KR20090033408A - 톱링, 폴리싱장치 및 폴리싱방법 - Google Patents
톱링, 폴리싱장치 및 폴리싱방법 Download PDFInfo
- Publication number
- KR20090033408A KR20090033408A KR1020097005513A KR20097005513A KR20090033408A KR 20090033408 A KR20090033408 A KR 20090033408A KR 1020097005513 A KR1020097005513 A KR 1020097005513A KR 20097005513 A KR20097005513 A KR 20097005513A KR 20090033408 A KR20090033408 A KR 20090033408A
- Authority
- KR
- South Korea
- Prior art keywords
- polishing
- ring
- top ring
- elastic membrane
- substrate
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 474
- 238000000034 method Methods 0.000 title claims description 43
- 239000012528 membrane Substances 0.000 claims description 115
- 239000000758 substrate Substances 0.000 claims description 68
- 238000003825 pressing Methods 0.000 claims description 42
- 239000012530 fluid Substances 0.000 claims description 39
- 238000007517 polishing process Methods 0.000 claims description 37
- 238000005096 rolling process Methods 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 abstract description 134
- 230000007246 mechanism Effects 0.000 abstract description 27
- 235000012431 wafers Nutrition 0.000 description 134
- 239000007788 liquid Substances 0.000 description 34
- 230000008569 process Effects 0.000 description 28
- 238000004891 communication Methods 0.000 description 23
- 238000001514 detection method Methods 0.000 description 18
- 238000006073 displacement reaction Methods 0.000 description 16
- 239000002245 particle Substances 0.000 description 15
- 238000009826 distribution Methods 0.000 description 14
- 229910003460 diamond Inorganic materials 0.000 description 11
- 239000010432 diamond Substances 0.000 description 11
- 230000002829 reductive effect Effects 0.000 description 10
- 238000007789 sealing Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 238000003860 storage Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000002002 slurry Substances 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 7
- 230000000670 limiting effect Effects 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000011144 upstream manufacturing Methods 0.000 description 5
- 229920002943 EPDM rubber Polymers 0.000 description 4
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 229920003225 polyurethane elastomer Polymers 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
- B24B49/183—Wear compensation without the presence of dressing tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
Claims (13)
- 기판을 유지하고, 폴리싱테이블 상의 폴리싱패드의 폴리싱면에 대해 상기 기판을 가압하기 위한 톱링에 있어서,상기 폴리싱면에 대해 상기 기판을 가압하도록 구성된 톱링바디; 및상기 폴리싱면을 가압하도록 구성되고, 상기 톱링바디의 주변부에 제공되는 리테이너링을 포함하되,상기 리테이너링은,압력챔버를 형성하기 위한 형태를 가지고, 상기 폴리싱면에 대해 상기 기판을 가압하는 동안 수직으로 팽창 및 수축될 수 있는 탄성멤브레인,상기 톱링바디에 상기 탄성멤브레인을 유지하고, 상기 압력챔버가 유체공급원과 연통하는 통로를 가지는 홀더, 및가압된 유체가 공급된 상기 압력챔버에 의하여 상기 폴리싱면에 대해 가압되고, 상기 톱링바디와 독립적으로 수직 이동가능한 링부재를 포함하는 것을 특징으로 하는 톱링.
- 제1항에 있어서,상기 탄성멤브레인은 벤트부를 가지는 것을 특징으로 하는 톱링.
- 제2항에 있어서,상기 탄성멤브레인은 롤링다이어프램을 포함하는 것을 특징으로 하는 톱링.
- 제1항에 있어서,상기 탄성멤브레인은 상기 압력챔버 내의 내부 압력이 증가하면 상기 압력챔버를 확장하기 위한 형태를 가지는 것을 특징으로 하는 톱링.
- 제1항에 있어서,상기 톱링바디의 하부면에 부착되고, 실질적으로 상기 기판의 전체 상부면에 접촉하기 위한 형태를 가지는 탄성멤브레인을 더 포함하는 것을 특징으로 하는 톱링.
- 제5항에 있어서,중앙챔버, 리플챔버, 외측챔버 및 에지챔버가 상기 톱링바디의 하부면에 부착되는 상기 탄성멤브레인에 의해 형성되는 것을 특징으로 하는 톱링.
- 제1항에 있어서,상기 리테이너링의 마모 정도를 측정하기 위해 구성된 리테이너링마모검출기를 더 포함하는 것을 특징으로 하는 톱링.
- 기판을 폴리싱하기 위한 장치에 있어서,그 위에 폴리싱패드를 지지하기 위한 폴리싱테이블; 및제1항에 따른 톱링을 포함하는 것을 특징으로 하는 폴리싱장치.
- 기판과, 폴리싱테이블 상의 폴리싱패드의 폴리싱면 간의 슬라이딩접촉을 제공함으로써 기판을 폴리싱하는 방법에 있어서,상기 폴리싱패드와 함께 상기 폴리싱테이블을 회전하는 단계;상기 폴리싱면에 대해 상기 기판을 가압하는 동안 수직으로 팽창 및 수축될 수 있는 탄성멤브레인에 의해 형성된 압력챔버에 의하여 상기 폴리싱면에 대해 리테이너링을 가압하는 동안, 톱링에 의해 상기 폴리싱면에 대하여 상기 기판을 가압하는 단계;상기 기판을 가압하는 단계 동안, 상기 기판과 함께 상기 톱링을 회전하는 단계; 및상기 압력챔버에 공급된 가압유체의 압력을 조절함으로써 상기 폴리싱면에 대한 상기 리테이너링의 가압력을 조절하는 단계를 포함하는 것을 특징으로 하는 폴리싱방법.
- 제9항에 있어서,상기 탄성멤브레인은 벤트부를 가지는 것을 특징으로 하는 폴리싱방법.
- 제9항에 있어서,상기 폴리싱면에 대하여 상기 기판을 가압하는 단계는, 중앙챔버, 리플챔버, 외측챔버 및 에지챔버를 통해 상기 폴리싱면에 대하여 상기 기판을 가압하는 단계를 포함하는 것을 특징으로 하는 폴리싱방법.
- 폴리싱장치에 있어서,폴리싱면; 및기판을 유지하고, 상기 기판의 주변부를 유지하기 위한 리테이너링을 가지는 톱링을 포함하되,상기 리테이너링은,수직으로 팽창 및 수축될 수 있고, 그 안에 압력챔버가 형성된 탄성멤브레인,상기 탄성멤브레인을 수직으로 팽창 및 수축시키기 위해, 상기 압력챔버로 유체를 공급하기 위한 통로,상기 탄성멤브레인의 수직운동에 따라 수직 이동가능하고, 상기 폴리싱면과 접촉하게 되는 링부재를 포함하는 것을 특징으로 하는 폴리싱장치.
- 제12항에 있어서,상기 리테이너링은,그 안에 상기 탄성멤브레인을 수용하는 실린더;상기 실린더에 상기 탄성멤브레인을 유지하도록 구성된 홀더; 및상기 실린더 안에서 수직 이동가능하고, 상기 탄성멤브레인에 연결된 피스톤을 포함하는 것을 특징으로 하는 폴리싱장치.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2004-318581 | 2004-11-01 | ||
JP2004318581A JP4597634B2 (ja) | 2004-11-01 | 2004-11-01 | トップリング、基板の研磨装置及び研磨方法 |
JPJP-P-2005-079166 | 2005-03-18 | ||
JP2005079166A JP4817687B2 (ja) | 2005-03-18 | 2005-03-18 | 研磨装置 |
JPJP-P-2005-145566 | 2005-05-18 | ||
JP2005145566A JP2006324413A (ja) | 2005-05-18 | 2005-05-18 | 基板保持装置および研磨装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020077012298A Division KR101044739B1 (ko) | 2004-11-01 | 2005-10-31 | 폴리싱장치 및 폴리싱방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090033408A true KR20090033408A (ko) | 2009-04-02 |
KR101011788B1 KR101011788B1 (ko) | 2011-02-07 |
Family
ID=36319267
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020097005513A KR101011788B1 (ko) | 2004-11-01 | 2005-10-31 | 톱링, 폴리싱장치 및 폴리싱방법 |
KR1020117024356A KR101214506B1 (ko) | 2004-11-01 | 2005-10-31 | 폴리싱장치 |
KR1020077012298A KR101044739B1 (ko) | 2004-11-01 | 2005-10-31 | 폴리싱장치 및 폴리싱방법 |
KR1020117006761A KR101126662B1 (ko) | 2004-11-01 | 2005-10-31 | 폴리싱장치 |
KR1020107025443A KR101186239B1 (ko) | 2004-11-01 | 2005-10-31 | 폴리싱장치 |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117024356A KR101214506B1 (ko) | 2004-11-01 | 2005-10-31 | 폴리싱장치 |
KR1020077012298A KR101044739B1 (ko) | 2004-11-01 | 2005-10-31 | 폴리싱장치 및 폴리싱방법 |
KR1020117006761A KR101126662B1 (ko) | 2004-11-01 | 2005-10-31 | 폴리싱장치 |
KR1020107025443A KR101186239B1 (ko) | 2004-11-01 | 2005-10-31 | 폴리싱장치 |
Country Status (6)
Country | Link |
---|---|
US (8) | US8083571B2 (ko) |
EP (6) | EP2418677B1 (ko) |
KR (5) | KR101011788B1 (ko) |
CN (4) | CN104044057B (ko) |
TW (2) | TWI368555B (ko) |
WO (1) | WO2006049269A1 (ko) |
Families Citing this family (116)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6760772B2 (en) * | 2000-12-15 | 2004-07-06 | Qualcomm, Inc. | Generating and implementing a communication protocol and interface for high data rate signal transfer |
EP2418677B1 (en) * | 2004-11-01 | 2016-12-07 | Ebara Corporation | Polishing apparatus |
JP4814677B2 (ja) | 2006-03-31 | 2011-11-16 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
US7699688B2 (en) | 2006-11-22 | 2010-04-20 | Applied Materials, Inc. | Carrier ring for carrier head |
US7575504B2 (en) | 2006-11-22 | 2009-08-18 | Applied Materials, Inc. | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
US7727055B2 (en) | 2006-11-22 | 2010-06-01 | Applied Materials, Inc. | Flexible membrane for carrier head |
US7654888B2 (en) | 2006-11-22 | 2010-02-02 | Applied Materials, Inc. | Carrier head with retaining ring and carrier ring |
EP1952945B1 (en) * | 2007-01-30 | 2010-09-15 | Ebara Corporation | Polishing apparatus |
US20080207093A1 (en) * | 2007-02-28 | 2008-08-28 | Applied Materials, Inc. | Methods and apparatus for cleaning a substrate edge using chemical and mechanical polishing |
JP2008305875A (ja) * | 2007-06-06 | 2008-12-18 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
JP5464820B2 (ja) * | 2007-10-29 | 2014-04-09 | 株式会社荏原製作所 | 研磨装置 |
JP4658182B2 (ja) * | 2007-11-28 | 2011-03-23 | 株式会社荏原製作所 | 研磨パッドのプロファイル測定方法 |
JP5199691B2 (ja) * | 2008-02-13 | 2013-05-15 | 株式会社荏原製作所 | 研磨装置 |
US8795032B2 (en) | 2008-06-04 | 2014-08-05 | Ebara Corporation | Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method |
JP5390807B2 (ja) | 2008-08-21 | 2014-01-15 | 株式会社荏原製作所 | 研磨方法および装置 |
JP4682236B2 (ja) * | 2008-08-29 | 2011-05-11 | アプライド マテリアルズ インコーポレイテッド | 軸動作検出機構およびコンディショナーヘッド |
JP5415735B2 (ja) * | 2008-09-26 | 2014-02-12 | 株式会社荏原製作所 | ドレッシング方法、ドレッシング条件の決定方法、ドレッシング条件決定プログラム、および研磨装置 |
TWI381904B (zh) * | 2009-12-03 | 2013-01-11 | Nat Univ Chung Cheng | The method of detecting the grinding characteristics and service life of the polishing pad |
KR101738885B1 (ko) * | 2010-04-20 | 2017-06-08 | 어플라이드 머티어리얼스, 인코포레이티드 | 개선된 폴리싱 패드 프로파일들을 위한 폐쇄-루프 제어 |
CN102059653B (zh) * | 2010-07-20 | 2012-10-31 | 上海交通大学 | 球面数控精密磨削过程自适应控制方法 |
US20120021671A1 (en) * | 2010-07-26 | 2012-01-26 | Applied Materials, Inc. | Real-time monitoring of retaining ring thickness and lifetime |
CN101972978B (zh) * | 2010-08-30 | 2012-05-16 | 清华大学 | 一种新型化学机械抛光装置 |
JP5511600B2 (ja) * | 2010-09-09 | 2014-06-04 | 株式会社荏原製作所 | 研磨装置 |
KR101104824B1 (ko) * | 2011-01-19 | 2012-01-16 | 김오수 | 캐리어 헤드 및 캐리어 헤드 유닛 |
JP2012192470A (ja) * | 2011-03-15 | 2012-10-11 | Asahi Glass Co Ltd | 板状体の研磨装置 |
CN102183198B (zh) * | 2011-03-15 | 2012-08-22 | 清华大学 | 用于测量硅片的膜厚度的测量装置 |
KR101196652B1 (ko) | 2011-05-31 | 2012-11-02 | 주식회사 케이씨텍 | 캐리어 헤드의 멤브레인 결합체 및 이를 구비한 캐리어 헤드 |
JP5896625B2 (ja) | 2011-06-02 | 2016-03-30 | 株式会社荏原製作所 | 研磨装置に使用される研磨パッドの研磨面を監視する方法および装置 |
US20130017762A1 (en) * | 2011-07-15 | 2013-01-17 | Infineon Technologies Ag | Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine |
KR101902049B1 (ko) | 2012-01-25 | 2018-09-27 | 어플라이드 머티어리얼스, 인코포레이티드 | 리테이닝 링 모니터링 및 압력 제어 |
JP5976522B2 (ja) * | 2012-05-31 | 2016-08-23 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
US10702972B2 (en) | 2012-05-31 | 2020-07-07 | Ebara Corporation | Polishing apparatus |
JP6193623B2 (ja) | 2012-06-13 | 2017-09-06 | 株式会社荏原製作所 | 研磨方法及び研磨装置 |
CN102862112B (zh) * | 2012-07-19 | 2014-12-03 | 京东方科技集团股份有限公司 | 一种导光板模板的加工装置及其进行加工的方法 |
JP6158637B2 (ja) * | 2012-08-28 | 2017-07-05 | 株式会社荏原製作所 | 弾性膜及び基板保持装置 |
JP5889760B2 (ja) * | 2012-09-24 | 2016-03-22 | 株式会社荏原製作所 | 基板の研磨異常検出方法および研磨装置 |
JP5973883B2 (ja) * | 2012-11-15 | 2016-08-23 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
JP6239354B2 (ja) * | 2012-12-04 | 2017-11-29 | 不二越機械工業株式会社 | ウェーハ研磨装置 |
JP5927129B2 (ja) * | 2013-01-31 | 2016-05-25 | 株式会社荏原製作所 | 研磨装置 |
JP6130677B2 (ja) * | 2013-01-31 | 2017-05-17 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
WO2014163735A1 (en) * | 2013-03-13 | 2014-10-09 | Applied Materials, Inc. | Reinforcement ring for carrier head |
USD770990S1 (en) * | 2013-05-15 | 2016-11-08 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD808349S1 (en) | 2013-05-15 | 2018-01-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
CN103317422B (zh) * | 2013-06-18 | 2015-08-19 | 浙江工业大学 | 一种动压浮离抛光装置 |
JP5967044B2 (ja) | 2013-09-19 | 2016-08-10 | 信越半導体株式会社 | 研磨パッドの評価方法及びウェーハの研磨方法 |
US9242341B2 (en) * | 2013-10-22 | 2016-01-26 | Globalfoundries Singapore Pte. Ltd. | CMP head structure |
JP6266493B2 (ja) | 2014-03-20 | 2018-01-24 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
JP2015220402A (ja) * | 2014-05-20 | 2015-12-07 | 株式会社荏原製作所 | 基板洗浄装置および基板洗浄装置で実行される方法 |
CN104029108B (zh) * | 2014-06-16 | 2016-11-23 | 张晶晶 | 全自动石英玻璃抛光机 |
KR102173323B1 (ko) | 2014-06-23 | 2020-11-04 | 삼성전자주식회사 | 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법 |
KR101428800B1 (ko) * | 2014-06-26 | 2014-08-08 | 신광선 | 웨이퍼 연마장치용 헤드 |
US10183374B2 (en) * | 2014-08-26 | 2019-01-22 | Ebara Corporation | Buffing apparatus, and substrate processing apparatus |
JP6181622B2 (ja) | 2014-09-17 | 2017-08-16 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
CN104400622A (zh) * | 2014-10-17 | 2015-03-11 | 成都泰美克晶体技术有限公司 | 一种双工位研磨机 |
WO2016068327A1 (ja) * | 2014-10-31 | 2016-05-06 | 株式会社 荏原製作所 | ワークピースを研磨するための化学機械研磨装置 |
JP6269450B2 (ja) * | 2014-11-18 | 2018-01-31 | 信越半導体株式会社 | ワークの加工装置 |
CN104493709B (zh) * | 2014-11-28 | 2017-02-01 | 无锡培基机械有限公司 | 一种带磨头修整环的工装夹具结构 |
CN107112260A (zh) * | 2014-12-08 | 2017-08-29 | 俞贤贞 | 化学研磨装置用承载头的固定环以及包括其的承载头 |
KR101679131B1 (ko) * | 2014-12-29 | 2016-11-23 | 주식회사 엘지실트론 | 웨이퍼 연마장치 및 그 연마방법 |
GB2553749A (en) * | 2016-06-22 | 2018-03-21 | Smart Separations Ltd | Apparatus and methods |
GB2534130B (en) * | 2015-01-06 | 2018-12-19 | Smart Separations Ltd | Apparatus and methods |
JP6444785B2 (ja) * | 2015-03-19 | 2018-12-26 | 株式会社荏原製作所 | 研磨装置およびその制御方法ならびにドレッシング条件出力方法 |
JP6489973B2 (ja) * | 2015-07-30 | 2019-03-27 | 株式会社ディスコ | 研削装置 |
US9835449B2 (en) | 2015-08-26 | 2017-12-05 | Industrial Technology Research Institute | Surface measuring device and method thereof |
JP6585445B2 (ja) * | 2015-09-28 | 2019-10-02 | 株式会社荏原製作所 | 研磨方法 |
JP6546845B2 (ja) * | 2015-12-18 | 2019-07-17 | 株式会社荏原製作所 | 研磨装置、制御方法及びプログラム |
JP6406238B2 (ja) * | 2015-12-18 | 2018-10-17 | 株式会社Sumco | ウェーハ研磨方法および研磨装置 |
CN105397885A (zh) * | 2015-12-22 | 2016-03-16 | 赖家明 | 一种竹青刮除装置的自适应往复转动送料机构 |
KR101812209B1 (ko) * | 2016-02-16 | 2017-12-26 | 주식회사 이오테크닉스 | 레이저 마킹 장치 및 레이저 마킹 방법 |
KR20170115217A (ko) * | 2016-04-06 | 2017-10-17 | 삼성전자주식회사 | 연마 패드 측정 장치 및 이를 이용한 화학적 기계적 연마 설비 |
JP2017185589A (ja) * | 2016-04-06 | 2017-10-12 | 株式会社荏原製作所 | 基板処理装置 |
JP6568006B2 (ja) * | 2016-04-08 | 2019-08-28 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
DE102016211723A1 (de) * | 2016-06-29 | 2018-01-04 | Weeke Bohrsysteme Gmbh | Bearbeitungsvorrichtung mit einer Lichtsignalanzeigevorrichtung und Verfahren |
JP2018001325A (ja) | 2016-06-30 | 2018-01-11 | 株式会社荏原製作所 | ヘッド高さ調整装置およびヘッド高さ調整装置を備える基板処理装置 |
JP6842859B2 (ja) | 2016-08-12 | 2021-03-17 | 株式会社荏原製作所 | ドレッシング装置、研磨装置、ホルダー、ハウジング及びドレッシング方法 |
KR102591914B1 (ko) * | 2016-11-25 | 2023-10-23 | 주식회사 케이씨텍 | 화학 기계적 연마 시스템의 기판 로딩 장치 |
TWI619580B (zh) * | 2016-12-05 | 2018-04-01 | 邱瑛杰 | 平面研磨機及其研磨方法 |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
CN110352115A (zh) * | 2017-03-06 | 2019-10-18 | 应用材料公司 | 为cmp位置特定研磨(lsp)设计的螺旋及同心圆移动 |
CN106625104B (zh) * | 2017-03-22 | 2018-11-30 | 天津盛世舜合自动化技术有限公司 | 一种马桶底部加工装置 |
JP6917966B2 (ja) * | 2017-10-25 | 2021-08-11 | 株式会社荏原製作所 | 弾性膜のストレッチ動作プログラム、弾性膜のストレッチ動作方法、および研磨装置 |
CN107877353B (zh) * | 2017-11-01 | 2019-10-18 | 湖南宇晶机器股份有限公司 | 自带车盘装置的研磨机 |
US11565365B2 (en) * | 2017-11-13 | 2023-01-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for monitoring chemical mechanical polishing |
CN107900909A (zh) * | 2017-11-15 | 2018-04-13 | 上海华力微电子有限公司 | 一种延长研磨垫修整盘使用寿命的方法及研磨垫修整盘 |
JP2019198938A (ja) * | 2018-05-18 | 2019-11-21 | 株式会社荏原製作所 | 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置 |
JP2020019082A (ja) * | 2018-07-31 | 2020-02-06 | 株式会社ディスコ | 研削装置の原点位置設定機構、及び原点位置設定方法 |
JP7074606B2 (ja) * | 2018-08-02 | 2022-05-24 | 株式会社荏原製作所 | 基板を保持するためのトップリングおよび基板処理装置 |
CN109623541B (zh) * | 2018-10-16 | 2020-07-17 | 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) | Bga封装器件焊球去除设备及其方法 |
US20200130134A1 (en) * | 2018-10-29 | 2020-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing apparatus and method |
KR102601619B1 (ko) * | 2018-11-12 | 2023-11-13 | 삼성전자주식회사 | 연마 패드 모니터링 방법 및 연마 패드 모니터링 장치 |
KR20200070825A (ko) | 2018-12-10 | 2020-06-18 | 삼성전자주식회사 | 연마 균일도를 제어할 수 있는 화학 기계적 연마 장치 |
CN109623554A (zh) * | 2019-01-08 | 2019-04-16 | 天津中环领先材料技术有限公司 | 一种降低硅片边缘粗糙度的边抛工艺 |
JP6736713B2 (ja) * | 2019-02-27 | 2020-08-05 | 株式会社荏原製作所 | 基板洗浄装置および基板洗浄装置で実行される方法 |
JP7317440B2 (ja) * | 2019-04-15 | 2023-07-31 | 株式会社ディスコ | ドレッシング工具 |
CN110103127B (zh) * | 2019-04-16 | 2021-01-12 | 芜湖市恒浩机械制造有限公司 | 一种汽车压缩机支撑板上表面自动抛光机 |
KR102339948B1 (ko) * | 2019-07-02 | 2021-12-17 | (주)미래컴퍼니 | 연마 시스템 및 연마 방법 |
SG10202006423VA (en) * | 2019-07-12 | 2021-02-25 | Ebara Corp | Substrate processing apparatus and storage medium |
US11623320B2 (en) | 2019-08-21 | 2023-04-11 | Applied Materials, Inc. | Polishing head with membrane position control |
WO2021041413A1 (en) * | 2019-08-27 | 2021-03-04 | Applied Materials, Inc. | Chemical mechanical polishing correction tool |
JP7406980B2 (ja) * | 2019-12-24 | 2023-12-28 | 株式会社荏原製作所 | 研磨ユニット、基板処理装置、および研磨方法 |
JP7365282B2 (ja) * | 2020-03-26 | 2023-10-19 | 株式会社荏原製作所 | 研磨ヘッドシステムおよび研磨装置 |
CN111347345B (zh) * | 2020-04-16 | 2020-10-16 | 华海清科股份有限公司 | 一种用于化学机械抛光的保持环和承载头 |
JP7479194B2 (ja) * | 2020-05-20 | 2024-05-08 | 東京エレクトロン株式会社 | 基板処理装置、及び基板処理方法 |
CN111482857B (zh) * | 2020-06-01 | 2021-11-30 | 山西宝隆科技有限公司 | 一种冶金铸造连接件成型后表面处理系统 |
US11705354B2 (en) | 2020-07-10 | 2023-07-18 | Applied Materials, Inc. | Substrate handling systems |
CN111922888B (zh) * | 2020-08-11 | 2022-04-29 | 西安奕斯伟材料科技有限公司 | 边缘抛光装置和抛光方法 |
CN112186385B (zh) * | 2020-08-24 | 2022-04-01 | 深圳市西点精工技术有限公司 | 车用无卤阻燃连接器的制作方法 |
US11794305B2 (en) | 2020-09-28 | 2023-10-24 | Applied Materials, Inc. | Platen surface modification and high-performance pad conditioning to improve CMP performance |
US11623321B2 (en) * | 2020-10-14 | 2023-04-11 | Applied Materials, Inc. | Polishing head retaining ring tilting moment control |
CN112192430B (zh) * | 2020-10-31 | 2022-06-14 | 贵溪金河铜业有限公司 | 一种铜棒抛光机 |
JP2023516875A (ja) | 2020-11-10 | 2023-04-21 | アプライド マテリアルズ インコーポレイテッド | 局所的なウエハ圧力を有する研磨ヘッド |
CN113561054A (zh) * | 2021-07-28 | 2021-10-29 | 北京烁科精微电子装备有限公司 | 一种抛光垫修整装置及抛光设备 |
CN116117686A (zh) * | 2021-11-15 | 2023-05-16 | 成都高真科技有限公司 | 晶圆抓取装置、抛光设备及应用 |
US20230356355A1 (en) * | 2022-05-03 | 2023-11-09 | Applied Materials, Inc. | Polishing head with local inner ring downforce control |
CN117020778B (zh) * | 2023-10-08 | 2023-12-26 | 湖南科德锐电子装备有限公司 | 一种导线密封管表面加工处理装置 |
Family Cites Families (105)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6248462A (ja) | 1985-08-27 | 1987-03-03 | Citizen Watch Co Ltd | 自動バフ機のドレスシステム |
JPH05277929A (ja) | 1992-04-01 | 1993-10-26 | Mitsubishi Materials Corp | ポリッシング装置の上軸機構 |
JPH05309559A (ja) | 1992-05-12 | 1993-11-22 | Speedfam Co Ltd | 平面研磨方法及び装置 |
US5635083A (en) * | 1993-08-06 | 1997-06-03 | Intel Corporation | Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate |
US5679059A (en) * | 1994-11-29 | 1997-10-21 | Ebara Corporation | Polishing aparatus and method |
US5593344A (en) * | 1994-10-11 | 1997-01-14 | Ontrak Systems, Inc. | Wafer polishing machine with fluid bearings and drive systems |
JP3158934B2 (ja) * | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
US5795215A (en) * | 1995-06-09 | 1998-08-18 | Applied Materials, Inc. | Method and apparatus for using a retaining ring to control the edge effect |
US6024630A (en) | 1995-06-09 | 2000-02-15 | Applied Materials, Inc. | Fluid-pressure regulated wafer polishing head |
US5681215A (en) | 1995-10-27 | 1997-10-28 | Applied Materials, Inc. | Carrier head design for a chemical mechanical polishing apparatus |
US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
US5762544A (en) | 1995-10-27 | 1998-06-09 | Applied Materials, Inc. | Carrier head design for a chemical mechanical polishing apparatus |
JPH09168968A (ja) * | 1995-10-27 | 1997-06-30 | Applied Materials Inc | ケミカルメカニカルポリシング装置のキャリアヘッドのデザイン |
EP0786310B1 (en) * | 1996-01-24 | 2002-12-04 | Lam Research Corporation | Wafer polishing head |
US5762539A (en) * | 1996-02-27 | 1998-06-09 | Ebara Corporation | Apparatus for and method for polishing workpiece |
US6146259A (en) | 1996-11-08 | 2000-11-14 | Applied Materials, Inc. | Carrier head with local pressure control for a chemical mechanical polishing apparatus |
US6183354B1 (en) * | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US6056632A (en) * | 1997-02-13 | 2000-05-02 | Speedfam-Ipec Corp. | Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
JP3807807B2 (ja) * | 1997-02-27 | 2006-08-09 | 株式会社荏原製作所 | ポリッシング装置 |
KR100538540B1 (ko) * | 1997-04-08 | 2006-06-16 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱장치 |
US6110025A (en) * | 1997-05-07 | 2000-08-29 | Obsidian, Inc. | Containment ring for substrate carrier apparatus |
EP0881039B1 (en) * | 1997-05-28 | 2003-04-16 | Tokyo Seimitsu Co.,Ltd. | Wafer polishing apparatus with retainer ring |
US5975994A (en) * | 1997-06-11 | 1999-11-02 | Micron Technology, Inc. | Method and apparatus for selectively conditioning a polished pad used in planarizng substrates |
US5964653A (en) | 1997-07-11 | 1999-10-12 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
TW434095B (en) * | 1997-08-11 | 2001-05-16 | Tokyo Seimitsu Co Ltd | Wafer polishing apparatus |
US5916016A (en) * | 1997-10-23 | 1999-06-29 | Vlsi Technology, Inc. | Methods and apparatus for polishing wafers |
CN1224922A (zh) * | 1997-11-05 | 1999-08-04 | 阿普莱克斯公司 | 抛光片磨损的在线监测 |
US6080040A (en) * | 1997-11-05 | 2000-06-27 | Aplex Group | Wafer carrier head with inflatable bladder and attack angle control for polishing |
JPH11226865A (ja) * | 1997-12-11 | 1999-08-24 | Speedfam Co Ltd | キャリア及びcmp装置 |
DE19755975A1 (de) * | 1997-12-16 | 1999-06-17 | Wolters Peter Werkzeugmasch | Halter für flache Werkstücke, insbesondere Halbleiterwafer |
US6116992A (en) * | 1997-12-30 | 2000-09-12 | Applied Materials, Inc. | Substrate retaining ring |
US6143127A (en) * | 1998-05-14 | 2000-11-07 | Applied Materials, Inc. | Carrier head with a retaining ring for a chemical mechanical polishing system |
US5993293A (en) | 1998-06-17 | 1999-11-30 | Speedram Corporation | Method and apparatus for improved semiconductor wafer polishing |
US6210255B1 (en) * | 1998-09-08 | 2001-04-03 | Applied Materials, Inc. | Carrier head for chemical mechanical polishing a substrate |
US6220930B1 (en) * | 1998-11-03 | 2001-04-24 | United Microelectronics Corp. | Wafer polishing head |
US6422927B1 (en) * | 1998-12-30 | 2002-07-23 | Applied Materials, Inc. | Carrier head with controllable pressure and loading area for chemical mechanical polishing |
US6162116A (en) * | 1999-01-23 | 2000-12-19 | Applied Materials, Inc. | Carrier head for chemical mechanical polishing |
US6231428B1 (en) * | 1999-03-03 | 2001-05-15 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
US6368189B1 (en) * | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
US20020173242A1 (en) * | 1999-04-19 | 2002-11-21 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
SG97860A1 (en) | 1999-03-05 | 2003-08-20 | Ebara Corp | Polishing apparatus |
JP3862920B2 (ja) | 1999-03-11 | 2006-12-27 | 株式会社荏原製作所 | 基板保持装置の姿勢制御装置を備えたポリッシング装置 |
TW467792B (en) | 1999-03-11 | 2001-12-11 | Ebara Corp | Polishing apparatus including attitude controller for turntable and/or wafer carrier |
JP2000288928A (ja) | 1999-03-31 | 2000-10-17 | Hitachi Seiki Co Ltd | 研磨盤の制御方法および研磨盤 |
US6113468A (en) * | 1999-04-06 | 2000-09-05 | Speedfam-Ipec Corporation | Wafer planarization carrier having floating pad load ring |
US20020077037A1 (en) * | 1999-05-03 | 2002-06-20 | Tietz James V. | Fixed abrasive articles |
US6241585B1 (en) * | 1999-06-25 | 2001-06-05 | Applied Materials, Inc. | Apparatus and method for chemical mechanical polishing |
US6068549A (en) * | 1999-06-28 | 2000-05-30 | Mitsubishi Materials Corporation | Structure and method for three chamber CMP polishing head |
US6390908B1 (en) * | 1999-07-01 | 2002-05-21 | Applied Materials, Inc. | Determining when to replace a retaining ring used in substrate polishing operations |
US6241593B1 (en) | 1999-07-09 | 2001-06-05 | Applied Materials, Inc. | Carrier head with pressurizable bladder |
US6290584B1 (en) * | 1999-08-13 | 2001-09-18 | Speedfam-Ipec Corporation | Workpiece carrier with segmented and floating retaining elements |
JP2001096456A (ja) | 1999-09-28 | 2001-04-10 | Toshiba Mach Co Ltd | ポリッシングヘッド |
US6439964B1 (en) | 1999-10-12 | 2002-08-27 | Applied Materials, Inc. | Method of controlling a polishing machine |
SG90746A1 (en) * | 1999-10-15 | 2002-08-20 | Ebara Corp | Apparatus and method for polishing workpiece |
JP4056205B2 (ja) | 1999-10-15 | 2008-03-05 | 株式会社荏原製作所 | ポリッシング装置および方法 |
US6241596B1 (en) | 2000-01-14 | 2001-06-05 | Applied Materials, Inc. | Method and apparatus for chemical mechanical polishing using a patterned pad |
US6705930B2 (en) * | 2000-01-28 | 2004-03-16 | Lam Research Corporation | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
US6390905B1 (en) * | 2000-03-31 | 2002-05-21 | Speedfam-Ipec Corporation | Workpiece carrier with adjustable pressure zones and barriers |
US6354928B1 (en) * | 2000-04-21 | 2002-03-12 | Agere Systems Guardian Corp. | Polishing apparatus with carrier ring and carrier head employing like polarities |
JP2001319903A (ja) | 2000-05-11 | 2001-11-16 | Lapmaster Sft Corp | 研磨装置用チャック |
CN100433269C (zh) * | 2000-05-12 | 2008-11-12 | 多平面技术公司 | 抛光装置以及与其一起使用的基片托架 |
US6506105B1 (en) * | 2000-05-12 | 2003-01-14 | Multi-Planar Technologies, Inc. | System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control |
US6558232B1 (en) * | 2000-05-12 | 2003-05-06 | Multi-Planar Technologies, Inc. | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
US6602114B1 (en) | 2000-05-19 | 2003-08-05 | Applied Materials Inc. | Multilayer retaining ring for chemical mechanical polishing |
JP2001334461A (ja) | 2000-05-26 | 2001-12-04 | Ebara Corp | 研磨装置 |
US6540592B1 (en) * | 2000-06-29 | 2003-04-01 | Speedfam-Ipec Corporation | Carrier head with reduced moment wear ring |
US6857945B1 (en) * | 2000-07-25 | 2005-02-22 | Applied Materials, Inc. | Multi-chamber carrier head with a flexible membrane |
EP2085181A1 (en) | 2000-07-31 | 2009-08-05 | Ebara Corporation | Substrate holding apparatus and substrate polishing apparatus |
JP2002113653A (ja) * | 2000-07-31 | 2002-04-16 | Ebara Corp | 基板保持装置及び該基板保持装置を備えたポリッシング装置 |
US6494765B2 (en) * | 2000-09-25 | 2002-12-17 | Center For Tribology, Inc. | Method and apparatus for controlled polishing |
US6257953B1 (en) * | 2000-09-25 | 2001-07-10 | Center For Tribology, Inc. | Method and apparatus for controlled polishing |
JP2002187060A (ja) * | 2000-10-11 | 2002-07-02 | Ebara Corp | 基板保持装置、ポリッシング装置、及び研磨方法 |
JP2002126995A (ja) * | 2000-10-24 | 2002-05-08 | Sony Corp | 研磨装置 |
CN1260778C (zh) * | 2000-12-04 | 2006-06-21 | 株式会社荏原制作所 | 基片加工方法 |
DE10062496B4 (de) * | 2000-12-14 | 2005-03-17 | Peter Wolters Cmp - Systeme Gmbh & Co. Kg | Halter für flache Werkstücke, insbesondere Halbleiterwafer |
JP2002217145A (ja) * | 2001-01-16 | 2002-08-02 | Lapmaster Sft Corp | 研磨装置用チャック |
DE60121292T2 (de) * | 2001-04-02 | 2007-07-05 | Infineon Technologies Ag | Verfahren zur Konditionierung der Oberfläche eines Polierkissens |
KR100939096B1 (ko) | 2001-05-29 | 2010-01-28 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱장치, 폴리싱방법 및 기판캐리어 시스템 |
EP1270148A1 (en) * | 2001-06-22 | 2003-01-02 | Infineon Technologies SC300 GmbH & Co. KG | Arrangement and method for conditioning a polishing pad |
US6431953B1 (en) * | 2001-08-21 | 2002-08-13 | Cabot Microelectronics Corporation | CMP process involving frequency analysis-based monitoring |
JP4721574B2 (ja) | 2001-08-29 | 2011-07-13 | 株式会社ディスコ | 研削装置の原点位置設定機構 |
JP4107835B2 (ja) | 2001-12-06 | 2008-06-25 | 株式会社荏原製作所 | 基板保持装置及びポリッシング装置 |
US6872130B1 (en) * | 2001-12-28 | 2005-03-29 | Applied Materials Inc. | Carrier head with non-contact retainer |
KR100416808B1 (ko) * | 2002-02-04 | 2004-01-31 | 삼성전자주식회사 | 반도체소자 제조용 씨엠피장치의 연마헤드 및 이를 구비한씨엠피장치 |
JP4353673B2 (ja) * | 2002-04-18 | 2009-10-28 | 株式会社荏原製作所 | ポリッシング方法 |
JP2004042174A (ja) | 2002-07-10 | 2004-02-12 | Daisho Seiki Kk | 平面研削方法 |
JP2004154874A (ja) * | 2002-11-05 | 2004-06-03 | Ebara Corp | ポリッシング装置及びポリッシング方法 |
TWI238754B (en) * | 2002-11-07 | 2005-09-01 | Ebara Tech Inc | Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof |
US6796887B2 (en) | 2002-11-13 | 2004-09-28 | Speedfam-Ipec Corporation | Wear ring assembly |
TWM255104U (en) * | 2003-02-05 | 2005-01-11 | Applied Materials Inc | Retaining ring with flange for chemical mechanical polishing |
US6821895B2 (en) * | 2003-02-20 | 2004-11-23 | Taiwan Semiconductor Manufacturing Co., Ltd | Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP |
US7131891B2 (en) | 2003-04-28 | 2006-11-07 | Micron Technology, Inc. | Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
US6939202B2 (en) * | 2003-08-13 | 2005-09-06 | Intel Corporation | Substrate retainer wear detection method and apparatus |
US7033252B2 (en) * | 2004-03-05 | 2006-04-25 | Strasbaugh | Wafer carrier with pressurized membrane and retaining ring actuator |
