JP5543336B2 - 高速スワップロボット付コンパクト基板搬送システム - Google Patents

高速スワップロボット付コンパクト基板搬送システム Download PDF

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Publication number
JP5543336B2
JP5543336B2 JP2010509494A JP2010509494A JP5543336B2 JP 5543336 B2 JP5543336 B2 JP 5543336B2 JP 2010509494 A JP2010509494 A JP 2010509494A JP 2010509494 A JP2010509494 A JP 2010509494A JP 5543336 B2 JP5543336 B2 JP 5543336B2
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substrate
transfer
chamber
module
substrate processing
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JP2011504288A (ja
JP2011504288A5 (https=
Inventor
クリストファー ホフマイスター
アレキサンダー ジー． クルフィシェフ
ユリシス ギルクリスト
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Azenta Inc
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Azenta Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
JP2010509494A 2007-05-18 2008-05-19 高速スワップロボット付コンパクト基板搬送システム Active JP5543336B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US93891307P 2007-05-18 2007-05-18
US60/938,913 2007-05-18
US12/123,329 US8562271B2 (en) 2007-05-18 2008-05-19 Compact substrate transport system
US12/123,329 2008-05-19
PCT/US2008/064144 WO2008144664A1 (en) 2007-05-18 2008-05-19 Compact substrate transport system with fast swap robot

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014023394A Division JP6630031B2 (ja) 2007-05-18 2014-02-10 基板搬送システム、基板処理装置、及び基板搬送方法

Publications (3)

Publication Number Publication Date
JP2011504288A JP2011504288A (ja) 2011-02-03
JP2011504288A5 JP2011504288A5 (https=) 2014-04-03
JP5543336B2 true JP5543336B2 (ja) 2014-07-09

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Family Applications (4)

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JP2010509494A Active JP5543336B2 (ja) 2007-05-18 2008-05-19 高速スワップロボット付コンパクト基板搬送システム
JP2014023394A Active JP6630031B2 (ja) 2007-05-18 2014-02-10 基板搬送システム、基板処理装置、及び基板搬送方法
JP2017027611A Active JP6480488B2 (ja) 2007-05-18 2017-02-17 基板搬送方法
JP2019170796A Active JP6898403B2 (ja) 2007-05-18 2019-09-19 基板搬送システム、基板処理装置、及び基板搬送方法

Family Applications After (3)

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JP2014023394A Active JP6630031B2 (ja) 2007-05-18 2014-02-10 基板搬送システム、基板処理装置、及び基板搬送方法
JP2017027611A Active JP6480488B2 (ja) 2007-05-18 2017-02-17 基板搬送方法
JP2019170796A Active JP6898403B2 (ja) 2007-05-18 2019-09-19 基板搬送システム、基板処理装置、及び基板搬送方法

Country Status (4)

Country Link
US (2) US8562271B2 (https=)
JP (4) JP5543336B2 (https=)
KR (3) KR20150038360A (https=)
WO (1) WO2008144664A1 (https=)

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Also Published As

Publication number Publication date
JP6630031B2 (ja) 2020-01-15
KR20100031681A (ko) 2010-03-24
JP2014123758A (ja) 2014-07-03
JP6898403B2 (ja) 2021-07-07
US20090003976A1 (en) 2009-01-01
KR101887110B1 (ko) 2018-08-09
JP2017143270A (ja) 2017-08-17
KR20160066555A (ko) 2016-06-10
KR20150038360A (ko) 2015-04-08
US8562271B2 (en) 2013-10-22
US20140044504A1 (en) 2014-02-13
JP2011504288A (ja) 2011-02-03
US9401294B2 (en) 2016-07-26
JP2020010059A (ja) 2020-01-16
WO2008144664A1 (en) 2008-11-27
JP6480488B2 (ja) 2019-03-13

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