JPH11223829A - Liquid crystal device - Google Patents
Liquid crystal deviceInfo
- Publication number
- JPH11223829A JPH11223829A JP2766298A JP2766298A JPH11223829A JP H11223829 A JPH11223829 A JP H11223829A JP 2766298 A JP2766298 A JP 2766298A JP 2766298 A JP2766298 A JP 2766298A JP H11223829 A JPH11223829 A JP H11223829A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- liquid crystal
- driver
- crystal device
- element substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、特にスイッチング
素子を有する素子基板とそれに対向する対向基板との間
にシール材を介して液晶が封入され、素子基板の電極に
接続されるドライバＩＣの実装面及び対向基板の電極に
接続されるドライバＩＣの実装面を備えた液晶装置に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting of a driver IC in which liquid crystal is sealed between an element substrate having a switching element and an opposing substrate facing the same through a sealing material, and is connected to an electrode of the element substrate. The present invention relates to a liquid crystal device including a surface and a mounting surface of a driver IC connected to electrodes of a counter substrate.
【０００２】[0002]
【従来の技術】従来のこの種の液晶装置としては、例え
ば図７に示すものが知られている。この液晶装置は、ス
イッチング素子として導電体−絶縁体−導電体構造を有
するＴＦＤ（Thin Film Diode：薄膜ダイオード） 素子
が形成された素子基板１と該素子基板１の上側に対向配
置された対向基板２との間に四角環状のシール材３を介
して液晶４が封入されており、素子基板１のＸ辺は対向
基板２のＸ辺からＹ方向に突出して該突出部の上面にド
ライバＩＣ５が実装され、対向基板２のＹ辺は素子基板
１のＹ辺からＸ方向に突出して該突出部の下面にドライ
バＩＣ６が実装されている。2. Description of the Related Art As a conventional liquid crystal device of this type, for example, the one shown in FIG. 7 is known. In this liquid crystal device, an element substrate 1 on which a TFD (Thin Film Diode) element having a conductor-insulator-conductor structure is formed as a switching element, and an opposing substrate disposed on the upper side of the element substrate 1 Liquid crystal 4 is sealed between the device substrate 1 and the device substrate 2 via a rectangular annular sealing material 3. The X side of the element substrate 1 protrudes in the Y direction from the X side of the counter substrate 2, and a driver IC 5 is provided on the upper surface of the protruding portion. The Y side of the opposing substrate 2 protrudes from the Y side of the element substrate 1 in the X direction, and the driver IC 6 is mounted on the lower surface of the protruding portion.
【０００３】ドライバＩＣ５の出力端子はＹ方向に延び
るデータ線７及びＴＦＤ素子８を介して素子基板１側の
電極である画素電極９に接続されており、ドライバＩＣ
６の出力端子は画素電極９を覆うようにＸ方向に延びる
対向基板２側の対向電極１０の電極端子部に金属配線１
１を介して接続されている。An output terminal of the driver IC 5 is connected to a pixel electrode 9 which is an electrode on the element substrate 1 via a data line 7 and a TFD element 8 extending in the Y direction.
The output terminal 6 is connected to the metal terminal 1 of the counter electrode 10 on the counter substrate 2 side extending in the X direction so as to cover the pixel electrode 9.
1 are connected.
【０００４】一方、ドライバＩＣ５の入力端子は素子基
板１のＸ辺に取り付けられたＦＰＣ（フレキシブルプリ
ント基板）１２に金属配線１３を介して接続されてお
り、ドライバＩＣ６の入力端子は対向基板２のＹ辺に取
り付けられたＦＰＣ１４に金属配線１５を介して接続さ
れている。On the other hand, the input terminal of the driver IC 5 is connected via a metal wiring 13 to an FPC (flexible printed circuit board) 12 attached to the X side of the element substrate 1, and the input terminal of the driver IC 6 is connected to the opposite substrate 2. It is connected to the FPC 14 attached to the Y side via the metal wiring 15.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、かかる
従来の液晶装置においては、素子基板１及び対向基板２
にそれぞれ一枚ずつ合計２枚のＦＰＣを備える必要があ
るため、構造が複雑になるとともにコスト低減の妨げに
なっている。In such a conventional liquid crystal device, however, the element substrate 1 and the opposing substrate 2
It is necessary to provide a total of two FPCs, one for each, which complicates the structure and hinders cost reduction.
