KR20140138134A - 강화 유리를 분리하는 방법과 장치 및 이에 의해 제조된 물품 - Google Patents
강화 유리를 분리하는 방법과 장치 및 이에 의해 제조된 물품 Download PDFInfo
- Publication number
- KR20140138134A KR20140138134A KR1020147023715A KR20147023715A KR20140138134A KR 20140138134 A KR20140138134 A KR 20140138134A KR 1020147023715 A KR1020147023715 A KR 1020147023715A KR 20147023715 A KR20147023715 A KR 20147023715A KR 20140138134 A KR20140138134 A KR 20140138134A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- laser light
- along
- light beam
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 63
- 238000000926 separation method Methods 0.000 title description 4
- 239000006058 strengthened glass Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 201
- 230000006835 compression Effects 0.000 claims description 30
- 238000007906 compression Methods 0.000 claims description 30
- 239000005341 toughened glass Substances 0.000 claims description 23
- 230000003287 optical effect Effects 0.000 claims description 15
- 238000003754 machining Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 230000031700 light absorption Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000002211 ultraviolet spectrum Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 description 15
- 239000003999 initiator Substances 0.000 description 10
- 230000005855 radiation Effects 0.000 description 10
- 230000000977 initiatory effect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000005496 tempering Methods 0.000 description 2
- 230000005374 Kerr effect Effects 0.000 description 1
- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- -1 but not limited to Substances 0.000 description 1
- 238000003426 chemical strengthening reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24488—Differential nonuniformity at margin
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261604380P | 2012-02-28 | 2012-02-28 | |
| US61/604,380 | 2012-02-28 | ||
| PCT/US2013/027947 WO2013130549A1 (en) | 2012-02-28 | 2013-02-27 | Method and apparatus for separation of strengthened glass and articles produced thereby |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20140138134A true KR20140138134A (ko) | 2014-12-03 |
Family
ID=49003164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147023715A Withdrawn KR20140138134A (ko) | 2012-02-28 | 2013-02-27 | 강화 유리를 분리하는 방법과 장치 및 이에 의해 제조된 물품 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9828277B2 (enExample) |
| JP (1) | JP2015511571A (enExample) |
| KR (1) | KR20140138134A (enExample) |
| CN (1) | CN104136967B (enExample) |
| TW (1) | TW201350245A (enExample) |
| WO (1) | WO2013130549A1 (enExample) |
Families Citing this family (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
| KR20120073249A (ko) * | 2009-08-28 | 2012-07-04 | 코닝 인코포레이티드 | 화학적으로 강화된 유리 기판으로부터 제품을 레이저 절단하기 위한 방법 |
| US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
| TWI494284B (zh) | 2010-03-19 | 2015-08-01 | Corning Inc | 強化玻璃之機械劃割及分離 |
| US8864005B2 (en) | 2010-07-16 | 2014-10-21 | Corning Incorporated | Methods for scribing and separating strengthened glass substrates |
| US9828278B2 (en) | 2012-02-28 | 2017-11-28 | Electro Scientific Industries, Inc. | Method and apparatus for separation of strengthened glass and articles produced thereby |
| CN104136967B (zh) | 2012-02-28 | 2018-02-16 | 伊雷克托科学工业股份有限公司 | 用于分离增强玻璃的方法及装置及由该增强玻璃生产的物品 |
| US10357850B2 (en) | 2012-09-24 | 2019-07-23 | Electro Scientific Industries, Inc. | Method and apparatus for machining a workpiece |
