KR100510439B1 - Chip on glass package structure of lcd driving chip using dummy projecting pad and packaging method therefor - Google Patents

Chip on glass package structure of lcd driving chip using dummy projecting pad and packaging method therefor Download PDF

Info

Publication number
KR100510439B1
KR100510439B1 KR1019970039645A KR19970039645A KR100510439B1 KR 100510439 B1 KR100510439 B1 KR 100510439B1 KR 1019970039645 A KR1019970039645 A KR 1019970039645A KR 19970039645 A KR19970039645 A KR 19970039645A KR 100510439 B1 KR100510439 B1 KR 100510439B1
Authority
KR
South Korea
Prior art keywords
liquid crystal
pad
driving chip
crystal driving
chip
Prior art date
Application number
KR1019970039645A
Other languages
Korean (ko)
Other versions
KR19990016915A (en
Inventor
김천호
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1019970039645A priority Critical patent/KR100510439B1/en
Publication of KR19990016915A publication Critical patent/KR19990016915A/en
Application granted granted Critical
Publication of KR100510439B1 publication Critical patent/KR100510439B1/en

Links

Images

Abstract

본 발명에 따른 더미돌출패드를 구비한 액정구동칩의 칩온글라스 패키지 구조 및 패키징 방법이 개시된다. The chipon glass package structure and a packaging method of a liquid crystal driving chip having a protrusion dummy pad according to the present invention is disclosed.
액정구동칩을 유리기판에 실장하는 칩온글라스 패키지 구조는 상기 액정구동칩에 더미 돌출패드를 포함한 돌출패드를 형성하고, 상기 유리기판에 상기 돌출패드에 상응하는 산화도전막을 형성하여, 상기 액정구동칩을 상기 유리기판에 실장한다. Chipon glass package structure is formed to form a protruding pad including pile projecting pad to the liquid crystal driving chip, and the glass substrate oxide conductive film corresponding to the protruding pad, the liquid crystal driving chip for mounting the liquid crystal driver IC on the glass substrate It is mounted to the glass substrate.
본 발명에 의하면, 액정구동칩의 내부회로 구성시, 외부 시스템과 인터페이스하기 위해 형성한 각종 돌출패드외에 신호선과 연결되지 않는 더미 돌출패드를 더 형성하고, 유리기판에 형성되는 산화도전막의 개수를 더미돌출패드를 포함한 개수만큼을 형성함으로써, 유리기판에 액정구동칩을 실장할 때 견고하게 실장되므로, 액정구동칩의 휨 등으로 인해 발생되는 액정구동칩의 실장불량을 해결할 수 있고, 장기간동안 응용세트에 실장되어도 견고하게 장착될 수 있는 효과를 갖는다. According to the present invention, when configuring the internal circuit of the liquid crystal driving chip, further form the various extrusion pad dummy addition that is not connected to the signal line protruding pad is formed to interface with external systems, and the pile the number oxide conductive film formed on a glass substrate by forming as many as the number, including the protruding pad, so rigidly mounted to mounting a liquid crystal driving chip to the glass substrate, it is possible to fix the mounting defect of the liquid crystal driving chip that is caused by the warping of the liquid crystal driving chip or the like, the application set for a long period of time It has the effect that even can be rigidly mounted on mounting.

Description

더미돌출패드를 구비한 액정구동칩의 칩온글라스 패키지 구조 및 패키징 방법{Chip on glass package structure of LCD driving chip using dummy projecting pad and packaging method therefor} Chipon of the liquid crystal driving chip having a protrusion dummy pad glass package structure and a packaging method {Chip on glass package structure of LCD driving chip using dummy projecting pad and packaging method therefor}

