JP4988645B2 - ワイヤー鋸用ワイヤー案内ロール - Google Patents
ワイヤー鋸用ワイヤー案内ロール Download PDFInfo
- Publication number
- JP4988645B2 JP4988645B2 JP2008114897A JP2008114897A JP4988645B2 JP 4988645 B2 JP4988645 B2 JP 4988645B2 JP 2008114897 A JP2008114897 A JP 2008114897A JP 2008114897 A JP2008114897 A JP 2008114897A JP 4988645 B2 JP4988645 B2 JP 4988645B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- guide roll
- wire guide
- coating
- saw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011248 coating agent Substances 0.000 claims description 52
- 238000000576 coating method Methods 0.000 claims description 52
- 235000012431 wafers Nutrition 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 9
- 229920002635 polyurethane Polymers 0.000 claims description 8
- 239000004814 polyurethane Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 description 11
- 238000005520 cutting process Methods 0.000 description 8
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 229910010271 silicon carbide Inorganic materials 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000725 suspension Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 3
- 239000011162 core material Substances 0.000 description 3
- 230000001627 detrimental effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000005068 cooling lubricant Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
- B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H57/00—Guides for filamentary materials; Supports therefor
- B65H57/14—Pulleys, rollers, or rotary bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/687—By tool reciprocable along elongated edge
- Y10T83/6905—With tool in-feed
- Y10T83/6945—With passive means to guide tool directly
- Y10T83/695—By plural opposed guide surfaces
- Y10T83/696—With relative adjustment between guide and work or work-support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/929—Tool or tool with support
- Y10T83/9292—Wire tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
R=0.4D − 0.9Dである。
F=A×E×dl/l
式中、Fは、ワイヤーの張力を表わし、Aは、ワイヤーの断面積を表わし、Eは、弾性率を表わし、dlは、長さの変化を表わし、lは、ワイヤーの自由長さを表わす。
Claims (6)
- 多重のウェーハを円筒形の被工作物から同時にスライスするためのワイヤー鋸に使用するワイヤー案内ロールであって、このワイヤー案内ロールが、少なくとも2mmおよび8mm未満の厚さを有するコーティングを備えており、少なくとも60および最大99のショアーA硬度を有する材料から構成されており、さらに鋸引きワイヤーが案内される多重の溝を有し、この溝が、それぞれ鋸引きワイヤー直径Dの0.25〜1.6倍である曲率半径Rおよび60〜130゜の開口角度を有する湾曲した溝ベースを有している、上記のワイヤー案内ロール。
- ワイヤー案内ロールのコーティングが、82〜99のショアーA硬度を有する材料から構成されている、請求項1記載のワイヤー案内ロール。
- 溝ベースの曲率半径Rが鋸引きワイヤーの直径Dの0.4〜0.9倍である、請求項1または2記載のワイヤー案内ロール。
- 溝の開口角度が80〜110°である、請求項1記載のワイヤー案内ロール。
- ポリウレタンがコーティング材料として使用されている、請求項1から4までのいずれか1項に記載のワイヤー案内ロール。
- 多重のウェーハを円筒形の被工作物からワイヤー鋸により同時にスライスする方法において、請求項1から5までのいずれか1項に記載のワイヤー案内ロールを使用することを特徴とする、多重のウェーハを円筒形の被工作物からワイヤー鋸により同時にスライスする方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007019566.6 | 2007-04-25 | ||
DE200710019566 DE102007019566B4 (de) | 2007-04-25 | 2007-04-25 | Drahtführungsrolle für Drahtsäge |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008272930A JP2008272930A (ja) | 2008-11-13 |
JP4988645B2 true JP4988645B2 (ja) | 2012-08-01 |
Family
ID=39777434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008114897A Active JP4988645B2 (ja) | 2007-04-25 | 2008-04-25 | ワイヤー鋸用ワイヤー案内ロール |
Country Status (7)
Country | Link |
---|---|
US (1) | US10245661B2 (ja) |
JP (1) | JP4988645B2 (ja) |
KR (1) | KR100956083B1 (ja) |
CN (1) | CN101549531B (ja) |
DE (1) | DE102007019566B4 (ja) |
SG (1) | SG147364A1 (ja) |
