201245737 六、發明說明： 【發明所屬之技術領域】 本發明提供一種以探針壓觸基板線路檢測點之對位方 法，特別涉及利用複數影像感測器校對探針與檢測點的基 準位置。本發明也涉及實施所述方法的對位裝置。 【先前技術】 按’構成液晶顯示器（LCD)或觸控板（T〇uchpanel) 之玻璃基板的表面都設有電路圖形結構，該電路圖形結構 具有複數延伸至基板邊緣的外接線路，且電路圖形結構是 利用所述外接線路與外界之控制或驅動等電路相互連接； 此外，該玻璃基板於電路圖形結構形成後，需經由所述外 接線路上之檢測點對電路圖形結構進行電阻值和電容值等 的量測，以判斷基板之電路圖形結構的良劣。 且知 ^ 用於1測上述基板之電路圖形結構的檢測設 備，通常配備有相互連動之檢測模具及影像 ##CCD(chargeCoupledDevice)^a,JIS,,^J#^ 部具有複數量測雜針；該檢測模具及影 於檢測設備之檢測台上沿縱向、橫向及㈣位移，^ ^ it上而下感測檢測台上之基板表面影像，以= 土板上之㈣或檢測點的基準位置，並 =檢測點位置而對準基板，且令所述探 具由^壓觸基板檢測點，以量測基板的電路圖形結t 置，;:由於”f像感測器雖然能夠校正基板的基準位 因此所述探針===據基板之型號而時常替換， 卞之基旱位置與檢測點的基準位置之間，存在 201245737 著容易產生誤差的隱憂，亟需加以改善。 【發明内容】 本發明之一目的在於提供一種以探針壓觸基板線路檢 測點之對位方法’能分別利用影像感測器校對基板與探針 的基準位置’以克服上述先前技術中，所述探針之基準位 置與檢測點的基準位置之間容易產生誤差的問題。 本發明之另一目的在於提供一種以探針壓觸基板線路 檢測點之對位裝置’有利於促使基板與探針接受影像感測 器校對基準位置。 為實現上述目的並解決問題’本發明採行的方法， 含： 於檢測台上提供一能夠擺放待測基板的承放盤，該 基板上具有複數線路之檢測點； 使用該檢測台上之一上影像感測器，於該承放盤上方 感測該基板，並經由調動該承放盤以校正板之 的基準位置；及 使用該檢測台上之-位置低於該上影像感測器的下影 像感測器，於一跟隨該上影像感測器移動的檢測模具下 方:感測職錢部之減探針，趣㈣動該承放盤或 該模具，以校對所述探針與該檢測點之基準位置。 據此，旎夠克服上述先前技術中，所述探針之基準位 置與檢測點的基準位置之間容易產生誤差關題，進而提 升基板上電路圖形結構之量測準確度。 在一具體的實施上，該承放盤能夠以自轉的方式調 動’該上影像感測器能沿著-以上轴向位移至承放盤上 201245737 ’該模具跟隨上影像 上 方’且下影像感測器固設於檢剛台 感測器移動至下影像感測器上方。 上二該下影像感測器也能沿著-以 除此之外，本發明採行的褒置技術，包含： 一檢測台； 一承放盤，極置於該檢測台上，該承放盤上擺放〆待 測基板，該基板上具有複數線路之檢測點； 一上影像感測器，配置於該檢測台上，能夠於該承放 盤上方感測該基板，並經由調動該承放盤以校正該基板之 檢測點的基準位置； 一檢測模具，連結該上影像感測器，而能夠跟隨該上 影像感測器移動，該模具底部具有複數探針；及 一下影像感測器，配置於该檢測台上低於該上影像感 測器的位置，能夠於該模具下方感測所述探針，並經由調 動該承放盤或該模具，以校對所述探針與該檢測點之基準 位置。 據此，有利於促使基板與探針接受影像感測器校對基 準位置。 實際上’該檢測台上具有一連結承放盤的第一驅動 器，能驅動承放盤以自轉的方式調動；該檢測台上具有一 連結上影像感測器的第二驅動器’能驅動上影像感測器沿 著一以上軸向位移至承放盤上方；該下影像感測器固設於 檢測台上，該模具跟隨上影像感測器移動至下影像感測器 上方。 5 201245737 或者，該檢測台上具有一連結下影像感測器的第三鵪 動器，也能驅動下影像感測器沿著一以上軸向位移至模區 下方。 異具 然而，為能明確且充分揭露本發明，併予列舉較佳命 施之圖例，以詳細說明.其實施方式如後述： 汽 【實施方式】 首觀圖1所示，揭示出本發明第一款實施例的流程圖， 並配合圖2至圖4說明本發明以探針壓觸基板線路檢蜊點 之對位方法，包含下列實施步驟： ' 在步驟S10中，於一檢測台丨上提供一能夠擺放複數 待測基板9的承放盤2’該基板9頂面之邊緣具有複數綠路 之檢測點91 (配合圖6所示）；在本實施上，該檢剛台ι項 部設有一連結承放盤2的第一驅動器6，該第一驅動器6包 含一接受馬達驅動的直立轉軸61，且承放盤2設於轉軸61 頂部，該第一驅動器6能經由轉軸61驅動承放盤2自轉。 在步驟S20中，使用檢測台！上之一上影像感測器3， 於承放盤2上方感測基板9 (配合圖5及圖6所示），並麵 由調動承放盤2及基板9，以校正基板9之檢測點91的基 準位置；在本實施上，該上影像感測器3能沿著一以上軸 向位移至承放盤2上方；實際上，該檢測台丨頂部設有_ 連結上影像感測器3的第二驅動器7,該第二驅動器7包含 一縱向軀動單元71、一橫向驅動單元72及一垂向驅動單元 73，該縱向驅動單元71設於檢測台1頂部，該橫向驅動單 元72設於縱向驅動單元71上，該垂向驅動單元73設於橫 向驅動單元72上’且上影像感測器3設於垂向驅動單元73 201245737 上：所述縱向、橫向、垂向驅動單元7i、72、73各自以一 馬^、-接受馬達!_㈣椁及二導引麟軌構成；如此， ;;二驅動器7f句驅動上影像感測器3沿縱向、橫向及 垂向位移至承放盤2上方；舲 驅動器6以自轉的方式觸^卜9該承賴2能經由第一 (未柄Γ由上影像感測器3外接之-計算機 J未;上^板9之檢剛點91的基準位置是否校正完 及所述檢測點91的影像像感測器3感測之基板9 及檢測點91的實際位置，6所示），而得到基板9 及檢測點9丨之鲜位置的=一於計算機減狀基板9 9及檢測點91之實際位置且計算機能將所述基板 基板9及檢測點91之誤差值二準值,互比對’而得出所述 檢測點91之誤差值，栌制第〜忒計算機依據所述基板9及 所述基板9及檢剩點^之誤=動器6調動承放盤2補償 測點91的基準位置； 值’而校正所述基板9及檢 的基準位置未校正^時，^基板9之所述檢測點91 機判斷基板9之所述产測點9f I施在步驟S2G，當計算 即實施在步驟S3G。、’的基準位置已校正完畢時， 感測哭3:二〇中’使用檢測台1上之-位置低於上影像 的檢測模具5 =❹ST一跟隨上影像感測器3移動 部之複數Μ方配。圖及圖8所示）’感測模具1底 9，以校ffm +51 ’並經由自轉的方式調動承放盤2及基板 上，該模/述探針51與檢測點91之基準位置·’在本實施 〆5與上影像感測裔3 —同設於第二驅動器7之 7 1 201245737 垂向驅動單元73上，且模具5之高度底於上影像感測器3, ，第二驅動器7能驅動模具5跟隨上影像感測器3沿縱向、 橫向及垂向位移，以壓觸及脫離該基板9之所述檢測點91 ; 该下影像感測器4固設於檢測台1上，且位於承放盤2旁 侧，該模具5能經由第二驅動器7驅動而跟隨上影像感測 器4移動至下影像感測器4上方。 〜 在步驟S31中，經由下影像感測器4外接 ，所述探針51與制點91之鮮位置是否射;^畢機 的實際Si (配合圖7及圖8所示)’而得出所述探針51 述基板9及於且計算機能夠將所述探針51之實際位置與所 松剛點91的基準位置相互比對， 針51之誤差 侍出所述探 制第一驅動哭“ 據所述探針51之誤差值，控 而校對所^ 6調動承放盤2補償所述探針5!之举差信 =對所4探針51與檢測 ^差值’ 斷所述探針51邀檢：則點91二之基準位置，當計算機判 重複實施在步 、’.的基準位置未校對完畢時’即 置 91的基準位置^機判斷所述探針51與L 在步驟S4〇 t 即實施在步驟S4〇° 模具5，而校^^實軛上，於步驟S30中，也能姑由 上，於步驟中述探針 值，經由自轉 δ亥叶异機也能依據所述探針51 = 值，而校對以？:具5補償所述探斜51 '十51與檢測點91之基準位置。 