본 발명은 액정구동칩의 칩온글라스 패키지 구조에 관한 것으로서, 더욱 상세하게는 액정구동칩에 더미패드를 포함한 돌출패드를 형성하고, 글라스기판에 돌출패드에 대응되는 산화도전막을 형성하여 액정구동칩을 글라스기판에 실장하도록한 액정구동칩의 칩온글라스 패키지 구조 및 그에 따른 액정구동칩의 돌출패드를 형성하는 방법에 관한 것이다. The present invention relates to a chipon glass package structure of the liquid crystal driving chip, and more particularly, to a liquid crystal driving chip to form the conductive oxide film corresponding to the protruding pad on a glass substrate to form a protruding pad, and including the dummy pad on the liquid crystal driving chip chipon of a liquid crystal driver IC mounted on a glass substrate to a glass package structure and a method of forming a projecting pad of the liquid crystal driver IC accordingly.

액정구동칩을 응용세트에 실장하는 방법으로서, 플라스틱 패키지로 조립하여 실장하는 방법이나, 베어 칩(bare chip)을 기판에 실장하는 칩온보드방법이 적용되어 왔다. A method for mounting the liquid crystal driver IC in an application set, it has a chip-on-board method to mount a method for mounting the assembly to a plastic package or the bare chip (bare chip) on the substrate is applied. 그러나, 세트의 소형화 및 두께의 슬림화에 따라 액정구동칩의 실장면적의 최소화 및 비용감소의 요구에 의해, 칩온글라스(chip on glass)방법에 의한 실장기술이 출현하였다. However, this set by the request of reducing costs and minimizing the mounting area of ​​the liquid crystal driving chip, chipon glass mount technology by (chip on glass) method was in accordance with the appearance of smaller and thinner thickness.

그러나, 칩온글라스방식에 의해 액정구동칩을 실장할 경우, 액정구동칩의 돌출패드의 표면이 불균일하고, 응용세트의 소형화에 따라 액정구동칩의 두께가 얇기 때문에 돌출된 액정구동칩의 휨 등으로 인해 액정구동칩을 실장할 때, 다량의 실장불량칩이 발생하는 문제점이 있다. A However, in the case of mounting a liquid crystal driving chip by chipon-glass method, the warping of the liquid crystal driving chip overhanging because non-uniform surface of the protruding pad of the liquid crystal driving chip, in accordance with the size of the application set to the thin thickness of the liquid crystal driver IC, etc. when mounting the liquid crystal driver chip reason, there is a problem that a large amount of bad chip mounting occurs.

본 발명은 상술한 문제점을 해결하기 위해 창출된 것으로서, 액정구동칩의 내부회로 구성시 외부시스템과 인터페이스 하기 위해 형성되는 각종 돌출패드외에 칩의 휨 방지용 더미돌출패드를 더 형성하여 글라스기판에 실장하도록한 더미돌출패드를 구비한 액정구동칩의 칩온글라스 패키지 구조를 제공하는 것을 제1목적으로 하고, 그에 따른 칩온글라스 패키징(packaging) 방법을 제공하는 것을 제2목적으로 한다. The invention to be mounted on a glass substrate by further forming as being created to solve the problems described above, bending at the time of an internal circuit configuration of the liquid crystal driving chip external system and various projecting pad in addition to the chip which is formed to interface preventing pile projecting pad to provide a chipon glass package structure of the liquid crystal driving chip having a protrusion dummy pad and a first object, to provide a glass chipon packaging (packaging) the method according to it is a second object.

상기의 목적을 달성하기 위한 본 발명에 따른 액정구동칩을 유리기판에 실장하는 칩온글라스 패키지 구조는 상기 액정구동칩에 돌출패드를 형성하고, 상기 유리기판에 상기 돌출패드에 상응하는 산화도전막을 형성하여, 상기 액정구동칩을 상기 유리기판에 실장함을 특징으로 한다. Chipon glass package structure for mounting the liquid crystal driver IC in accordance with the present invention for achieving the above object, a glass substrate is formed a projecting pad in the liquid crystal driving chip, and the oxide conductive film corresponding to the protruding pad to the glass substrate and further characterized in that the mounting of the liquid crystal driving chip to the glass substrate.