| CN104114506B (zh) | 2012-02-29 | 2017-05-24 | 伊雷克托科学工业股份有限公司 | 加工强化玻璃的方法和装置及藉此制造的物品 |
| US9938186B2 (en) * | 2012-04-13 | 2018-04-10 | Corning Incorporated | Strengthened glass articles having etched features and methods of forming the same |
| US10351460B2 (en) * | 2012-05-22 | 2019-07-16 | Corning Incorporated | Methods of separating strengthened glass sheets by mechanical scribing |
| US9938180B2 (en) * | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
| US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
| WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| WO2014144322A1 (en) * | 2013-03-15 | 2014-09-18 | Kinestral Technologies, Inc. | Laser cutting strengthened glass |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| US9328011B2 (en) * | 2013-06-04 | 2016-05-03 | Coherent, Inc. | Laser-scribing of chemically strengthened glass |
| US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
| US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US20160311717A1 (en) * | 2013-12-17 | 2016-10-27 | Corning Incorporated | 3-d forming of glass |
| EP3099640B1 (en) * | 2014-01-27 | 2022-01-12 | Corning Incorporated | Edge chamfering by mechanically processing laser cut glass |
| US9776906B2 (en) | 2014-03-28 | 2017-10-03 | Electro Scientific Industries, Inc. | Laser machining strengthened glass |
| KR102445217B1 (ko) | 2014-07-08 | 2022-09-20 | 코닝 인코포레이티드 | 재료를 레이저 가공하는 방법 및 장치 |
| WO2016010943A2 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for arresting crack propagation |
| TWI659793B (zh) * | 2014-07-14 | 2019-05-21 | 美商康寧公司 | 用於使用可調整雷射束焦線來處理透明材料的系統及方法 |
| WO2016010991A1 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
| US10611667B2 (en) | 2014-07-14 | 2020-04-07 | Corning Incorporated | Method and system for forming perforations |
| US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
| EP3245166B1 (en) | 2015-01-12 | 2020-05-27 | Corning Incorporated | Laser cutting of thermally tempered substrates using the multi photon absorption method |
| EP3848334A1 (en) | 2015-03-24 | 2021-07-14 | Corning Incorporated | Alkaline earth boro-aluminosilicate glass article with laser cut edge |
| WO2016160391A1 (en) | 2015-03-27 | 2016-10-06 | Corning Incorporated | Gas permeable window and method of fabricating the same |
| US11186060B2 (en) | 2015-07-10 | 2021-11-30 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
| DE102016102768A1 (de) * | 2016-02-17 | 2017-08-17 | Schott Ag | Verfahren zur Kantenbearbeitung von Glaselementen und verfahrensgemäß bearbeitetes Glaselement |
| MY194570A (en) | 2016-05-06 | 2022-12-02 | Corning Inc | Laser cutting and removal of contoured shapes from transparent substrates |
| US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| CN109803934A (zh) | 2016-07-29 | 2019-05-24 | 康宁股份有限公司 | 用于激光处理的装置和方法 |
| WO2018044843A1 (en) | 2016-08-30 | 2018-03-08 | Corning Incorporated | Laser processing of transparent materials |
| CN109803786B (zh) | 2016-09-30 | 2021-05-07 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
| JP7066701B2 (ja) * | 2016-10-24 | 2022-05-13 | コーニング インコーポレイテッド | シート状ガラス基体のレーザに基づく加工のための基体処理ステーション |
| US20180118602A1 (en) * | 2016-11-01 | 2018-05-03 | Corning Incorporated | Glass sheet transfer apparatuses for laser-based machining of sheet-like glass substrates |
