TW499353B - Three-dimension diamond wire saw cutting machine - Google Patents

Abstract

The present invention relates to use a diamond wire saw for cutting a non-conductive material. The cutting method thereof is similar to a discharge processing device and can cut a brittle hard material, e.g. ceramics, composite material, silicon, etc. which can not be processed into a required shape by a conventional method. The invented diamond wire saw is mainly for processing a 3-D object. The invented device uses a controller mainly comprising a PC to perform a numerical control. The machine uses a diamond wire saw to move in the Z-axis direction or a specific direction, thereby achieving the function of cutting. The workpiece can be clamped on a lateral shaft, which moves synchronously with the X-Y bed and has indexing or rotation functions on the side thereof. The computer calculates a cutting path and allows the machine platform to perform a corresponding movement. The lateral shaft with indexing functions can alter the rotation angle of the workpiece according to the need in order to cut a symmetrical or asymmetrical 3-D product. The lateral shaft with indexing functions can cut a symmetrical 3-D product at the faster speed.

Description

499353 V. Description of the invention (1) The present invention is a machine tool that uses diamond wire saws to cut materials that cannot be processed by traditional methods. This machine tool can cut materials with high hardness, brittleness, etc., such as ceramics and silicon wafers. , Granite, marble, etc., to make up for the deficiencies of the traditional processing methods, and can solve the various problems of emerging materials processing and cutting. For example, in the semiconductor industry, it is often necessary to process ingots and cut them into wafers. When the size of the wafer is larger, such as twelve pairs, sixteen leaves ... #, etc., it is difficult to cut the ingots with today's processing technology. Such as a diamond circular saw blade. In addition, the processing of some emerging ceramic materials also faces problems: because ceramic materials have many characteristics and uses, such as financial heat, insect resistance, high hardness, high strength, good thermal conductivity and electrical insulation, and their unique light, heat, and electrical properties. , Magnetic, etc., can be used as electronic components for special functions such as sensing and control, such as dielectric ceramic materials, piezoelectric ceramic materials, medical ceramic materials, etc. Because ceramic materials can be used for general materials (such as iron, steel, etc.) cannot be used, but its high brittleness, susceptible to stress damage, etc., making it impossible to obtain the required shape by ordinary traditional processing . For this kind of required parts, we have chosen diamond wire saw as the cutting tool, which mainly attaches the diamond particles to the piano wire through various gluing, plating, or brazing methods. The diamond wire saw has excellent cutting characteristics and has an advantage over diamond tools in cutting performance. In addition, it can also solve the heat concentration of the crystal structure of high-brittleness materials in the case of frictional heat, which will increase the temperature and affect the characteristics of the material. Therefore, all solid materials can be cut by diamond wire saws, and after cutting, there is almost no jagged shape. , Breakage or surface damage. In addition, when cutting easily and brittle crystals, it can avoid the severe vibration of the diamond cutter, which

Page 4 499353 V. Description of the invention (2) The piece is broken into pieces. Because the diamond wire saw is highly flexible, it will suppress vibration when it contacts the workpiece. It is more suitable for cutting fragile materials than traditional cutting tools such as circular abrasive saw blades. . In addition, the diamond wire saw has a very small contact area with the workpiece, and new diamond particles are constantly in contact with the workpiece during cutting. Therefore, when cutting any material, the frictional heat generated is less than that of traditional tools, and the diamond adhered to the surface after cutting The degree of wear of the particles is small.

C There are very few machines on the market that use diamond wire saws for cutting. The US patent US 4 0 1 6 8 5 6 talks about a diamond wire saw cutting machine. The announcement date of one is April 1977. The patent validity period has been lost. Both are because they are not computer-controlled and use threading instead of winding. Therefore, the cutting speed and accuracy are poor. Only simple shapes can be cut, and precision machining cannot be achieved. US Patent No. 5 5 6 4 4 0 9 also uses alloy wires to cut hard discs. Because this patent uses alloy wires and abrasive grains to cut, not diamond wire saws; two-dimensional diamond wire cutting machines were used in 1990 Obtained the Republic of China Invention Patent Bulletin No. 4 4 2 3 7 0 on June 2 and 3, the vertical machine k of its two-dimensional diamond wire cutting machine please refer to the first picture, because the diamond wire saw 1 can only move in the Z axis direction In combination with XY bed 5 for XY plane motion, this diamond wire cutting machine can only cut two-dimensional products as shown in the second figure. Today's invention will break through the previous one-dimensional cutting or two-dimensional Shape processing, through the movement of the third axis to achieve three Machining shape three-dimensional shape of the main demands. In summary, one of the objectives of the present invention is to design a side axis that moves in parallel with the bed and has an indexing function to hold the workpiece, and cooperate with the diamond line of the Z-axis movement and the computer-controlled machining trajectory to achieve symmetry. Or asymmetric 3D shape processing.