상기 돌출패드는 실제신호단자와 연결되는 제1돌출패드외에도 상기 액정구동칩의 휨을 방지하기 위해 형성된 실제신호단자와 연결되지 않은 제2돌출패드를 형성함을 특징으로 하며, 상기 산화도전막은 상기 액정구동칩에 형성된 돌출패드에 대응되는 개수만큼을 형성함을 특징으로 한다. The projecting pad has a first protrusion pad in addition characterized in that it forms a physical signal terminal, the second projecting pads are not connected and are formed to prevent warpage of the liquid crystal driving chip, and film liquid crystal wherein the conductive oxide is associated with the actual signal terminals It characterized in that the form of the number as corresponding to the protruding pad formed on the drive chip.

상기의 제2목적을 달성하기 위한 본 발명에 따른, 액정구동칩을 유리기판에 실장하는 칩온글라스 패키지 구조에 있어, 액정구동칩의 돌출패드를 형성하는 방법은 실리콘 기판위에 내부패드와 절연막을 형성하는 공정; In chipon glass package structure in which a liquid crystal driving chip, according to the present invention for achieving the second object of the mounting to the glass substrate, a method of forming a projecting pad of the liquid crystal driving chip is formed an inner pad and an insulating film on a silicon substrate, step of; 및 상기 내부패드 상에 돌출패드를 형성하는 공정을 포함하는 것을 특징으로 한다. And it characterized by including a step of forming a projecting pads on the inner pad.

이하, 첨부된 도면을 참조하여 본 발명을 보다 상세히 설명한다. With reference to the accompanying drawings, it will be described the present invention in more detail.

도 1은 본 발명에 따른 더미돌출패드를 구비한 액정구동칩의 칩온글라스 패키지 구조를 도시한 도면이다. 1 is a view showing an chipon glass package structure of the liquid crystal driving chip having a protrusion dummy pad according to the present invention.

도 1에 도시된 액정구동칩의 칩온글라스 패키지 구조에 있어서, 참조부호 10은 액정구동칩을, 참조부호 12는 액정구동칩(10)에 형성된 돌출패드를, 참조부호 14는 글라스기판을, 참조부호 16은 글라스기판(14)위에 형성된 산화도전막을, 참조부호 18은 액정판넬을 각각 나타낸다. In the chipon glass package structure of the liquid crystal driving chip shown in Figure 1, the reference numeral 10, see the projected pads formed a liquid crystal drive chip, a reference numeral 12 is a liquid crystal driving chip 10, reference numeral 14 is a glass substrate, numeral 16 is a glass substrate 14, the conductive oxide film, reference numeral 18 denotes a liquid crystal panel formed on each.

도 1에 도시된 액정구동칩의 칩온글라스 패키지 구조를 살펴보면, 유리기판(14)위에 표시화면을 구성하는 액정판넬(18)을 배치하고, 액정판넬(18)의 로우신호선과 칼럼신호선을 액정구동칩(10)과 연결하기 위한 산화도전막(16)이 형성된다. A look at the chipon glass package structure of the liquid crystal driving chip, a glass substrate 14 on the arrangement of the liquid crystal panel 18 constituting the display screen, the liquid crystal driving the Righteous line and a column signal line in the liquid crystal panel 18 shown in Figure 1 the oxide conductive film 16 for connecting the chip 10 is formed. 액정구동칩(10)에 형성된 돌출패드(12)는 유리기판(16) 위에 형성된 산화도전막(16)과 접촉되어 전기적인 신호의 통로가 된다. Projecting pads formed on the liquid crystal driving chip 10, 12 is in contact with the conductive oxide film 16 is formed on the glass substrate 16 is the passage of an electrical signal.

도 2는 도 1에 도시된 액정구동칩(10)과 유리기판(14)사이의 돌출패드와 산화도전막의 상세한 구성을 도시한 도면이다. 2 is a view showing a liquid crystal driving chip 10 and the glass substrate 14 and a protruding pad oxide conductive film between the detailed structure of the shown in Fig.

