TWM560607U - LCD connection structure - Google Patents

Abstract

The present invention relates to a liquid crystal display connection structure, comprising a liquid crystal panel, a flip chip circuit board and a flexible circuit board, the flip chip circuit board being connected to the liquid crystal panel, the flexible circuit board being connected to the flip chip board and Between a printed circuit board. The present invention allows the flexible circuit board to be connected to the printed circuit board by adding a flexible circuit board between the flip chip board and the printed circuit board, thereby allowing high-temperature connection technology such as soldering or hot pressing which is easier to process. In addition, since the terminal area of the flexible circuit board can be freely disposed on the same surface or different surfaces, the connection type of the flip-chip circuit board and the printed circuit board is increased by adding the flexible circuit board. Without being limited by the type of the liquid crystal panel and the printed circuit board.

Description

LCD display connection structure

The present invention relates to a display structure, and more particularly to a liquid crystal display connection structure.

A commonly used liquid crystal display generally includes a backlight module and a liquid crystal module, and the liquid crystal module is overlaid on the backlight module; the operation mode of the liquid crystal module is applied between the two glass plates. Different voltages cause a plurality of liquid crystal molecules between the two glass plates to be rotated by different electric fields, and each of them is directed in different directions, and is formed by different arrangement of liquid crystal molecules and then transmitted through the backlight module. Different shapes and color combinations can reveal the image that the user wants to watch.

Referring to FIG. 11 and FIG. 12 , an exploded view of a connection structure of a conventional liquid crystal module includes a liquid crystal panel 60 , a flip chip circuit board 62 , and a printed circuit board 64 .

The liquid crystal panel 60 includes an upper glass plate 611 and a lower glass plate 612. The area of the lower glass plate 612 is larger than the area of the upper glass plate 611. The plate surface of the upper glass plate 611 and the lower surface of the lower glass plate 612 are mutually The upper glass plate 612 is not covered by the upper glass plate 611 to form an upper stepped surface 613. The upper glass plate 611 and the lower glass plate 612 are filled with the liquid crystal molecules.

The flip chip board 62 is connected to the liquid crystal panel 60. The flip chip board 62 includes a plurality of first contacts 621, a plurality of second contacts 622, and a driving die 623. The chip on film (COF) is packaged to form the flip chip board 62. The driving chip 623 is disposed on the same surface as the first contact 621 and the second contacts 622, wherein the first contacts 621 are used to connect the liquid crystal panel 60; the respective pins of the driving chip 623 The system is connected to the corresponding first contact 621 and each second contact 622.

The printed circuit board 64 is connected to the flip chip board 61. The printed circuit board 64 includes a plurality of signal terminals 641. According to the design requirements of the printed circuit board 64, a slot 643 can be further formed. The signal terminals 641 of the printed circuit board 64 are connected to the second contacts 622 through an Aisotropic Conductive Film (ACF) according to the current practice.

In order to control the arrangement of the liquid crystal molecules, the driving wafer 623 applies a control signal to the two glass plates to distribute a dissimilar electric field between the two glass plates, thereby rotating the liquid crystal molecules and controlling the arrangement of the liquid crystal molecules. Positioning, and then showing the image.

However, the flip chip board 62 has a problem of single-sided bare copper design, which is easily damaged in a high-temperature process, that is, it cannot be connected by a high-temperature method such as soldering, and the conductive film 63 must be applied at the joint to be electrically connected and fixed. The printed circuit board 64, in turn, limits the manner of connection.

Referring to FIG. 13 , the connection structure of another conventional liquid crystal module is different from that of FIG. 9 and FIG. 10 in that the area of the upper glass plate 611 is larger than the area of the lower glass plate 612 , and the upper glass plate 611 is not under the The area covered by the glass sheet 612 has a lower step surface 614.

The first contact points 621 and the second contacts 622 of the flip chip board 62 can only be disposed on the same surface. When the upper glass plate 611 and the lower glass plate 612 are bonded together, the lower step surface 614 is formed. The flip chip circuit board 62 must be bent so that the second contacts 622 can be connected to the printed circuit board 64 through the conductive film 63. This bending manner causes the flip chip board 62 to be internal. The wire is cracked or even broken, causing poor contact or even breaking, which affects the quality of the display.