| US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| JP2019125688A (ja) * | 2018-01-16 | 2019-07-25 | 株式会社ディスコ | 被加工物のレーザー加工方法 |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| CN108298803B (zh) * | 2018-03-19 | 2019-03-29 | 莆田市威特电子有限公司 | 一种激光切割玻璃的方法 |
| CN111136378B (zh) * | 2019-12-31 | 2021-06-01 | 江西师范高等专科学校 | 一种航空飞机仪表显示系统维修设备 |
| US20250269463A1 (en) * | 2022-04-19 | 2025-08-28 | Nielson Scientific, Llc | Systems and methods for laser ablation |
Family Cites Families (156)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE638146A (enExample) | 1962-10-04 | |||
| US4702042A (en) | 1984-09-27 | 1987-10-27 | Libbey-Owens-Ford Co. | Cutting strengthened glass |
| US4828900A (en) | 1987-12-23 | 1989-05-09 | Ppg Industries, Inc. | Discrete glass cutting and edge shaping |
| GB2227965B (en) | 1988-10-12 | 1993-02-10 | Rolls Royce Plc | Apparatus for drilling a shaped hole in a workpiece |
| DE69133169D1 (de) | 1990-05-09 | 2003-01-16 | Canon Kk | Verfahren zur Erzeugung einer Struktur und Verfahren zum Vorbereiten einer halbleitenden Anordnung mit Hilfe dieses Verfahrens |
| RU2024441C1 (ru) | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
| US5637244A (en) | 1993-05-13 | 1997-06-10 | Podarok International, Inc. | Method and apparatus for creating an image by a pulsed laser beam inside a transparent material |
| US5656186A (en) | 1994-04-08 | 1997-08-12 | The Regents Of The University Of Michigan | Method for controlling configuration of laser induced breakdown and ablation |
| US5543365A (en) | 1994-12-02 | 1996-08-06 | Texas Instruments Incorporated | Wafer scribe technique using laser by forming polysilicon |
| US5665134A (en) | 1995-06-07 | 1997-09-09 | Hughes Missile Systems Company | Laser machining of glass-ceramic materials |
| US6373026B1 (en) | 1996-07-31 | 2002-04-16 | Mitsubishi Denki Kabushiki Kaisha | Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board |
| DE69629704T2 (de) | 1995-08-31 | 2004-07-08 | Corning Inc. | Verfahren und vorrichtung zum zerbrechen von sprödem material |
| US6820330B1 (en) | 1996-12-13 | 2004-11-23 | Tessera, Inc. | Method for forming a multi-layer circuit assembly |
| US5973290A (en) | 1997-02-26 | 1999-10-26 | W. L. Gore & Associates, Inc. | Laser apparatus having improved via processing rate |
| JP3957010B2 (ja) | 1997-06-04 | 2007-08-08 | 日本板硝子株式会社 | 微細孔を有するガラス基材 |
| US6577472B2 (en) * | 1997-07-24 | 2003-06-10 | Hitachi, Ltd. | Glass substrate for a magnetic disk, a magnetic disk which can be formed with a stable texture |
| DE19741329C1 (de) | 1997-09-19 | 1998-10-22 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zur Materialbearbeitung mit Plasma induzierender Hochenergiestrahlung |
| JPH11134645A (ja) * | 1997-10-30 | 1999-05-21 | Hoya Corp | 情報記録媒体用ガラス基板及びその製造方法 |
| JP3449201B2 (ja) | 1997-11-28 | 2003-09-22 | 日亜化学工業株式会社 | 窒化物半導体素子の製造方法 |
| US6313435B1 (en) | 1998-11-20 | 2001-11-06 | 3M Innovative Properties Company | Mask orbiting for laser ablated feature formation |
| US6211488B1 (en) | 1998-12-01 | 2001-04-03 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe |
| US6333485B1 (en) | 1998-12-11 | 2001-12-25 | International Business Machines Corporation | Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed beam |
| DE10029110B4 (de) | 1999-06-15 | 2006-05-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren für die Materialbearbeitung und Verwendung desselben |
| US6795274B1 (en) | 1999-09-07 | 2004-09-21 | Asahi Glass Company, Ltd. | Method for manufacturing a substantially circular substrate by utilizing scribing |