도 2에 도시된 바와 같이, 액정구동칩(10)에는 외부시스템과 인터페이스하기 위해 형성된 입출력용 돌출패드, 전력공급용 돌출패드 등과 같이 실제신호단자와 연결된 돌출패드(12a)와, 실제 신호단자와 전혀 무관하고 단지 액정구동칩의 실장을 견고하게 하기 위해 형성된 더미돌출패드(12b)를 구비한다. And the like, a liquid crystal driver IC 10 is provided with projecting pads (12a) associated with the actual signal terminals such as input and output projecting pads, the power supply protrusion pad for provided for interfacing with external system shown in Figure 2, from the original signal terminals It is completely independent, and only provided with a protrusion dummy pads (12b) formed in order to strengthen the mounting of the liquid crystal driving chip.

도 3은 도 2에 도시된 액정구동칩의 단면을 도시한 도면이다. Figure 3 is a view showing a cross section of the liquid crystal driving chip shown in FIG.

도 3에 도시된 바와 같이, 액정구동칩(10)의 실장면에는 외부시스템과 인터페이스하기 위한 소정개의 돌출패드(12a)외에도 액정구동칩(10)의 휨이나 실장의 견고함을 위해 소정의 위치에 다수개의 더미돌출패드(12b)를 형성한다. 3, the mounting has a predetermined position in addition to the robustness of the bending and mounting the liquid crystal driver IC 10 is given two projecting pads (12a) to the external system and the interface of the liquid crystal driving chip 10 to form a plurality of piles projecting pads (12b).

도 4a 내지 도 4b는 본 발명에 따른 액정구동칩의 돌출패드 생성방법을 설명하기 위한 도면이다. Figure 4a-4b is a view illustrating a protruding pad forming process of the liquid crystal driver IC in accordance with the present invention.

도 4a는 실리콘 기판 위(10)에 내부패드(20)와 절연막(18)을 형성하는 공정을 나타내는 도면이다. Figure 4a is a view showing the step of forming the inner pad 20 and the insulating film 18 above the silicon substrate 10.

도 4b는 도 4a에서 형성된 내부패드(20)위에 돌출패드(22)를 형성하는 공정을 나타내는 도면이다. Figure 4b is a view showing a step of forming a protruding pad 22 on the inner pad 20 is formed in Figure 4a.

따라서, 도 4에 도시된 액정구동칩의 돌출패드 생성방법에 의하면, 도 2에서 설명한 외부돌출패드(12)는 내부패드(20)와 돌출패드(22)가 결합되어 형성된 것이며, 전기적인 신호단자와 연결되는 돌출패드를 생성할 때 더미 돌출패드도 함께 형성되며, 유리기판(14)에 형성되는 산화도전막(16)은 액정구동칩(10)에 형성된 더미돌출패드를 포함한 돌출패드의 개수에 대응하는 개수가 형성된다. Therefore, according to the protruding pad method for generating a liquid crystal driving chip shown in FIG. 4, the outer protruding pad 12 described in the second it will formed by combination of the inner pad 20 and the protruding pad 22, the electrical signal terminals when creating a projecting pad which is connected with and also formed with a pile projecting pad, the conductive film 16 is oxidized to be formed on the glass substrate 14 to the number of the projecting pad including a stack projecting pads formed on the liquid crystal driving chip 10 the corresponding number that is formed.

