KR20080041558A - 발광 디스플레이 디바이스용 봉지, 방법 및 장치 - Google Patents
발광 디스플레이 디바이스용 봉지, 방법 및 장치 Download PDFInfo
- Publication number
- KR20080041558A KR20080041558A KR1020070078739A KR20070078739A KR20080041558A KR 20080041558 A KR20080041558 A KR 20080041558A KR 1020070078739 A KR1020070078739 A KR 1020070078739A KR 20070078739 A KR20070078739 A KR 20070078739A KR 20080041558 A KR20080041558 A KR 20080041558A
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- South Korea
- Prior art keywords
- substrate
- frit
- light emitting
- glass
- mole
- Prior art date
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- 239000000758 substrate Substances 0.000 claims abstract description 166
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract description 52
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- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 abstract description 21
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
- C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
- C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/16—Silica-free oxide glass compositions containing phosphorus
- C03C3/21—Silica-free oxide glass compositions containing phosphorus containing titanium, zirconium, vanadium, tungsten or molybdenum
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/08—Frit compositions, i.e. in a powdered or comminuted form containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
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Abstract
Description
화합물 | 몰% 범위 |
산화 칼륨 | 0-10 |
산화 제2철 | 0-20 |
산화 안티몬 | 0-40 |
오산화 인 | 20-40 |
오산화 바나듐 | 30-60 |
이산화 티탄 | 0-20 |
산화 알루미늄 | 0-5 |
산화 붕소 | 0-5 |
산화 텅스텐 | 0-5 |
산화 비스무스 | 0-5 |
산화 아연 | 0-20 |
화합물 | 몰% 범위 |
이산화 실리콘 | 5-75 |
산화 붕소 | 10-40 |
산화 알루미늄 | 0-20 |
산화 아연 | 0-60 |
산화 제2구리 | 0-25 |
산화 제2철 | 0-7 |
오산화 바나듐 | 0-10 |
이산화 티탄 | 0-5 |
Claims (25)
- 제1기판,제2기판,상기 제1기판 및 제2기판을 연결하는 프릿, 및상기 제1기판 및 제2기판을 더욱 연결하는 고분자 접착제를 포함하며,여기서, 상기 제1기판의 적어도 일부는 상기 제2기판의 적어도 일부와 중첩되어 정렬되며, 상기 프릿은:5 내지 75몰%의 SiO2;10 내지 40몰%의 B2O3;0 내지 20몰%의 Al2O3를 포함하는 베이스 성분; 및a) 0 초과 25몰% 이하의 CuO; 또는b) 0 초과 7몰% 이하의 Fe2O3;0 초과 10몰% 이하의 V2O5; 및0 내지 5몰%의 TiO2를 포함하는 적어도 하나의 흡수 성분을 포함하는 유리부를 포함하는 것을 특징으로 하는 유리 패키지.
- 제1항에 있어서, 상기 프릿은 프릿 루프를 형성하는 것을 특징으로 하는 유리 패키지.
- 제2항에 있어서, 상기 고분자 접착제는 상기 프릿 루프 외부에 위치된 접착제 루프를 형성하는 것을 특징으로 하는 유리 패키지.
- 제1항에 있어서, 상기 고분자 접착제는 적어도 2개의 개별적인 위치에 위치되는 것을 특징으로 하는 유리 패키지.
- 제1항에 있어서, 상기 제1기판 및/또는 상기 제2기판은 코너를 포함하며, 여기서 상기 고분자 접착제는 상기 코너들에 위치된 적어도 4개의 개별적인 위치에 위치되는 것을 특징으로 하는 유리 패키지.
- 제1항에 있어서, 발광층을 더욱 포함하며, 여기서, 상기 프릿은 상기 제1기판 및 제2기판 사이에 위치되어 프릿 루프를 형성하며, 상기 발광층은 상기 제1기판 및 제2기판 사이에서 상기 프릿 루프 내에 위치되는 것을 특징으로 하는 유리 패키지.
- 제6항에 있어서, 상기 발광층은 유기 발광 다이오드를 포함하는 것을 특징으로 하는 유리 패키지.