| CA2397315C (en) * | 2000-01-27 | 2009-07-07 | National Research Council Of Canada | Method and apparatus for repair of defects in materials with short laser pulses |
| AU2001239794A1 (en) | 2000-02-17 | 2001-08-27 | Cquint Communications Corporation | Resonant optical filters |
| US20010035447A1 (en) | 2000-05-05 | 2001-11-01 | Andreas Gartner | Methods for laser cut initiation |
| JP2001354439A (ja) | 2000-06-12 | 2001-12-25 | Matsushita Electric Ind Co Ltd | ガラス基板の加工方法および高周波回路の製作方法 |
| JP4786783B2 (ja) | 2000-08-18 | 2011-10-05 | 日本板硝子株式会社 | ガラス板の切断方法及び記録媒体用ガラス円盤 |
| JP3722731B2 (ja) | 2000-09-13 | 2005-11-30 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| JP4659300B2 (ja) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
| AU2001249140A1 (en) | 2000-09-20 | 2002-04-02 | Electro Scientific Industries, Inc. | Uv laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses |
| JP4150155B2 (ja) * | 2000-10-10 | 2008-09-17 | 株式会社日立製作所 | 情報記録媒体、情報の記録方法、再生方法、記録記録装置及び情報再生装置 |
| US6962279B1 (en) | 2000-10-18 | 2005-11-08 | Ge Medical Systems Global Technology Company, Llc | Apparatus and method for glass separation for flat panel displays |
| JP3516233B2 (ja) * | 2000-11-06 | 2004-04-05 | 日本板硝子株式会社 | 情報記録媒体用ガラス基板の製造方法 |
| JP4512786B2 (ja) | 2000-11-17 | 2010-07-28 | 独立行政法人産業技術総合研究所 | ガラス基板の加工方法 |
| JP3802442B2 (ja) | 2000-12-01 | 2006-07-26 | エルジー電子株式会社 | ガラス切断方法および装置 |
| US20030044539A1 (en) * | 2001-02-06 | 2003-03-06 | Oswald Robert S. | Process for producing photovoltaic devices |
| JP2002241141A (ja) | 2001-02-08 | 2002-08-28 | Nippon Steel Techno Research Corp | レーザによるガラスの加工方法及び装置 |
| JP4631196B2 (ja) | 2001-04-04 | 2011-02-16 | ソニー株式会社 | ガラス基板の製造方法およびガラス基板の製造装置 |
| WO2003002289A1 (en) | 2001-06-28 | 2003-01-09 | Electro Scientific Industries, Inc. | Multistep laser processing of wafers supporting surface device layers |
| US6642476B2 (en) | 2001-07-23 | 2003-11-04 | Siemens Automative Corporation | Apparatus and method of forming orifices and chamfers for uniform orifice coefficient and surface properties by laser |
| WO2003028949A2 (en) * | 2001-10-01 | 2003-04-10 | Xsil Technology Limited | Method of machining substrates |
| US6521862B1 (en) | 2001-10-09 | 2003-02-18 | International Business Machines Corporation | Apparatus and method for improving chamfer quality of disk edge surfaces with laser treatment |
| US6642477B1 (en) | 2001-10-23 | 2003-11-04 | Imra America, Inc. | Method for laser drilling a counter-tapered through-hole in a material |
| US7553390B2 (en) | 2001-11-08 | 2009-06-30 | Sharp Kabushiki Kaisha | Method and device for parting glass substrate, liquid crystal panel, and liquid crystal panel manufacturing device |
| JP2003160348A (ja) | 2001-11-21 | 2003-06-03 | Nippon Sheet Glass Co Ltd | 情報記録媒体用ガラス基板及びその製造方法 |
| US6720519B2 (en) * | 2001-11-30 | 2004-04-13 | Matsushita Electric Industrial Co., Ltd. | System and method of laser drilling |
| JP2003226551A (ja) | 2002-02-05 | 2003-08-12 | Nippon Sheet Glass Co Ltd | 微細孔を有するガラス板およびその製造方法 |
| US20030155328A1 (en) | 2002-02-15 | 2003-08-21 | Huth Mark C. | Laser micromachining and methods and systems of same |
| JP4267240B2 (ja) | 2002-02-22 | 2009-05-27 | 日本板硝子株式会社 | ガラス構造物の製造方法 |
| US6756563B2 (en) | 2002-03-07 | 2004-06-29 | Orbotech Ltd. | System and method for forming holes in substrates containing glass |