이와 같이, 본 발명에서는 액정구동칩(10)에 형성된 돌출패드들(12a, 12b)에 대응되는 개수만큼 산화도전막들(16)이 유리기판(14)상에 형성되어 있어서, 이에 따라 실장시 더미 돌출패드들(12b)에 대해서도 금속간 물리적 접속을 용이하고 견고하게 한다. Thus, in the present invention, in 16, the number as long as the conductive oxide film corresponding to the protruding pad formed on the liquid crystal driver IC (10) (12a, 12b) is formed on the glass substrate 14, whereby the mounting when even for the dummy protruding pad (12b) to facilitate and strengthen the physical connection between the metal. 이는 액정구동칩(10) 상에 형성되는 돌출패드들(12a, 12b) 및 이에 대응되는 유리 기판(14)의 산화도전막들(16)은 상호간에 신호가 전달될 수 있도록 금속물질로 이루어 지기 때문이다. This is being done by projecting pads (12a, 12b) and hence the oxide conductive film in the corresponding glass substrates 14 to be 16 is a metal material so that the signal can be transmitted to each other is formed on the liquid crystal driving chip 10 Because. 즉, 실장시에는, 유리 기판(14)과 칩(10) 사이에 압력을 가하면 전기적으로 접속될 수 있는 물질을 삽입한 후에, 유리 기판(14)과 칩이 서로 붙고 해당 패드가 전기적으로 접속되도록 열과 압력을 가하게 되는데, 이때 돌출패드들(12a, 12b)과 산화도전막들(16)은 서로 성질이 같은 금속성 물질 이므로 접촉력(adhesion)이 좋아 견고하게 실장된다. That is, when mounting, after the insertion of a substance which can be electrically connected to Applying pressure between the glass substrate 14 and the chip 10, a glass substrate 14 and the chip catching up each other so that the pads are electrically connected to there is a heat and pressure exerts, wherein projecting pads (16) to (12a, 12b) and the conductive oxide film is fixedly mounted to each other like properties of the metallic material because the contact force (adhesion).

상술한 바와 같이 본 발명에 따른 더미돌출패드를 구비한 액정구동칩의 칩온글라스 패키지 구조 및 칩온글라스 패키징 방법에 의하면, 액정구동칩의 내부회로 구성시, 외부 시스템과 인터페이스하기 위해 형성한 각종 돌출패드외에 신호선과 연결되지 않는 더미 돌출패드를 더 형성하고, 유리기판에 형성되는 산화도전막의 개수를 더미돌출패드를 포함한 개수만큼을 형성함으로써, 유리기판에 액정구동칩을 실장할 때 견고하게 실장되므로, 액정구동칩의 휨 등으로 인해 발생되는 액정구동칩의 실장불량을 해결할 수 있고, 장기간동안 응용세트에 실장되어도 견고하게 장착될 수 있는 효과를 갖는다. One According to the chipon glass package structure and chipon glass packaging method of the liquid crystal driving chip, when configuring the internal circuit of the liquid crystal driving chip, and various formed to interface with external systems projecting pad having a pile projecting pad in accordance with the present invention as described above, in addition to further form a pile projecting pads that are not connected to the signal line, by forming a number of as including a projecting pad pile a number of oxide-conductive film formed on the glass substrate, so rigidly mounted to mounting a liquid crystal driving chip to the glass substrate, It can solve the mounting defect of the liquid crystal driving chip that is caused by a bending and so on of the liquid crystal driving chip, has an effect which can be rigidly mounted may be mounted on a set of applications for a long period of time.

본 발명은 액정구동칩을 유리기판에 실장하는 기술외에도 유리기판에 실장되는 모든 칩에 적용됨을 주지한다. The present invention not in addition to technology for mounting the liquid crystal driver IC on the glass substrate applied to all the chips mounted on the glass substrate.

도 1은 본 발명에 따른 더미돌출패드를 구비한 액정구동칩의 칩온글라스 패키지 구조를 도시한 도면이다. 1 is a view showing an chipon glass package structure of the liquid crystal driving chip having a protrusion dummy pad according to the present invention.

도 2는 도 1에 도시된 액정구동칩(10)과 유리기판(14)사이의 돌출패드와 산화도전막의 상세한 구성을 도시한 도면이다. 2 is a view showing a liquid crystal driving chip 10 and the glass substrate 14 and a protruding pad oxide conductive film between the detailed structure of the shown in Fig.

도 3은 도 2에 도시된 액정구동칩의 단면을 도시한 도면이다. Figure 3 is a view showing a cross section of the liquid crystal driving chip shown in FIG.