【０００６】本発明はかかる不都合を解消するためにな
されたものであり、構造の簡略化及びコストの低減を図
ることができる液晶装置を提供することを目的とする。The present invention has been made to solve such a disadvantage, and an object of the present invention is to provide a liquid crystal device capable of simplifying the structure and reducing the cost.
【０００７】[0007]
【課題を解決するための手段】かかる目的を達成するた
めに、請求項１に係る液晶装置は、第１の基板と第２の
基板との間に環状のシール材を介して液晶が封入され、
前記第１の基板の電極に接続されるドライバＩＣの実装
面及び前記第２の基板の電極に接続されるドライバＩＣ
の実装面を備えた液晶装置であって、前記第１の基板に
該第１の基板の電極に接続されるドライバＩＣを実装す
るとともに、前記第２の基板の電極端子部を導通部を介
して前記第１の基板に引き出して該第１の基板に前記第
２の基板の電極に接続されるドライバＩＣを実装したこ
とを特徴とする。According to a first aspect of the present invention, there is provided a liquid crystal device in which liquid crystal is sealed between a first substrate and a second substrate via an annular sealing material. ,
The mounting surface of the driver IC connected to the electrode of the first substrate and the driver IC connected to the electrode of the second substrate
A driver IC connected to an electrode of the first substrate is mounted on the first substrate, and an electrode terminal portion of the second substrate is connected to the liquid crystal device through a conductive portion. And a driver IC connected to an electrode of the second substrate is mounted on the first substrate.
【０００８】この手段によれば、一枚のＦＰＣで足りる
ため、構造の簡略化とコスト低減を図ることができると
いう効果が得られる。According to this means, since one FPC is sufficient, the effect that the structure can be simplified and the cost can be reduced can be obtained.
【０００９】この場合、第１の基板を金属配線の多い素
子基板として、該素子基板に各ドライバＩＣの実装面を
設けることにより、接続抵抗の安定性と低抵抗化の上で
有利なものとすることができるという効果が得られる。In this case, by providing the first substrate as an element substrate having many metal wirings and providing a mounting surface for each driver IC on the element substrate, it is advantageous in terms of stability of connection resistance and reduction in resistance. The effect is obtained.
【００１０】請求項２に係る液晶装置は、請求項１にお
いて、前記シール材に導電性粒子を混入して前記導通部
を構成したことを特徴とする。According to a second aspect of the present invention, in the liquid crystal device according to the first aspect, the conductive portion is formed by mixing conductive particles into the sealing material.
【００１１】請求項３に係る液晶装置は、請求項１にお
いて、前記導通部は、前記シール材の外側に配置された
導電性粒子を含有する樹脂層であることを特徴とする。According to a third aspect of the present invention, in the liquid crystal device according to the first aspect, the conductive portion is a resin layer containing conductive particles disposed outside the sealing material.
【００１２】請求項４に係る液晶装置は、第１の基板と
第２の基板との間に環状のシール材を介して液晶が封入
され、前記第１の基板及び前記第２の基板にそれぞれド
ライバＩＣの実装面を備えた液晶装置であって、前記第
２の基板に実装されたドライバＩＣの入力端子側の配線
を導通部を介して前記第１の基板の実装面に引き出した
ことを特徴とする。In the liquid crystal device according to a fourth aspect, liquid crystal is sealed between the first substrate and the second substrate via an annular sealant, and the first substrate and the second substrate are respectively filled with liquid crystal. A liquid crystal device having a driver IC mounting surface, wherein wiring on an input terminal side of the driver IC mounted on the second substrate is drawn out to a mounting surface of the first substrate via a conductive portion. Features.
