KR20080095750A - 와이어쏘를 위한 와이어 가이드 롤 - Google Patents
와이어쏘를 위한 와이어 가이드 롤 Download PDFInfo
- Publication number
- KR20080095750A KR20080095750A KR1020080027470A KR20080027470A KR20080095750A KR 20080095750 A KR20080095750 A KR 20080095750A KR 1020080027470 A KR1020080027470 A KR 1020080027470A KR 20080027470 A KR20080027470 A KR 20080027470A KR 20080095750 A KR20080095750 A KR 20080095750A
- Authority
- KR
- South Korea
- Prior art keywords
- wire
- wire guide
- guide roll
- cutting
- groove
- Prior art date
Links
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
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- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
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- 239000000654 additive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
- B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H57/00—Guides for filamentary materials; Supports therefor
- B65H57/14—Pulleys, rollers, or rotary bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/687—By tool reciprocable along elongated edge
- Y10T83/6905—With tool in-feed
- Y10T83/6945—With passive means to guide tool directly
- Y10T83/695—By plural opposed guide surfaces
- Y10T83/696—With relative adjustment between guide and work or work-support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/929—Tool or tool with support
- Y10T83/9292—Wire tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
Claims (6)
- 원통형 소재로부터 다수의 웨이퍼를 동시에 얇게 절단하기 위한 와이어쏘에 사용하기 위한 와이어 가이드 롤로서, 두께가 2 mm 이상 최대 7.5 mm이며 Shore A 경도가 60 이상 최대 99인 재료로 이루어진 코팅이 마련되고, 다수의 홈을 더 포함하여 이 홈을 통해 절단용 와이어가 안내되며, 각각의 홈은 곡률 반경(R)이 절단용 와이어 직경(D)의 0.25 내지 1.6 배이고 개구 각도(a)가 60 내지 130°인 만곡된 홈 기부를 갖는 것인 와이어 가이드 롤.
- 제1항에 있어서, 상기 와이어 가이드 롤의 코팅은 82 내지 99의 Shore A 경도를 갖는 재료로 이루어지는 것인 와이어 가이드 롤.
- 제1항 또는 제2항에 있어서, 상기 홈의 기부의 곡률 반경(R)은 절단용 와이어 직경(D)의 0.4 내지 0.9 배인 것인 와이어 가이드 롤.
- 제1항에 있어서, 상기 홈의 개구 각도는 80 내지 110°인 것인 와이어 가이드 롤.
- 제1항 또는 제2항에 있어서, 상기 코팅의 재료로서 폴리우레탄이 사용되는 것인 와이어 가이드 롤.
- 와이어쏘에 의해 원통형 소재로부터 다수의 웨이퍼를 동시에 얇게 절단하는 방법에 있어서, 제1항 또는 제2항에 따른 와이어 가이드 롤을 사용하는 것인 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200710019566 DE102007019566B4 (de) | 2007-04-25 | 2007-04-25 | Drahtführungsrolle für Drahtsäge |
DE102007019566.6 | 2007-04-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080095750A true KR20080095750A (ko) | 2008-10-29 |
KR100956083B1 KR100956083B1 (ko) | 2010-05-07 |
Family
ID=39777434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080027470A KR100956083B1 (ko) | 2007-04-25 | 2008-03-25 | 와이어쏘를 위한 와이어 가이드 롤 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10245661B2 (ko) |
JP (1) | JP4988645B2 (ko) |
KR (1) | KR100956083B1 (ko) |
CN (1) | CN101549531B (ko) |
DE (1) | DE102007019566B4 (ko) |
SG (1) | SG147364A1 (ko) |
TW (1) | TWI352642B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190117618A (ko) * | 2017-02-14 | 2019-10-16 | 실트로닉 아게 | 잉곳으로부터 복수의 웨이퍼를 동시 절단하기 위한 와이어 소오, 와이어 가이드 롤 및 방법 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5311964B2 (ja) * | 2008-10-29 | 2013-10-09 | 京セラ株式会社 | ワイヤーソー装置 |
DE102009012679A1 (de) | 2009-03-13 | 2010-09-16 | Schott Solar Ag | Drahtsäge-Vorrichtung |
JP5750737B2 (ja) * | 2009-06-17 | 2015-07-22 | 三菱レイヨン株式会社 | ワイヤソー用メインローラー、そのローラー本体及び製造方法 |
DE102009057592B3 (de) * | 2009-12-09 | 2011-05-05 | Siltronic Ag | Drahtführungsrolle für Drahtsäge |
DE102010005718B4 (de) | 2010-01-26 | 2011-09-22 | Schott Solar Ag | Drahtführungsrolle zur Verwendung in Drahtsägen |