도 4a 내지 도 4b는 본 발명에 따른 액정구동칩의 돌출패드 생성방법을 설명하기 위한 도면이다. Figure 4a-4b is a view illustrating a protruding pad forming process of the liquid crystal driver IC in accordance with the present invention.

Claims (2)

  1. 칩내의 실제신호단자와 연결되는 신호 돌출패드들 및 칩내의 실제신호단자와 연결되지 않은 더미 돌출패드들을 포함하는 액정구동칩; The signal pad protruding to be connected to the real signal terminals in the chip and the liquid crystal driving chip containing projecting pad dummy terminal that is not connected from the original signal in the chip; And
    상기 신호 돌출패드들 및 상기 더미 돌출패드들에 상응하는 산화도전막들이 형성된 유리기판을 구비하고, It said signal pads and provided with a projecting glass substrate oxide conductive film are formed to correspond to the dummy protruding pad,
    상기 신호 돌출패드들 및 상기 더미 돌출패드들 각각은 해당 산화도전막과 전기적으로 연결되어 상기 액정구동칩이 상기 유리기판에 실장되며, Each of the signal pads and projecting the dummy protruding pad is electrically connected to the conductive oxide film and the liquid crystal driving chip is mounted on the glass substrate,
    상기 산화도전막들은 상기 액정구동칩에 형성된 상기 신호 돌출패드들 및 상기 더미 돌출패드들에 하나씩 대응되도록 그 패드들의 개수만큼 형성되고, Are formed as many as the number of the pad so that one corresponding to the projected signal pads and the dummy pad formed on the protrusion are the liquid crystal driving chip the oxide conductive film,
    상기 더미 돌출패드들도 상기 해당 산화도전막들과 결합되어 실장이 견고해지는 것을 특징으로 하는 액정구동칩의 칩온글라스 패키지 구조. The dummy protruding pads also chipon glass package structure of the liquid crystal driving chip that is coupled with the conductive film characterized in that the oxide becomes a robust mounting.
  2. 액정구동칩을 유리기판에 실장하는 칩온글라스 패키징 방법에 있어서, In chipon glass packaging method for mounting a liquid crystal driving chip to the glass substrate,
    상기 액정구동칩의 실리콘 기판위에 내부패드들과 절연막을 형성하는 단계; Forming an internal pad, and an insulating film on a silicon substrate of the liquid crystal driving chip;
    상기 액정구동칩에서, 상기 내부패드들 각각에 전기적으로 연결되고, 칩내의 실제신호단자와 연결되는 신호 돌출패드들 및 칩내의 실제신호단자와 연결되지 않은 더미 돌출패드들을 형성하는 단계; In the liquid crystal driver IC, the method comprising: electrically connecting each of the inner pads and, forming a pile projecting pad that is not associated with the actual signal in the signal terminal protrude pads and the chip is connected to the actual signal terminals in the chip;
    상기 유리기판에 상기 액정구동칩에 형성된 상기 신호 돌출패드들 및 상기 더미 돌출패드들에 하나씩 대응되도록 그 패드들의 개수만큼 산화도전막들을 형성하는 단계; Forming the signal projection pads and conductive oxide film as the number of the pad so that one corresponding to the dummy pad formed projecting to the liquid crystal driving chip on the glass substrate; And
    상기 신호 돌출패드들 및 상기 더미 돌출패드들과 이에 대응되는 상기 산화도전막을 서로 접속시키는 단계를 구비하고, And that said signal pads and projecting the dummy pad a corresponding protrusion and a step of connecting together the conductive oxide film,
    상기 더미 돌출패드들도 상기 해당 산화도전막들과 결합되어 실장이 견고해지는 것을 특징으로 하는 액정구동칩의 칩온글라스 패키징 방법. The dummy protruding pads also chipon glass packaging method of the liquid crystal driving chip that is coupled with the conductive film characterized in that the oxide becomes a robust mounting.
KR1019970039645A 1997-08-20 1997-08-20 Chip on glass package structure of lcd driving chip using dummy projecting pad and packaging method therefor KR100510439B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019970039645A KR100510439B1 (en) 1997-08-20 1997-08-20 Chip on glass package structure of lcd driving chip using dummy projecting pad and packaging method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970039645A KR100510439B1 (en) 1997-08-20 1997-08-20 Chip on glass package structure of lcd driving chip using dummy projecting pad and packaging method therefor