- 제1항에 있어서, 상기 프릿의 유리부는 0 초과 60몰% 이하의 ZnO를 더욱 포함하는 것을 특징으로 하는 유리 패키지.
- 제1항에 있어서, 상기 고분자 접착제는 에폭시를 포함하는 것을 특징으로 하는 유리 패키지.
- 제1항에 있어서, 상기 제1기판 및/또는 상기 제2기판은 보로실리케이트 유리를 포함하는 것을 특징으로 하는 유리 패키지.
- 제1항에 있어서, 상기 프릿은 열팽창계수 매칭 필러를 더욱 포함하는 것을 특징으로 하는 유리 패키지.
- 제1항에 있어서, 상기 프릿은 상기 제1기판 및 제2기판 사이의 기밀 봉지인 것을 특징으로 하는 유리 패키지.
- 제1기판,제2기판,상기 제1기판 및 제2기판을 연결하는 프릿, 및상기 제1기판 및 제2기판을 더욱 연결하는 고분자 접착제를 포함하며,여기서 상기 제1기판의 적어도 일부는 상기 제2기판의 적어도 일부와 중첩되어 정렬되며, 상기 프릿은 적어도 하나의 전이금속으로 도핑된 유리로부터 제조되며, 상기 프릿은 열팽창계수 매칭 필러를 포함하지 않는 것을 특징으로 하는 유리 패키지.
- 제13항에 있어서, 상기 프릿은 프릿 루프를 형성하는 것을 특징으로 하는 유리 패키지.
- 제14항에 있어서, 상기 고분자 접착제는 상기 프릿 루프의 외부에 위치된 접착제 루프를 형성하는 것을 특징으로 하는 유리 패키지.
- 제13항에 있어서, 상기 고분자 접착제는 적어도 2개의 개별적인 위치에 위치된 것을 특징으로 하는 유리 패키지.
- 제13항에 있어서, 상기 제1기판 및/또는 제2기판은 코너를 포함하며, 여기서 상기 고분자 접착제는 상기 코너에 위치되는 것을 특징으로 하는 유리 패키지.
- 제13항에 있어서, 발광층을 더욱 포함하며, 여기서 상기 프릿은 상기 제1기판 및 제2기판의 사이에 위치되어 프릿 루프를 형성하며, 상기 발광층은 상기 제1기판 및 제2기판 사이에서 프릿 루프 내에 위치되는 것을 특징으로 하는 유리 패키지.
- 제18항에 있어서, 상기 발광층은 유기 발광 다이오드를 포함하는 것을 특징으로 하는 유리 패키지.
- 제13항에 있어서, 상기 고분자 접착제는 에폭시를 포함하는 것을 특징으로 하는 유리 패키지.
- 제13항에 있어서, 상기 제1기판 및/또는 상기 제2기판은 보로실리케이트 유리를 포함하는 것을 특징으로 하는 유리 패키지.
- 제13항에 있어서, 상기 프릿은 상기 제1기판 및 상기 제2기판 사이의 기밀 봉지인 것을 특징으로 하는 유리 패키지.
- 발광층, 제1기판 및 제2기판을 준비하는 단계, 여기서 각각의 기판은 내표면과 외표면을 가짐;상기 제1기판의 내표면 주변(perimeter)의 둘레에 프릿을 증착시키는 단계;상기 제1기판 또는 제2기판 중 적어도 하나의 내표면 상에 고분자 접착제를 증착시키는 단계;상기 발광층이 상기 제1기판 및 상기 제2기판 사이에 위치되고, 상기 제1기판의 적어도 일부가 상기 제2기판의 적어도 일부에 중첩되어 정렬되도록 상기 제1기판 및 제2기판의 내표면들을 결합하는 단계;기밀 봉지가 형성될 때까지 상기 프릿을 가열하는 단계; 및상기 고분자 접착제를 경화시키는 단계;를 포함하며,여기서 상기 가열 단계 및 경화 단계는 순서 없이 수행될 수 있는 것을 특징으로 하는 발광 디스플레이 디바이스의 밀봉방법.
- 제23항에 있어서, 상기 가열 단계는 레이저를 포함하는 것을 특징으로 하는 방법.
