JPH10223695A - Tape carrier package, flexible substrate and substrate mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable the alignment using image pickup means, by providing an aligning hole near connection electrodes on a base. SOLUTION: An aligning hole 54 is a hole of about 1mm wide, provided near and outside connection electrodes 52a distant about 0.5mm from an anisotropically conductive film connection. Electrodes 51a are positioned to align with Cu electrodes 33, using a charge transfer device camera for checking the positions of the electrodes 52a and Cu electrodes 33 from the holes 54, thereby ensuring a high accuracy positioning in a direction α. To avoid shorting Cu wirings 52 in the aligning holes 54, they are sealed with a high-insulation resin. The aligning holes 54 enables the high accuracy positioning even when mounting on an opaque substrate such as glass epoxy substrate 30.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a tape carrier package, a flexible substrate, and a substrate mounting method capable of performing highly accurate positioning.

[0002]

2. Description of the Related Art FIGS. 11A and 11B are views showing an example of a conventional tape carrier package 10. FIG. The tape carrier package 10 is a base 1 made of a polyimide material.
1, a copper wiring 12 patterned on the surface of the base 11, and an IC 13 mounted at the center of the base 11. Each terminal 13 a of the IC 13 is connected to the copper wiring 12.

[0003] Reference numeral 10a in FIG. 11 of the tape carrier package 10 denotes an anisotropic conductive film connecting portion provided for connection with, for example, a glass substrate 20 via an anisotropic conductive film P as described later. In FIG. 11, reference numeral 10b denotes a solder connection portion provided for connection of, for example, the glass epoxy substrate 30 via the solder S as described later. Also, copper wiring 1
2, a portion provided for connection with an ITO (indium tin oxide film) electrode 23 described later is referred to as a connection electrode 12a, and a portion of the copper wiring 12 provided for connection with a copper electrode 33 described later is referred to as a connection electrode 12b. Is called.

FIGS. 12A and 12B are views showing a state in which the above-described tape carrier package 10 is connected to a glass substrate 20 and a glass epoxy substrate 30. FIG. In addition,
The glass substrate 20 includes a glass plate 21 and the glass plate 21.
The ITO wiring 22 formed on the surface and the ITO wiring 2
2 provided with an ITO electrode 23 provided at the tip end.
The glass epoxy board 30 is a glass epoxy board 3
1, a copper wiring 32 formed on the surface of the glass epoxy plate 31, and a copper electrode 3 provided at the tip of the copper wiring 32.
3 is provided.

[0005] When the tape carrier package 10 is connected to the glass substrate 20 and the glass epoxy substrate 30, as shown by an arrow A in FIG.
By imaging from the 0 side by an imaging means such as a camera, I
The TO electrode 23 and the connection electrode 12a were aligned.

FIGS. 13A and 13B are views showing an example of a conventional flexible substrate 40. FIG. The flexible substrate 40 includes a base 41 made of a polyimide material,
And a copper wiring 42 patterned on one surface.

In FIG. 13, reference numerals 40a and 40b of the flexible substrate 40 denote anisotropic conductive film connecting portions provided for connection with, for example, the glass epoxy substrate 30 via the anisotropic conductive film P as described later. I have. In addition, a portion of the copper wiring 42 of the anisotropic conductive film connecting portion 40a, which is provided for connection with the copper electrode 33, is a connecting electrode 42a, and a copper electrode of the copper wiring 42 of the anisotropic conductive film connecting portion 40b, which will be described later. The portion provided for connection with the connection 33 is referred to as a connection electrode 42b.

FIGS. 14A and 14B are views showing a state in which the above-mentioned flexible board 40 is connected to a glass epoxy board 30. FIG. When the flexible substrate 40 is connected to the glass epoxy substrate 30, the copper electrode 33 and the connection electrode 42 a are imaged from the base 41 side by an imaging means such as a camera as shown by an arrow B in FIG. Was to be aligned.

[0009]

The above-described conventional tape carrier package 10 and flexible substrate 40 have the following problems. That is, when the tape carrier package 10 is connected to a non-transparent substrate such as a glass epoxy substrate 30 that does not transmit light, FIG.
No image can be taken from the position indicated by A in (b) of FIG. Therefore, an image is taken from the position indicated by A ′ in FIG. 12B from the base 11 side of the tape carrier package 10. However, there is a problem that light is not transmitted when the base 11 has a certain thickness.

