KR20150056597A - 작업물들을 분리하는 방법 및 장치 및 이에 의해 제조된 물품 - Google Patents
작업물들을 분리하는 방법 및 장치 및 이에 의해 제조된 물품 Download PDFInfo
- Publication number
- KR20150056597A KR20150056597A KR1020157009304A KR20157009304A KR20150056597A KR 20150056597 A KR20150056597 A KR 20150056597A KR 1020157009304 A KR1020157009304 A KR 1020157009304A KR 20157009304 A KR20157009304 A KR 20157009304A KR 20150056597 A KR20150056597 A KR 20150056597A
- Authority
- KR
- South Korea
- Prior art keywords
- workpiece
- pulse
- laser
- changing
- modified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261704038P | 2012-09-21 | 2012-09-21 | |
| US61/704,038 | 2012-09-21 | ||
| US201261735489P | 2012-12-10 | 2012-12-10 | |
| US61/735,489 | 2012-12-10 | ||
| US201361766274P | 2013-02-19 | 2013-02-19 | |
| US61/766,274 | 2013-02-19 | ||
| US201361866736P | 2013-08-16 | 2013-08-16 | |
| US61/866,736 | 2013-08-16 | ||
| US14/032,829 | 2013-09-20 | ||
| US14/032,829 US9610653B2 (en) | 2012-09-21 | 2013-09-20 | Method and apparatus for separation of workpieces and articles produced thereby |
| PCT/US2013/061162 WO2014047549A1 (en) | 2012-09-21 | 2013-09-23 | Method and apparatus for separation of workpieces and articles produced thereby |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20150056597A true KR20150056597A (ko) | 2015-05-26 |
Family
ID=50337863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157009304A Abandoned KR20150056597A (ko) | 2012-09-21 | 2013-09-23 | 작업물들을 분리하는 방법 및 장치 및 이에 의해 제조된 물품 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9610653B2 (https=) |
| JP (1) | JP6397821B2 (https=) |
| KR (1) | KR20150056597A (https=) |
| CN (1) | CN104684677B (https=) |
| TW (1) | TWI637807B (https=) |
| WO (1) | WO2014047549A1 (https=) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012110971B4 (de) * | 2012-11-14 | 2025-03-20 | Schott Ag | Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks |
| WO2014121261A1 (en) * | 2013-02-04 | 2014-08-07 | Newport Corporation | Method and apparatus for laser cutting transparent and semitransparent substrates |
| CN107406294A (zh) * | 2015-01-06 | 2017-11-28 | 康宁股份有限公司 | 用于加工挠性玻璃板的玻璃载体组件和方法 |
| CN104827191A (zh) * | 2015-05-12 | 2015-08-12 | 大族激光科技产业集团股份有限公司 | 蓝宝石的激光切割方法 |
| EP3345878B1 (en) * | 2015-09-04 | 2023-04-26 | AGC Inc. | Glass tube production method, glass article production method, glass tube and glass article |
| CN107922259B (zh) | 2015-09-04 | 2021-05-07 | Agc株式会社 | 玻璃板的制造方法、玻璃板、玻璃物品的制造方法、玻璃物品以及玻璃物品的制造装置 |
| KR102781391B1 (ko) | 2015-09-09 | 2025-03-17 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들 |
| JP2019512397A (ja) | 2016-03-17 | 2019-05-16 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | レーザ加工システムにおける像平面の配置 |
| EP3508458B1 (en) | 2016-09-01 | 2022-03-16 | Agc Inc. | Method for manufacturing glass product |
| DE102016220844A1 (de) * | 2016-10-24 | 2018-04-26 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Verfahren zur Vorhersage der Kippneigung eines freigeschnittenen Werkstückteils und Bearbeitungsmaschine zur trennenden Bearbeitung eines plattenförmigen Werkstücks |
| CN110139727B (zh) | 2016-12-30 | 2022-04-05 | 伊雷克托科学工业股份有限公司 | 用于延长镭射处理设备中的光学器件生命期的方法和系统 |
| CN110291051B (zh) | 2017-02-21 | 2022-04-29 | Agc株式会社 | 玻璃板以及玻璃板的制造方法 |
| WO2018155100A1 (ja) | 2017-02-21 | 2018-08-30 | Agc株式会社 | ガラス板およびガラス板の製造方法 |
| JP2020531392A (ja) * | 2017-08-25 | 2020-11-05 | コーニング インコーポレイテッド | アフォーカルビーム調整アセンブリを用いて透明被加工物をレーザ加工するための装置及び方法 |