校對完畢時，結束=述探針51與檢義W的基準仅 在另一 s… °201245737 VI. Description of the Invention: [Technical Field] The present invention provides a method for aligning a line detection point of a substrate with a probe, and particularly relates to a reference position of a probe and a detection point by a plurality of image sensors. The invention also relates to a aligning device implementing the method. [Prior Art] The surface of a glass substrate constituting a liquid crystal display (LCD) or a touch panel (T〇uchpanel) is provided with a circuit pattern structure having a plurality of external lines extending to the edge of the substrate, and a circuit pattern The structure is interconnected with the external control or driving circuit by using the external circuit; further, after the glass substrate is formed in the circuit pattern structure, the resistance value and the capacitance value of the circuit pattern structure are required to be detected through the detection point on the external wiring line. The measurement is performed to judge the goodness of the circuit pattern structure of the substrate. And knowing that the detecting device for measuring the circuit pattern of the above-mentioned substrate is usually equipped with a detecting mold and an image that are interlocked with each other##CCD(chargeCoupledDevice)^a, JIS, and ^J#^ have a plurality of measuring needles; The detecting mold and the detection table on the detecting device are longitudinally, laterally and (four) displaced, and the upper surface of the detecting device senses the surface image of the substrate on the detecting table to = (4) on the earth plate or the reference position of the detecting point. And = the position of the detection point is aligned with the substrate, and the probe is pressed against the substrate detection point to measure the circuit pattern of the substrate;;: because the "f image sensor can correct the reference of the substrate Therefore, the probe === is often replaced according to the model of the substrate, and there is a concern that 201245737 is prone to error between the base position of the base and the reference position of the detection point, and it is not necessary to improve. It is an object of the present invention to provide a method for aligning a substrate line to detect a point by a probe, and to correct the reference position of the substrate and the probe by using an image sensor, respectively, to overcome the reference position of the probe in the prior art. There is a problem that an error is easily generated between the reference positions of the detection points. Another object of the present invention is to provide a matching device that uses a probe to press the substrate line detection point to facilitate the substrate and the probe to receive the image sensor calibration reference. In order to achieve the above object and solve the problem, the method of the present invention comprises: providing a receiving and placing disk capable of placing a substrate to be tested on a detecting platform, the substrate having a detection point of a plurality of lines; using the detecting table An upper image sensor, the substrate is sensed above the receiving plate, and the reference position of the plate is corrected by mobilizing the receiving plate; and the position on the detecting table is lower than the position of the upper image sensor The lower image sensor is below the detecting mold that follows the movement of the upper image sensor: sensing