【００１３】この手段によれば、一枚のＦＰＣで足りる
ため、構造の簡略化とコスト低減を図ることができると
いう効果が得られる。According to this means, since one FPC is sufficient, the effect that the structure can be simplified and the cost can be reduced can be obtained.
【００１４】請求項５に係る液晶装置は、前記第１の基
板がスイッチング素子を有する素子基板であり、前記第
２の基板が前記素子基板に対向して配置される対向基板
であることを特徴とする。According to a fifth aspect of the present invention, in the liquid crystal device, the first substrate is an element substrate having a switching element, and the second substrate is a counter substrate arranged to face the element substrate. And
【００１５】[0015]
【発明の実施の形態】以下、本発明の実施の形態を図を
参照して説明する。図１は本発明の第１の態様の実施の
形態である液晶装置を説明するための説明的斜視図、図
２は図１のＩＩ−ＩＩ線断面図、図３は導通部の変形例
を説明するための説明的斜視図、図４は図３のＩＶ−Ｉ
Ｖ線断面図、図５は本発明の第２の態様の実施の形態で
ある液晶装置を説明するための説明的斜視図、図６は図
５のＶＩ−ＶＩ線断面図である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory perspective view illustrating a liquid crystal device according to an embodiment of the first aspect of the present invention, FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1, and FIG. Explanatory perspective view for explaining, FIG. 4 is IV-I of FIG.
FIG. 5 is a cross-sectional view taken along line V, FIG. 5 is an explanatory perspective view illustrating a liquid crystal device according to an embodiment of the second aspect of the present invention, and FIG. 6 is a cross-sectional view taken along line VI-VI of FIG.
【００１６】まず、図１及び図２を参照して本発明の第
１の態様の実施の形態である液晶装置から説明する。First, a liquid crystal device according to an embodiment of the first aspect of the present invention will be described with reference to FIGS.
【００１７】この液晶装置は、素子基板（第１の基板）
２０と該素子基板２０の上側に対向配置された対向基板
（第２の基板）２１との間に、図示しない液晶注入部が
設けられた四角環状のシール材２２を介して液晶２３が
封入されており、素子基板２０のＸ辺は対向基板２１の
Ｘ辺からＹ方向に突出して該突出部の上面に二個のドラ
イバＩＣ２４がＸ方向に互いに離間してＣＯＧ（チップ
・オン・グラス）方式により実装され、素子基板２０の
Ｙ辺は対向基板２１のＹ辺からＸ方向に突出して該突出
部の上面に二個のドライバＩＣ２５がＹ方向に互いに離
間してＣＯＧ実装されている。This liquid crystal device has an element substrate (first substrate)
A liquid crystal 23 is sealed between the substrate 20 and an opposing substrate (second substrate) 21 disposed on the upper side of the element substrate 20 via a rectangular annular sealing material 22 provided with a liquid crystal injection portion (not shown). The X side of the element substrate 20 protrudes in the Y direction from the X side of the opposing substrate 21, and two driver ICs 24 are separated from each other in the X direction on the upper surface of the protruding portion, so that a COG (chip-on-glass) method is used. The Y side of the element substrate 20 protrudes in the X direction from the Y side of the opposing substrate 21, and two driver ICs 25 are COG mounted on the upper surface of the protruding portion while being separated from each other in the Y direction.
【００１８】素子基板２０の上面のシール材２２の内側
にはＹ方向に所定の間隔で複数形成された画素電極（第
１の基板の電極）２６がＸ方向に複数列配置されてお
り、該画素電極２６はＴＦＤ素子２７及びＹ方向に延び
るデータ線２８を介してドライバＩＣ２４の出力端子に
接続されている。また、対向基板２１の下面には素子基
板のデータ線と交差するようにＹ方向に走査側の電極
（第２の基板の電極）２９が、画素電極２６と平面的に
重なるように複数形成されている。A plurality of pixel electrodes (electrodes of the first substrate) 26 formed at predetermined intervals in the Y direction are arranged in the X direction in a plurality of rows inside the sealing material 22 on the upper surface of the element substrate 20. The pixel electrode 26 is connected to an output terminal of the driver IC 24 via a TFD element 27 and a data line 28 extending in the Y direction. A plurality of electrodes (electrodes of the second substrate) 29 on the scanning side in the Y direction are formed on the lower surface of the counter substrate 21 so as to intersect with the data lines of the element substrate so as to overlap the pixel electrodes 26 in a plane. ing.