| KR20250039487A (ko) | 2018-06-05 | 2025-03-20 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법 |
| KR102240325B1 (ko) * | 2018-06-18 | 2021-04-13 | 신에츠 엔지니어링 가부시키가이샤 | 워크 분리 장치 및 워크 분리 방법 |
| TWI843784B (zh) | 2019-01-31 | 2024-06-01 | 美商伊雷克托科學工業股份有限公司 | 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體 |
| US11054574B2 (en) | 2019-05-16 | 2021-07-06 | Corning Research & Development Corporation | Methods of singulating optical waveguide sheets to form optical waveguide substrates |
| DE102019003822A1 (de) * | 2019-06-02 | 2020-12-03 | Keming Du | Verfahren zur Bearbeitung transparenter Materialien |
| WO2020251782A1 (en) | 2019-06-10 | 2020-12-17 | Electro Scientific Industries, Inc. | Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
| DE102020123146A1 (de) * | 2019-09-06 | 2021-03-11 | Andreas Wienkamp | Verfahren und Vorrichtung zum Einbringen eines Schnitts in ein Werkstück |
| JP2021163914A (ja) * | 2020-04-02 | 2021-10-11 | 浜松ホトニクス株式会社 | レーザ加工装置、レーザ加工方法及びウェハ |
| DE102021105034A1 (de) | 2021-03-02 | 2022-09-08 | Cericom GmbH | Vorrichtung und Verfahren zum Bearbeiten eines Werkstücks aus Glas |
| DE102021214310A1 (de) | 2021-12-14 | 2023-06-15 | Carl Zeiss Smt Gmbh | Verfahren und Vorrichtung zum Erzeugen mindestens einer Hohlstruktur, EUVSpiegel und EUV-Lithographiesystem |
Family Cites Families (184)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE559796A (https=) | 1956-10-12 | |||
| DE1244346B (de) | 1964-10-19 | 1967-07-13 | Menzel Gerhard Glasbearbeitung | Verfahren zum Schneiden von Glas |
| US3629545A (en) | 1967-12-19 | 1971-12-21 | Western Electric Co | Laser substrate parting |
| NL6801184A (https=) | 1968-01-26 | 1969-07-29 | ||
| GB1246481A (en) | 1968-03-29 | 1971-09-15 | Pilkington Brothers Ltd | Improvements in or relating to the cutting of glass |
| US3629546A (en) | 1969-04-02 | 1971-12-21 | American Can Co | Air-cooled laser processing of materials |
| US3751238A (en) | 1970-02-25 | 1973-08-07 | Corning Glass Works | Method of chemically strengthening a silicate article containing soda |
| AT342232B (de) | 1972-10-12 | 1978-03-28 | Glaverbel | Verfahren und vorrichtung zum trennen eines korpers aus einem glasartigen oder vitrokristallinen material |
| DE3110235A1 (de) | 1981-03-17 | 1982-10-21 | Trumpf GmbH & Co, 7257 Ditzingen | "verfahren und vorrichtung zum brennschneiden mittels eines laserstrahls" |
| US4467168A (en) | 1981-04-01 | 1984-08-21 | Creative Glassworks International | Method of cutting glass with a laser and an article made therewith |
| US4468534A (en) | 1982-09-30 | 1984-08-28 | Boddicker Franc W | Method and device for cutting glass |
| US4702042A (en) | 1984-09-27 | 1987-10-27 | Libbey-Owens-Ford Co. | Cutting strengthened glass |
| US4639572A (en) | 1985-11-25 | 1987-01-27 | Ibm Corporation | Laser cutting of composite materials |
| EP0397236B1 (en) | 1989-05-08 | 1994-10-05 | Koninklijke Philips Electronics N.V. | Method of severing a plate of brittle material |
| US5073687A (en) * | 1989-06-22 | 1991-12-17 | Canon Kabushiki Kaisha | Method and apparatus for working print board by laser |
| US5132505A (en) | 1990-03-21 | 1992-07-21 | U.S. Philips Corporation | Method of cleaving a brittle plate and device for carrying out the method |
| RU2024441C1 (ru) | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
| JP2524477B2 (ja) | 1993-12-20 | 1996-08-14 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 液晶パネル形成用基板及びその製造方法 |
