KR100510439B1 - Chip on glass package structure of lcd driving chip using dummy projecting pad and packaging method therefor - Google Patents

Chip on glass package structure of lcd driving chip using dummy projecting pad and packaging method therefor Download PDF

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KR100510439B1
KR100510439B1 KR1019970039645A KR19970039645A KR100510439B1 KR 100510439 B1 KR100510439 B1 KR 100510439B1 KR 1019970039645 A KR1019970039645 A KR 1019970039645A KR 19970039645 A KR19970039645 A KR 19970039645A KR 100510439 B1 KR100510439 B1 KR 100510439B1
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liquid crystal
chip
driving chip
crystal driving
pads
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KR1019970039645A
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Korean (ko)
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KR19990016915A (en
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김천호
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삼성전자주식회사
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611—Control of matrices with row and column drivers
    • G09G3/3648—Control of matrices with row and column drivers using an active matrix
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/02—Composition of display devices
    • G09G2300/023—Display panel composed of stacked panels
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0404—Matrix technologies
    • G09G2300/0413—Details of dummy pixels or dummy lines in flat panels

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Liquid Crystal (AREA)

Abstract

본 발명에 따른 더미돌출패드를 구비한 액정구동칩의 칩온글라스 패키지 구조 및 패키징 방법이 개시된다.Disclosed is a chip-on-glass package structure and packaging method of a liquid crystal drive chip having a dummy protrusion pad according to the present invention.

액정구동칩을 유리기판에 실장하는 칩온글라스 패키지 구조는 상기 액정구동칩에 더미 돌출패드를 포함한 돌출패드를 형성하고, 상기 유리기판에 상기 돌출패드에 상응하는 산화도전막을 형성하여, 상기 액정구동칩을 상기 유리기판에 실장한다.The chip-on-glass package structure for mounting a liquid crystal driving chip on a glass substrate forms a protrusion pad including a dummy protrusion pad on the liquid crystal driving chip, and an oxide conductive film corresponding to the protrusion pad on the glass substrate, thereby forming the liquid crystal driving chip. Is mounted on the glass substrate.

본 발명에 의하면, 액정구동칩의 내부회로 구성시, 외부 시스템과 인터페이스하기 위해 형성한 각종 돌출패드외에 신호선과 연결되지 않는 더미 돌출패드를 더 형성하고, 유리기판에 형성되는 산화도전막의 개수를 더미돌출패드를 포함한 개수만큼을 형성함으로써, 유리기판에 액정구동칩을 실장할 때 견고하게 실장되므로, 액정구동칩의 휨 등으로 인해 발생되는 액정구동칩의 실장불량을 해결할 수 있고, 장기간동안 응용세트에 실장되어도 견고하게 장착될 수 있는 효과를 갖는다. According to the present invention, when the internal circuit of the liquid crystal driving chip is configured, a dummy protrusion pad which is not connected to a signal line is further formed in addition to various protrusion pads formed to interface with an external system, and the number of oxide conductive films formed on the glass substrate is piled up. By forming the number including the protruding pad, it is firmly mounted when mounting the liquid crystal driving chip on the glass substrate, so that the mounting defect of the liquid crystal driving chip caused by the bending of the liquid crystal driving chip can be solved and the application set for a long time. Even if mounted on the has the effect that can be firmly mounted.

Description

더미돌출패드를 구비한 액정구동칩의 칩온글라스 패키지 구조 및 패키징 방법{Chip on glass package structure of LCD driving chip using dummy projecting pad and packaging method therefor}Chip on glass package structure of LCD driving chip using dummy projecting pad and packaging method therefor}

본 발명은 액정구동칩의 칩온글라스 패키지 구조에 관한 것으로서, 더욱 상세하게는 액정구동칩에 더미패드를 포함한 돌출패드를 형성하고, 글라스기판에 돌출패드에 대응되는 산화도전막을 형성하여 액정구동칩을 글라스기판에 실장하도록한 액정구동칩의 칩온글라스 패키지 구조 및 그에 따른 액정구동칩의 돌출패드를 형성하는 방법에 관한 것이다.The present invention relates to a chip-on-glass package structure of a liquid crystal driving chip, and more particularly, a protrusion pad including a dummy pad is formed on a liquid crystal driving chip, and an oxide conductive film corresponding to the protrusion pad is formed on a glass substrate to form a liquid crystal driving chip. The present invention relates to a chip on glass package structure of a liquid crystal driving chip mounted on a glass substrate, and a method of forming a protruding pad of the liquid crystal driving chip.