| FR2839508B1 (fr) | 2002-05-07 | 2005-03-04 | Saint Gobain | Vitrage decoupe sans rompage |
| JP2004160483A (ja) | 2002-11-12 | 2004-06-10 | Disco Abrasive Syst Ltd | レーザー加工方法およびレーザー加工装置 |
| KR100497820B1 (ko) | 2003-01-06 | 2005-07-01 | 로체 시스템즈(주) | 유리판절단장치 |
| JP2004299969A (ja) | 2003-03-31 | 2004-10-28 | Toshiba Ceramics Co Ltd | シリカガラスのスライス方法 |
| US7023001B2 (en) | 2003-03-31 | 2006-04-04 | Institut National D'optique | Method for engraving materials using laser etched V-grooves |
| JP2004343008A (ja) | 2003-05-19 | 2004-12-02 | Disco Abrasive Syst Ltd | レーザ光線を利用した被加工物分割方法 |
| US6890836B2 (en) * | 2003-05-23 | 2005-05-10 | Texas Instruments Incorporated | Scribe street width reduction by deep trench and shallow saw cut |
| US6949449B2 (en) | 2003-07-11 | 2005-09-27 | Electro Scientific Industries, Inc. | Method of forming a scribe line on a ceramic substrate |
| EP2332687B1 (en) * | 2003-07-18 | 2015-02-18 | Hamamatsu Photonics K.K. | Method of laser beam machining a machining target using pulsed laser beam and expanded tape for cutting a machining target |
| JP2005081715A (ja) * | 2003-09-09 | 2005-03-31 | Sony Corp | レーザ加工装置およびレーザ加工方法 |
| US20050087522A1 (en) | 2003-10-24 | 2005-04-28 | Yunlong Sun | Laser processing of a locally heated target material |
| JP2005268752A (ja) | 2004-02-19 | 2005-09-29 | Canon Inc | レーザ割断方法、被割断部材および半導体素子チップ |
| FI120082B (fi) | 2004-03-18 | 2009-06-30 | Antti Salminen | Menetelmä materiaalin työstämiseksi suuritehotiheyksisellä sähkömagneettisella säteilyllä |
| US7057133B2 (en) | 2004-04-14 | 2006-06-06 | Electro Scientific Industries, Inc. | Methods of drilling through-holes in homogenous and non-homogenous substrates |
| DE102004020737A1 (de) | 2004-04-27 | 2005-11-24 | Lzh Laserzentrum Hannover E.V. | Vorrichtung zum Durchtrennen von Bauteilen aus sprödbrüchigen Materialien mit spannungsfreier Bauteillagerung |
| DE102004024475A1 (de) | 2004-05-14 | 2005-12-01 | Lzh Laserzentrum Hannover E.V. | Verfahren und Vorrichtung zum Trennen von Halbleitermaterialien |
| US7060933B2 (en) | 2004-06-08 | 2006-06-13 | Igor Troitski | Method and laser system for production of laser-induced images inside and on the surface of transparent material |
| EP1772245B1 (en) | 2004-07-30 | 2014-05-07 | Mitsuboshi Diamond Industrial Co., Ltd. | Vertical crack forming method and vertical crack forming device in substrate |
| US7598167B2 (en) | 2004-08-24 | 2009-10-06 | Micron Technology, Inc. | Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures |
| US7378342B2 (en) | 2004-08-27 | 2008-05-27 | Micron Technology, Inc. | Methods for forming vias varying lateral dimensions |
| US7169687B2 (en) | 2004-11-03 | 2007-01-30 | Intel Corporation | Laser micromachining method |
| CN100481337C (zh) | 2004-12-08 | 2009-04-22 | 雷射先进科技株式会社 | 被分割体的分割起点形成方法、被分割体的分割方法 |
| KR100906543B1 (ko) | 2004-12-08 | 2009-07-07 | 가부시키가이샤 레이져 솔루션즈 | 피분할체에 있어서의 분할 기점 형성 방법, 피분할체의 분할 방법, 및 펄스 레이저광에 의한 피가공물의 가공방법 |
| US7528342B2 (en) * | 2005-02-03 | 2009-05-05 | Laserfacturing, Inc. | Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser |
| US20070012665A1 (en) * | 2005-07-12 | 2007-01-18 | Hewlett-Packard Development Company Lp | Laser ablation |
| US9138913B2 (en) | 2005-09-08 | 2015-09-22 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
| JP2007290011A (ja) | 2006-04-26 | 2007-11-08 | Seiko Epson Corp | 基板ならびに基板の分断方法、電気光学装置、電子機器 |