On the other hand, in the flexible substrate 40,
Even if the thickness of the base 41 is sufficient to allow light to pass therethrough, it is necessary to increase the magnification of the CCD camera when the copper wirings 12 and 32 are arranged at a high density to some extent.
For this reason, the amount of light is reduced and the depth of focus is narrowed, so that there has been a problem that alignment by the CCD camera cannot be performed.

Accordingly, the present invention provides a tape carrier package and a flexible package which can be aligned by an image pickup means such as a CCD camera regardless of the thickness or wiring density of a base when connecting to a non-transparent substrate such as a glass epoxy substrate. It is intended to provide a substrate.

Further, the present invention provides a substrate capable of performing high-precision alignment by an imaging means such as a CCD camera when connecting a substrate such as a tape carrier package and a flexible substrate to a non-transparent substrate such as a glass epoxy substrate. It aims to provide an implementation method.

[0013]

Means for Solving the Problems In order to solve the above problems and achieve the object, the invention described in claim 1 comprises a flexible base, an electronic component provided on the base, A plurality of wirings provided on the base and having one end connected to a terminal of the electronic component and having a connection electrode at the other end; and a plurality of wirings provided on the base and arranged near the connection electrode. And a hole.

According to a second aspect of the present invention, in the first aspect of the present invention, the connection electrode is electrically connected to the wiring of the substrate via an anisotropic conductive film or solder. Is preferred.

According to a third aspect of the present invention, in the first aspect of the present invention, a portion serving as a connection electrode of the wiring is disposed in parallel, and a positioning hole is disposed in a direction crossing the wiring. It is preferably formed in a long slot shape.

According to a fourth aspect of the present invention, in the first aspect of the present invention, the positioning hole is provided outside the connection electrode, and a wiring is provided at the position of the positioning hole. Preferably it extends.

According to a fifth aspect of the present invention, in the first aspect of the invention, the positioning holes correspond to some of the connection electrodes selected from the plurality of connection electrodes. Preferably, it is provided.

According to a sixth aspect of the present invention, in the first aspect of the invention, a notch corresponding to a notch provided in advance in a wiring of a board to be connected is formed in the positioning hole. It is preferred that

According to a seventh aspect of the present invention, there is provided a flexible base, a plurality of wirings provided on the base and having connection electrodes at both ends, and a vicinity of the connection electrode provided on the base. And a positioning hole provided in the device.

According to an eighth aspect of the present invention, in the seventh aspect, the connection electrode is electrically connected to the connected electrode via an anisotropic conductive film or solder. Is preferred.

According to a ninth aspect of the present invention, in the invention according to the seventh aspect, a portion serving as a connection electrode of the wiring is disposed in parallel, and a positioning hole is disposed in a direction crossing the wiring. It is preferably formed in a long slot shape.

[0022] The invention described in claim 10 is the seventh invention.
In the invention described in (1), it is preferable that the positioning hole is provided outside the connection electrode, and that the wiring extends to the position of the positioning hole.

The invention described in claim 11 is the seventh invention.
In the invention described in (1), it is preferable that the positioning holes are provided respectively corresponding to some of the connection electrodes selected from the plurality of connection electrodes.

The invention described in claim 12 is the seventh invention.
In the invention described in (1), it is preferable that a notch corresponding to a notch provided in advance in a wiring having a connected electrode is formed in the positioning hole.

According to a thirteenth aspect of the present invention, there is provided a flexible base, an electronic component provided on the base, and one end provided on the base and having one end connected to a terminal of the electronic component; A tape carrier package comprising: a plurality of first wirings having a first connection electrode at the other end; and a positioning hole provided on the base and provided near the first connection electrode. A substrate mounting method for mounting on a flexible substrate comprising: a flexible base; and a plurality of second wirings provided on the base and having a second electrode connected to the first connection electrode. A first step of positioning the first connection electrode and the second connection electrode, and after the first step, the first connection electrode and the second connection electrode are anisotropically aligned. Via conductive film or solder And a second step of connection, the first step, through the positioning holes, the first
The measurement was performed based on the measurement result of the deviation between the wiring of the second wiring and the second wiring.

As a result of taking the above-described measures, the following operation occurs. That is, according to the first aspect of the present invention, since the positioning hole is provided near the electrode, the tape carrier package side is used for connection with the electrode when mounting on another substrate or the like. The electrode on the side can be visually recognized, and highly accurate positioning can be performed.