| US5776220A (en) | 1994-09-19 | 1998-07-07 | Corning Incorporated | Method and apparatus for breaking brittle materials |
| EP0847317B1 (en) | 1995-08-31 | 2003-08-27 | Corning Incorporated | Method and apparatus for breaking brittle materials |
| JP3271691B2 (ja) | 1996-02-29 | 2002-04-02 | セイコーインスツルメンツ株式会社 | 表示装置の製造方法 |
| JPH10128567A (ja) | 1996-10-30 | 1998-05-19 | Nec Kansai Ltd | レーザ割断方法 |
| MY120533A (en) | 1997-04-14 | 2005-11-30 | Schott Ag | Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass. |
| US5961852A (en) | 1997-09-09 | 1999-10-05 | Optical Coating Laboratory, Inc. | Laser scribe and break process |
| JP4396953B2 (ja) | 1998-08-26 | 2010-01-13 | 三星電子株式会社 | レーザ切断装置および切断方法 |
| JP3178524B2 (ja) | 1998-11-26 | 2001-06-18 | 住友重機械工業株式会社 | レーザマーキング方法と装置及びマーキングされた部材 |
| US6420678B1 (en) | 1998-12-01 | 2002-07-16 | Brian L. Hoekstra | Method for separating non-metallic substrates |
| US6259058B1 (en) | 1998-12-01 | 2001-07-10 | Accudyne Display And Semiconductor Systems, Inc. | Apparatus for separating non-metallic substrates |
| US6252197B1 (en) | 1998-12-01 | 2001-06-26 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator |
| US6211488B1 (en) | 1998-12-01 | 2001-04-03 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe |
| US6327875B1 (en) | 1999-03-09 | 2001-12-11 | Corning Incorporated | Control of median crack depth in laser scoring |
| DE10029110B4 (de) | 1999-06-15 | 2006-05-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren für die Materialbearbeitung und Verwendung desselben |
| JP3370310B2 (ja) | 1999-06-18 | 2003-01-27 | 三星ダイヤモンド工業株式会社 | レーザーを用いたスクライブ法 |
| KR100626983B1 (ko) | 1999-06-18 | 2006-09-22 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 레이저를 이용한 스크라이브 방법 |
| US6684885B2 (en) | 1999-06-18 | 2004-02-03 | Paul M. Graczyk | Laser surgery eye shield |
| US6472295B1 (en) | 1999-08-27 | 2002-10-29 | Jmar Research, Inc. | Method and apparatus for laser ablation of a target material |
| JP4172112B2 (ja) | 1999-09-03 | 2008-10-29 | 旭硝子株式会社 | ガラスリボンの割断方法 |
| DE19952331C1 (de) | 1999-10-29 | 2001-08-30 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen |
| DE19955824A1 (de) | 1999-11-20 | 2001-06-13 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Schneiden eines Werkstückes aus sprödbrüchigem Werkstoff |
| EP1232038B1 (en) | 1999-11-24 | 2008-04-23 | Applied Photonics, Inc. | Method and apparatus for separating non-metallic materials |
| US8217304B2 (en) * | 2001-03-29 | 2012-07-10 | Gsi Group Corporation | Methods and systems for thermal-based laser processing a multi-material device |
| DE19963939B4 (de) | 1999-12-31 | 2004-11-04 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material |
| DE10016628A1 (de) | 2000-04-04 | 2001-10-18 | Schott Glas | Verfahren zum Herstellen von kleinen Dünnglasscheiben und größere Dünnglasscheibe als Halbfabrikat für dieses Herstellen |
| AU2001261402A1 (en) | 2000-05-11 | 2001-11-20 | Ptg Precision Technology Center Limited Llc | System for cutting brittle materials |
| JP2002019528A (ja) | 2000-07-05 | 2002-01-23 | Kasai Kogyo Co Ltd | トノボード装置 |
| DE10041519C1 (de) | 2000-08-24 | 2001-11-22 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Durchschneiden einer Flachglasplatte in mehrere Rechteckplatten |
| JP4659300B2 (ja) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
| US6676878B2 (en) | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
