1343090 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種對位系統及其對位方法，特別是一種液晶 顯不製程中基板對位系統及其對位方法。 【先前技術】 在液晶顯示器（liquidcrystal display ; LCD)製造過程中，許 多元件都需準確地鋪應之元件相互齡。以LCD的驅動積體電 路（integrated circuit ; 1C)為例，驅動1(:係經由高溫高壓的壓合 製程而準確地壓合到基板的對應位置上；於壓合前，需經過一道 對準的動作’解方式是藉由㈣ic上及基板上相互對應的機 構，、經對準之後即進行相互麵合。然而，耦合過程中難免會有機 械或人為的誤差，產生失準偏移的情況，因此需要觀察偏移狀況， 藉以將機台重新調校。 在傳統的基板與驅動1C的偏移狀況檢測方式中，主要是由操 作員利用顯微鏡直接觀察驅動IC壓合後在相對基板的對位標記上 的位置。當偏移發生時，再對偏移狀況進行初略估計，據以進行 機台的調校。 然而’隨著工業自動化要求的不斷提高，在LCD製造業中， 諸如薄膜覆晶（dlip_Qn_fllm ; C()F)基板與印刷電路板（㈣^ board ; PCB)、或驅動Ic與基板之_對位元件需要利用 特定設備以自_顺自動計算偏移量，進而得以於偏移時進行 機台的調校。 習知技術巾存在-麵财^，其制於減基板的接觸塾 與1C的凸塊之壓合檢測。檢測時係利用一側向光源照射玻璃基 1：343〇9〇 對位黏合。 第一標記係設置於第一基板上，且位於兩相鄰之第一引腳之 間。第二標記則係設置於第二基板上，並且於兩相鄰之第二引腳 之間。 一 根據本發明之較佳實施例，第一標記與第二標記係為不相同 之形狀，並且當第一引腳與第二引腳對位黏合時，第—標記與第 二標記的位置會相互對應。 〃1343090 IX. Description of the Invention: [Technical Field] The present invention relates to a aligning system and a aligning method thereof, and more particularly to a substrate aligning system and a aligning method thereof in a liquid crystal display process. [Prior Art] In the manufacture of liquid crystal displays (LCDs), many components need to be accurately placed to match the age of the components. Taking the integrated circuit (1C) of the LCD as an example, the drive 1 (: is accurately pressed to the corresponding position of the substrate via a high-temperature and high-pressure pressing process; before the press-fitting, an alignment is required. The action 'solution method is based on (4) the corresponding mechanism on the ic and the substrate, and after the alignment, the mutual face is combined. However, in the coupling process, mechanical or human error is inevitable, and the misalignment is generated. Therefore, it is necessary to observe the offset condition, so as to recalibrate the machine. In the conventional substrate and drive 1C offset condition detection mode, the operator directly observes the pair of the opposite substrate on the drive IC by the microscope. The position on the bit mark. When the offset occurs, the offset condition is estimated first, and the machine is adjusted accordingly. However, as the industrial automation requirements continue to increase, in the LCD manufacturing industry, such as film Flip chip (dlip_Qn_fllm; C()F) substrate and printed circuit board ((4) ^ board; PCB), or drive Ic and substrate _ alignment components need to use a specific device to automatically calculate the offset from the _ cis The adjustment of the machine can be performed at the time of the offset. The conventional technical towel is provided in the face-to-face, which is used for detecting the contact between the contact 塾 of the substrate and the bump of the 1C. Base 1: 343 〇 9 〇 aligning. The first marking is disposed on the first substrate and between the two adjacent first pins. The second marking is disposed on the second substrate, and Between adjacent second pins. According to a preferred embodiment of the present invention, the first mark and the second mark are different shapes, and when the first pin is bonded to the second pin, The positions of the first mark and the second mark correspond to each other.