According to the second aspect of the present invention, since the connection electrode is electrically connected to the wiring of the substrate via the anisotropic conductive film or the solder, the positioning state is maintained. It can be connected as it is.

According to the third aspect of the present invention, the portions serving as the connection electrodes of the wirings are disposed in parallel, and the positioning holes are formed in the shape of long holes arranged in the direction crossing the wirings. Shifts of a plurality of wirings can be visually recognized at the same time.

According to the fourth aspect of the present invention, the positioning hole is provided outside the connection electrode.
Since the wiring extends to the position of the positioning hole, the position to be visually recognized for positioning is further outside, and the visual recognition is easy.

According to the fifth aspect of the present invention, since the positioning holes are provided corresponding to some of the connection electrodes selected from the plurality of connection electrodes, the strength is reduced. Nothing.

According to the invention described in claim 6, since the notch corresponding to the notch provided in advance in the wiring of the board to be connected is formed in the positioning hole, the hole is aligned in two or more directions. Positioning along can be performed.

In the invention described in claim 7, since the positioning hole is provided in the vicinity of the electrode, when mounting on another substrate or the like, the mating member provided for connection with the electrode from the flexible substrate side. The electrode on the side can be visually recognized, and highly accurate positioning can be performed.

In the invention described in claim 8, the connection electrode is electrically connected to the wiring of the substrate via the anisotropic conductive film or the solder, so that the positioning state is maintained. It can be connected as it is.

According to the ninth aspect of the present invention, the portions serving as the connection electrodes of the wirings are arranged in parallel, and the positioning holes are formed in the shape of long holes arranged in the direction crossing the wirings. Shifts of a plurality of wirings can be visually recognized at the same time.

According to the tenth aspect of the present invention, since the positioning hole is provided outside the connection electrode, and the wiring extends to the position of the positioning hole,
The position to be visually recognized for alignment is further outside, and the visual recognition is easy.

According to the eleventh aspect of the present invention, since the positioning holes are provided correspondingly to some of the connection electrodes selected from the plurality of connection electrodes, the strength is reduced. Nothing.

According to the twelfth aspect of the present invention, since the notch corresponding to the notch provided in advance in the wiring of the board to be connected is formed in the positioning hole, it can be formed in two or more directions. Positioning along can be performed.

According to the thirteenth aspect, in the first step of positioning the first connection electrode of the tape carrier package and the second connection electrode of the flexible substrate, the positioning provided on the flexible substrate is performed. Since the determination is performed based on the measurement result of the deviation between the first wiring and the second wiring via the hole, highly accurate positioning can be performed.

[0039]

1 (a) and 1 (b) show a tape carrier package 50 according to a first embodiment of the present invention.
FIGS. 2A and 2B are views showing a state in which the tape carrier package 50 is connected to the glass epoxy substrate 30. FIG. In these figures, the same functional portions as those in FIGS. 11 and 12 are denoted by the same reference numerals.

As shown in FIG. 1, the tape carrier package 50 comprises a base 51 made of a polyimide material and copper wiring (wiring) 52 patterned on the surface of the base 51.
And an IC (electronic component) mounted at the center of the base 51
53. Each terminal 53 a of the IC 53 is connected to the copper wiring 52.

The tape carrier package 50 shown in FIG.
Reference numeral 0a denotes an anisotropic conductive film connecting portion provided for connection with the glass epoxy substrate 30 via the anisotropic conductive film P. Reference numeral 50b in FIG. 1 indicates a solder connection portion provided for connection of the glass epoxy substrate 30 via the solder S. In addition, a portion of the copper wiring 52 of the anisotropic conductive film connection portion 50 a that is used for connection with the copper electrode 33 is connected to the connection electrode 52.
a, the copper electrode 33 of the copper wiring 52 of the solder connection portion 50b
The portion provided for connection with is referred to as a connection electrode 52b.

On the other hand, reference numeral 54 in FIG. 1 denotes an alignment hole having a width of about 1 mm provided near and outside the connection electrode 52a. Note that the positioning hole 54 and the anisotropic conductive film connecting portion 50a are separated by about 0.5 mm.

FIGS. 2A and 2B are views showing a state in which the above-described tape carrier package 50 is connected to the glass epoxy substrate 30. FIG. The glass epoxy substrate 3
Numeral 0 includes a glass epoxy plate 31, a copper wiring 32 formed on the surface of the glass epoxy plate 31, and a copper electrode 33 provided at the tip of the copper wiring 32.

