KR20100063093A - 유전체 막 경화 방법 - Google Patents
유전체 막 경화 방법 Download PDFInfo
- Publication number
- KR20100063093A KR20100063093A KR1020107006708A KR20107006708A KR20100063093A KR 20100063093 A KR20100063093 A KR 20100063093A KR 1020107006708 A KR1020107006708 A KR 1020107006708A KR 20107006708 A KR20107006708 A KR 20107006708A KR 20100063093 A KR20100063093 A KR 20100063093A
- Authority
- KR
- South Korea
- Prior art keywords
- dielectric film
- curing
- low
- exposing
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0436—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/08—Planarisation of organic insulating materials
Landscapes
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/854,937 US20090075491A1 (en) | 2007-09-13 | 2007-09-13 | Method for curing a dielectric film |
| US11/854,937 | 2007-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20100063093A true KR20100063093A (ko) | 2010-06-10 |
Family
ID=40452494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107006708A Ceased KR20100063093A (ko) | 2007-09-13 | 2008-09-12 | 유전체 막 경화 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20090075491A1 (https=) |
| JP (1) | JP2011502343A (https=) |
| KR (1) | KR20100063093A (https=) |
| CN (1) | CN101816059B (https=) |
| TW (1) | TWI431689B (https=) |
| WO (1) | WO2009036249A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200083309A (ko) * | 2018-12-28 | 2020-07-08 | 주식회사 케이엠디피 | 웨이퍼 경화 장치 및 이를 구비한 웨이퍼 경화 시스템 |
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- 2008-09-12 KR KR1020107006708A patent/KR20100063093A/ko not_active Ceased
- 2008-09-12 CN CN2008801070343A patent/CN101816059B/zh not_active Expired - Fee Related
- 2008-09-12 JP JP2010525019A patent/JP2011502343A/ja active Pending
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20200083309A (ko) * | 2018-12-28 | 2020-07-08 | 주식회사 케이엠디피 | 웨이퍼 경화 장치 및 이를 구비한 웨이퍼 경화 시스템 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI431689B (zh) | 2014-03-21 |
| TW200913064A (en) | 2009-03-16 |
| CN101816059B (zh) | 2013-03-27 |
| WO2009036249A1 (en) | 2009-03-19 |
| CN101816059A (zh) | 2010-08-25 |
| US20090075491A1 (en) | 2009-03-19 |
| JP2011502343A (ja) | 2011-01-20 |
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