| US7605343B2 (en) * | 2006-05-24 | 2009-10-20 | Electro Scientific Industries, Inc. | Micromachining with short-pulsed, solid-state UV laser |
| US8624157B2 (en) * | 2006-05-25 | 2014-01-07 | Electro Scientific Industries, Inc. | Ultrashort laser pulse wafer scribing |
| US20070272666A1 (en) * | 2006-05-25 | 2007-11-29 | O'brien James N | Infrared laser wafer scribing using short pulses |
| US8394301B2 (en) | 2006-06-02 | 2013-03-12 | Electro Scientific Industries, Inc. | Process for forming panel with an optically transmissive portion and products related thereto |
| US20080029152A1 (en) | 2006-08-04 | 2008-02-07 | Erel Milshtein | Laser scribing apparatus, systems, and methods |
| US20080093775A1 (en) * | 2006-08-19 | 2008-04-24 | Colorado State University Research Foundation | Nanometer-scale ablation using focused, coherent extreme ultraviolet/soft x-ray light |
| US8168514B2 (en) * | 2006-08-24 | 2012-05-01 | Corning Incorporated | Laser separation of thin laminated glass substrates for flexible display applications |
| DE102006046313B3 (de) | 2006-09-29 | 2008-01-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Anordnung zum Strukturieren einer lichtleitenden Faser entlang deren Längsachse (longitudinale Strukturierung) basierend auf der nicht-linearen Absorption von Laserstrahlung |
| US8530784B2 (en) | 2007-02-01 | 2013-09-10 | Orbotech Ltd. | Method and system of machining using a beam of photons |
| DE102007009786B4 (de) | 2007-02-27 | 2013-09-05 | Schott Ag | Beschichtetes vorgespanntes Glas, Verfahren zu dessen Herstellung und dessen Verwendung |
| TWI424972B (zh) | 2007-03-02 | 2014-02-01 | Nippon Electric Glass Co | 強化板玻璃 |
| US7982162B2 (en) | 2007-05-15 | 2011-07-19 | Corning Incorporated | Method and apparatus for scoring and separating a brittle material with a single beam of radiation |
| US20080290077A1 (en) | 2007-05-22 | 2008-11-27 | Demeritt Jeffery Alan | Separation of transparent glasses and systems and methods therefor |
| US8710402B2 (en) | 2007-06-01 | 2014-04-29 | Electro Scientific Industries, Inc. | Method of and apparatus for laser drilling holes with improved taper |
| US20090020511A1 (en) * | 2007-07-17 | 2009-01-22 | Kommera Swaroop K | Ablation |
| US20090045179A1 (en) * | 2007-08-15 | 2009-02-19 | Ellen Marie Kosik Williams | Method and system for cutting solid materials using short pulsed laser |
| JP2009061462A (ja) | 2007-09-05 | 2009-03-26 | Sumitomo Electric Ind Ltd | 基板の製造方法および基板 |
| KR100876502B1 (ko) * | 2007-09-21 | 2008-12-31 | 한국정보통신대학교 산학협력단 | 초단파 레이저 빔을 이용한 기판 절단장치 및 그 절단방법 |
| KR101235617B1 (ko) * | 2007-10-16 | 2013-02-28 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 재료 기판의 u자 형상 홈 가공 방법 및 이것을 사용한 제거 가공 방법 및 도려내기 가공 방법 및 모따기 방법 |
| EP2233447B1 (en) | 2007-12-18 | 2020-08-05 | Hoya Corporation | Cover glass for portable terminal, method for manufacturing cover glass for portable terminal, and portable terminal apparatus |
| US20090212030A1 (en) * | 2008-02-25 | 2009-08-27 | Optisolar, Inc., A Delaware Corporation | Autofocus for Ablation Laser |
| EP2096375B1 (en) | 2008-02-26 | 2011-03-09 | Rioglass Solar, S.A. | A reflector element for a solar heat reflector and the method for producing the same |
| CN102006964B (zh) * | 2008-03-21 | 2016-05-25 | Imra美国公司 | 基于激光的材料加工方法和系统 |
| US8093532B2 (en) * | 2008-03-31 | 2012-01-10 | Electro Scientific Industries, Inc. | Laser machining of fired ceramic and other hard and/or thick materials |