【００１９】ここで、この実施の形態では、四角環状の
シール材２２のうちでドライバＩＣ２５側でＹ方向に延
びる部分に導電性粒子２２ａを混入して導通部３０を構
成している。導通部３０の上側には走査側電極２９の電
極端子部が接触しており、これにより、走査側電極２９
の電極端子部が導通部３０を介して素子基板２０に引き
出されるとともに、素子基板２０のＹ辺側の実装面に形
成された金属配線３１を介してドライバＩＣ２５の出力
端子に接続されている。In this embodiment, the conductive portion 30 is formed by mixing the conductive particles 22a into a portion of the rectangular annular sealing material 22 extending in the Y direction on the driver IC 25 side. An electrode terminal portion of the scanning electrode 29 is in contact with the upper side of the conductive portion 30, and thereby the scanning electrode 29 is
Are drawn out to the element substrate 20 via the conductive portion 30 and are connected to the output terminals of the driver IC 25 via the metal wiring 31 formed on the mounting surface on the Y side of the element substrate 20.
【００２０】ドライバＩＣ２４の入力端子は素子基板２
０のＸ辺側の実装面に形成された金属配線３２を介して
該素子基板２０のＸ辺に取り付けられたＦＰＣ（フレキ
シブルプリント基板）３３に接続され、ドライバＩＣ２
５の入力端子は素子基板２０のＹ辺側の実装面に形成さ
れた金属配線３４を介してＦＰＣ３３に接続されてお
り、これにより、ドライバＩＣ２４，２５の各入力端子
が金属配線３２，３４を介して共通のＦＰＣ３３に接続
されている。The input terminal of the driver IC 24 is the element substrate 2
0 is connected to an FPC (flexible printed circuit board) 33 attached to the X side of the element substrate 20 via a metal wiring 32 formed on the mounting surface on the X side of the driver IC 2.
The input terminal 5 is connected to the FPC 33 via the metal wiring 34 formed on the mounting surface on the Y side of the element substrate 20, whereby the input terminals of the driver ICs 24 and 25 are connected to the metal wiring 32 and 34. It is connected to the common FPC 33 via the same.
【００２１】上記の記載から明らかなように、この実施
の形態の液晶装置においては、一枚のＦＰＣ３３で足り
るため、構造の簡略化とコスト低減を図ることができ
る。As is clear from the above description, in the liquid crystal device of this embodiment, since one FPC 33 is sufficient, the structure can be simplified and the cost can be reduced.
【００２２】また、ドライバＩＣ２４，２５の実装面を
金属配線の多い素子基板２０側に設けているので、接続
抵抗の安定性と低抵抗化の上で有利なものとすることが
できる。Further, since the mounting surfaces of the driver ICs 24 and 25 are provided on the side of the element substrate 20 having a large number of metal wirings, it is advantageous in terms of stability of connection resistance and reduction of resistance.
【００２３】なお、上記実施の形態では、第１の基板を
素子基板２０とし第２の基板を対向基板２１として、素
子基板２０側にドライバＩＣ２４，２５の実装面を設け
た場合を例に採ったが、これに代えて、第１の基板を対
向基板とし第２の基板を素子基板として、ドライバＩＣ
２４，２５の実装面を対向基板に設けて該対向基板側に
ＦＰＣを取り付けるようにしてもよい。この場合、図示
は省略するが、素子基板のデータ線を導通部を介して対
向基板に引き出して該対向基板に素子基板の画素電極に
接続されるドライバＩＣ２４を実装する。In the above-described embodiment, an example is given in which the first substrate is used as the element substrate 20 and the second substrate is used as the opposing substrate 21, and mounting surfaces for the driver ICs 24 and 25 are provided on the element substrate 20 side. However, instead of this, the first substrate is used as the opposing substrate and the second substrate is used as the element substrate, and the driver IC is used.
