JP2008272930A - ワイヤー鋸用ワイヤー案内ロール - Google Patents
ワイヤー鋸用ワイヤー案内ロール Download PDFInfo
- Publication number
- JP2008272930A JP2008272930A JP2008114897A JP2008114897A JP2008272930A JP 2008272930 A JP2008272930 A JP 2008272930A JP 2008114897 A JP2008114897 A JP 2008114897A JP 2008114897 A JP2008114897 A JP 2008114897A JP 2008272930 A JP2008272930 A JP 2008272930A
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- JP
- Japan
- Prior art keywords
- wire
- guide roll
- wire guide
- coating
- saw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
- B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H57/00—Guides for filamentary materials; Supports therefor
- B65H57/14—Pulleys, rollers, or rotary bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/687—By tool reciprocable along elongated edge
- Y10T83/6905—With tool in-feed
- Y10T83/6945—With passive means to guide tool directly
- Y10T83/695—By plural opposed guide surfaces
- Y10T83/696—With relative adjustment between guide and work or work-support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/929—Tool or tool with support
- Y10T83/9292—Wire tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
【解決手段】多重のウェーハを円筒形の被工作物から同時にスライスするためのワイヤー鋸に使用するワイヤー案内ロールの場合に、このワイヤー案内ロールは、少なくとも2mmおよび最大7.5mmの厚さを有するコーティングを備えており、少なくとも60および最大99のショアーA硬度を有する材料から構成されており、さらに鋸引きワイヤーが案内される多重の溝を有し、この溝は、それぞれ鋸引きワイヤー直径Dの0.25〜1.6倍である曲率半径Rおよび60〜130゜の開口角度を有する湾曲した溝ベースを有している。
【選択図】図1
Description
R=0.4D − 0.9Dである。
F=A×E×dl/l
式中、Fは、ワイヤーの張力を表わし、Aは、ワイヤーの断面積を表わし、Eは、弾性率を表わし、dlは、長さの変化を表わし、lは、ワイヤーの自由長さを表わす。
Claims (6)
- 多重のウェーハを円筒形の被工作物から同時にスライスするためのワイヤー鋸に使用するワイヤー案内ロールであって、このワイヤー案内ロールが、少なくとも2mmおよび最大7.5mmの厚さを有するコーティングを備えており、少なくとも60および最大99のショアーA硬度を有する材料から構成されており、さらに鋸引きワイヤーが案内される多重の溝を有し、この溝が、それぞれ鋸引きワイヤー直径Dの0.25〜1.6倍である曲率半径Rおよび60〜130゜の開口角度を有する湾曲した溝ベースを有している、上記のワイヤー案内ロール。
- ワイヤー案内ロールのコーティングが、82〜99のショアーA硬度を有する材料から構成されている、請求項1記載のワイヤー案内ロール。
- 溝ベースの曲率半径Rが鋸引きワイヤーの直径Dの0.4〜0.9倍である、請求項1または2記載のワイヤー案内ロール。
- 溝の開口角度が80〜110°である、請求項1記載のワイヤー案内ロール。
- ポリウレタンがコーティング材料として使用されている、請求項1から4までのいずれか1項に記載のワイヤー案内ロール。
- 多重のウェーハを円筒形の被工作物からワイヤー鋸により同時にスライスする方法において、請求項1から5までのいずれか1項に記載のワイヤー案内ロールを使用することを特徴とする、多重のウェーハを円筒形の被工作物からワイヤー鋸により同時にスライスする方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200710019566 DE102007019566B4 (de) | 2007-04-25 | 2007-04-25 | Drahtführungsrolle für Drahtsäge |
DE102007019566.6 | 2007-04-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008272930A true JP2008272930A (ja) | 2008-11-13 |
JP4988645B2 JP4988645B2 (ja) | 2012-08-01 |
Family
ID=39777434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008114897A Active JP4988645B2 (ja) | 2007-04-25 | 2008-04-25 | ワイヤー鋸用ワイヤー案内ロール |
Country Status (7)
Country | Link |
---|---|
US (1) | US10245661B2 (ja) |
JP (1) | JP4988645B2 (ja) |
KR (1) | KR100956083B1 (ja) |
CN (1) | CN101549531B (ja) |
DE (1) | DE102007019566B4 (ja) |