액정구동칩을 응용세트에 실장하는 방법으로서, 플라스틱 패키지로 조립하여 실장하는 방법이나, 베어 칩(bare chip)을 기판에 실장하는 칩온보드방법이 적용되어 왔다. 그러나, 세트의 소형화 및 두께의 슬림화에 따라 액정구동칩의 실장면적의 최소화 및 비용감소의 요구에 의해, 칩온글라스(chip on glass)방법에 의한 실장기술이 출현하였다.As a method of mounting a liquid crystal drive chip in an application set, a method of assembling and mounting a plastic package or a chip on board method of mounting a bare chip on a substrate has been applied. However, due to the miniaturization of the set and the slimness of the thickness, the mounting technology by the chip on glass method has emerged due to the requirement of minimizing the mounting area of the liquid crystal driving chip and reducing the cost.

그러나, 칩온글라스방식에 의해 액정구동칩을 실장할 경우, 액정구동칩의 돌출패드의 표면이 불균일하고, 응용세트의 소형화에 따라 액정구동칩의 두께가 얇기 때문에 돌출된 액정구동칩의 휨 등으로 인해 액정구동칩을 실장할 때, 다량의 실장불량칩이 발생하는 문제점이 있다. However, when mounting the liquid crystal drive chip by the chip-on-glass method, the surface of the protrusion pad of the liquid crystal drive chip is uneven and the thickness of the liquid crystal drive chip is thin due to the miniaturization of the application set. Therefore, when mounting the liquid crystal driving chip, there is a problem that a large amount of defective chip is generated.

본 발명은 상술한 문제점을 해결하기 위해 창출된 것으로서, 액정구동칩의 내부회로 구성시 외부시스템과 인터페이스 하기 위해 형성되는 각종 돌출패드외에 칩의 휨 방지용 더미돌출패드를 더 형성하여 글라스기판에 실장하도록한 더미돌출패드를 구비한 액정구동칩의 칩온글라스 패키지 구조를 제공하는 것을 제1목적으로 하고, 그에 따른 칩온글라스 패키징(packaging) 방법을 제공하는 것을 제2목적으로 한다.The present invention has been made to solve the above-described problems, and in addition to the various protrusion pads formed to interface with the external system when the internal circuit of the liquid crystal drive chip is formed to form a dummy protrusion pad for preventing bending of the chip to be mounted on the glass substrate A first object of the present invention is to provide a chip-on-glass package structure of a liquid crystal driving chip having a dummy protrusion pad, and a second object of the present invention is to provide a chip-on-glass packaging method.

상기의 목적을 달성하기 위한 본 발명에 따른 액정구동칩을 유리기판에 실장하는 칩온글라스 패키지 구조는 상기 액정구동칩에 돌출패드를 형성하고, 상기 유리기판에 상기 돌출패드에 상응하는 산화도전막을 형성하여, 상기 액정구동칩을 상기 유리기판에 실장함을 특징으로 한다.The chip-on-glass package structure for mounting the liquid crystal driving chip according to the present invention for achieving the above object on a glass substrate forms a protrusion pad on the liquid crystal driving chip and an oxide conductive film corresponding to the protrusion pad on the glass substrate. The liquid crystal driving chip is mounted on the glass substrate.