In view of the above problem that the liquid crystal panel has connection limitations, the main object of the present invention is to provide a liquid crystal display connection structure to increase the degree of freedom of the connection structure of the liquid crystal panel.

In order to achieve the previous project, the present invention is a liquid crystal display connection structure, which comprises:

a liquid crystal panel comprising an upper glass plate and a lower glass plate, wherein the upper glass plate and the lower glass plate are adhered to each other, and a region of the two glass plates not covering each other forms a step surface, the step surface having a plurality of signal connections point;

A flip-chip circuit board comprising: a driving chip for driving and controlling the liquid crystal panel; a first contact region comprising a plurality of first contacts, each of the first contacts and the signal of the step surface The connection point is electrically connected; a second contact area includes a plurality of second contacts.

a flexible circuit board comprising a first terminal region and a second terminal region, the first terminal region comprising a plurality of first terminals, the second terminal region comprising a plurality of second terminals, the first terminal region transmitting through a conductive The film is electrically connected to the second contact region of the flip chip board.

The flexible circuit board is further connected to a printed circuit board. Since the flexible circuit board and the printed circuit board can be subjected to high temperature, the flexible circuit board can be connected to the printed circuit board by high temperature connection technology such as soldering or hot pressing. In order to reduce the process and time cost during the operation; in addition, the first terminal area and the second terminal area of the flexible circuit board may be disposed on the same surface, or respectively disposed on different surfaces, so that the printed circuit board is The connection mode with the flexible circuit board becomes more flexible and flexible, and different flexible circuit boards can be selected according to various design requirements of the printed circuit board, so that the printed circuit board is electrically connected to the flip-chip circuit board, and The form of the liquid crystal panel, together with the appropriate flexible circuit board, can also improve the flexibility of the connection mode of the liquid crystal panel and the flexible circuit board.

The present invention is a liquid crystal display connection structure. Referring to the embodiment shown in FIG. 1 to FIG. 3, the present invention comprises a liquid crystal panel 10, a flip chip board 20, a conductive film 30 and a flexible circuit board 40.

The liquid crystal panel 10 has an upper glass plate 11, a lower glass plate 12 and a liquid crystal layer. In this embodiment, the area of the lower glass plate 12 is larger than the area of the upper glass plate 11, and the lower glass plate 12 is not. The area covered by the glass plate 11 forms an upper stepped surface 121 having a plurality of signal connection points; the liquid crystal layer comprising liquid crystal crystals having bipolarity.

The chip-on-board (CRF) is connected to the upper stepped surface 121. The flip-chip board 20 has a driving chip 21, a first contact region 22 and a second contact region 23. The driving chip 21, the first contact region 22 and the second contact region 23 are disposed on the same surface. The driving chip 21 is a driving integrated circuit for controlling the arrangement of the liquid crystal crystals. The first contact region 22 includes a plurality of first contacts 221, and the first contacts 221 and the upper step surface Each signal connection point of 121 is electrically connected as a signal for receiving or transmitting from the liquid crystal panel 10 and the driving wafer 21; the second contact region 23 includes a plurality of second contacts 231.

The conductive film 30 is a conductive paste. In this embodiment, the conductive film 30 is an anisotropic conductive film (ACF). One side of the conductive film 30 is electrically connected to the second contacts 231. The second connection region 23 of the flip chip board 20 is bonded and fixed, and the other surface of the conductive film 30 is in contact with the flexible circuit board 40.

The flexible printed circuit (FPC) includes a first terminal region 41 and a second terminal region 42A, 42B. The first terminal region 41 is connected to one surface of the conductive film 30. The second terminal region 42A and 42B are connected to the printed circuit board 50. In the embodiment, the first terminal region 41 includes a plurality of first terminals 411 and is disposed on a first surface 43 of the flexible circuit board 40. The second terminal region 42A includes a plurality of second terminals 421 and The first surface 43 is connected to the conductive film 30 with respect to the second surface 44. In this embodiment, the first surface is disposed on the second surface 44 of the flexible circuit board 40. The two terminals 421 are a plurality of gold finger contacts.