SG (1) | SG147364A1 (ja) |
TW (1) | TWI352642B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010105114A (ja) * | 2008-10-29 | 2010-05-13 | Kyocera Corp | ワイヤーソー装置 |
JP2011000665A (ja) * | 2009-06-17 | 2011-01-06 | Mitsubishi Plastics Inc | ワイヤソー用メインローラー、そのローラー本体及び製造方法 |
JP2020507484A (ja) * | 2017-02-14 | 2020-03-12 | ジルトロニック アクチエンゲゼルシャフトSiltronic AG | ワイヤソー、ワイヤガイドロール、およびインゴットから複数のウェハを同時に切出すための方法 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009012679A1 (de) | 2009-03-13 | 2010-09-16 | Schott Solar Ag | Drahtsäge-Vorrichtung |
DE102009057592B3 (de) * | 2009-12-09 | 2011-05-05 | Siltronic Ag | Drahtführungsrolle für Drahtsäge |
DE102010005718B4 (de) | 2010-01-26 | 2011-09-22 | Schott Solar Ag | Drahtführungsrolle zur Verwendung in Drahtsägen |
DE102010007459B4 (de) | 2010-02-10 | 2012-01-19 | Siltronic Ag | Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Kristall aus Halbleitermaterial |
DE102011005949B4 (de) * | 2011-03-23 | 2012-10-31 | Siltronic Ag | Verfahren zum Abtrennen von Scheiben von einem Werkstück |
DE102011082366B3 (de) * | 2011-09-08 | 2013-02-28 | Siltronic Ag | Einlagiges Wickeln von Sägedraht mit fest gebundenem Schneidkorn für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück |
DE102011083175A1 (de) | 2011-09-22 | 2013-03-28 | Voith Patent Gmbh | Drahtführungsrolle für Drahtsägen mit Datenerfassungssystem |
DE102011083261A1 (de) | 2011-09-23 | 2013-03-28 | Voith Patent Gmbh | Drahtführungsrolle für Drahtsägen mit Datenerfassungssystem |
CN102501324A (zh) * | 2011-11-03 | 2012-06-20 | 昆山翰辉电子科技有限公司 | 线形切割机的导轮的线槽结构 |
MY178917A (en) | 2012-12-04 | 2020-10-22 | Prec Surfacing Solutions Gmbh | Wire management system |
DE102013219900B3 (de) * | 2013-10-01 | 2015-02-26 | Siltronic Ag | Verfahren zum Rillieren der Drahtführungsrollen für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück |
DE102013225104B4 (de) | 2013-12-06 | 2019-11-28 | Siltronic Ag | Verfahren zum Abtrennen von Scheiben von einem Werkstück mittels einer Drahtsäge |
DE102015200198B4 (de) | 2014-04-04 | 2020-01-16 | Siltronic Ag | Verfahren zum Abtrennen von Halbleiterscheiben von einem Werkstück mit einem Sägedraht |
DE102014224759B3 (de) * | 2014-12-03 | 2016-01-21 | Siltronic Ag | Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Werkstück |
DE102018210401A1 (de) | 2018-06-26 | 2020-01-02 | Siltronic Ag | Verfahren zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem Halbleiterstab |
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JPH0344020U (ja) * | 1989-09-09 | 1991-04-24 | ||
JPH11262853A (ja) * | 1998-03-19 | 1999-09-28 | Shin Etsu Handotai Co Ltd | ワイヤーソー装置のメインローラ及び ガイドローラの改質方法 |
JP2002018831A (ja) * | 2000-07-07 | 2002-01-22 | Hitachi Cable Ltd | ワイヤソー切断装置及び半導体結晶インゴットのスライス方法 |
JP2002219643A (ja) * | 2001-01-26 | 2002-08-06 | Taiheiyo Cement Corp | ワイヤーソー用ローラおよびその製造方法 |