the reducing probe of the working money department, and interestingly (four) moving the receiving tray or the mold to proofread the probe and the detecting According to the above, in the prior art, the reference position between the probe and the reference position of the detection point is prone to error, thereby improving the circuit on the substrate. The measurement accuracy of the shape structure. In a specific implementation, the bearing plate can be mobilized in a self-rotating manner. The upper image sensor can be axially displaced along the above-mentioned axis to the loading plate 201245737 'The mold follows the image The upper and lower image sensors are fixed on the detector to move over the lower image sensor. The second image sensor can also be along the other side, in addition to the present invention. The mounting technology comprises: a detecting station; a receiving plate placed on the detecting table, the substrate to be tested is placed on the receiving plate, the substrate has a detection point of a plurality of lines; an upper image sensor, Disposed on the detecting table, the substrate can be sensed above the receiving plate, and the reference position of the detecting point of the substrate is corrected by mobilizing the receiving plate; a detecting mold is connected to the upper image sensor, and can be followed The upper image sensor moves, the bottom of the mold has a plurality of probes; and a lower image sensor is disposed on the detection table below the position of the upper image sensor, and the probe can be sensed under the mold Needle The mobilization of the mold or tray is resting, to the probe and the calibration reference point of the position detection. Accordingly, it is advantageous to cause the substrate and the probe to receive the image sensor to calibrate the reference position. In fact, the detection platform has a first driver for connecting the loading and unloading discs, and the driving tray can be driven to rotate in a self-rotating manner; the detecting station has a second driver connected to the image sensor to drive the image sensing. The device is displaced along one or more axial directions to the top of the receiving tray; the lower image sensor is fixed on the detecting table, and the mold moves to the upper image sensor following the upper image sensor. 5 201245737 Alternatively, the test stand has a third actuator connected to the lower image sensor, which can also drive the lower image sensor to be displaced along one or more axial directions below the mold area. However, in order to clearly and fully disclose the present invention, a preferred embodiment of the invention will be described in detail, and its embodiment will be described later. [Embodiment] FIG. 1 shows the first aspect of the present invention. A flow chart of an embodiment, with reference to FIG. 2 to FIG. 4, illustrates a method for aligning the inspection points of the substrate with the probe by the probe, and includes the following implementation steps: 'In step S10, on a detection table Providing a receiving tray 2' capable of placing a plurality of substrates to be tested 9; the edge of the top surface of the substrate 9 has a plurality of green road detection points 91 (shown in FIG. 6); in this embodiment, the inspection platform A first drive 6 is provided, which is connected to the receiving plate 2 . The first drive 6 includes an