根據本發明之較佳實施例，當第一引腳與第二弓丨腳對位準確 時，第二標記之邊緣與鄰近之第一引腳之邊緣的χ軸向距離係不 小於一既定之X軸向偏移距離。當第一引腳與第二引腳對位準確 時，第一標記之邊緣與相鄰之第二標記之邊緣的γ軸向距離係不 小於一既定之γ軸向偏移距離。 根據本發明之較佳實施例，第—標記與第二標記具有不相同 的顏色，以進一步增強標記的辨識度。 本發明所揭露之對位方法係用於對準第一和第二基板，第一 基板具有相鄰之複數個第—引腳，且第二基板具有相^且對應於 第-引腳之複數個第二引腳，第—引腳之間具有至少一第一標 引腳之間具有至少-對應之第二標記，其中第一標記: 第一標s己為不相同之形狀。 本發明所揭露之對位方法包含：傾測第—標記； ί二=計算第-與第二標記之間的距離以得到X、轴向偏移 :二:L與第二標記之間的距離以得到γ軸向偏移量;根據 以==γ轴向偏移量調整第一和第二基板的相對位置; 以及對位黏合第一和第二基板。 1343090 於此’ x轴向偏移量可透過量測第一標記與第二標記之間的 X軸向距離，然後再將其換算成X轴向偏移量而得之。同理，Y 軸向偏移量則可透過量測第一標記與第二標記之間的γ轴向距 離，然後再將其換算成γ軸向偏移量而得之。 如此即可準確地搜尋及辨識標記，以進一步偵測兩基板的對 位狀態。換言之，在進行標記搜尋時，可避免找不到對應之標記 或誤辨等辨識失誤的現象。 有關本發明的技術特徵與實作，茲配合圖式作較佳實施例詳 細說明如下。 【實施方式】 以下舉出具體實施例並參照圖式以詳細說明本發明之内容。 說明中提及之符號係參照圖式符號。 第2圖係為根據本發明之一實施例所繪示的對位系統，其包 含第一基板110、複數個第一引腳〇ead) U2、第二基板12〇、複 數個第二引腳122、一個或多個第一標記13〇以及一個或多個第二 標記140。 ^第一引腳112係依序設置於第一基板110上，而第二引腳122 係依序設置於第二基板12〇上；其中，第二引腳122對應於第— 引腳112 ’以與對應之第-引腳112對位黏合。 第一標記130係設置於第一基板11()上，且位於兩相鄰之第 ^丨腳112之間。根據較佳實施例，第一標記130係位於兩相鄰 之第一引腳112的中央。 一第一標記丨4〇係設置於第二基板120上，且位於兩相鄰之第 腳22之間。根據較佳實施例，第二標記mo係位於兩相鄰 1343090 之第二引腳122的中央。 根據本發明之難實施例，第—標記13G鮮二標記14〇係 為不相同之形狀，並且當第一引腳112與第二引腳122對位黏合 時’第-標記no與第二標記140相互對應。當第一引腳ιΐ2與 第二引腳122對準時，第二標記14G與相鄰之第—標記13〇之中 心大致上成一登直線。According to a preferred embodiment of the present invention, when the first pin is aligned with the second leg, the axial distance between the edge of the second mark and the edge of the adjacent first pin is not less than a predetermined X axial offset distance. When the first pin is aligned with the second pin, the γ axial distance between the edge of the first mark and the edge of the adjacent second mark is not less than a predetermined γ axial offset distance. In accordance with a preferred embodiment of the present invention, the first mark and the second mark have different colors to further enhance the recognition of the mark. The alignment method disclosed in the present invention is for aligning the first and second substrates, the first substrate has a plurality of adjacent first-pins, and the second substrate has a plurality of phases corresponding to the first-pin And a second pin having at least one corresponding first mark between the first and the first pins, wherein the first mark: the first mark s has a different shape. The alignment method disclosed in the present invention comprises: tilting the first mark; 二 two = calculating the distance between the first and second marks to obtain X, the axial offset: two: the distance between the L and the second mark Obtaining a γ axial offset amount; adjusting a relative position of the first and second substrates according to an axial offset of == γ; and bonding the first and second substrates in a para position. 1343090 Here the 'x-axis offset can be measured by measuring the X-axis distance between the first mark and the second mark, and then converting it to the X-axis offset. Similarly, the Y-axis offset can be obtained by measuring the γ axial distance between the first mark and the second mark and then converting it to the γ-axis offset. In this way, the mark can be accurately searched and identified to further detect the alignment state of the two substrates. In other words, when performing tag search, it is possible to avoid the phenomenon of identifying errors such as corresponding marks or misrecognition. The technical features and implementations of the present invention will be described in detail below with reference to the drawings. [Embodiment] Hereinafter, specific embodiments will be described with reference to the drawings to explain the details of the present invention. The symbols mentioned in the description refer to the schema symbols. 