imaging output pattern match. Here, if it is recognized as a match,
It is determined that the tape carrier (I) is correctly positioned, and if it does not match, the installation position of the tape carrier (G) is corrected so that it matches the above.This correction is 1
For example, a tape carrier (a mounting table (20
) by slightly moving the tape carrier α) in the feeding direction or i direction, or by selectively rotating the sprocket (10) slightly in the forward and reverse directions to move the tape carrier α)
) or in the opposite direction. Furthermore, a combination of these methods may also be used. Through such alignment, the tape carrier (1) is set at a predetermined position.

Next, tape carrier (1) with IC chip 0) mounted on it
Perform the inspection (E). First, the back surface of the tape carrier (1) is vacuum-adsorbed on the mounting table (20). In this state,
The probe unit (15) and the mounting table (20) are moved relatively close to each other in the vertical direction. For example, the mounting table (20) is raised a predetermined distance. As a result, each probe needle (18) and each electrode terminal 0 of the tape carrier (D) come into electrical contact. In this contact state, the tester (not shown) and the probe needle (18) are electrically connected. Since it is in a conductive state, an electrical characteristic test is performed using a tester. After this test, the mounting table (20) is lowered by a predetermined amount -B (to bring each probe needle (18) and each electrode terminal (2) into a non-contact state. Also, at almost the same time, the mounting table (2
0) Release the vacuum suction of the tape carrier (υ).

At this time, the mounting table (20) is further lowered and the mounting table (20) is lowered.
It is desirable to ensure that the tape carrier (1) and the tape carrier (1) are in a non-contact state.

Next, it is determined whether there are any remaining tape carriers α) to be inspected (F). If there are any remaining, the next tape carrier 0)
Conduct inspections. For example, the tape carrier α) is pitch-fed along a predetermined route. After this transfer, the feeding direction (1
4) is performed by pattern recognition (D).

Then, the inspection is performed using a predetermined operation (E). Also, if there is no remaining material according to the above judgment (F), the inspection is terminated (G
).

As described above, according to this embodiment, the transport route of the tape carrier is determined in advance before inspection, the tape carriers are sequentially transported along this transport route, and the positioning in the transport direction is performed by pattern recognition in the inspection section. Since the test is then carried out in the test section, electrical contact can always be made accurately between the electrode terminals of the tape carrier and the contact terminals connected to the tester, thereby providing accurate test results.

In particular, it is sufficient to determine the transport route of the tape carrier in advance and align only the feed amount of the tape carrier during inspection, thereby shortening the alignment time and improving the operating rate of the apparatus. Further, fine positioning is possible, and it is possible to sufficiently cope with an increase in the number of electrode terminals and miniaturization of the tape carrier.

The present invention is not limited to the above embodiments, and the guide for maintaining the transport route of the tape carrier may be provided at any location, and is not limited to the mounting table.

Furthermore, the electronic components mounted on the tape carrier are not limited to IC chips, and may be any electronic components.Furthermore, the electronic component mounted on the tape carrier is applicable to a device that performs a continuity check such as a lead pattern of a tape carrier on which no electronic component is mounted. You may do so.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram of a probe device for explaining one embodiment of the method of the present invention, FIG. 2 is an enlarged view of the inspection section of the device shown in FIG. 1, and FIG. An explanatory diagram of a tape carrier that is an object to be inspected. FIG. 4 is an explanatory diagram of a guide for determining the transfer route of the tape carrier by the mounting table of the apparatus shown in FIG. 1, and FIG. 5 is a flowchart showing an inspection method in the apparatus shown in FIG. 1. 1... Tape carrier 7... Supply reel 9...
・Inspection part IO・・Sprocket 20・・
Mounting table 21...Guide patent applicant
Chill Tohoku Co., Ltd.

Claims (1)

[Claims] means for transporting the tape carrier to an inspection section along a predetermined guide; and means for transporting the tape carrier to a TV in the inspection section;
It includes a means for capturing an image with a camera, a means for comparing the image output from this means with pre-stored reference data, and a means for aligning the electrode terminal of the tape carrier and the probe body in the transport direction based on the result of the means. A tape carrier inspection method characterized by the following.