상기 돌출패드는 실제신호단자와 연결되는 제1돌출패드외에도 상기 액정구동칩의 휨을 방지하기 위해 형성된 실제신호단자와 연결되지 않은 제2돌출패드를 형성함을 특징으로 하며, 상기 산화도전막은 상기 액정구동칩에 형성된 돌출패드에 대응되는 개수만큼을 형성함을 특징으로 한다.The protruding pad may include a second protruding pad that is not connected to an actual signal terminal formed to prevent bending of the liquid crystal driving chip in addition to the first protruding pad that is connected to an actual signal terminal. Characterized in that the number corresponding to the protrusion pad formed on the driving chip.

상기의 제2목적을 달성하기 위한 본 발명에 따른, 액정구동칩을 유리기판에 실장하는 칩온글라스 패키지 구조에 있어, 액정구동칩의 돌출패드를 형성하는 방법은 실리콘 기판위에 내부패드와 절연막을 형성하는 공정; 및 상기 내부패드 상에 돌출패드를 형성하는 공정을 포함하는 것을 특징으로 한다.In the chip-on-glass package structure for mounting the liquid crystal driving chip on a glass substrate according to the present invention for achieving the second object, a method of forming a protruding pad of the liquid crystal driving chip includes forming an inner pad and an insulating film on a silicon substrate. Process of doing; And forming a protruding pad on the inner pad.

이하, 첨부된 도면을 참조하여 본 발명을 보다 상세히 설명한다.Hereinafter, with reference to the accompanying drawings will be described the present invention in more detail.

도 1은 본 발명에 따른 더미돌출패드를 구비한 액정구동칩의 칩온글라스 패키지 구조를 도시한 도면이다.1 is a diagram illustrating a chip-on-glass package structure of a liquid crystal driving chip having a dummy protrusion pad according to the present invention.

도 1에 도시된 액정구동칩의 칩온글라스 패키지 구조에 있어서, 참조부호 10은 액정구동칩을, 참조부호 12는 액정구동칩(10)에 형성된 돌출패드를, 참조부호 14는 글라스기판을, 참조부호 16은 글라스기판(14)위에 형성된 산화도전막을, 참조부호 18은 액정판넬을 각각 나타낸다.In the chip-on-glass package structure of the liquid crystal driver chip shown in FIG. 1, reference numeral 10 denotes a liquid crystal driver chip, reference numeral 12 denotes a protruding pad formed on the liquid crystal driver chip 10, reference numeral 14 denotes a glass substrate. Reference numeral 16 denotes an oxide conductive film formed on the glass substrate 14, and reference numeral 18 denotes a liquid crystal panel.

도 1에 도시된 액정구동칩의 칩온글라스 패키지 구조를 살펴보면, 유리기판(14)위에 표시화면을 구성하는 액정판넬(18)을 배치하고, 액정판넬(18)의 로우신호선과 칼럼신호선을 액정구동칩(10)과 연결하기 위한 산화도전막(16)이 형성된다. 액정구동칩(10)에 형성된 돌출패드(12)는 유리기판(16) 위에 형성된 산화도전막(16)과 접촉되어 전기적인 신호의 통로가 된다.Referring to the chip-on-glass package structure of the liquid crystal driving chip illustrated in FIG. 1, the liquid crystal panel 18 constituting the display screen is disposed on the glass substrate 14, and the low signal line and the column signal line of the liquid crystal panel 18 are driven by liquid crystal driving. An oxide conductive film 16 for connecting with the chip 10 is formed. The protruding pad 12 formed on the liquid crystal driving chip 10 is in contact with the oxide conductive film 16 formed on the glass substrate 16 to be an electrical signal path.

도 2는 도 1에 도시된 액정구동칩(10)과 유리기판(14)사이의 돌출패드와 산화도전막의 상세한 구성을 도시한 도면이다.FIG. 2 is a diagram illustrating a detailed configuration of the protruding pad and the oxide conductive film between the liquid crystal driving chip 10 and the glass substrate 14 shown in FIG. 1.