Here, the process of mounting the tape carrier package 50 on the glass epoxy substrate 30 will be described with reference to FIGS. That is, as shown in FIG. 3A, the anisotropic conductive film P is bonded to the copper electrode 33 of the glass epoxy substrate 30. Next, as shown in FIG. 3B and FIG. 4A, the glass epoxy substrate 30 is supported on the pressure bonding stage 60, and the tape carrier package 50 is separated from the TAB tape 61.
Support on top.

Next, as shown in FIG.
Positioning is performed so that 2a and the copper electrode 33 coincide.
At this time, the positioning holes 54 are provided through the CCD camera 63.
Since the position of the connection electrode 52a and the position of the copper electrode 33 can be confirmed from FIG. 2, highly accurate positioning in the direction along the α direction in FIG. 2A can be performed.

Then, as shown in FIGS. 3 (c) and 4 (c), the anisotropic conductive film portion 50a is temporarily compression-bonded (5 kgf / cm) from the tape carrier package 50 side using the compression bonding tool 64. ^Then , the connection electrode 52a and the copper electrode 33 are connected by performing full pressure bonding (30 kgf / cm ² , 20 seconds, 180 ° C.). In order to prevent the copper wiring 52 from being short-circuited in the positioning hole 54,
Seal with a highly insulating resin.

As described above, the positioning hole 54 is provided in the tape carrier package 50 according to the first embodiment.
Is provided, high-precision positioning can be performed even when mounting on a non-transmissive substrate such as the glass epoxy substrate 30.

FIG. 5 is a view showing a tape carrier package 50A according to a first modification of the first embodiment. The first modified example is different from the tape carrier package 50 described above in that a positioning hole 55 is provided instead of the positioning hole 54. Positioning hole 5
5 is provided only on the upper and lower sides of the copper wiring 52 in FIG.

In this modification, the same effects as those of the above-described embodiment can be obtained, and the area of the portion where the holes are provided can be reduced, so that the reduction in the strength of the base 51 can be minimized.

FIG. 6 is a view showing a tape carrier package 50B according to a second modification of the first embodiment. The second modified example is different from the tape carrier package 50 described above in that a notch 56 is formed in the alignment hole 54 along the direction in which the copper wiring 52 is arranged.

In this modification, the same effects as those of the above-described embodiment can be obtained, and the projections 33b are formed on the copper wirings 33 of the glass epoxy substrate 30 so that the projections 3b are formed.
3b and the notch 56 can also be aligned at the same time. That is, fine adjustment can be performed also in the direction along the β direction in FIG. 2A between the tape carrier package 50 and the glass epoxy substrate 30, and more accurate positioning can be performed.

FIGS. 7A and 7B show a flexible substrate 70 according to a second embodiment of the present invention. FIGS. 8A and 8B show a flexible substrate 70 which is a glass epoxy substrate. FIG. 3 is a diagram showing a state connected to 30. In these figures, the same reference numerals are given to the same functional portions as those in FIGS.

As shown in FIG.
Has a base 71 made of a polyimide material and a copper wiring (wiring) 72 patterned on the surface of the base 71.

In FIG. 7, reference numerals 70a and 70b of the flexible substrate 70 denote anisotropic conductive film connecting portions provided for connection with the glass epoxy substrate 30 via the anisotropic conductive film P. Further, a portion of the copper wiring 72 of the anisotropic conductive film connecting portion 70 a which is provided for connection with the copper electrode 33 is connected to the connecting electrode 72.
a, a portion of the copper wiring 72 of the anisotropic conductive film connection portion 70b that is used for connection with the copper electrode 33 is referred to as a connection electrode 72b.

On the other hand, reference numeral 74 in FIG. 7 denotes an alignment hole having a width of about 1 mm provided near and outside the connection electrode 72a. The positioning hole 74 and the anisotropic conductive film connecting portions 70a and 70b are separated from each other by about 0.5 mm.

FIGS. 8A and 8B are views showing a state in which the above-mentioned flexible board 70 is connected to the glass epoxy board 30. FIG. The glass epoxy substrate 30 includes a glass epoxy plate 31, a copper wiring 32 formed on the surface of the glass epoxy plate 31, and a copper electrode 33 provided at a tip of the copper wiring 32.