| JP2009280452A (ja) * | 2008-05-23 | 2009-12-03 | Central Glass Co Ltd | ガラス基板及び製造方法 |
| US8075999B2 (en) | 2008-08-08 | 2011-12-13 | Corning Incorporated | Strengthened glass articles and methods of making |
| KR101107859B1 (ko) * | 2008-09-12 | 2012-01-31 | 오므론 가부시키가이샤 | 할단용 스크라이브선의 형성 방법 및 장치 |
| EP2377375B1 (en) * | 2008-12-13 | 2016-01-27 | M-Solv Limited | Method and apparatus for laser machining relatively narrow and relatively wide structures |
| US9346130B2 (en) | 2008-12-17 | 2016-05-24 | Electro Scientific Industries, Inc. | Method for laser processing glass with a chamfered edge |
| KR20110106275A (ko) * | 2008-12-25 | 2011-09-28 | 아사히 가라스 가부시키가이샤 | 취성 재료 기판의 할단 방법, 장치 및 차량용 창유리 |
| GB0900036D0 (en) * | 2009-01-03 | 2009-02-11 | M Solv Ltd | Method and apparatus for forming grooves with complex shape in the surface of apolymer |
| US8347651B2 (en) | 2009-02-19 | 2013-01-08 | Corning Incorporated | Method of separating strengthened glass |
| US8341976B2 (en) | 2009-02-19 | 2013-01-01 | Corning Incorporated | Method of separating strengthened glass |
| US8327666B2 (en) * | 2009-02-19 | 2012-12-11 | Corning Incorporated | Method of separating strengthened glass |
| US9685186B2 (en) | 2009-02-27 | 2017-06-20 | Applied Materials, Inc. | HDD pattern implant system |
| KR101041137B1 (ko) | 2009-03-25 | 2011-06-13 | 삼성모바일디스플레이주식회사 | 기판 절단 장치 및 이를 이용한 기판 절단 방법 |
| US8609512B2 (en) | 2009-03-27 | 2013-12-17 | Electro Scientific Industries, Inc. | Method for laser singulation of chip scale packages on glass substrates |
| US8350187B2 (en) * | 2009-03-28 | 2013-01-08 | Electro Scientific Industries, Inc. | Method and apparatus for laser machining |
| TWI523720B (zh) * | 2009-05-28 | 2016-03-01 | 伊雷克托科學工業股份有限公司 | 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 |
| US8110419B2 (en) | 2009-08-20 | 2012-02-07 | Integrated Photovoltaic, Inc. | Process of manufacturing photovoltaic device |
| US8932510B2 (en) * | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
| KR20120073249A (ko) * | 2009-08-28 | 2012-07-04 | 코닝 인코포레이티드 | 화학적으로 강화된 유리 기판으로부터 제품을 레이저 절단하기 위한 방법 |
| JP5565659B2 (ja) | 2009-10-22 | 2014-08-06 | 株式会社ブイ・テクノロジー | レーザ加工装置 |
| US8946590B2 (en) * | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
| CN102741179B (zh) | 2009-11-30 | 2015-11-25 | 康宁股份有限公司 | 用于激光刻划和分割玻璃基板的方法 |
| US20110127242A1 (en) | 2009-11-30 | 2011-06-02 | Xinghua Li | Methods for laser scribing and separating glass substrates |
| JP5031877B2 (ja) | 2010-01-06 | 2012-09-26 | キヤノン株式会社 | 画像処理装置及び画像処理方法 |
| TWI438162B (zh) | 2010-01-27 | 2014-05-21 | Wintek Corp | 強化玻璃切割方法及強化玻璃切割預置結構 |
| JP5451443B2 (ja) | 2010-02-15 | 2014-03-26 | 株式会社ジャパンディスプレイ | 電気的固体装置の製造方法 |
| US8743165B2 (en) * | 2010-03-05 | 2014-06-03 | Micronic Laser Systems Ab | Methods and device for laser processing |
| TWI494284B (zh) | 2010-03-19 | 2015-08-01 | Corning Inc | 強化玻璃之機械劃割及分離 |
| DE102010012265B4 (de) | 2010-03-22 | 2012-09-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Heraustrennen von Einzelscheiben aus einer Verbundglastafel und Verwendung einer Vorrichtung dafür |
| EP2371778A1 (en) | 2010-03-30 | 2011-10-05 | Linde Aktiengesellschaft | Method for producing toughened flat glass with anti-reflective properties |
| JP5693705B2 (ja) * | 2010-03-30 | 2015-04-01 | イムラ アメリカ インコーポレイテッド | レーザベースの材料加工装置及び方法 |
| US8383984B2 (en) * | 2010-04-02 | 2013-02-26 | Electro Scientific Industries, Inc. | Method and apparatus for laser singulation of brittle materials |