도 2에 도시된 바와 같이, 액정구동칩(10)에는 외부시스템과 인터페이스하기 위해 형성된 입출력용 돌출패드, 전력공급용 돌출패드 등과 같이 실제신호단자와 연결된 돌출패드(12a)와, 실제 신호단자와 전혀 무관하고 단지 액정구동칩의 실장을 견고하게 하기 위해 형성된 더미돌출패드(12b)를 구비한다.As shown in FIG. 2, the liquid crystal drive chip 10 includes a protrusion pad 12a connected to an actual signal terminal, such as an input / output protrusion pad and a power supply protrusion pad formed to interface with an external system, and an actual signal terminal. It is completely irrelevant and only has a dummy protrusion pad 12b formed to firmly mount the liquid crystal driving chip.

도 3은 도 2에 도시된 액정구동칩의 단면을 도시한 도면이다.3 is a cross-sectional view of the liquid crystal driving chip illustrated in FIG. 2.

도 3에 도시된 바와 같이, 액정구동칩(10)의 실장면에는 외부시스템과 인터페이스하기 위한 소정개의 돌출패드(12a)외에도 액정구동칩(10)의 휨이나 실장의 견고함을 위해 소정의 위치에 다수개의 더미돌출패드(12b)를 형성한다. As shown in FIG. 3, the mounting surface of the liquid crystal driving chip 10 has a predetermined position for bending or mounting of the liquid crystal driving chip 10 in addition to a predetermined protrusion pad 12a for interfacing with an external system. A plurality of dummy protrusion pads 12b are formed on the substrate.

도 4a 내지 도 4b는 본 발명에 따른 액정구동칩의 돌출패드 생성방법을 설명하기 위한 도면이다.4A to 4B are views for explaining a method of generating a protruding pad of a liquid crystal driving chip according to the present invention.

도 4a는 실리콘 기판 위(10)에 내부패드(20)와 절연막(18)을 형성하는 공정을 나타내는 도면이다.4A is a diagram illustrating a process of forming an inner pad 20 and an insulating film 18 on a silicon substrate 10.

도 4b는 도 4a에서 형성된 내부패드(20)위에 돌출패드(22)를 형성하는 공정을 나타내는 도면이다.4B is a view illustrating a process of forming the protruding pad 22 on the inner pad 20 formed in FIG. 4A.

따라서, 도 4에 도시된 액정구동칩의 돌출패드 생성방법에 의하면, 도 2에서 설명한 외부돌출패드(12)는 내부패드(20)와 돌출패드(22)가 결합되어 형성된 것이며, 전기적인 신호단자와 연결되는 돌출패드를 생성할 때 더미 돌출패드도 함께 형성되며, 유리기판(14)에 형성되는 산화도전막(16)은 액정구동칩(10)에 형성된 더미돌출패드를 포함한 돌출패드의 개수에 대응하는 개수가 형성된다. Therefore, according to the method of generating the protruding pad of the liquid crystal driving chip illustrated in FIG. 4, the external protruding pad 12 described in FIG. 2 is formed by combining the inner pad 20 and the protruding pad 22, and an electrical signal terminal. When generating the protruding pads connected with the dummy pads, the dummy protruding pads are also formed, and the oxide conductive film 16 formed on the glass substrate 14 has a number of protruding pads including the dummy protruding pads formed on the liquid crystal driving chip 10. The corresponding number is formed.