The process of mounting the flexible substrate 70 on the glass epoxy substrate 30 is the same as that of the first embodiment, and therefore will not be described. As described above, since the positioning hole 74 is provided in the flexible substrate 70 according to the first embodiment, the glass epoxy substrate 3
Even when mounting on a non-transparent substrate such as 0, high-precision positioning can be performed.

FIG. 5 is a view showing a flexible substrate 70A according to a first modification of the first embodiment. The first modified example is different from the above-described flexible substrate 70 in that a positioning hole 75 is provided instead of the positioning hole 74. The alignment holes 75 are provided only on the upper and lower sides of the copper wiring 72 in FIG.

In this modification, the same effects as those of the above-described embodiment can be obtained, and the area of the portion where the holes are provided can be reduced, so that the reduction in the strength of the base 71 can be minimized.

FIG. 6 is a view showing a flexible board 70B according to a second modification of the first embodiment. The second modification is different from the above-described flexible substrate 70 in that a notch 76 is formed in the alignment hole 74 along the direction in which the copper wiring 72 is arranged.

In this modification, the same effects as those of the above-described embodiment can be obtained, and the projections 33b are formed on the copper wirings 33 of the glass epoxy substrate 30, so that the projections 3b are formed.
3b and the notch 76 can also be aligned at the same time. That is, the fine adjustment can be performed also in the direction along the β direction in FIG. 8A between the flexible substrate 70 and the glass epoxy substrate 30, and the positioning can be performed with higher accuracy.

The present invention is not limited to the above embodiments. That is, in the above embodiment,
The base is made of a polyimide material, but is not limited to this. In addition, although copper or ITO is used as the wiring, it is not limited to these. Further, a silver paste may be used instead of the anisotropic conductive film. Further, the shape of the base and the arrangement of the electronic components and the wirings may be appropriately changed. In addition, it goes without saying that various modifications can be made without departing from the spirit of the present invention.

[0063]

According to the first aspect of the present invention, since the positioning hole is provided near the electrode, the tape carrier package can be connected to the electrode from the tape carrier package side when mounting on another substrate or the like. The electrode of the other party can be visually recognized, and highly accurate positioning can be performed.

According to the second aspect of the present invention, since the connection electrodes are electrically connected to the wiring of the substrate via the anisotropic conductive film or the solder, the positioning state is maintained. It can be connected as it is.

According to the third aspect of the present invention, the displacement of a plurality of wirings can be visually recognized simultaneously. According to the fourth aspect of the present invention, the position to be visually recognized for alignment is further outside, and the visual recognition is easy.

According to the invention described in claim 5, the strength is not reduced. In the invention described in claim 6,
Positioning along two or more directions can be performed.

According to the seventh aspect of the present invention, since the positioning hole is provided near the electrode, when mounting on another substrate or the like, the mating member provided for connection with the electrode from the flexible substrate side. The electrode on the side can be visually recognized, and highly accurate positioning can be performed.

In the invention described in claim 8, since the connection electrode is electrically connected to the wiring of the substrate via the anisotropic conductive film or the solder, the positioning state is maintained. It can be connected as it is.

According to the ninth aspect of the present invention, the displacement of a plurality of wirings can be visually recognized simultaneously. According to the tenth aspect of the present invention, the position to be visually recognized for alignment is further outside, and the visual recognition is easy.

According to the eleventh aspect, the strength is not reduced. According to the twelfth aspect, positioning can be performed in two or more directions.

According to the thirteenth aspect of the present invention, in the first step of aligning the first connection electrode of the tape carrier package and the second connection electrode of the flexible substrate, the positioning provided on the flexible substrate is performed. Since the determination is performed based on the measurement result of the deviation between the first wiring and the second wiring via the hole, highly accurate positioning can be performed.

[Brief description of the drawings]

FIG. 1 is a diagram showing a tape carrier package according to a first embodiment of the present invention, wherein (a) is a plan view,
(B) is sectional drawing cut | disconnected by the II line in (a) and seen in the arrow direction.

FIGS. 2A and 2B are diagrams showing a state in which the tape carrier package is mounted on a glass epoxy substrate, wherein FIG. 2A is a plan view, and FIG. 2B is cut along line II-II in FIG. Sectional view.

FIG. 3 is a view schematically showing a mounting step of mounting the tape carrier package on a glass epoxy substrate.

FIG. 4 is a view showing a positioning step in the mounting step.

FIG. 5 is a diagram showing a first modification of the first embodiment.

FIG. 6 is a diagram showing a second modification of the first embodiment.