In this embodiment, the flexible circuit board 40 of the present invention is further connected to a printed circuit board 50. The printed circuit board 50 is generally made of insulating materials such as bakelite or glass fiber, but Limiting, and the wiring of the circuit and the related connection terminals can be fabricated on the printed circuit board 50 by etching or the like for integrating the running line of the circuit; the printed circuit board 50 has a signal 埠 51, and the signal 埠 51 includes a plurality of signals The signal terminals 52 are electrically connected to the corresponding second terminals 421. In this embodiment, the printed circuit board 50 further includes a slot 54 which is a rectangular recess. The driving chip 21 is protruded from the flip chip board 20, and the size of the opening 54 is equal to the driving chip 21, but is not limited thereto.

As shown in FIG. 4, the first contact region 22 of the flip-chip circuit board 20 is connected to the upper step surface 121; the conductive film 30 is electrically connected to the second contact region 23 and the first terminal. The second terminal region 42A of the flexible circuit board 40 overlaps and is electrically connected to the signal port 51 of the printed circuit board 50.

Referring to FIG. 5 and FIG. 6, in another preferred embodiment of the liquid crystal panel 10, the difference from the embodiment of FIG. 2 and FIG. 3 is that the area of the upper glass plate 11 is larger than the area of the lower glass plate 12. The upper glass plate 11 is not covered by the lower glass plate 12 to form a step surface 111. The first terminal region 41 and the second terminal region 42B of the flexible circuit board 40 are located on the first surface 43.

Referring to FIG. 7 , in another preferred embodiment of the liquid crystal panel 10 , the difference from the embodiment of FIG. 5 and FIG. 6 is that the signal terminals 52 of the printed circuit board 50 are located on the printed circuit board 50 . lower surface. The flip-chip circuit board 20 and the printed circuit can also be connected to the position of the signal terminals 52 of the printed circuit board 50 by using the flexible circuit boards 40 disposed on the same side of the terminal areas 41 and 42 in FIG. Board 50.

In the present invention, a flexible circuit board 40 is added between the flip chip board 20 and the printed circuit board 50. Since the flexible circuit board 40 and the printed circuit board 50 have the characteristics of withstanding high temperature, the present invention can be borrowed. The flexible circuit board 40 and the printed circuit board 50 are connected and fixed by soldering or hot pressing of a relatively easy processing operation, and the signal terminals 52 and the second terminals 421 are electrically connected, thereby reducing the number of processes in the process. Time cost of consumption.

Furthermore, the first terminal region 41 and the second terminal region 42A, 42B of the flexible circuit board 40 may be disposed on the same surface or respectively disposed on different surfaces, so that the printed circuit board 50 and The flexible circuit board 40 can be more flexible and flexible. According to the circuit board design requirements of the printed circuit board 50, the flexible circuit board 40 is matched to achieve electrical connection with the flip chip board 20; Since the upper glass plate 11 and the lower glass plate 12 have different areas, the two glass plate bonding forms form the upper step surface 121 or the lower step surface 111, and the signal board 51 of the printed circuit board 50 The flexible circuit board 40 is added to the upper surface or the lower surface of the printed circuit board 50, and the flexible circuit board 40 is added for bridging connection. The flexible circuit board 40 can also be selected according to different glass board bonding patterns and different printed circuit board patterns. To increase the freedom of connection.

Referring to FIG. 8 , in the embodiment, the second terminals 421 of the flexible circuit board 40 are gold finger contacts. In addition, in order to increase the connection convenience of the flexible circuit board 40 and the printed circuit board 50, please refer to FIG. 9, which is another preferred embodiment of the flexible circuit board 40, and the flexible circuit board 40 of FIG. 4 and FIG. The difference is that the golden finger contacts of the second terminal region 42B are replaced by a connector 424.

The connector 424 is disposed on the first surface 43 of the flexible circuit board 40, but is not limited thereto. In this embodiment, the connector 424 can be a slot in which the connector 424 is integrated. The lines of the first terminals 411 of the first terminal region 41 are connected to the corresponding signal ports 51.

In addition, in order to increase the function of the driving chip 21, please refer to FIG. 10, which is another preferred embodiment of the flexible circuit board 40. The difference from FIG. 9 further includes a component on the flexible circuit board 40. District 45.