| WO2002048059A1 (de) | 2000-12-15 | 2002-06-20 | Lzh Laserzentrum Hannover E.V. | Verfahren zum durchtrennen von bauteilen aus glas, keramik, glaskeramik oder dergleichen durch erzeugung eines thermischen spannungsrisses an dem bauteil entlang einer trennzone |
| FR2819505B1 (fr) | 2001-01-12 | 2003-02-28 | Saint Gobain | Procede de decoupe des bords d'un ruban continu de verre, dispositif de mise en oeuvre, plateau de verre decoupe selon ce procede |
| TW592867B (en) | 2001-06-11 | 2004-06-21 | Mitsuboshi Diamond Ind Co Ltd | An apparatus and a method for scribing brittle substrates |
| TW592868B (en) | 2001-07-18 | 2004-06-21 | Mitsuboshi Diamond Ind Co Ltd | Device and method for scribing fragile material substrate |
| RU2206525C2 (ru) | 2001-07-25 | 2003-06-20 | Кондратенко Владимир Степанович | Способ резки хрупких неметаллических материалов |
| US6559411B2 (en) | 2001-08-10 | 2003-05-06 | First Solar, Llc | Method and apparatus for laser scribing glass sheet substrate coatings |
| TW568809B (en) | 2001-09-21 | 2004-01-01 | Mitsuboshi Diamond Ind Co Ltd | Method for scribing substrate of brittle material and scriber |
| KR100786179B1 (ko) | 2002-02-02 | 2007-12-18 | 삼성전자주식회사 | 비금속 기판 절단 방법 및 장치 |
| JP4267240B2 (ja) | 2002-02-22 | 2009-05-27 | 日本板硝子株式会社 | ガラス構造物の製造方法 |
| TWI277477B (en) | 2002-03-12 | 2007-04-01 | Mitsuboshi Diamond Ind Co Ltd | Method and system for machining fragile material |
| ATE493226T1 (de) | 2002-03-12 | 2011-01-15 | Hamamatsu Photonics Kk | Verfahren zum schneiden eines bearbeiteten objekts |
| US6787732B1 (en) * | 2002-04-02 | 2004-09-07 | Seagate Technology Llc | Method for laser-scribing brittle substrates and apparatus therefor |
| US6744009B1 (en) | 2002-04-02 | 2004-06-01 | Seagate Technology Llc | Combined laser-scribing and laser-breaking for shaping of brittle substrates |
| KR101037142B1 (ko) * | 2002-04-19 | 2011-05-26 | 일렉트로 사이언티픽 인더스트리즈, 아이엔씨 | 펄스 레이저를 이용한 기판의 프로그램 제어 다이싱 |
| FR2839508B1 (fr) | 2002-05-07 | 2005-03-04 | Saint Gobain | Vitrage decoupe sans rompage |
| JP4408607B2 (ja) | 2002-06-11 | 2010-02-03 | 三星ダイヤモンド工業株式会社 | スクライブ方法及びスクライブ装置 |
| JP4032857B2 (ja) | 2002-07-24 | 2008-01-16 | ソニー株式会社 | タッチパネル用のガラス基板、タッチパネル及び携帯端末 |
| TWI277612B (en) | 2002-08-09 | 2007-04-01 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing fragile material substrate |
| JP2004083378A (ja) | 2002-08-29 | 2004-03-18 | Central Glass Co Ltd | 化学強化ガラス |
| EP1396556A1 (en) | 2002-09-06 | 2004-03-10 | ALSTOM (Switzerland) Ltd | Method for controlling the microstructure of a laser metal formed hard layer |
| CN100528507C (zh) | 2002-11-06 | 2009-08-19 | 三星钻石工业股份有限公司 | 划线形成设备和划线形成方法 |
| JP2004168584A (ja) | 2002-11-19 | 2004-06-17 | Thk Co Ltd | ガラス基板材の切断方法 |
| KR100497820B1 (ko) | 2003-01-06 | 2005-07-01 | 로체 시스템즈(주) | 유리판절단장치 |
| ATE524285T1 (de) | 2003-01-10 | 2011-09-15 | Mitsuboshi Diamond Ind Co Ltd | Vorrichtung und verfahren zum ritzen von trägern aus sprödem material sowie automatische analyselinie |
| JP2004217492A (ja) | 2003-01-17 | 2004-08-05 | Murakami Corp | ガラス板材の切抜方法 |
| JP2004223796A (ja) | 2003-01-21 | 2004-08-12 | Kyoto Seisakusho Co Ltd | 脆性材料の割断加工方法 |
| WO2004067243A1 (ja) | 2003-01-29 | 2004-08-12 | Mitsuboshi Diamond Industrial Co., Ltd. | 基板分断装置および基板分断方法 |
| JP4515034B2 (ja) | 2003-02-28 | 2010-07-28 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| CN1758985A (zh) * | 2003-03-12 | 2006-04-12 | 浜松光子学株式会社 | 激光加工方法 |