| JP2011230940A (ja) | 2010-04-26 | 2011-11-17 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板の割断方法 |
| JP2011251879A (ja) | 2010-06-02 | 2011-12-15 | Asahi Glass Co Ltd | 化学強化ガラスの切断方法および切断装置 |
| JP5664471B2 (ja) | 2010-06-28 | 2015-02-04 | 信越化学工業株式会社 | 半導体用合成石英ガラス基板の製造方法 |
| KR20120015366A (ko) | 2010-07-19 | 2012-02-21 | 엘지디스플레이 주식회사 | 강화유리 절단방법 및 절단장치 |
| JP2012031018A (ja) | 2010-07-30 | 2012-02-16 | Asahi Glass Co Ltd | 強化ガラス基板及び強化ガラス基板の溝加工方法と強化ガラス基板の切断方法 |
| US8393175B2 (en) | 2010-08-26 | 2013-03-12 | Corning Incorporated | Methods for extracting strengthened glass substrates from glass sheets |
| US8584354B2 (en) | 2010-08-26 | 2013-11-19 | Corning Incorporated | Method for making glass interposer panels |
| TWI513670B (zh) * | 2010-08-31 | 2015-12-21 | Corning Inc | 分離強化玻璃基板之方法 |
| US8607590B2 (en) | 2010-11-30 | 2013-12-17 | Corning Incorporated | Methods for separating glass articles from strengthened glass substrate sheets |
| US8616024B2 (en) | 2010-11-30 | 2013-12-31 | Corning Incorporated | Methods for forming grooves and separating strengthened glass substrate sheets |
| US20120168412A1 (en) | 2011-01-05 | 2012-07-05 | Electro Scientific Industries, Inc | Apparatus and method for forming an aperture in a substrate |
| US8539794B2 (en) | 2011-02-01 | 2013-09-24 | Corning Incorporated | Strengthened glass substrate sheets and methods for fabricating glass panels from glass substrate sheets |
| US8584490B2 (en) | 2011-02-18 | 2013-11-19 | Corning Incorporated | Laser cutting method |
| US8635887B2 (en) | 2011-08-10 | 2014-01-28 | Corning Incorporated | Methods for separating glass substrate sheets by laser-formed grooves |
| JP2013043795A (ja) | 2011-08-23 | 2013-03-04 | Nippon Electric Glass Co Ltd | 強化ガラス及びその製造方法 |
| US20130129947A1 (en) * | 2011-11-18 | 2013-05-23 | Daniel Ralph Harvey | Glass article having high damage resistance |
| JP4932059B1 (ja) | 2011-12-16 | 2012-05-16 | 株式会社ミクロ技術研究所 | 強化ガラス、タッチパネル、及び強化ガラスの製造方法 |
| CN104136967B (zh) | 2012-02-28 | 2018-02-16 | 伊雷克托科学工业股份有限公司 | 用于分离增强玻璃的方法及装置及由该增强玻璃生产的物品 |
| US9828278B2 (en) | 2012-02-28 | 2017-11-28 | Electro Scientific Industries, Inc. | Method and apparatus for separation of strengthened glass and articles produced thereby |
| WO2013130581A1 (en) | 2012-02-28 | 2013-09-06 | Electro Scientific Industries, Inc. | Method and apparatus for separation of strengthened glass and articles produced thereby |
| US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
| US9776906B2 (en) | 2014-03-28 | 2017-10-03 | Electro Scientific Industries, Inc. | Laser machining strengthened glass |
-
2013
- 2013-02-27 CN CN201380009631.3A patent/CN104136967B/zh not_active Expired - Fee Related
- 2013-02-27 KR KR1020147023715A patent/KR20140138134A/ko not_active Withdrawn
- 2013-02-27 US US13/778,950 patent/US9828277B2/en not_active Expired - Fee Related
- 2013-02-27 WO PCT/US2013/027947 patent/WO2013130549A1/en not_active Ceased
- 2013-02-27 JP JP2014559964A patent/JP2015511571A/ja active Pending
- 2013-03-01 TW TW102107446A patent/TW201350245A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015511571A (ja) | 2015-04-20 |
| WO2013130549A1 (en) | 2013-09-06 |
| US9828277B2 (en) | 2017-11-28 |
| CN104136967A (zh) | 2014-11-05 |
| TW201350245A (zh) | 2013-12-16 |
| US20130224439A1 (en) | 2013-08-29 |
| CN104136967B (zh) | 2018-02-16 |
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