The mounting surfaces 24 and 25 may be provided on the opposing substrate, and the FPC may be attached to the opposing substrate. In this case, although not shown, the data lines of the element substrate are drawn out to the opposing substrate via the conductive portion, and the driver IC 24 connected to the pixel electrode of the element substrate is mounted on the opposing substrate.
【００２４】また、上記実施の形態では、シール材２２
に導電性粒子２２ａを混入して導通部３０を構成してい
るが、これに代えて、例えば図３及び図４に示すよう
に、四角環状のシール材２２のうちでドライバＩＣ２５
側でＹ方向に延びる部分の外側位置において、素子基板
２０と対向基板２１との間に導電性粒子２２ａを含有す
る樹脂層であるＡＣＦ（異方性導電膜）をＹ方向に沿っ
て延在させてこれを導通部３５としてもよい。In the above embodiment, the sealing material 22
The conductive portion 30 is formed by mixing the conductive particles 22a into the conductive member 22. Alternatively, for example, as shown in FIGS.
ACF (anisotropic conductive film), which is a resin layer containing conductive particles 22a, extends in the Y direction between the element substrate 20 and the counter substrate 21 at a position outside the portion extending in the Y direction on the side. This may be used as the conducting portion 35.
【００２５】次に、図５及び図６を参照して本発明の第
２の態様の実施の形態である液晶装置を説明すると、こ
の液晶装置は、素子基板（第１の基板）５０と該素子基
板５０の上側に対向配置された対向基板（第２の基板）
５１との間に四角環状のシール材５２を介して液晶５３
が封入されており、素子基板５０のＸ辺は対向基板５１
のＸ辺からＹ方向に突出して該突出部の上面に二個のド
ライバＩＣ５４がＸ方向の互いに離間してＣＯＧ（チッ
プ・オン・グラス）実装され、対向基板５１のＹ辺は素
子基板５０のＹ辺からＸ方向に突出して該突出部の下面
に二個のドライバＩＣ５５がＹ方向に互いに離間してＣ
ＯＧ実装されている。Next, a liquid crystal device according to a second embodiment of the present invention will be described with reference to FIGS. 5 and 6. This liquid crystal device comprises an element substrate (first substrate) 50 and Opposite substrate (second substrate) opposingly arranged above element substrate 50
51 and a liquid crystal 53 via a square annular sealing material 52.
Is enclosed, and the X side of the element substrate 50 is
The two driver ICs 54 protrude from the X side in the Y direction and are mounted on the upper surface of the protruding portion at a distance from each other in the X direction by COG (chip-on-glass). Two driver ICs 55 projecting from the Y side in the X direction and separated from each other in the Y direction
OG is implemented.
【００２６】素子基板５０の上面のシール材５２の内側
にはＹ方向に等間隔で複数形成された画素電極（第１の
基板の電極）５６がＸ方向に複数列配置されており、該
画素電極５６はＴＦＤ素子５７及びＹ方向に延びるデー
タ線５８を介してドライバＩＣ５４の出力端子に接続さ
れている。また、対向基板５１の下面には画素電極５６
を覆うようにＸ方向に延びる走査側の電極（第２の基板
の電極）５９がＹ方向に等間隔で複数形成されており、
該走査側電極５９の電極端子部は対向基板５１側の実装
面に形成された金属配線６０を介してドライバＩＣ５５
の出力端子に接続されている。A plurality of pixel electrodes (electrodes of the first substrate) 56 formed at equal intervals in the Y direction are arranged in the X direction in a plurality of rows inside the sealing material 52 on the upper surface of the element substrate 50. The electrode 56 is connected to an output terminal of the driver IC 54 via a TFD element 57 and a data line 58 extending in the Y direction. The pixel electrode 56 is provided on the lower surface of the counter substrate 51.