DE102010007459B4 (de) | 2010-02-10 | 2012-01-19 | Siltronic Ag | Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Kristall aus Halbleitermaterial |
DE102011005949B4 (de) * | 2011-03-23 | 2012-10-31 | Siltronic Ag | Verfahren zum Abtrennen von Scheiben von einem Werkstück |
DE102011082366B3 (de) * | 2011-09-08 | 2013-02-28 | Siltronic Ag | Einlagiges Wickeln von Sägedraht mit fest gebundenem Schneidkorn für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück |
DE102011083175A1 (de) | 2011-09-22 | 2013-03-28 | Voith Patent Gmbh | Drahtführungsrolle für Drahtsägen mit Datenerfassungssystem |
DE102011083261A1 (de) | 2011-09-23 | 2013-03-28 | Voith Patent Gmbh | Drahtführungsrolle für Drahtsägen mit Datenerfassungssystem |
CN102501324A (zh) * | 2011-11-03 | 2012-06-20 | 昆山翰辉电子科技有限公司 | 线形切割机的导轮的线槽结构 |
EP2928632B1 (en) | 2012-12-04 | 2021-06-30 | Precision Surfacing Solutions GmbH | Wire management system |
DE102013219900B3 (de) * | 2013-10-01 | 2015-02-26 | Siltronic Ag | Verfahren zum Rillieren der Drahtführungsrollen für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück |
DE102013225104B4 (de) | 2013-12-06 | 2019-11-28 | Siltronic Ag | Verfahren zum Abtrennen von Scheiben von einem Werkstück mittels einer Drahtsäge |
DE102015200198B4 (de) | 2014-04-04 | 2020-01-16 | Siltronic Ag | Verfahren zum Abtrennen von Halbleiterscheiben von einem Werkstück mit einem Sägedraht |
DE102014224759B3 (de) * | 2014-12-03 | 2016-01-21 | Siltronic Ag | Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Werkstück |
DE102018210401A1 (de) | 2018-06-26 | 2020-01-02 | Siltronic Ag | Verfahren zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem Halbleiterstab |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2958323A (en) * | 1958-01-29 | 1960-11-01 | Ty Sa Man Machine Company | Stone cutting apparatus |
US4134384A (en) * | 1977-09-16 | 1979-01-16 | Motorola, Inc. | Wire saw with rotatable guide sleeve |
FR2481985A1 (fr) * | 1980-05-09 | 1981-11-13 | Saint Gobain Vetrotex | Dispositif pour la coupe de fils continus, notamment de fils de verre |
JPS57137285A (en) * | 1981-02-17 | 1982-08-24 | Mitsubishi Electric Corp | Hoisting device for elevator |
JPH0344020U (ko) * | 1989-09-09 | 1991-04-24 | ||
US5586639A (en) * | 1994-12-12 | 1996-12-24 | Yazaki Industrial Chemical Co. | Powered roller conveyer for light loads |
CH691038A5 (fr) * | 1996-02-06 | 2001-04-12 | Hct Shaping Systems Sa | Dispositif de sciage par fil pour le découpe de tranches fines. |
CH691037A5 (fr) * | 1996-02-06 | 2001-04-12 | Hct Shaping Systems Sa | Dispositif de sciage par fil. |
JP3273163B2 (ja) * | 1996-09-06 | 2002-04-08 | シャープ株式会社 | マルチワイヤソー |
EP0980303B1 (fr) * | 1997-05-07 | 2002-09-18 | HCT Shaping Systems SA | Dispositif de sciage par fil pour la decoupe de tranches fines utilisant le croisement angulaire d'au moins deux nappes de fils |
JPH1199465A (ja) | 1997-09-26 | 1999-04-13 | Tokyo Seimitsu Co Ltd | 固定砥粒ワイヤソー |
JPH11114799A (ja) * | 1997-10-07 | 1999-04-27 | Hitachi Ltd | 切断方法および装置 |
JPH11123648A (ja) * | 1997-10-27 | 1999-05-11 | Taiheiyo Cement Corp | ワイヤーソー用多溝ローラ |
JP3804723B2 (ja) | 1998-03-19 | 2006-08-02 | 信越半導体株式会社 | ワイヤーソー装置のメインローラ及びガイドローラの改質方法 |
TW383249B (en) * | 1998-09-01 | 2000-03-01 | Sumitomo Spec Metals | Cutting method for rare earth alloy by annular saw and manufacturing for rare earth alloy board |
GB9828305D0 (en) * | 1998-12-23 | 1999-02-17 | Eastman Kodak Co | Device to reduce electrostatic pattern transfer in coating processes |