upright rotating shaft 61 that is driven by a motor. The receiving plate 2 is disposed on the top of the rotating shaft 61. The first driving device 6 can drive the receiving and receiving disk 2 via the rotating shaft 61. rotation. In step S20, the test station is used! The upper image sensor 3 senses the substrate 9 above the loading and unloading disk 2 (shown in FIG. 5 and FIG. 6 ), and aligns the receiving plate 2 and the substrate 9 to correct the detection point 91 of the substrate 9 . a reference position; in this embodiment, the upper image sensor 3 can be displaced along more than one axial direction to the top of the loading and unloading disc 2; in fact, the top of the detecting table is provided with a second connecting the upper image sensor 3 The driver 7 includes a longitudinal body unit 71, a lateral drive unit 72 and a vertical drive unit 73. The longitudinal drive unit 71 is disposed on the top of the detection table 1, and the lateral drive unit 72 is disposed in the longitudinal direction. On the unit 71, the vertical driving unit 73 is disposed on the lateral driving unit 72' and the upper image sensor 3 is disposed on the vertical driving unit 73 201245737: the longitudinal, lateral, vertical driving units 7i, 72, 73 Each of the horses is received by a motor, a motor, a motor, a motor, a motor, a motor, a motor, a motor, a camera, a camera, a camera, a camera The driver 6 touches the sound in a self-rotating manner. The upper side of the image sensor 3 is connected to the computer J; the reference position of the inspection point 91 of the upper board 9 is corrected, and the substrate 9 and the detection point 91 sensed by the image sensor 3 of the detection point 91 are corrected. The actual position, shown in 6), obtains the actual position of the substrate 9 and the detection point 9 = = the actual position of the computer minus substrate 9 9 and the detection point 91 and the computer can display the substrate substrate 9 and the detection point The error value of the error value of 91 is the same as the value of the error value of the detection point 91, and the error value of the detection point 91 is obtained by the computer according to the substrate 9 and the substrate 9 and the error of the detection point ^ 6, the transfer tray 2 compensates the reference position of the measuring point 91; the value 'corrects the substrate 9 and the reference position of the inspection is not corrected ^, the detection point 91 of the substrate 9 determines the production point of the substrate 9 9f I is applied to step S2G, and when it is calculated, it is implemented in step S3G. When the 'reference position has been corrected, the sensory cry 3: in the second ' 'Use the detection table 1 - the position is lower than the upper image detection mold 5 = ❹ ST one follows the image sensor 3 moving part of the Μ Party match. Fig. 8 and Fig. 8' sense the bottom 9 of the mold 1 to modulate the ffm + 51 ' and mobilize the mounting plate 2 and the substrate via the rotation. The reference position of the mold/descriptor 51 and the detection point 91 is ' In the present embodiment, the image sensor 3 is disposed on the vertical drive unit 73 of the second driver 7 and the height of the mold 5 is lower than the upper image sensor 3, and the second driver 7 is provided. The driving mold 5 is driven to follow the longitudinal, lateral and vertical displacement of the