- 발광층, 제1기판 및 제2기판을 준비하는 단계, 여기서 각각의 기판은 내표면과 외표면을 가짐;상기 제1기판의 내표면 주변의 둘레에 프릿을 증착시키는 단계;상기 제1기판의 적어도 일부가 상기 제2기판의 적어도 일부에 중첩되어 정렬되고 상기 발광층이 상기 제1기판 및 상기 제2기판 사이에 위치되도록 상기 제1기판 및 제2기판의 내표면들을 결합함으로써 결합된 제1기판 및 제2기판을 생성하는 단계;상기 결합된 제1기판 또는 제2기판의 주변의 둘레에 고분자 접착제를 증착시키는 단계;기밀 봉지가 형성될 때까지 상기 프릿을 가열하는 단계; 및상기 고분자 접착제를 경화시키는 단계;를 포함하며,여기서 상기 가열 단계 및 경화 단계는 순서 없이 수행될 수 있는 것을 특징으로 하는 발광 디스플레이 디바이스의 밀봉방법.
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US11/593,819 US7800303B2 (en) | 2006-11-07 | 2006-11-07 | Seal for light emitting display device, method, and apparatus |
US11/593,819 | 2006-11-07 |
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EP (2) | EP2495221B1 (ko) |
JP (1) | JP4615000B2 (ko) |
KR (1) | KR100916693B1 (ko) |
CN (1) | CN100595944C (ko) |
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- 2007-08-06 KR KR1020070078739A patent/KR100916693B1/ko active IP Right Grant
- 2007-10-23 JP JP2007274775A patent/JP4615000B2/ja not_active Expired - Fee Related
- 2007-11-06 AT AT07120107T patent/ATE553070T1/de active
- 2007-11-06 EP EP12153828.4A patent/EP2495221B1/en not_active Not-in-force
- 2007-11-06 EP EP07120107A patent/EP1925601B1/en not_active Not-in-force
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US9130191B2 (en) | 2011-06-17 | 2015-09-08 | Samsung Display Co., Ltd. | Display panel, method of manufacturing the same, and FRIT composition used in the display panel |
US10361392B2 (en) | 2011-11-29 | 2019-07-23 | Semiconductor Energy Laboratory Co., Ltd. | Sealed structure, light-emitting device, electronic device, and lighting device |
US11101444B2 (en) | 2011-11-29 | 2021-08-24 | Semiconductor Energy Laboratory Co., Ltd. | Sealed structure, light-emitting device, electronic device, and lighting device |
US9276232B2 (en) | 2013-05-14 | 2016-03-01 | Samsung Display Co., Ltd. | Display apparatus and method of manufacturing the same |
US9634073B2 (en) | 2013-05-16 | 2017-04-25 | Samsung Display Co., Ltd. | Organic light-emitting display device and method of manufacturing the same |
US9954197B2 (en) | 2013-12-16 | 2018-04-24 | Samsung Display Co., Ltd. | Organic light-emitting diode (OLED) display and method of fabricating the same |
US11056670B2 (en) | 2013-12-16 | 2021-07-06 | Samsung Display Co., Ltd. | Organic light-emitting diode (OLED) display and method of fabricating the same |
US11569474B2 (en) | 2013-12-16 | 2023-01-31 | Samsung Display Co., Ltd. | Organic light-emitting diode (OLED) display and method of fabricating the same |
Also Published As
Publication number | Publication date |
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JP2008117767A (ja) | 2008-05-22 |
CN101179113A (zh) | 2008-05-14 |
US7800303B2 (en) | 2010-09-21 |
TWI366416B (en) | 2012-06-11 |
ATE553070T1 (de) | 2012-04-15 |
CN100595944C (zh) | 2010-03-24 |
EP2495221B1 (en) | 2013-07-10 |
US20080106194A1 (en) | 2008-05-08 |
EP1925601B1 (en) | 2012-04-11 |
JP4615000B2 (ja) | 2011-01-19 |
EP1925601A1 (en) | 2008-05-28 |
KR100916693B1 (ko) | 2009-09-11 |
US8134293B2 (en) | 2012-03-13 |
US20110001424A1 (en) | 2011-01-06 |
EP2495221A1 (en) | 2012-09-05 |
TW200822789A (en) | 2008-05-16 |
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