, A plurality of scanning-side electrodes (electrodes of the second substrate) 59 extending in the X direction are formed at equal intervals in the Y direction so as to cover
The electrode terminal portion of the scanning side electrode 59 is connected to the driver IC 55 via a metal wiring 60 formed on the mounting surface on the counter substrate 51 side.
Output terminal.
【００２７】ドライバＩＣ５４の入力端子は素子基板５
０の実装面に形成された金属配線６１を介して該素子基
板５０のＸ辺に取り付けられたＦＰＣ（フレキシブルプ
リント基板）６２に接続されている。一方、対向基板５
１の実装面に形成されたドライバＩＣ５５の入力端子側
の金属配線６３は、シール材５２の外側位置で素子基板
５０と対向基板５１との間に介在された導電性粒子（図
示せず。）を含有する樹脂層である導通部（ＡＣＦ）６
４を介して素子基板５０の実装面に引き出されるととも
に、素子基板５０の実装面に形成された金属配線６５を
介してＦＰＣ６２に接続されており、これにより、ドラ
イバＩＣ５４，５５の各入力端子がＡＣＦ６４及び金属
配線６１，６３，６５を介して共通のＦＰＣ６２に接続
されている。The input terminal of the driver IC 54 is the element substrate 5
It is connected to an FPC (flexible printed circuit board) 62 attached to the X side of the element substrate 50 via a metal wiring 61 formed on the mounting surface of No. 0. On the other hand, the counter substrate 5
The metal wiring 63 on the input terminal side of the driver IC 55 formed on the mounting surface of the device 1 has conductive particles (not shown) interposed between the element substrate 50 and the opposing substrate 51 at a position outside the sealing material 52. (ACF) 6 which is a resin layer containing
4 and is connected to the FPC 62 via a metal wiring 65 formed on the mounting surface of the element substrate 50, whereby each input terminal of the driver ICs 54 and 55 is connected to the FPC 62. It is connected to a common FPC 62 via an ACF 64 and metal wirings 61, 63, 65.
【００２８】上記の記載から明らかなように、この実施
の形態の液晶装置においては、一枚のＦＰＣ６２で足り
るため、構造の簡略化とコスト低減を図ることができ
る。As is clear from the above description, in the liquid crystal device of this embodiment, since one FPC 62 is sufficient, the structure can be simplified and the cost can be reduced.
【００２９】なお、上記実施の形態では、第１の基板を
素子基板５０とし第２の基板を対向基板５１とした場合
を例に採ったが、これに限定されず、第１の基板を対向
基板とし第２の基板を素子基板として、対向基板側にＦ
ＰＣ６２を取り付けるようにしてもよい。この場合、図
示は省略するが、ドライバＩＣ５５の入力端子を対向基
板５１の実装面に形成された金属配線を介して該対向基
板５１のＹ辺に取り付けられたＦＰＣ６２に接続し、素
子基板５０の実装面に形成されたドライバＩＣ５４の入
力端子側の金属配線をＡＣＦ６４を介して対向基板５１
の実装面に引き出して該対向基板５１の実装面に形成さ
れた金属配線を介してＦＰＣ６２に接続する。In the above embodiment, the case where the first substrate is the element substrate 50 and the second substrate is the counter substrate 51 is taken as an example. However, the present invention is not limited to this. The second substrate is used as an element substrate, and F
The PC 62 may be attached. In this case, although not shown, the input terminal of the driver IC 55 is connected to the FPC 62 attached to the Y side of the counter substrate 51 via metal wiring formed on the mounting surface of the counter substrate 51, The metal wiring on the input terminal side of the driver IC 54 formed on the mounting surface is connected to the opposing substrate 51 via the ACF 64.