TW (1) | TWI352642B (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5311964B2 (ja) * | 2008-10-29 | 2013-10-09 | 京セラ株式会社 | ワイヤーソー装置 |
DE102009012679A1 (de) | 2009-03-13 | 2010-09-16 | Schott Solar Ag | Drahtsäge-Vorrichtung |
JP5750737B2 (ja) * | 2009-06-17 | 2015-07-22 | 三菱レイヨン株式会社 | ワイヤソー用メインローラー、そのローラー本体及び製造方法 |
DE102009057592B3 (de) * | 2009-12-09 | 2011-05-05 | Siltronic Ag | Drahtführungsrolle für Drahtsäge |
DE102010005718B4 (de) | 2010-01-26 | 2011-09-22 | Schott Solar Ag | Drahtführungsrolle zur Verwendung in Drahtsägen |
DE102010007459B4 (de) | 2010-02-10 | 2012-01-19 | Siltronic Ag | Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Kristall aus Halbleitermaterial |
DE102011005949B4 (de) * | 2011-03-23 | 2012-10-31 | Siltronic Ag | Verfahren zum Abtrennen von Scheiben von einem Werkstück |
DE102011082366B3 (de) * | 2011-09-08 | 2013-02-28 | Siltronic Ag | Einlagiges Wickeln von Sägedraht mit fest gebundenem Schneidkorn für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück |
DE102011083175A1 (de) | 2011-09-22 | 2013-03-28 | Voith Patent Gmbh | Drahtführungsrolle für Drahtsägen mit Datenerfassungssystem |
DE102011083261A1 (de) | 2011-09-23 | 2013-03-28 | Voith Patent Gmbh | Drahtführungsrolle für Drahtsägen mit Datenerfassungssystem |
CN102501324A (zh) * | 2011-11-03 | 2012-06-20 | 昆山翰辉电子科技有限公司 | 线形切割机的导轮的线槽结构 |
KR102056958B1 (ko) | 2012-12-04 | 2019-12-30 | 프리시전 써페이싱 솔루션즈 게엠베하 | 와이어 관리시스템 |
DE102013219900B3 (de) * | 2013-10-01 | 2015-02-26 | Siltronic Ag | Verfahren zum Rillieren der Drahtführungsrollen für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück |
DE102013225104B4 (de) | 2013-12-06 | 2019-11-28 | Siltronic Ag | Verfahren zum Abtrennen von Scheiben von einem Werkstück mittels einer Drahtsäge |
DE102015200198B4 (de) | 2014-04-04 | 2020-01-16 | Siltronic Ag | Verfahren zum Abtrennen von Halbleiterscheiben von einem Werkstück mit einem Sägedraht |
DE102014224759B3 (de) * | 2014-12-03 | 2016-01-21 | Siltronic Ag | Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Werkstück |
DE102017202314A1 (de) * | 2017-02-14 | 2018-08-16 | Siltronic Ag | Drahtsäge, Drahtführungsrolle und Verfahren zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem Stab |
DE102018210401A1 (de) | 2018-06-26 | 2020-01-02 | Siltronic Ag | Verfahren zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem Halbleiterstab |
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-
2007
- 2007-04-25 DE DE200710019566 patent/DE102007019566B4/de active Active
-
2008
- 2008-02-27 SG SG200801642-0A patent/SG147364A1/en unknown
- 2008-03-25 KR KR1020080027470A patent/KR100956083B1/ko active IP Right Grant
- 2008-04-03 CN CN2008100918107A patent/CN101549531B/zh active Active
- 2008-04-21 US US12/106,428 patent/US10245661B2/en active Active
- 2008-04-23 TW TW97114821A patent/TWI352642B/zh active
- 2008-04-25 JP JP2008114897A patent/JP4988645B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
SG147364A1 (en) | 2008-11-28 |
CN101549531A (zh) | 2009-10-07 |
KR20080095750A (ko) | 2008-10-29 |
KR100956083B1 (ko) | 2010-05-07 |
TWI352642B (en) | 2011-11-21 |
DE102007019566B4 (de) | 2012-11-29 |
CN101549531B (zh) | 2012-04-25 |
JP2008272930A (ja) | 2008-11-13 |
US10245661B2 (en) | 2019-04-02 |
DE102007019566A1 (de) | 2008-10-30 |
US20080264228A1 (en) | 2008-10-30 |
TW200841988A (en) | 2008-11-01 |
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