KR20150038360A - 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템 - Google Patents

빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템 Download PDF

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Publication number
KR20150038360A
KR20150038360A KR20157004933A KR20157004933A KR20150038360A KR 20150038360 A KR20150038360 A KR 20150038360A KR 20157004933 A KR20157004933 A KR 20157004933A KR 20157004933 A KR20157004933 A KR 20157004933A KR 20150038360 A KR20150038360 A KR 20150038360A
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KR
South Korea
Prior art keywords
substrate
transfer
module
arm
chamber
Prior art date
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Ceased
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KR20157004933A
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English (en)
Korean (ko)
Inventor
크리스토퍼 호프마이스터
알렉산더 쥐. 크루피쉐브
율리시스 길크라이스트
Original Assignee
브룩스 오토메이션 인코퍼레이티드
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Publication of KR20150038360A publication Critical patent/KR20150038360A/ko
Ceased legal-status Critical Current

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    • H01L21/67742—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H01L21/67196—
    • H01L21/67201—
    • H01L21/67766—
    • H01L21/67775—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Engineering (AREA)
KR20157004933A 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템 Ceased KR20150038360A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US93891307P 2007-05-18 2007-05-18
US60/938,913 2007-05-18
US12/123,329 US8562271B2 (en) 2007-05-18 2008-05-19 Compact substrate transport system
US12/123,329 2008-05-19
PCT/US2008/064144 WO2008144664A1 (en) 2007-05-18 2008-05-19 Compact substrate transport system with fast swap robot

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020097026390A Division KR20100031681A (ko) 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020167013801A Division KR101887110B1 (ko) 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템

Publications (1)

Publication Number Publication Date
KR20150038360A true KR20150038360A (ko) 2015-04-08

Family

ID=40122195

Family Applications (3)

Application Number Title Priority Date Filing Date
KR20157004933A Ceased KR20150038360A (ko) 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템
KR1020167013801A Active KR101887110B1 (ko) 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템
KR1020097026390A Ceased KR20100031681A (ko) 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020167013801A Active KR101887110B1 (ko) 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템
KR1020097026390A Ceased KR20100031681A (ko) 2007-05-18 2008-05-19 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템

Country Status (4)

Country Link
US (2) US8562271B2 (https=)
JP (4) JP5543336B2 (https=)
KR (3) KR20150038360A (https=)
WO (1) WO2008144664A1 (https=)

Cited By (1)

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KR20200050039A (ko) * 2018-10-31 2020-05-11 세메스 주식회사 기판 처리 장치 및 방법

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TWI738166B (zh) 2013-01-22 2021-09-01 美商布魯克斯自動機械公司 基材運送
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200050039A (ko) * 2018-10-31 2020-05-11 세메스 주식회사 기판 처리 장치 및 방법

Also Published As

Publication number Publication date
JP6630031B2 (ja) 2020-01-15
KR20100031681A (ko) 2010-03-24
JP2014123758A (ja) 2014-07-03
JP6898403B2 (ja) 2021-07-07
US20090003976A1 (en) 2009-01-01
KR101887110B1 (ko) 2018-08-09
JP2017143270A (ja) 2017-08-17
KR20160066555A (ko) 2016-06-10
JP5543336B2 (ja) 2014-07-09
US8562271B2 (en) 2013-10-22
US20140044504A1 (en) 2014-02-13
JP2011504288A (ja) 2011-02-03
US9401294B2 (en) 2016-07-26
JP2020010059A (ja) 2020-01-16
WO2008144664A1 (en) 2008-11-27
JP6480488B2 (ja) 2019-03-13

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