Page 5 499353 V. Description of the invention (3) The second purpose of the present invention is to design a side shaft that rotates with the bed and has a rotating function to hold the workpiece. This rotating side shaft will continuously drive during the cutting process. The workpiece itself rotates, and with the Z-axis moving diamond line and computer-controlled machining trajectory, it achieves a symmetrical three-dimensional shape processing "quickly". In order to make the examiner of the Bureau more clear about the efficacy of the patent of the present invention, detailed descriptions such as Y: Graphic: First image: Vertical mechanism of two-dimensional diamond wire cutting machine Second image: Schematic diagram of diamond wire saw cutting a circular piece Third image: Schematic diagram of the relative position of the side axis and diamond wire saw Fourth image: points Side-axis cutting trajectory (asymmetric) Figure 5: Indexing side-axis cutting trajectory (Symmetry) Figure 6: Asymmetric 3D shape product (indexing) Figure 7: Symmetric 3D shape product (grading) Figure # 8: Cutting trajectory of the rotating side shaft Figure 9: Three-dimensional shaped product (rotation) Drawing number: 1 Diamond wire saw 2 Side shaft 3 Side shaft clamp 4 Workpiece 5 XY bed 6 A guide roller group 7 B guide roller Passive roller set 10 B 8 9 A passive roller drive roller 11 C passive roller body 12

Page 6 499353 V. Description of the invention (4) 13 Rotary rod 14 Negative line 15 Loaded roller 16 Counterweight load 17 Drive motor 18 Belt 19 A pulley 20 B pulley 21 PC 22 Servo motor 23 CNC bed controller 24 A cutting Trajectory 25 B cutting trajectory 26 C cutting trajectory 27 A cutting trajectory 28 B cutting trajectory 29 C cutting trajectory 30 D cutting trajectory 31 In order to achieve the aforementioned three-dimensional processing, the cutting trajectory is shown in the third figure First, pass the diamond wire saw 1 around the drive roller 8, then bypass the A passive roller 9, then the A guide roller group 6, the B guide roller group 7, and then bypass the B passive roller 1 0 and C passive roller 1 1 To complete an entire loop. The driving roller 7, and the three passive rollers 9, 10, and 11 are all mounted on the body 12 in a cantilever-like manner, so as to directly put the diamond wire saw ring 1 which has been butt welded in advance. C Passive roller 1 1 is mounted on the rotating rod 13 and a load line 1 4 is drawn from above the rotating rod 13 and passes the load roller 15 to suspend a weighted load of appropriate weight 16 to make the diamond wire saw Before the ring 1 is cut, it is subject to a certain tension in advance; and when the diamond saw ring 1 is put on, the fine rotation of the C passive roller 11 and the rotary rod 13 can make the diamond wire saw ring 1 easily put on, so Save on diamond wire saws

Page 7 499353 V. Description of the invention (5) Time spent on ring 1.