The component area 45 is located on the first surface 43, but is not limited thereto. In this embodiment, the element area 45 includes a plurality of electronic components 451, and each of the electronic components 451 may be a passive component such as a resistor or a capacitor. It can also be an active component of a transistor or a diode.

10‧‧‧LCD panel
11‧‧‧Upper glass plate
111‧‧‧ lower step surface
12‧‧‧Under glass plate
121‧‧‧Upper step
20‧‧‧Fly Crystal Board
21‧‧‧Drive chip
22‧‧‧First contact area
221‧‧‧ first joint
23‧‧‧Second junction area
231‧‧‧second junction
30‧‧‧Electrical film
40‧‧‧Soft circuit board
41‧‧‧First terminal area
411‧‧‧First terminal
42A, 42B‧‧‧second terminal area
421‧‧‧second terminal
424‧‧‧Connecting head
43‧‧‧ first surface
44‧‧‧ second surface
45‧‧‧Component area
451‧‧‧Electronic components
50‧‧‧Printed circuit board
51‧‧‧Signal
52‧‧‧Signal terminals
54‧‧‧ slotting
60‧‧‧LCD panel
611‧‧‧Upper glass plate
612‧‧‧Lower glass plate
613‧‧‧Upper step
614‧‧‧ lower step surface
62‧‧‧Flip chip board
621‧‧‧ first contact
622‧‧‧second junction
623‧‧‧Drive chip
63‧‧‧Electrical film
64‧‧‧Printed circuit board
641‧‧‧Signal terminal
643‧‧‧ slotting

Figure 1: An exploded perspective view of the connection structure of the liquid crystal display of the present invention. Figure 2 is a side elevational view of the first embodiment of the present invention. Figure 3: Schematic diagram of a first embodiment of the flexible circuit board of the present invention. Figure 4: Top view of the creation. Figure 5 is a side elevational view of a second embodiment of the present invention. Figure 6 is a schematic view showing a second embodiment of the flexible circuit board of the present invention. Figure 7 is a side elevational view of a third embodiment of the present invention. Figure 8 is a schematic view showing a second embodiment of the flexible circuit board of the present invention. Figure 9 is a schematic view of a third embodiment of the flexible circuit board of the present invention. Figure 10 is a schematic view showing a fourth embodiment of the flexible circuit board of the present invention. Fig. 11 is an exploded perspective view showing the connection structure of the conventional liquid crystal panel. Fig. 12 is a side elevational view showing the connection structure of the conventional liquid crystal panel. Figure 13 is a side elevational view of another embodiment of a conventional liquid crystal panel connection structure.

Claims (7)

A liquid crystal display connection structure comprises: a liquid crystal panel comprising an upper glass plate and a lower glass plate, wherein the upper glass plate and the lower glass plate are adhered to each other, and a region of the two glass plates not covering each other forms a step surface, The step surface has a plurality of signal connection points; a flip chip circuit board comprising: a driving chip for driving and controlling the liquid crystal panel; a first contact region comprising a plurality of first contacts, each of the first connections The point system is electrically connected to each signal connection point of the step surface; a second contact area includes a plurality of second contacts; and a flexible circuit board includes a first terminal area and a second terminal area, the first A terminal region includes a plurality of first terminals, and the second terminal region includes a plurality of second terminals. The first terminal region is electrically connected to the second contact region of the flip chip board through a conductive film. The liquid crystal display device of claim 1, wherein the flexible circuit board has a first surface and a second surface, wherein the first terminal region and the second terminal region are respectively disposed on the first surface and the first surface Two surfaces. The liquid crystal display device of claim 1, wherein the flexible circuit board has a first surface and a second surface, and the first terminal region and the second terminal region are disposed on the first surface. The liquid crystal display connection structure of claim 2 or 3, wherein the plurality of second terminals in the second terminal region of the flexible circuit board are gold finger contacts. The liquid crystal display connection structure of claim 2 or 3, wherein the plurality of second terminals in the second terminal region of the flexible circuit board is a connector. The liquid crystal display connection structure of claim 4, wherein the flexible circuit board comprises an element region having a plurality of electronic components. The liquid crystal display connection structure according to claim 5, wherein the flexible circuit board comprises an element region having a plurality of electronic components.