image sensor 3 to press and disengage the detecting point 91 of the substrate 9; the lower image sensor 4 is fixed on the detecting station 1 and Located on the side of the receiving tray 2, the mold 5 can be driven by the second driver 7 to move over the lower image sensor 4 following the upper image sensor 4. ~ In step S31, via the lower image sensor 4, the position of the probe 51 and the spot 91 is shot; the actual Si of the machine (shown in Fig. 7 and Fig. 8) is obtained. The probe 51 describes the substrate 9 and the computer can compare the actual position of the probe 51 with the reference position of the loose point 91, and the error of the needle 51 gives the probe the first drive to cry. According to the error value of the probe 51, the calibration and proofing plate 2 compensates the probe 5! The difference signal = the 4 probe 51 and the detection difference 'breaks the probe 51 Invited: The reference position of 91 is the same. When the computer judges that the step is repeated, the reference position of '. is not corrected, the reference position of 91 is set to determine the probes 51 and L in step S4〇t. That is, the mold 5 is executed in the step S4, and the yoke is fixed on the yoke. In the step S30, the probe value can also be referred to in the step, and the probe value can also be based on the rotation. The pin 51 = value, and the proofreading with ?: 5 compensates the reference position of the probe 51 '10 51 and the detection point 91. When the proofreading is completed, the end = the probe 51 and the base of the detection W Quasi only in another s... °
S 201245737 下 在又一具體的實施上，該下影像感測器4也处 以上軸向位移至模具5下方；在本實施上，該檢=’一 具有一連結下影像感测器4的第三驅動器％如〇 上 能驅動下影像感測器4沿著一以上軸向位移至模罝f7F)’ 方；實際上，該第三驅動器8包含一縱向驅動單二f 5 橫向驅動單元82,該縱向驅動單元81設於檢阀=ι81及二 松向驅動早元82設於縱向驅動單元81上，且 為 器4設於橫向驅動單元82上，所述縱向、橫向㈣二像感測 82各自以一馬達、一接受該馬達驅動的螺桿及二^ 8 = 軌構成，如此，該第三驅動器8能夠驅動下影 /月 沿著縱向及橫向位移至模具5。 像感測15 4 據此，能夠先利用上影像感測器3校正基板9 點91的基準位置’再利用下影像感測器4校對所述=叙= 與檢測點91之基準位置，以克服上述先前技術中，二述探 ，之基準位置與檢測點的基準位置之間容易產生誤差的$ 靖，進而升基板上電路圖形結構之量測準確度。 請參閱圖2所示，揭示出本發明第二款實施例的俯視 圖，並配合圖3及圖4說明本發明以探針壓觸基板線路檢 測點之對位裝置，包含一檢測台丨、一承放盤2、一上影像 感測器3、一檢測模具5及一下影像感測器4;該承放盤2 拖置於檢測台1頂部，該承放盤2頂部能擺放一以上待測 基板9 ’該基板9表面具有複數線路之檢測點91 (配合圖6 所示）；該上影像感測器3配置於檢測台1上，且懸持於檢 測台1及承放盤2上方，能於承放盤5上方感測基板9 (如 圖5所示）’並經由調動承放盤2以校正基板9之檢測點91In another specific implementation of S 201245737, the lower image sensor 4 is also axially displaced to the lower side of the mold 5; in this embodiment, the test has a first joint image sensor 4 The third driver % can drive the image sensor 4 to be displaced along one or more axial directions to the module f7F)'; in fact, the third driver 8 includes a longitudinally driven single two f 5 lateral driving unit 82, The longitudinal driving unit 81 is disposed on the longitudinal driving unit 81 at the check valve=ι81 and the second loose driving unit 82, and the device 4 is disposed on the lateral driving unit 82. The longitudinal and lateral (four) two-image sensing 82 Each is constituted by a motor, a screw driven by the motor, and a secondary rail, and thus, the third actuator 8 is capable of driving the lower shadow/month to be displaced to the mold 5 in the longitudinal and lateral directions. Image sensing 15 4 Accordingly, the reference position of the substrate 9 point 91 can be corrected by the upper image sensor 3, and the lower image sensor 4 can be used to correct the reference position of the === and the detection point 91 to overcome In the