| JP4337059B2 (ja) | 2003-03-21 | 2009-09-30 | ローツェ システムズ コーポレーション | ガラス板切断装置 |
| JP2004343008A (ja) | 2003-05-19 | 2004-12-02 | Disco Abrasive Syst Ltd | レーザ光線を利用した被加工物分割方法 |
| JP4535692B2 (ja) | 2003-05-28 | 2010-09-01 | セントラル硝子株式会社 | 化学強化ガラス |
| JP2005019667A (ja) | 2003-06-26 | 2005-01-20 | Disco Abrasive Syst Ltd | レーザ光線を利用した半導体ウエーハの分割方法 |
| JP2005088078A (ja) | 2003-09-17 | 2005-04-07 | Lemi Ltd | 走査型レーザ装置 |
| JP4615231B2 (ja) | 2004-02-02 | 2011-01-19 | 三星ダイヤモンド工業株式会社 | スクライブ装置およびこの装置を用いたスクライブ方法 |
| JP2005268752A (ja) | 2004-02-19 | 2005-09-29 | Canon Inc | レーザ割断方法、被割断部材および半導体素子チップ |
| JP4716663B2 (ja) * | 2004-03-19 | 2011-07-06 | 株式会社リコー | レーザ加工装置、レーザ加工方法、及び該加工装置又は加工方法により作製された構造体 |
| DE102004014277A1 (de) | 2004-03-22 | 2005-10-20 | Fraunhofer Ges Forschung | Verfahren zum laserthermischen Trennen von Flachgläsern |
| DE102004020737A1 (de) | 2004-04-27 | 2005-11-24 | Lzh Laserzentrum Hannover E.V. | Vorrichtung zum Durchtrennen von Bauteilen aus sprödbrüchigen Materialien mit spannungsfreier Bauteillagerung |
| DE102004024475A1 (de) | 2004-05-14 | 2005-12-01 | Lzh Laserzentrum Hannover E.V. | Verfahren und Vorrichtung zum Trennen von Halbleitermaterialien |
| US20060021977A1 (en) | 2004-07-30 | 2006-02-02 | Menegus Harry E | Process and apparatus for scoring a brittle material incorporating moving optical assembly |
| US7820941B2 (en) | 2004-07-30 | 2010-10-26 | Corning Incorporated | Process and apparatus for scoring a brittle material |
| US7723212B2 (en) | 2004-07-30 | 2010-05-25 | Mitsuboshi Diamond Industrial Co., Ltd | Method for forming median crack in substrate and apparatus for forming median crack in substrate |
| US7550367B2 (en) * | 2004-08-17 | 2009-06-23 | Denso Corporation | Method for separating semiconductor substrate |
| US7575999B2 (en) | 2004-09-01 | 2009-08-18 | Micron Technology, Inc. | Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies |
| JP3887394B2 (ja) | 2004-10-08 | 2007-02-28 | 芝浦メカトロニクス株式会社 | 脆性材料の割断加工システム及びその方法 |
| US7585791B2 (en) | 2004-10-20 | 2009-09-08 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method, laser irradiation apparatus and method for manufacturing semiconductor device |
| EP1806202B1 (en) | 2004-10-25 | 2011-08-17 | Mitsuboshi Diamond Industrial Co., Ltd. | Method and device for forming crack |
| JP4917257B2 (ja) | 2004-11-12 | 2012-04-18 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| WO2006062017A1 (ja) | 2004-12-08 | 2006-06-15 | Laser Solutions Co., Ltd. | 被分割体における分割起点形成方法、被分割体の分割方法、およびパルスレーザー光による被加工物の加工方法 |
| JP2006159747A (ja) | 2004-12-09 | 2006-06-22 | Japan Steel Works Ltd:The | レーザ加工方法及びその装置 |
| JP4666391B2 (ja) | 2004-12-28 | 2011-04-06 | 三星ダイヤモンド工業株式会社 | ガラス基板の分断方法 |
| US7528342B2 (en) | 2005-02-03 | 2009-05-05 | Laserfacturing, Inc. | Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser |
| JP4198123B2 (ja) * | 2005-03-22 | 2008-12-17 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| JP2006294099A (ja) | 2005-04-07 | 2006-10-26 | Asahi Glass Co Ltd | 磁気記録媒体用ガラス基板の周面研磨装置及び製造方法 |
| DE102005024497B4 (de) | 2005-05-27 | 2008-06-19 | Schott Ag | Verfahren zum mechanischen Brechen von geritzten flachen Werkstücken aus sprödbrüchigem Material |
| US9138913B2 (en) * | 2005-09-08 | 2015-09-22 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
| DE102006042280A1 (de) | 2005-09-08 | 2007-06-06 | IMRA America, Inc., Ann Arbor | Bearbeitung von transparentem Material mit einem Ultrakurzpuls-Laser |