JP2002239889A (ja) * | 2001-02-09 | 2002-08-28 | Taiheiyo Cement Corp | ワイヤーソー用ローラ |
JP2004114235A (ja) * | 2002-09-26 | 2004-04-15 | Toyo Advanced Technologies Co Ltd | ワイヤソーおよびガイドローラ組立体 |
JP2006075969A (ja) * | 2004-09-13 | 2006-03-23 | Sharp Corp | ワイヤソー装置 |
JP2006346848A (ja) * | 2005-06-17 | 2006-12-28 | Kazumasa Onishi | 超音波ワイヤソー装置 |
JP2007090466A (ja) * | 2005-09-28 | 2007-04-12 | Shin Etsu Handotai Co Ltd | (110)シリコンウエーハの製造方法 |
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2007
- 2007-04-25 DE DE200710019566 patent/DE102007019566B4/de active Active
-
2008
- 2008-02-27 SG SG200801642-0A patent/SG147364A1/en unknown
- 2008-03-25 KR KR1020080027470A patent/KR100956083B1/ko active IP Right Grant
- 2008-04-03 CN CN2008100918107A patent/CN101549531B/zh active Active
- 2008-04-21 US US12/106,428 patent/US10245661B2/en active Active
- 2008-04-23 TW TW97114821A patent/TWI352642B/zh active
- 2008-04-25 JP JP2008114897A patent/JP4988645B2/ja active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0344020U (ja) * | 1989-09-09 | 1991-04-24 | ||
JPH11262853A (ja) * | 1998-03-19 | 1999-09-28 | Shin Etsu Handotai Co Ltd | ワイヤーソー装置のメインローラ及び ガイドローラの改質方法 |
JP2002018831A (ja) * | 2000-07-07 | 2002-01-22 | Hitachi Cable Ltd | ワイヤソー切断装置及び半導体結晶インゴットのスライス方法 |
JP2002219643A (ja) * | 2001-01-26 | 2002-08-06 | Taiheiyo Cement Corp | ワイヤーソー用ローラおよびその製造方法 |
JP2002239889A (ja) * | 2001-02-09 | 2002-08-28 | Taiheiyo Cement Corp | ワイヤーソー用ローラ |
JP2004114235A (ja) * | 2002-09-26 | 2004-04-15 | Toyo Advanced Technologies Co Ltd | ワイヤソーおよびガイドローラ組立体 |
JP2006075969A (ja) * | 2004-09-13 | 2006-03-23 | Sharp Corp | ワイヤソー装置 |
JP2006346848A (ja) * | 2005-06-17 | 2006-12-28 | Kazumasa Onishi | 超音波ワイヤソー装置 |
JP2007090466A (ja) * | 2005-09-28 | 2007-04-12 | Shin Etsu Handotai Co Ltd | (110)シリコンウエーハの製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010105114A (ja) * | 2008-10-29 | 2010-05-13 | Kyocera Corp | ワイヤーソー装置 |
JP2011000665A (ja) * | 2009-06-17 | 2011-01-06 | Mitsubishi Plastics Inc | ワイヤソー用メインローラー、そのローラー本体及び製造方法 |
JP2020507484A (ja) * | 2017-02-14 | 2020-03-12 | ジルトロニック アクチエンゲゼルシャフトSiltronic AG | ワイヤソー、ワイヤガイドロール、およびインゴットから複数のウェハを同時に切出すための方法 |
JP7102422B2 (ja) | 2017-02-14 | 2022-07-19 | ジルトロニック アクチエンゲゼルシャフト | ワイヤソー、ワイヤガイドロール、およびインゴットから複数のウェハを同時に切出すための方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101549531A (zh) | 2009-10-07 |
SG147364A1 (en) | 2008-11-28 |
US20080264228A1 (en) | 2008-10-30 |
CN101549531B (zh) | 2012-04-25 |
DE102007019566B4 (de) | 2012-11-29 |
TWI352642B (en) | 2011-11-21 |
KR20080095750A (ko) | 2008-10-29 |
DE102007019566A1 (de) | 2008-10-30 |
JP4988645B2 (ja) | 2012-08-01 |
TW200841988A (en) | 2008-11-01 |
KR100956083B1 (ko) | 2010-05-07 |
US10245661B2 (en) | 2019-04-02 |
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