2 is a aligning system according to an embodiment of the invention, including a first substrate 110, a plurality of first pins 〇ead) U2, a second substrate 12 〇, a plurality of second pins 122, one or more first indicia 13A and one or more second indicia 140. The first pin 112 is sequentially disposed on the first substrate 110, and the second pin 122 is sequentially disposed on the second substrate 12A; wherein the second pin 122 corresponds to the first pin 112' It is bonded to the corresponding first-pin 112. The first mark 130 is disposed on the first substrate 11 () and is located between the two adjacent legs 112. According to a preferred embodiment, the first indicia 130 is located in the center of two adjacent first pins 112. A first mark 设置4〇 is disposed on the second substrate 120 and located between the two adjacent legs 22. According to a preferred embodiment, the second mark mo is located in the center of the second pin 122 of two adjacent 1343090. According to a difficult embodiment of the present invention, the first mark 13G is in a different shape, and when the first pin 112 is bonded to the second pin 122, the 'marker no and the second mark' are used. 140 corresponds to each other. When the first pin ι ΐ 2 is aligned with the second pin 122, the second mark 14G is substantially aligned with the center of the adjacent first mark 13 。.
根據本發明之較佳實關，亦可將第-標記130與第二標記 14〇設計成不相同之顏色，以進一步增強標記的辨識度。^ 此外’參照第3八圖及第3B圖，當第一引腳112與第二引腳 122對位準確時，第二標記14〇之邊緣與鄰近之第一引腳112之邊 緣的X軸向距離X2係、不小於—既定之χ轴向偏移距離幻。當第 一引腳112與第二引腳122對位準確時，第一標記13〇之邊緣與 相鄰之第二標記14()之邊緣的γ轴向距離¥2係不小於—既定之γ 轴向偏移距離Y1。熟f相關技藝之人士當能瞭解，既定之X轴向 偏移距離XI與Y軸向偏移距離Y1可視f際應崎況根據不同 的精度要求予以定義。 如此-來，根據本發明，即可保證當第一基板110與第二基 板120發生部分錯位時’不會遮住第一對位標記⑽或第二標記 L40 ’城即可賴透過搜尋、辨識第—標記UG與第二標記140， 仔知疋位點15G、⑽。然後進_步得到定位點15()、_之間的橫 向距離ΛΧ及縱向轉Δγ，如第4騎示。因此即可透過補正換 Ϊ，將取叙躺輯ΛΧ及縱向麟ΔΥ解成實際偏移量，、 據以進行機台的調校。 第5圖係為根據本發明之一實施例所緣示的對位方法流程 圖=方法可使具有相鄰之複數個第一弓ί腳之第一基板和具有相 4之複數個第—⑽之第二基板相互對準。於此，第一引腳之間 具有至少-第-標記，第二引腳賴於第—引腳，且兩者之間具 有對應於第-標記之至卜第二標記，其中第—標記與第二標記 形狀為不相同。前述對位方法包括： 偵，第-標記，以及偵測對應之第二標記（步驟210); 计算第一標記與第二標記之間的距離以得到χ轴向偏移量以 及Υ軸向偏移量（步驟220); 根據X軸向鄉量和丫軸向偏移量碰第—基板和第二基板 的相對位置（步驟230);以及 對位黏合第一基板和第二基板（步驟240)。 當第一引腳與第二引腳對準時，第二標記位於第一標記之中 間。在較佳實施射’第二標記與相鄰之第—標記大致上排列成 一豎直線。 根據本發明之較佳實施例，當第一基板與第二基板對位準確 時，第二標記之邊緣與鄰近之第一引腳之邊緣的χ軸向距離係不 小於一既定之Χ軸向偏移距離。當第一基板與第二基板對位準確 時，第一標記邊緣與相鄰之第二標記之邊緣的γ軸向距離係不小 於一既定之γ軸向偏移距離。 根據本發明之較佳實施例，χ軸向偏移量可透過量測第一標 記與第二標記之間的X軸向距離，然後再將其換算成χ軸向偏移 量而得之。同理’ γ軸向偏移量可透過量測第一標記與第二標記 之間的Υ軸向距離’然後再將其換算成¥軸向偏移量而得之a 根據本發明之較佳實施例，亦可將第一標記與第二標記設計 1343090 成不相同之顏色’以進一步增強標記的辨識度。 於此，第一基板可為印刷電路板（PCB)、軟性電路板（FPC) 或薄膜覆晶（COF )基板。第二基板可為pCB、FPC或COF基板。 舉例來說，在LCD製程中，前述第一基板和第二基板可分別為 COF基板與PCB ;當欲將c〇F基板與pCB耦合時，可利用分別 设置於其上之彼此互為不同形狀（例如：三角形、類三角形、圓 形、類圓形、矩形或任意之多邊形等，本發明並秘定於特定形 狀）的相對應標記進行對位動作。According to a preferred embodiment of the present invention, the first mark 130 and the second mark 14 can also be designed in different colors to further enhance the recognition of the mark. ^ In addition, referring to FIGS. 3-8 and 3B, when the first pin 112 and the second pin 122 are aligned accurately, the edge of the second mark 14 与 and the X axis of the edge of the adjacent first pin 112 The distance from the X2 system is not less than - the predetermined axial offset distance is illusory. When the first pin 112 and the second pin 122 are aligned accurately, the γ axial distance of the edge of the first mark 13 与 and the edge of the adjacent second mark 14 () is not less than - the predetermined γ The axial offset is the distance Y1. Those skilled in the art can understand