| KR101081613B1 (ko) | 2005-09-13 | 2011-11-09 | 가부시키가이샤 레미 | 취성재료의 할단방법 및 장치 |
| JP4816390B2 (ja) * | 2005-11-16 | 2011-11-16 | 株式会社デンソー | 半導体チップの製造方法および半導体チップ |
| JP2007165850A (ja) * | 2005-11-16 | 2007-06-28 | Denso Corp | ウェハおよびウェハの分断方法 |
| US20070155131A1 (en) | 2005-12-21 | 2007-07-05 | Intel Corporation | Method of singulating a microelectronic wafer |
| DE102006018622B3 (de) | 2005-12-29 | 2007-08-09 | H2B Photonics Gmbh | Vorrichtung zum durchtrennenden Bearbeiten von Bauteilen aus sprödbrüchigem Material |
| KR20070074297A (ko) | 2006-01-09 | 2007-07-12 | 주식회사 탑 엔지니어링 | 초음파를 이용한 글라스 기판의 브레이크 장치 |
| JPWO2007094348A1 (ja) | 2006-02-15 | 2009-07-09 | 東レエンジニアリング株式会社 | レーザスクライブ方法、レーザスクライブ装置、及びこの方法または装置を用いて割断した割断基板 |
| JP2008007360A (ja) | 2006-06-28 | 2008-01-17 | Optrex Corp | マザーガラス基板及びガラス基板ならびにそのガラス基板の製造方法 |
| JP2008007384A (ja) | 2006-06-30 | 2008-01-17 | Optrex Corp | ガラス基板の製造方法 |
| ES2428826T3 (es) | 2006-07-03 | 2013-11-11 | Hamamatsu Photonics K.K. | Procedimiento de procesamiento por láser y chip |
| DE102006033217A1 (de) | 2006-07-14 | 2008-01-17 | Jenoptik Automatisierungstechnik Gmbh | Verfahren zur Erzeugung optisch wahrnehmbarer laserinduzierter Risse in sprödes Material |
| TWI350824B (en) | 2006-08-30 | 2011-10-21 | Nat Applied Res Laboratories | A pre-fixed position thermal fracturing method of brittle material and device for the same |
| JP4954653B2 (ja) | 2006-09-19 | 2012-06-20 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| JP5132911B2 (ja) | 2006-10-03 | 2013-01-30 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| JP2008115067A (ja) | 2006-11-07 | 2008-05-22 | Lemi Ltd | フラットパネルディスプレィ薄板の割断方法 |
| US20080110952A1 (en) | 2006-11-15 | 2008-05-15 | Marvin William Kemmerer | Sheet separation through fluid impact |
| US20100119846A1 (en) | 2007-03-02 | 2010-05-13 | Masahiro Sawada | Reinforced plate glass and method for manufacturing the same |
| US7977602B2 (en) | 2007-03-21 | 2011-07-12 | Photon Dynamics, Inc. | Laser ablation using multiple wavelengths |
| JP2008229711A (ja) | 2007-03-23 | 2008-10-02 | Toray Eng Co Ltd | レーザスクライブ方法およびその装置 |
| JP5784273B2 (ja) * | 2007-04-05 | 2015-09-24 | チャーム エンジニアリング株式会社 | レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法 |
| US7982162B2 (en) | 2007-05-15 | 2011-07-19 | Corning Incorporated | Method and apparatus for scoring and separating a brittle material with a single beam of radiation |
| US8062732B2 (en) | 2007-05-22 | 2011-11-22 | Corning Incorporated | Glass article having improved edge |
| CN101542606B (zh) | 2007-05-30 | 2012-06-20 | 东洋钢钣株式会社 | 磁盘用玻璃基板的表面加工方法和磁盘用玻璃基板 |
| JP4730345B2 (ja) | 2007-06-18 | 2011-07-20 | ソニー株式会社 | ガラス基板対を有する表示装置及びその切断方法 |
| JP4886620B2 (ja) | 2007-07-04 | 2012-02-29 | 株式会社東芝 | レーザ割断装置及び基板の製造方法 |
| JP4402708B2 (ja) | 2007-08-03 | 2010-01-20 | 浜松ホトニクス株式会社 | レーザ加工方法、レーザ加工装置及びその製造方法 |
| US20090040640A1 (en) | 2007-08-07 | 2009-02-12 | Jinnam Kim | Glass cutting method, glass for flat panel display thereof and flat panel display device using it |
| JP5113462B2 (ja) | 2007-09-12 | 2013-01-09 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の面取り方法 |
| JP2009090598A (ja) | 2007-10-11 | 2009-04-30 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板の曲線状クラック形成方法および脆性材料基板 |
| US8011207B2 (en) | 2007-11-20 | 2011-09-06 | Corning Incorporated | Laser scoring of glass sheets at high speeds and with low residual stress |