The bottom of the side shaft 2 is installed next to the XY bed 5 so that the side shaft 2 will also move with the XY bed 5 when it moves; and the processing workpiece 4 is fixed by the side shaft clamp 3, and the front end A is rotated by the driving motor 17 The pulley 19 rotates the B pulley 20 and the driving roller 8 by the transmission of the belt 18, and then drives the diamond wire saw 1 to rotate, so that the workpiece 4 can be cut and processed. A command from the program of PC2 1 (refer to the first picture) is given to the CNC bed controller 23 (refer to the first picture), and the X-Y bed 5 is driven by the CNC bed controller 2 3 to move, referring to the fourth picture, The machining workpiece 4 can be moved according to the A cutting trajectory line 2 4 set in the program. After this cutting operation is completed, the program of PC2 1 is used to send a signal to the servo motor 2 2 inside the side shaft 2 to rotate the machining workpiece 4 1 2 0 degrees, then perform the cutting operation according to the second B cutting trajectory line 25, and after this cutting operation is completed; turn the machining workpiece 4 by 0 degrees, and then perform the cutting operation according to the third C cutting trajectory line 26, After the cutting operation is completed, a finished product as shown in FIG. 6 can be obtained. Since the paths of the three cutting trajectories 24, 25, and 26 are not the same, the finished product processed is like the asymmetric shape shown in the sixth figure. Referring to the fifth figure, when the XY table 5 completes the operation according to the A cutting trajectory line 27, and then rotates the processed workpiece 4 by 90 degrees, then performs the cutting operation according to the second B cutting trajectory line 28, and waits for the cutting operation Finished; then turn the machining workpiece 4 by 90 degrees, and perform the cutting action according to the third C cutting trajectory line 29, and wait for this cutting action to be completed; finally, turn the machining workpiece 4 by 90 degrees, and cut according to the last D 30 lines of cutting action are performed on the trace. After the cutting action is completed, the finished product as shown in the seventh figure can be obtained. Because these four cutting trajectories are exactly the same as the cutting paths of lines 2, 7, 2, 9, 9, 30, so

Page 8 499353 V. The shape of the invention is explained later. After borrowing 25 '26', the products are designed by the side. It is completed by the action set in the lathe and the finished product of the lathe. Diamond wire saw 0 (6) as the seventh The figure shows the symmetrical shape. The above-mentioned cutting process is to process the workpiece 4 by a certain angle, and the X-Y bed 5 performs the cutting operation according to the cutting trajectory 2, 2, 7, 2, 9, 9, 30 set in the program. The indexing function of the completed shaft 2 is completed. Referring to the eighth figure, another aspect of the present invention is that the workpiece 4 is continuously rotated and then cooperates with the XY table 5 to perform cutting according to a very compliant cutting trajectory line 31. After cutting, the result shown in the ninth figure is obtained. Finished product; the action during this action is just that the cutting tool of the lathe will anneal. The cutting process is prone to vibration, so it can only cut out a certain level. However, the design of the present invention uses a strong piano wire to plate diamond particles. Therefore, there will be no annealing and cutting vibration.

499353 Schematic description

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Claims (1)

499353 VI. Application for patent scope 1. A three-dimensional diamond wire saw cutting machine, which includes ten diamond wire rings that do not move in an axial direction with the diamond line, such as the Z axis direction; a two-dimensional platform with moving axes perpendicular to each other, such as X -Y bed; • One set on two medicines fe — Vibrenda to drive rotation; π two-dimensional platform direction and axis of rotation through a servo motor (approximately dedicated bed), trajectory movement, with 2. as the index of the patent application The cutting degree command, and the written cutting trajectory degree, are re-cut to have a symmetry 3. As the patent application holds, the continuous rotation command, in the cutting operation, also cooperates with the written cutting cutting trajectory to actuate the rotation axis on the dimension platform, The preferred axis is the two-dimensional platform, which rotates in parallel with the two-dimensional bed, and independently sets a clamp to hold the workpieces by the rotation axis of the servo horse, and the workpieces rotate in the same direction; it drives the workpiece to rotate by an angle ( Indexing) or continuous rotation and two-dimensional bed control according to the computer program for predetermined cutting to achieve the processing of three-dimensional products. The three-dimensional diamond wire saw cutting machine as described in the scope 1, wherein the servo motor is issued a rotation angle by a computer program to cooperate with the two-dimensional bed side-moving side axis to perform a complete cutting operation in accordance with a pre-programmed program in the computer, and then change The indexing angle of the other processing surface, until the indexing reaches 360 degrees, can be completed or asymmetric 3D shape products. The three-dimensional diamond wire saw cutting machine described in the scope 1, wherein the cutting is performed by a computer program, and the servo motor continuously drives the processed workpiece during the turning of the servo motor. The two-dimensional bed according to the scope of patent application 2 The computer trajectory program operates, but only one piece of two-dimensional bed can be followed to quickly obtain a symmetrical three-dimensional shape. 499353 Page 12