FIGS. 7A and 7B are views showing a flexible substrate according to a second embodiment of the present invention, wherein FIG. 7A is a plan view, and FIG. 7B is a sectional view taken along line III-III in FIG. FIG.

FIGS. 8A and 8B are diagrams showing a state where the flexible substrate is mounted on a glass epoxy substrate, wherein FIG. 8A is a plan view and FIG.
FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.

FIG. 9 is a diagram showing a first modification of the second embodiment.

FIG. 10 is a diagram showing a second modification of the second embodiment.

11A and 11B are views showing a conventional tape carrier package, wherein FIG. 11A is a plan view, and FIG.
Sectional drawing cut | disconnected by X-ray and seen in the arrow direction.

FIGS. 12A and 12B are diagrams showing a state where the tape carrier package is connected to a glass substrate and a glass epoxy substrate, wherein FIG. 12A is a plan view and FIG.
Sectional drawing cut | disconnected by X 'line and seen in the arrow direction.

FIG. 13 is a view showing a conventional flexible substrate,
2A is a plan view, and FIG. 2B is a cross-sectional view taken along line YY in FIG.

14A and 14B are diagrams showing a state where the flexible substrate is connected to a glass substrate and a glass epoxy substrate, and FIG.
2B is a plan view, and FIG. 2B is a cross-sectional view taken along the line Y′-Y ′ in FIG.

[Explanation of symbols]

 Reference Signs List 30 glass epoxy substrate 33 copper electrode 50, 50A, 50B tape carrier package 52a, 52b copper electrode 54, 55 positioning hole 70, 70A, 70B flexible substrate 72a, 72b copper electrode 74, 75 Alignment hole

Claims (13)

[Claims] 1. A flexible base, an electronic component provided on the base, and one end connected to a terminal of the electronic component and having a connection electrode at the other end provided on the base. A tape carrier package comprising: a plurality of wirings; and a positioning hole provided on the base and near the connection electrode. 2. The tape carrier package according to claim 1, wherein the connection electrode is electrically connected to wiring on the substrate via an anisotropic conductive film or solder. 3. The device according to claim 1, wherein the portions serving as connection electrodes of the wiring are arranged in parallel, and the positioning holes are formed in a long hole shape arranged in a direction crossing the wiring. The described tape carrier package. 4. The tape carrier according to claim 1, wherein the positioning hole is provided outside the connection electrode, and a wiring extends at the position of the positioning hole. package. 5. The tape carrier package according to claim 1, wherein the positioning holes are provided respectively corresponding to some of the connection electrodes selected from the plurality of connection electrodes. . 6. The tape carrier package according to claim 1, wherein a notch corresponding to a notch provided in advance in wiring of a board to be connected is formed in the positioning hole. 7. A flexible base, a plurality of wirings provided on the base and having connection electrodes at both ends, and a positioning means provided on the base and arranged near the connection electrodes. And a hole. 8. The flexible substrate according to claim 7, wherein the connection electrode is electrically connected to the connection target electrode via an anisotropic conductive film or solder. 9. A wiring according to claim 7, wherein the portions serving as connection electrodes of the wiring are arranged in parallel, and the positioning hole is formed in an elongated hole shape arranged in a direction crossing said wiring. The flexible substrate as described. 10. The flexible substrate according to claim 7, wherein the positioning hole is provided outside the connection electrode, and a wiring extends at the position of the positioning hole. . 11. The flexible substrate according to claim 7, wherein the positioning holes are provided respectively corresponding to some of the connection electrodes selected from the plurality of connection electrodes. 12. The flexible substrate according to claim 7, wherein a notch corresponding to a notch provided in advance in a wiring having a connected electrode is formed in the positioning hole. 13. A flexible base, an electronic component provided on the base, and one end connected to a terminal of the electronic component and one end connected to a terminal of the electronic component provided on the base. A flexible base comprising: a plurality of first wires having electrodes; and a tape carrier package provided on the base and provided with an alignment hole provided near the first connection electrode. A substrate mounting method for mounting on a flexible substrate including a plurality of second wirings provided on the base and having a second connection electrode connected to the first connection electrode, wherein the first connection electrode And a second step of aligning the second connection electrode with the second connection electrode. After the first step, the first connection electrode and the second connection electrode are connected via an anisotropic conductive film or solder. The second step of connecting Bei, and the first step, through the positioning holes, the substrate mounting method and performing based on the deviation measurement result of the second wiring and the first wiring.