| KR100949152B1 (ko) | 2007-11-23 | 2010-03-25 | 삼성코닝정밀유리 주식회사 | 유리 기판 레이저 절단 장치 |
| CN101468875A (zh) | 2007-12-24 | 2009-07-01 | 鸿富锦精密工业(深圳)有限公司 | 脆性非金属基材及其切割方法 |
| CN101497493B (zh) | 2008-02-01 | 2012-12-26 | 鸿富锦精密工业(深圳)有限公司 | 激光切割装置 |
| GB2457720A (en) | 2008-02-23 | 2009-08-26 | Philip Thomas Rumsby | Method for laser processing on the opposite sides of thin transparent substrates |
| US8232218B2 (en) | 2008-02-29 | 2012-07-31 | Corning Incorporated | Ion exchanged, fast cooled glasses |
| EP2277838B1 (en) | 2008-03-19 | 2014-01-22 | Hoya Corporation | Magnetic recording media substrates and magnetic recording media |
| JP5345334B2 (ja) | 2008-04-08 | 2013-11-20 | 株式会社レミ | 脆性材料の熱応力割断方法 |
| US8173038B2 (en) | 2008-04-18 | 2012-05-08 | Corning Incorporated | Methods and systems for forming microstructures in glass substrates |
| JP2009280452A (ja) | 2008-05-23 | 2009-12-03 | Central Glass Co Ltd | ガラス基板及び製造方法 |
| JP5005612B2 (ja) | 2008-05-24 | 2012-08-22 | 株式会社レミ | 脆性材料のフルカット割断方法 |
| US8053704B2 (en) | 2008-05-27 | 2011-11-08 | Corning Incorporated | Scoring of non-flat materials |
| US8258427B2 (en) | 2008-05-30 | 2012-09-04 | Corning Incorporated | Laser cutting of glass along a predetermined line |
| US8051679B2 (en) | 2008-09-29 | 2011-11-08 | Corning Incorporated | Laser separation of glass sheets |
| DE102008052006B4 (de) | 2008-10-10 | 2018-12-20 | 3D-Micromac Ag | Verfahren und Vorrichtung zur Herstellung von Proben für die Transmissionselektronenmikroskopie |
| WO2010074091A1 (ja) | 2008-12-25 | 2010-07-01 | 旭硝子株式会社 | 脆性材料基板の割断方法、装置及び車両用窓ガラス |
| JP2010150068A (ja) | 2008-12-25 | 2010-07-08 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板の割断方法 |
| US8327666B2 (en) | 2009-02-19 | 2012-12-11 | Corning Incorporated | Method of separating strengthened glass |
| US8341976B2 (en) | 2009-02-19 | 2013-01-01 | Corning Incorporated | Method of separating strengthened glass |
| US8347651B2 (en) | 2009-02-19 | 2013-01-08 | Corning Incorporated | Method of separating strengthened glass |
| US8245540B2 (en) | 2009-02-24 | 2012-08-21 | Corning Incorporated | Method for scoring a sheet of brittle material |
| KR20170082649A (ko) | 2009-03-20 | 2017-07-14 | 코닝 인코포레이티드 | 정밀 레이저 스코어링 |
| US8590873B2 (en) | 2009-04-08 | 2013-11-26 | Corning Incorporated | Method and device for restraining movement of continuously traveling glass sheet |
| US20100279067A1 (en) | 2009-04-30 | 2010-11-04 | Robert Sabia | Glass sheet having enhanced edge strength |
| US8132427B2 (en) | 2009-05-15 | 2012-03-13 | Corning Incorporated | Preventing gas from occupying a spray nozzle used in a process of scoring a hot glass sheet |
| US8269138B2 (en) | 2009-05-21 | 2012-09-18 | Corning Incorporated | Method for separating a sheet of brittle material |
| WO2010138451A2 (en) | 2009-05-27 | 2010-12-02 | Corning Incorporated | Laser scoring of glass at elevated temperatures |
| US8543888B2 (en) | 2009-06-09 | 2013-09-24 | Microchip Technology Incorporated | Programmable cyclic redundancy check CRC unit |
| CN102470549A (zh) | 2009-07-03 | 2012-05-23 | 旭硝子株式会社 | 脆性材料基板的切割方法、切割装置以及通过该切割方法获得的车辆用窗玻璃 |
| US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
| EP2480507A1 (en) * | 2009-08-28 | 2012-08-01 | Corning Incorporated | Methods for laser cutting articles from chemically strengthened glass substrates |
| US8426767B2 (en) | 2009-08-31 | 2013-04-23 | Corning Incorporated | Methods for laser scribing and breaking thin glass |