Publications (2)

Publication Number Publication Date
KR19990016915A KR19990016915A (en) 1999-03-15
KR100510439B1 true KR100510439B1 (en) 2005-08-19

Family

ID=37305604

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970039645A KR100510439B1 (en) 1997-08-20 1997-08-20 Chip on glass package structure of lcd driving chip using dummy projecting pad and packaging method therefor

Country Status (1)

Country Link
KR (1) KR100510439B1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7995183B2 (en) 2000-03-13 2011-08-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method of manufacturing the same
US8873011B2 (en) 2000-03-16 2014-10-28 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and method of manufacturing the same
US9048146B2 (en) 2000-05-09 2015-06-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9059045B2 (en) 2000-03-08 2015-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9099355B2 (en) 2000-03-06 2015-08-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9099355B2 (en) 2000-03-06 2015-08-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US9368514B2 (en) 2000-03-08 2016-06-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9786687B2 (en) 2000-03-08 2017-10-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9059045B2 (en) 2000-03-08 2015-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7995183B2 (en) 2000-03-13 2011-08-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method of manufacturing the same
US8873011B2 (en) 2000-03-16 2014-10-28 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and method of manufacturing the same
US9298056B2 (en) 2000-03-16 2016-03-29 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and method of manufacturing the same
US9429807B2 (en) 2000-05-09 2016-08-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9048146B2 (en) 2000-05-09 2015-06-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof

Also Published As

Publication number Publication date
KR19990016915A (en) 1999-03-15

Similar Documents

Publication Publication Date Title
KR100887032B1 (en) Ic chip mounting structure and display device
US7041589B2 (en) Metal bump with an insulating sidewall and method of fabricating thereof
KR920000964B1 (en) Method for connecting electronic components with dummy patterns
JP3501218B2 (en) Flat panel display module and a manufacturing method thereof
JP3996535B2 (en) The liquid crystal display device
JP4298068B2 (en) Method of manufacturing an electro-optical device and an electronic device and an electro-optical device comprising thereof
US6542374B1 (en) Circuit board, method for manufacturing the circuit board, and display device and electronic equipment employing the circuit board
KR100269947B1 (en) Printed circuit board and LCD module using it
US6952250B2 (en) Pressure-welded structure of flexible circuit boards
US5084961A (en) Method of mounting circuit on substrate and circuit substrate for use in the method
KR100562098B1 (en) Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument
CN1181542C (en) Semiconductor device, installation structure for semiconductor device, liquid crystal device and electronic device
US6525718B1 (en) Flexible circuit board and liquid crystal display device incorporating the same
KR100256289B1 (en) Flat panel type display apparatus having driver ics formed on plate for holding glasses
US7164460B2 (en) Mounting structure for semiconductor device, electro-optical device, and electronic apparatus
US5959709A (en) Display unit with flexible printed circuit board
CN1199534C (en) Tellite and display apparatus and electronic equipment using the same
US6172730B1 (en) Liquid crystal display apparatus having stepped section in glass substrate
CN1156734C (en) Display Panel
KR100240818B1 (en) Lcd device with tcp
US4514042A (en) Thin structure of display panel
KR100368701B1 (en) Flat panel display device and manufacturing method thereof
US20020012096A1 (en) Manufacturing method for manufacturing electro-optical device, connection method for connecting terminals, electro-optical device, and electronic equipment
KR100247259B1 (en) A circuit board for lcd, a circuit module, an lcd using them, and a fabrication method
US7903067B2 (en) Driver chip and display apparatus having the same

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee