CN101972978B - 一种新型化学机械抛光装置 - Google Patents
一种新型化学机械抛光装置 Download PDFInfo
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- CN101972978B CN101972978B CN2010102666343A CN201010266634A CN101972978B CN 101972978 B CN101972978 B CN 101972978B CN 2010102666343 A CN2010102666343 A CN 2010102666343A CN 201010266634 A CN201010266634 A CN 201010266634A CN 101972978 B CN101972978 B CN 101972978B
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- polishing
- chemical mechanical
- rubbing head
- disk
- polishing pad
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- 238000005498 polishing Methods 0.000 title claims abstract description 122
- 239000000126 substance Substances 0.000 title claims abstract description 17
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 34
- 239000010703 silicon Substances 0.000 claims abstract description 34
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000012530 fluid Substances 0.000 claims description 13
- 230000003321 amplification Effects 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 5
- 230000010358 mechanical oscillation Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
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Priority Applications (1)
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CN2010102666343A CN101972978B (zh) | 2010-08-30 | 2010-08-30 | 一种新型化学机械抛光装置 |
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CN2010102666343A CN101972978B (zh) | 2010-08-30 | 2010-08-30 | 一种新型化学机械抛光装置 |
Publications (2)
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CN101972978A CN101972978A (zh) | 2011-02-16 |
CN101972978B true CN101972978B (zh) | 2012-05-16 |
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CN2010102666343A Active CN101972978B (zh) | 2010-08-30 | 2010-08-30 | 一种新型化学机械抛光装置 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150111478A1 (en) * | 2013-10-23 | 2015-04-23 | Applied Materials, Inc. | Polishing system with local area rate control |
CN104117878B (zh) * | 2014-07-28 | 2017-01-18 | 辽宁工业大学 | 利用液体传递兆赫级振动的超声抛光方法及其抛光装置 |
CN105666287B (zh) * | 2016-02-23 | 2017-04-26 | 武汉大学 | 一种加工航空领域金属构件基于cmp的机器人磨抛系统 |
CN107520686A (zh) * | 2017-08-25 | 2017-12-29 | 浙江羿阳太阳能科技有限公司 | 一种硅片用新型抛光装置 |
CN109702625A (zh) * | 2018-12-28 | 2019-05-03 | 天津洙诺科技有限公司 | 一种硅片单面抛光装置及其方法 |
CN111590459A (zh) * | 2020-05-26 | 2020-08-28 | 湘潭大学 | 一种带断屑槽硬质合金刀片化学机械抛光设备控制系统 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10329011A (ja) * | 1997-03-21 | 1998-12-15 | Canon Inc | 精密研磨装置及び方法 |
US6020262A (en) * | 1998-03-06 | 2000-02-01 | Siemens Aktiengesellschaft | Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer |
US6623355B2 (en) * | 2000-11-07 | 2003-09-23 | Micell Technologies, Inc. | Methods, apparatus and slurries for chemical mechanical planarization |
CN102513920B (zh) * | 2004-11-01 | 2016-04-27 | 株式会社荏原制作所 | 抛光设备 |
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2010
- 2010-08-30 CN CN2010102666343A patent/CN101972978B/zh active Active
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Effective date of registration: 20190620 Address after: 300 350 Building 9, 8 Juxing Road, Haihe Science Park, Jinnan District, Tianjin Patentee after: TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.) Address before: 100084 mailbox 100084-82, Beijing City Patentee before: Tsinghua University |
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Address after: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Patentee after: Huahaiqingke Co.,Ltd. Address before: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Patentee before: TSINGHUA University |