US6620494B2 (en) * | 1999-07-03 | 2003-09-16 | Ten Cate Enbi B.V. | Conductive roller |
NL1012507C2 (nl) | 1999-07-03 | 2001-01-08 | Ten Cate Enbi B V | Geleidende rol. |
JP2001277093A (ja) * | 2000-01-27 | 2001-10-09 | Mitsubishi Materials Corp | 駆動プーリ及びそれを用いたワイヤソー装置並びに切断方法 |
TW442370B (en) | 2000-05-24 | 2001-06-23 | Chien Hui Chuan | Diamond wire saw cutting machine |
JP2002018831A (ja) | 2000-07-07 | 2002-01-22 | Hitachi Cable Ltd | ワイヤソー切断装置及び半導体結晶インゴットのスライス方法 |
CH694182A5 (fr) * | 2000-11-20 | 2004-08-31 | Hct Shaping Systems Sa | Dispositif de sciage par fil. |
CN1228162C (zh) * | 2000-11-24 | 2005-11-23 | 株式会社新王磁材 | 稀土合金的切断方法和稀土磁铁的制造方法 |
JP2002219643A (ja) * | 2001-01-26 | 2002-08-06 | Taiheiyo Cement Corp | ワイヤーソー用ローラおよびその製造方法 |
JP2002239889A (ja) * | 2001-02-09 | 2002-08-28 | Taiheiyo Cement Corp | ワイヤーソー用ローラ |
DE10139962C1 (de) * | 2001-08-14 | 2003-04-17 | Wacker Siltronic Halbleitermat | Verfahren zum Abtrennen von Scheiben von einem sprödharten Werkstück und Drahtsäge zur Durchführung des Verfahrens |
WO2003033207A1 (fr) * | 2001-10-17 | 2003-04-24 | Neomax Co., Ltd. | Procede de decoupe au moyen d'un fil helicoidal, dispositif de decoupe a fil helicoidal, et procede de fabrication d'un aimant permanent a base de terres rares |
TW499353B (en) | 2001-12-31 | 2002-08-21 | Chien Hui Chuan | Three-dimension diamond wire saw cutting machine |
DE10220640A1 (de) * | 2002-05-08 | 2002-12-19 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung zum Abtrennen von Scheiben von einem Werkstück |
JP4473499B2 (ja) | 2002-09-26 | 2010-06-02 | トーヨーエイテック株式会社 | ワイヤソーおよびガイドローラ組立体 |
DE10349287A1 (de) * | 2003-10-23 | 2005-06-16 | Siltronic Ag | Drahtführungsrolle mit demontierbarem Beschichtungsträger |
JP4049768B2 (ja) * | 2004-08-11 | 2008-02-20 | 日本エラストマ−開発株式会社 | ワイヤーソー用ガイドローラ |
CN1586855A (zh) * | 2004-08-20 | 2005-03-02 | 张革 | 台式大尺寸精密金刚石线切割机 |
JP2006075969A (ja) | 2004-09-13 | 2006-03-23 | Sharp Corp | ワイヤソー装置 |
JP2006102917A (ja) | 2004-10-08 | 2006-04-20 | Sumco Corp | ワイヤソー用ローラ |
JP2006346848A (ja) * | 2005-06-17 | 2006-12-28 | Kazumasa Onishi | 超音波ワイヤソー装置 |
JP4951914B2 (ja) | 2005-09-28 | 2012-06-13 | 信越半導体株式会社 | (110)シリコンウエーハの製造方法 |
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2007
- 2007-04-25 DE DE200710019566 patent/DE102007019566B4/de active Active
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2008
- 2008-02-27 SG SG200801642-0A patent/SG147364A1/en unknown
- 2008-03-25 KR KR1020080027470A patent/KR100956083B1/ko active IP Right Grant
- 2008-04-03 CN CN2008100918107A patent/CN101549531B/zh active Active
- 2008-04-21 US US12/106,428 patent/US10245661B2/en active Active
- 2008-04-23 TW TW97114821A patent/TWI352642B/zh active
- 2008-04-25 JP JP2008114897A patent/JP4988645B2/ja active Active
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KR20190117618A (ko) * | 2017-02-14 | 2019-10-16 | 실트로닉 아게 | 잉곳으로부터 복수의 웨이퍼를 동시 절단하기 위한 와이어 소오, 와이어 가이드 롤 및 방법 |
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DE102007019566B4 (de) | 2012-11-29 |
JP2008272930A (ja) | 2008-11-13 |
KR100956083B1 (ko) | 2010-05-07 |
TWI352642B (en) | 2011-11-21 |
JP4988645B2 (ja) | 2012-08-01 |
SG147364A1 (en) | 2008-11-28 |
CN101549531A (zh) | 2009-10-07 |
DE102007019566A1 (de) | 2008-10-30 |
US10245661B2 (en) | 2019-04-02 |
CN101549531B (zh) | 2012-04-25 |
TW200841988A (en) | 2008-11-01 |
US20080264228A1 (en) | 2008-10-30 |
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