above prior art, the difference between the reference position and the reference position of the detection point is likely to cause an error, thereby increasing the measurement accuracy of the circuit pattern structure on the substrate. Referring to FIG. 2, a top view of a second embodiment of the present invention is disclosed, and the alignment device of the probe contact point detection point of the present invention is described with reference to FIG. 3 and FIG. 4, which includes a detection platform and a a loading tray 2, an upper image sensor 3, a detecting mold 5 and a lower image sensor 4; the receiving tray 2 is dragged on the top of the detecting table 1, and more than one substrate to be tested can be placed on the top of the receiving tray 2. 'The surface of the substrate 9 has a detection point 91 of a plurality of lines (shown in FIG. 6); the upper image sensor 3 is disposed on the detection table 1 and is suspended above the detection table 1 and the loading tray 2 to The substrate 9 (as shown in FIG. 5) is sensed above the discharge plate 5 and the detection point 91 of the substrate 9 is corrected by transferring the substrate 2
S 9 201245737 的基準位置；該檢測模具5連結上影像感剛 圖8所不），而能夠跟隨上 -(如圖 部具有複數探針51;該下影像感‘=;模具5底 上 低於上影像感鄉器3的位置，能於模且5下方:挪台1 針51 ’趣由調動承放盤2或模* 5，以校f感哪所迷探 與檢測點9丨之基準位置。其餘構件 t所述探斜51 於上述第一款實施例。 實知步驟係等同 據此，有利於促使基板9 影像感測H校對基準位置。 ’點91與料51接受 限定本發明;凡其他未脫例:二，並非用以 的等效修飾或置換，職包含之精神下而完成 【圖式簡單說明】 、後述申凊專利範圍内。 圖1是本發明第一款實施例的流程圖； 圖2是本發明第二款實施例的俯視圖； 圖3是圖2之A-A斷面圖； 圖4是圖2之B-B斷面圖； 圖5是圖3之一使用狀態圖； 圖6是圖2之一使用狀態的局部放大圖； 圖7是圖3之另一使用狀態圖· =圖7之探針:下影像感測器的局部放大圖； 圖9疋圖3之附加實施型態的 【主要元件符號說明】 置下心圖。 檢測台 承放盤 2 201245737 3 上影像感測器 4 下影像感測器 5 模具 51 探針 6 第一驅動器 61 轉軸 7 第二驅動器 71、81 縱向驅動單元 72 ' 82 橫向驅動單元 73 垂向驅動單元 8 第三驅動器 9 基板 91 檢測點 s 11The reference position of S 9 201245737; the detection mold 5 is connected to the image sense just as shown in Fig. 8), and can follow the upper- (the figure has a plurality of probes 51; the lower image sense '=; the mold 5 is lower than the bottom The position of the upper image sensing device 3 can be in the lower part of the mold and 5: the 1st pin 51' of the mobile station is tuned by the transfer plate 2 or the die * 5 to determine which of the detection and detection points 9 丨. The remaining members t are probed 51 in the first embodiment described above. The steps are known to facilitate the substrate 9 image sensing H to calibrate the reference position. 'Point 91 and material 51 are limited to the present invention; The following is a non-exhaustive example: the second embodiment of the present invention is not included in the spirit of the job, and is completed within the scope of the following claims. Figure 2 is a plan view of a second embodiment of the present invention; Figure 3 is a cross-sectional view taken along line AA of Figure 2; Figure 4 is a cross-sectional view of Figure 2; Figure 5 is a view of one of Figure 3; Figure 2 is a partial enlarged view of the state of use; Figure 7 is another use state diagram of Figure 3 = = probe of Figure 7: lower image sensor Partially enlarged view; Figure 9 附加 Figure 3 Additional embodiment of the [main component symbol description] Set the heart diagram. Test stand bearing plate 2 201245737 3 Upper image sensor 4 Lower image sensor 5 Mold 51 Probe 6 A driver 61 shaft 7 second driver 71, 81 longitudinal drive unit 72' 82 lateral drive unit 73 vertical drive unit 8 third drive 9 substrate 91 detection point s 11