And connected to the FPC 62 via metal wiring formed on the mounting surface of the counter substrate 51.
【００３０】[0030]
【発明の効果】上記の説明から明らかなように、本発明
によれば、一枚のＦＰＣで足りるため、構造の簡略化と
コスト低減を図ることができるという効果が得られる。As is clear from the above description, according to the present invention, since one FPC is sufficient, the effect that the structure can be simplified and the cost can be reduced can be obtained.
【図１】本発明の第１の態様の実施の形態である液晶装
置を説明するための説明的斜視図である。FIG. 1 is an explanatory perspective view illustrating a liquid crystal device according to an embodiment of a first aspect of the present invention.
【図２】図１のＩＩ−ＩＩ線断面図である。FIG. 2 is a sectional view taken along line II-II of FIG.
【図３】導通部の変形例を説明するための説明的斜視図
である。FIG. 3 is an explanatory perspective view for explaining a modified example of the conducting portion.
【図４】図３のＩＶ−ＩＶ線断面図である。FIG. 4 is a sectional view taken along line IV-IV of FIG. 3;
【図５】本発明の第２の態様の実施の形態である液晶装
置を説明するための説明的斜視図である。FIG. 5 is an explanatory perspective view illustrating a liquid crystal device according to an embodiment of the second aspect of the present invention.
【図６】図５のＶＩ−ＶＩ線断面図である。FIG. 6 is a sectional view taken along line VI-VI of FIG. 5;
【図７】従来の液晶装置を説明するための説明的斜視図
である。FIG. 7 is an explanatory perspective view for explaining a conventional liquid crystal device.
２０，５０…素子基板（第１の基板） ２１，５１…対向基板（第２の基板） ２２，５２…シール材 ２３，５３…液晶 ２６，５６…画素電極（第１の基板の電極） ２４，２５，５４，５５…ドライバＩＣ ２９，５９…走査側電極（第２の基板の電極） ３０，３５，６４…導通部 20, 50: Element substrate (first substrate) 21, 51: Counter substrate (second substrate) 22, 52: Sealing material 23, 53: Liquid crystal 26, 56: Pixel electrode (electrode of first substrate) 24 , 25, 54, 55 driver IC 29, 59 scanning electrode (electrode of second substrate) 30, 35, 64 conductive part
Claims (5)
シール材を介して液晶が封入され、前記第１の基板の電
極に接続されるドライバＩＣの実装面及び前記第２の基
板の電極に接続されるドライバＩＣの実装面を備えた液
晶装置であって、 前記第１の基板に該第１の基板の電極に接続されるドラ
イバＩＣを実装するとともに、前記第２の基板の電極端
子部を導通部を介して前記第１の基板に引き出して該第
１の基板に前記第２の基板の電極に接続されるドライバ
ＩＣを実装したことを特徴とする液晶装置。1. A liquid crystal is sealed between a first substrate and a second substrate via an annular sealing material, and a mounting surface of a driver IC connected to an electrode of the first substrate and the second substrate. A liquid crystal device having a mounting surface of a driver IC connected to an electrode of the substrate, wherein the driver IC connected to the electrode of the first substrate is mounted on the first substrate; A liquid crystal device, wherein an electrode terminal portion of a substrate is drawn out to the first substrate via a conductive portion, and a driver IC connected to an electrode of the second substrate is mounted on the first substrate.
記導通部を構成したことを特徴とする請求項１記載の液
晶装置。2. The liquid crystal device according to claim 1, wherein the conductive portion is formed by mixing conductive particles into the sealing material.
置された導電性粒子を含有する樹脂層であることを特徴
とする請求項１記載の液晶装置。3. The liquid crystal device according to claim 1, wherein the conductive portion is a resin layer containing conductive particles disposed outside the sealing material.