이와 같이, 본 발명에서는 액정구동칩(10)에 형성된 돌출패드들(12a, 12b)에 대응되는 개수만큼 산화도전막들(16)이 유리기판(14)상에 형성되어 있어서, 이에 따라 실장시 더미 돌출패드들(12b)에 대해서도 금속간 물리적 접속을 용이하고 견고하게 한다. 이는 액정구동칩(10) 상에 형성되는 돌출패드들(12a, 12b) 및 이에 대응되는 유리 기판(14)의 산화도전막들(16)은 상호간에 신호가 전달될 수 있도록 금속물질로 이루어 지기 때문이다. 즉, 실장시에는, 유리 기판(14)과 칩(10) 사이에 압력을 가하면 전기적으로 접속될 수 있는 물질을 삽입한 후에, 유리 기판(14)과 칩이 서로 붙고 해당 패드가 전기적으로 접속되도록 열과 압력을 가하게 되는데, 이때 돌출패드들(12a, 12b)과 산화도전막들(16)은 서로 성질이 같은 금속성 물질 이므로 접촉력(adhesion)이 좋아 견고하게 실장된다. As such, in the present invention, the oxide conductive films 16 are formed on the glass substrate 14 by the number corresponding to the protruding pads 12a and 12b formed on the liquid crystal driving chip 10. The dummy protruding pads 12b also make the physical connection between metals easy and robust. This is because the protrusion pads 12a and 12b formed on the liquid crystal driving chip 10 and the oxide conductive layers 16 of the glass substrate 14 corresponding thereto are made of a metal material so that signals can be transmitted to each other. Because. That is, in mounting, after inserting a material that can be electrically connected when the pressure is applied between the glass substrate 14 and the chip 10, the glass substrate 14 and the chip to stick to each other and the corresponding pad is electrically connected Heat and pressure are applied. At this time, since the protruding pads 12a and 12b and the oxide conductive layers 16 are metallic materials having the same properties as each other, the contact force is good and is firmly mounted.

상술한 바와 같이 본 발명에 따른 더미돌출패드를 구비한 액정구동칩의 칩온글라스 패키지 구조 및 칩온글라스 패키징 방법에 의하면, 액정구동칩의 내부회로 구성시, 외부 시스템과 인터페이스하기 위해 형성한 각종 돌출패드외에 신호선과 연결되지 않는 더미 돌출패드를 더 형성하고, 유리기판에 형성되는 산화도전막의 개수를 더미돌출패드를 포함한 개수만큼을 형성함으로써, 유리기판에 액정구동칩을 실장할 때 견고하게 실장되므로, 액정구동칩의 휨 등으로 인해 발생되는 액정구동칩의 실장불량을 해결할 수 있고, 장기간동안 응용세트에 실장되어도 견고하게 장착될 수 있는 효과를 갖는다.As described above, according to the chip-on-glass package structure and the chip-on-glass packaging method of the liquid crystal driving chip including the dummy protrusion pad according to the present invention, various protrusion pads are formed to interface with an external system when the internal circuit of the liquid crystal driving chip is configured. In addition, by forming a dummy protrusion pad that is not connected to the signal line, and by forming the number of the oxide conductive film formed on the glass substrate including the dummy protrusion pad, it is firmly mounted when mounting the liquid crystal driving chip on the glass substrate, It is possible to solve the mounting failure of the liquid crystal driving chip caused by the bending of the liquid crystal driving chip, etc., and has the effect of being firmly mounted even when mounted in the application set for a long time.

본 발명은 액정구동칩을 유리기판에 실장하는 기술외에도 유리기판에 실장되는 모든 칩에 적용됨을 주지한다.Note that the present invention is applicable to all chips mounted on the glass substrate, in addition to the technology for mounting the liquid crystal driving chip on the glass substrate.

도 1은 본 발명에 따른 더미돌출패드를 구비한 액정구동칩의 칩온글라스 패키지 구조를 도시한 도면이다.1 is a diagram illustrating a chip-on-glass package structure of a liquid crystal driving chip having a dummy protrusion pad according to the present invention.

도 2는 도 1에 도시된 액정구동칩(10)과 유리기판(14)사이의 돌출패드와 산화도전막의 상세한 구성을 도시한 도면이다.FIG. 2 is a diagram illustrating a detailed configuration of the protruding pad and the oxide conductive film between the liquid crystal driving chip 10 and the glass substrate 14 shown in FIG. 1.

도 3은 도 2에 도시된 액정구동칩의 단면을 도시한 도면이다.3 is a cross-sectional view of the liquid crystal driving chip illustrated in FIG. 2.