that the established X-axis offset distance XI and the Y-axis offset distance Y1 can be defined according to different accuracy requirements. In this way, according to the present invention, it can be ensured that when the first substrate 110 and the second substrate 120 are partially misaligned, the first alignment mark (10) or the second mark L40 can not be blocked. The first mark UG and the second mark 140, and the points 15G, (10) are known. Then, in step _, the lateral distance ΛΧ between the positioning points 15 (), _ and the longitudinal rotation Δγ are obtained, as shown in the fourth riding. Therefore, it is possible to correct the Ϊ 躺 ΛΧ and the longitudinal Υ Δ 成 into actual offsets, and adjust the machine according to the correction. 5 is a flow chart of a aligning method according to an embodiment of the present invention. The method may be such that a first substrate having a plurality of adjacent first edges and a plurality of phases having a phase 4 (10) The second substrates are aligned with each other. Here, the first pin has at least a -th mark, the second pin depends on the first pin, and there is a second mark corresponding to the first mark to the second mark, wherein the first mark The second mark shape is different. The foregoing alignment method includes: detecting, first-marking, and detecting a corresponding second mark (step 210); calculating a distance between the first mark and the second mark to obtain an axial offset and an axial offset Shifting (step 220); touching the relative positions of the first substrate and the second substrate according to the X-axis and the axial offset (step 230); and bonding the first substrate and the second substrate (step 240) ). When the first pin is aligned with the second pin, the second mark is located between the first marks. Preferably, the second mark is aligned with the adjacent first mark in a vertical line. According to a preferred embodiment of the present invention, when the alignment between the first substrate and the second substrate is accurate, the axial distance between the edge of the second mark and the edge of the adjacent first pin is not less than a predetermined axial direction. Offset distance. When the first substrate and the second substrate are aligned accurately, the γ axial distance between the first mark edge and the edge of the adjacent second mark is not less than a predetermined γ axial offset distance. In accordance with a preferred embodiment of the present invention, the yaw axial offset is measured by measuring the X-axis distance between the first mark and the second mark and then converting it to the χ axial offset. Similarly, the 'γ axial offset can be measured by measuring the axial distance ' between the first mark and the second mark' and then converting it into an axial offset, which is preferred according to the present invention. In an embodiment, the first mark may be in a different color from the second mark design 1343090 to further enhance the recognition of the mark. Here, the first substrate may be a printed circuit board (PCB), a flexible circuit board (FPC), or a thin film flip chip (COF) substrate. The second substrate can be a pCB, FPC or COF substrate. For example, in the LCD process, the first substrate and the second substrate may be a COF substrate and a PCB respectively; when the c〇F substrate is to be coupled with the pCB, the mutually different shapes respectively disposed on the substrate may be utilized. (For example, a triangle, a triangle, a circle, a circle, a rectangle, or an arbitrary polygon, etc., and the corresponding mark of the present invention is fixed to a specific shape) performs an alignment action.