シール材を介して液晶が封入され、前記第１の基板及び
前記第２の基板にそれぞれドライバＩＣの実装面を備え
た液晶装置であって、 前記第２の基板に実装されたドライバＩＣの入力端子側
の配線を導通部を介して前記第１の基板の実装面に引き
出したことを特徴とする液晶装置。4. A liquid crystal is sealed between a first substrate and a second substrate via an annular sealant, and the first substrate and the second substrate are provided with respective driver IC mounting surfaces. The liquid crystal device according to claim 1, wherein a wiring on an input terminal side of the driver IC mounted on the second substrate is led out to a mounting surface of the first substrate via a conductive portion.
する素子基板であり、前記第２の基板が前記素子基板に
対向して配置される対向基板であることを特徴とする請
求項１〜４のいずれか一項に記載の液晶装置。5. The device according to claim 1, wherein the first substrate is an element substrate having a switching element, and the second substrate is an opposing substrate disposed to face the element substrate. The liquid crystal device according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2766298A JPH11223829A (en) | 1998-02-09 | 1998-02-09 | Liquid crystal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2766298A JPH11223829A (en) | 1998-02-09 | 1998-02-09 | Liquid crystal device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11223829A true JPH11223829A (en) | 1999-08-17 |
Family
ID=12227159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2766298A Pending JPH11223829A (en) | 1998-02-09 | 1998-02-09 | Liquid crystal device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11223829A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1176456A2 (en) * | 2000-07-26 | 2002-01-30 | Casio Computer Co., Ltd. | Liquid crystal display device having non-display area with reduced width |
| US6850307B2 (en) | 2000-02-18 | 2005-02-01 | Seiko Epson Corporation | Display device substrate, method for manufacturing the display device substrate, liquid-crystal display device, and electronic equipment |
| JP2005234459A (en) * | 2004-02-23 | 2005-09-02 | Nec Corp | Display apparatus and liquid crystal display apparatus |
| JP2005301161A (en) * | 2004-04-15 | 2005-10-27 | Nec Corp | Display device |
| JP2005301205A (en) * | 2004-03-15 | 2005-10-27 | Nec Corp | Display device, and portable terminal using the same |
| JP2007086627A (en) * | 2005-09-26 | 2007-04-05 | Casio Comput Co Ltd | Liquid crystal display module |
| US8563983B2 (en) | 2009-08-25 | 2013-10-22 | Sharp Kabushiki Kaisha | Display panel, display device, and method manufacturing same |
-
1998
- 1998-02-09 JP JP2766298A patent/JPH11223829A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6850307B2 (en) | 2000-02-18 | 2005-02-01 | Seiko Epson Corporation | Display device substrate, method for manufacturing the display device substrate, liquid-crystal display device, and electronic equipment |
| US6922225B2 (en) | 2000-02-18 | 2005-07-26 | Seiko Epson Corporation | Display device substrate, method for manufacturing the display device substrate, liquid-crystal device, and electronic equipment |
| US6924867B2 (en) | 2000-02-18 | 2005-08-02 | Seiko Epson Corporation | Display device substrate, method for manufacturing the display device substrate, liquid-crystal device, and electronic equipment |
| EP1176456A2 (en) * | 2000-07-26 | 2002-01-30 | Casio Computer Co., Ltd. | Liquid crystal display device having non-display area with reduced width |
| EP1176456A3 (en) * | 2000-07-26 | 2003-06-04 | Casio Computer Co., Ltd. | Liquid crystal display device having non-display area with reduced width |
| JP2005234459A (en) * | 2004-02-23 | 2005-09-02 | Nec Corp | Display apparatus and liquid crystal display apparatus |
| JP2005301205A (en) * | 2004-03-15 | 2005-10-27 | Nec Corp | Display device, and portable terminal using the same |
| JP2005301161A (en) * | 2004-04-15 | 2005-10-27 | Nec Corp | Display device |
| JP2007086627A (en) * | 2005-09-26 | 2007-04-05 | Casio Comput Co Ltd | Liquid crystal display module |
| US8563983B2 (en) | 2009-08-25 | 2013-10-22 | Sharp Kabushiki Kaisha | Display panel, display device, and method manufacturing same |
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