EP2418677B1 (en) * | 2004-11-01 | 2016-12-07 | Ebara Corporation | Polishing apparatus |
DE102005009024B4 (de) * | 2005-02-28 | 2010-09-30 | Advanced Micro Devices Inc., Sunnyvale | Verfahren und System zum Steuern einer vertikalen Substratposition in einem elektrochemischen Prozess zur Herstellung von mikrostrukturierten integrierten Schaltungen |
JP4814677B2 (ja) | 2006-03-31 | 2011-11-16 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
US7654888B2 (en) * | 2006-11-22 | 2010-02-02 | Applied Materials, Inc. | Carrier head with retaining ring and carrier ring |
US7699688B2 (en) * | 2006-11-22 | 2010-04-20 | Applied Materials, Inc. | Carrier ring for carrier head |
JP4534165B2 (ja) | 2006-12-18 | 2010-09-01 | エルピーダメモリ株式会社 | 半導体装置の製造装置及び、半導体装置の製造方法 |
EP1952945B1 (en) | 2007-01-30 | 2010-09-15 | Ebara Corporation | Polishing apparatus |
US8795032B2 (en) | 2008-06-04 | 2014-08-05 | Ebara Corporation | Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method |
JP5390807B2 (ja) | 2008-08-21 | 2014-01-15 | 株式会社荏原製作所 | 研磨方法および装置 |
JP6328977B2 (ja) * | 2014-03-31 | 2018-05-23 | 株式会社荏原製作所 | 基板研磨装置 |
KR102173323B1 (ko) * | 2014-06-23 | 2020-11-04 | 삼성전자주식회사 | 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법 |
-
2005
- 2005-10-31 EP EP11008956.2A patent/EP2418677B1/en active Active
- 2005-10-31 EP EP14188224.1A patent/EP2838110B1/en active Active
- 2005-10-31 EP EP14177630.2A patent/EP2797109B1/en active Active
- 2005-10-31 KR KR1020097005513A patent/KR101011788B1/ko active IP Right Grant
- 2005-10-31 CN CN201410104150.7A patent/CN104044057B/zh active Active
- 2005-10-31 CN CN201010267843XA patent/CN101934491B/zh active Active
- 2005-10-31 CN CN201610230339.XA patent/CN105904335B/zh active Active
- 2005-10-31 EP EP05800303A patent/EP1807865B1/en active Active
- 2005-10-31 KR KR1020117024356A patent/KR101214506B1/ko active IP Right Grant
- 2005-10-31 CN CN201110447907.9A patent/CN102513920B/zh active Active
- 2005-10-31 KR KR1020077012298A patent/KR101044739B1/ko active IP Right Grant
- 2005-10-31 KR KR1020117006761A patent/KR101126662B1/ko active IP Right Grant
- 2005-10-31 TW TW094138057A patent/TWI368555B/zh active
- 2005-10-31 EP EP16158297.8A patent/EP3043377A1/en not_active Withdrawn
- 2005-10-31 TW TW098107806A patent/TWI373393B/zh active
- 2005-10-31 EP EP13005022.2A patent/EP2690652A3/en not_active Withdrawn
- 2005-10-31 KR KR1020107025443A patent/KR101186239B1/ko active IP Right Grant
- 2005-10-31 WO PCT/JP2005/020334 patent/WO2006049269A1/en active Application Filing
- 2005-10-31 US US11/665,648 patent/US8083571B2/en active Active
-
2009
- 2009-02-25 US US12/379,597 patent/US20090191797A1/en not_active Abandoned
-
2011
- 2011-11-28 US US13/304,931 patent/US8845396B2/en active Active
-
2014
- 2014-06-23 US US14/312,641 patent/US10040166B2/en active Active
- 2014-07-15 US US14/332,357 patent/US20140329446A1/en not_active Abandoned
- 2014-08-20 US US14/464,130 patent/US9724797B2/en active Active
-
2016
- 2016-05-09 US US15/150,279 patent/US10293455B2/en active Active
-
2019
- 2019-04-03 US US16/374,590 patent/US11224956B2/en active Active
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101011788B1 (ko) | 톱링, 폴리싱장치 및 폴리싱방법 | |
JP4817687B2 (ja) | 研磨装置 | |
JP4597634B2 (ja) | トップリング、基板の研磨装置及び研磨方法 | |
US8100739B2 (en) | Substrate holding apparatus, polishing apparatus, and polishing method | |
JP5291746B2 (ja) | 研磨装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A107 | Divisional application of patent | ||
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20140107 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20150105 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20160104 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20170102 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20180103 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20190103 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20200103 Year of fee payment: 10 |