| JP2011088382A (ja) | 2009-10-23 | 2011-05-06 | Mitsuboshi Diamond Industrial Co Ltd | ブレイク装置およびブレイク方法 |
| US8171753B2 (en) | 2009-11-18 | 2012-05-08 | Corning Incorporated | Method for cutting a brittle material |
| US20110127242A1 (en) | 2009-11-30 | 2011-06-02 | Xinghua Li | Methods for laser scribing and separating glass substrates |
| US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
| JP5584560B2 (ja) * | 2010-08-31 | 2014-09-03 | 三星ダイヤモンド工業株式会社 | レーザスクライブ方法 |
| US8720228B2 (en) | 2010-08-31 | 2014-05-13 | Corning Incorporated | Methods of separating strengthened glass substrates |
| US20120175652A1 (en) | 2011-01-06 | 2012-07-12 | Electro Scientific Industries, Inc. | Method and apparatus for improved singulation of light emitting devices |
| TWI457191B (zh) | 2011-02-04 | 2014-10-21 | Mitsuboshi Diamond Ind Co Ltd | 雷射切割方法及雷射加工裝置 |
| JP5789802B2 (ja) * | 2011-03-22 | 2015-10-07 | 株式会社ソシオネクスト | 半導体チップの製造方法 |
| JP2014210669A (ja) * | 2011-08-31 | 2014-11-13 | 旭硝子株式会社 | 強化ガラスの切断方法 |
| US8677783B2 (en) | 2011-11-28 | 2014-03-25 | Corning Incorporated | Method for low energy separation of a glass ribbon |
| US9828277B2 (en) | 2012-02-28 | 2017-11-28 | Electro Scientific Industries, Inc. | Methods for separation of strengthened glass |
| US20130221053A1 (en) | 2012-02-28 | 2013-08-29 | Electro Scientific Industries, Inc. | Method and apparatus for separation of strengthened glass and articles produced thereby |
| US9828278B2 (en) | 2012-02-28 | 2017-11-28 | Electro Scientific Industries, Inc. | Method and apparatus for separation of strengthened glass and articles produced thereby |
| JP2015516352A (ja) | 2012-02-29 | 2015-06-11 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 強化ガラスを加工するための方法及び装置並びにこれにより生成された製品 |
| US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
| JP5575200B2 (ja) * | 2012-09-28 | 2014-08-20 | 浜松ホトニクス株式会社 | レーザ加工装置及びその製造方法 |
-
2013
- 2013-09-20 US US14/032,829 patent/US9610653B2/en not_active Expired - Fee Related
- 2013-09-23 WO PCT/US2013/061162 patent/WO2014047549A1/en not_active Ceased
- 2013-09-23 CN CN201380047456.7A patent/CN104684677B/zh not_active Expired - Fee Related
- 2013-09-23 TW TW102134228A patent/TWI637807B/zh not_active IP Right Cessation
- 2013-09-23 KR KR1020157009304A patent/KR20150056597A/ko not_active Abandoned
- 2013-09-23 JP JP2015533244A patent/JP6397821B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN104684677A (zh) | 2015-06-03 |
| TWI637807B (zh) | 2018-10-11 |
| JP6397821B2 (ja) | 2018-09-26 |
| TW201436918A (zh) | 2014-10-01 |
| US9610653B2 (en) | 2017-04-04 |
| WO2014047549A1 (en) | 2014-03-27 |
| CN104684677B (zh) | 2018-11-16 |
| US20140083983A1 (en) | 2014-03-27 |
| JP2015529161A (ja) | 2015-10-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20150056597A (ko) | 작업물들을 분리하는 방법 및 장치 및 이에 의해 제조된 물품 | |
| US20240261893A1 (en) | Method for laser processing a transparent material | |
| EP3363771B1 (en) | Method of machining and releasing closed forms from a transparent substrate using burst of ultrafast laser pulses | |
| JP2019064916A (ja) | 透明及び半透明な基板をレーザ切断する方法及び装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20150410 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20180913 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20191021 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20200416 |
|
| PC1904 | Unpaid initial registration fee |