도 4a 내지 도 4b는 본 발명에 따른 액정구동칩의 돌출패드 생성방법을 설명하기 위한 도면이다.4A to 4B are views for explaining a method of generating a protruding pad of a liquid crystal driving chip according to the present invention.

Claims (2)

칩내의 실제신호단자와 연결되는 신호 돌출패드들 및 칩내의 실제신호단자와 연결되지 않은 더미 돌출패드들을 포함하는 액정구동칩; 및A liquid crystal driving chip including signal protrusion pads connected to the actual signal terminals in the chip and dummy protrusion pads not connected to the actual signal terminals in the chip; And 상기 신호 돌출패드들 및 상기 더미 돌출패드들에 상응하는 산화도전막들이 형성된 유리기판을 구비하고,And a glass substrate having oxide conductive films corresponding to the signal protrusion pads and the dummy protrusion pads. 상기 신호 돌출패드들 및 상기 더미 돌출패드들 각각은 해당 산화도전막과 전기적으로 연결되어 상기 액정구동칩이 상기 유리기판에 실장되며, Each of the signal protrusion pads and the dummy protrusion pads is electrically connected to a corresponding oxide conductive film so that the liquid crystal driving chip is mounted on the glass substrate. 상기 산화도전막들은 상기 액정구동칩에 형성된 상기 신호 돌출패드들 및 상기 더미 돌출패드들에 하나씩 대응되도록 그 패드들의 개수만큼 형성되고, The oxide conductive films are formed by the number of pads corresponding to the signal protrusion pads and the dummy protrusion pads formed on the liquid crystal driving chip one by one, 상기 더미 돌출패드들도 상기 해당 산화도전막들과 결합되어 실장이 견고해지는 것을 특징으로 하는 액정구동칩의 칩온글라스 패키지 구조. And the dummy protruding pads are also combined with the corresponding oxide conductive layers to secure the mounting thereof. 액정구동칩을 유리기판에 실장하는 칩온글라스 패키징 방법에 있어서, In the chip-on-glass packaging method for mounting a liquid crystal drive chip on a glass substrate, 상기 액정구동칩의 실리콘 기판위에 내부패드들과 절연막을 형성하는 단계; Forming internal pads and an insulating layer on a silicon substrate of the liquid crystal driving chip; 상기 액정구동칩에서, 상기 내부패드들 각각에 전기적으로 연결되고, 칩내의 실제신호단자와 연결되는 신호 돌출패드들 및 칩내의 실제신호단자와 연결되지 않은 더미 돌출패드들을 형성하는 단계; Forming, in the liquid crystal driving chip, signal protrusion pads electrically connected to each of the internal pads and connected to actual signal terminals in the chip, and dummy protrusion pads not connected to the actual signal terminals in the chip; 상기 유리기판에 상기 액정구동칩에 형성된 상기 신호 돌출패드들 및 상기 더미 돌출패드들에 하나씩 대응되도록 그 패드들의 개수만큼 산화도전막들을 형성하는 단계; 및Forming oxide conductive films on the glass substrate by the number of pads corresponding to the signal protrusion pads and the dummy protrusion pads formed on the liquid crystal driving chip; And 상기 신호 돌출패드들 및 상기 더미 돌출패드들과 이에 대응되는 상기 산화도전막을 서로 접속시키는 단계를 구비하고,Connecting the signal protruding pads, the dummy protruding pads, and the oxide conductive layer corresponding thereto; 상기 더미 돌출패드들도 상기 해당 산화도전막들과 결합되어 실장이 견고해지는 것을 특징으로 하는 액정구동칩의 칩온글라스 패키징 방법. And the dummy protruding pads are also coupled to the corresponding oxide conductive layers to secure the mounting thereof.
KR1019970039645A 1997-08-20 1997-08-20 Chip on glass package structure of lcd driving chip using dummy projecting pad and packaging method therefor KR100510439B1 (en)

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