雖然本發明以前述之較佳實施_露如上，财並非用以限 定本發明，任何熟習相關技藝者，在不脫離本發明之精神和範圍 内，當可作⑽之更__，因此本㈣之專娜護範圍須視 本說明書所附之巾料纖騎界定者為準。 【圖式簡單說明】 第圖及第1B圖係為習知對位偏移檢測方法之示意圖； •第2圖係為根據本發明之—實施例鱗示之對位系統之示意 圖， .第3A圖係為第2圖中第一基板與第二基板錯位狀態之示意 .第3B圖係為第2圖中第一基板與第二基板對位狀態之示意 圖；以及_係為第2圖中第—基板與第二基板調校狀態之示意 圖 第圖係為根據本發明之一實施例所繪示之對位方法之流程 1343090 【主要元件符號說明】 12................................引腳 22................................引腳 30................................標記 40................................標記 50................................定位點 60................................定位點 110..............................第一基板 112..............................第一引腳 120..............................第二基板 122..............................第二引腳 130..............................第一標記 140..............................第二標記 150..............................定位點 160..............................定位點 △X.............................距離 ΔΥ.............................距離 XI...............................X轴向偏移距離 Y1...............................Y軸向偏移距離 X2...............................X軸向距離 Y2...............................Y軸向距離Although the present invention has been described above in detail, it is not intended to limit the present invention, and those skilled in the art can make (10) more __, therefore, (4) without departing from the spirit and scope of the present invention. The scope of the special care shall be subject to the definition of the towel material attached to this manual. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 and FIG. 1B are schematic diagrams showing a conventional alignment offset detecting method; FIG. 2 is a schematic diagram of a registration system according to the embodiment of the present invention, and FIG. 3A The figure is a schematic diagram of the state in which the first substrate and the second substrate are dislocated in FIG. 2; FIG. 3B is a schematic view showing the alignment state of the first substrate and the second substrate in FIG. 2; - Schematic diagram of the alignment state of the substrate and the second substrate. The figure is a flow 1336890 of the alignment method according to an embodiment of the present invention. [Description of main component symbols] 12........... ..................... Pins 22.......................... ...pin 30................................mark 40....... .........................Marking 50....................... .........positioning point 60................................positioning point 110... ...........................first substrate 112................... ...........the first pin 120..............................the second substrate 122 ..............................Second pin 130............... ...............the first Note 140..............................The second mark 150............. ................positioning point 160.............................. positioning Point △X............................. Distance ΔΥ................ .............distance XI...............................X axial deviation Shift distance Y1..............................Y axial offset distance X2......... ......................X axial distance Y2...................... ........Y axial distance