TWI366416B - Hermetically sealed light emitting display device and method of sealing - Google Patents

Hermetically sealed light emitting display device and method of sealing

Info

Publication number
TWI366416B
TWI366416B TW096126736A TW96126736A TWI366416B TW I366416 B TWI366416 B TW I366416B TW 096126736 A TW096126736 A TW 096126736A TW 96126736 A TW96126736 A TW 96126736A TW I366416 B TWI366416 B TW I366416B
Authority
TW
Taiwan
Prior art keywords
light emitting
sealing
display device
emitting display
substrate
Prior art date
Application number
TW096126736A
Other languages
English (en)
Other versions
TW200822789A (en
Inventor
Lvovich Logunov Stephan
Pattabhirami Reddy Kamjula
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of TW200822789A publication Critical patent/TW200822789A/zh
Application granted granted Critical
Publication of TWI366416B publication Critical patent/TWI366416B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/16—Silica-free oxide glass compositions containing phosphorus
    • C03C3/21—Silica-free oxide glass compositions containing phosphorus containing titanium, zirconium, vanadium, tungsten or molybdenum
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/08—Frit compositions, i.e. in a powdered or comminuted form containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Glass Compositions (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
TW096126736A 2006-11-07 2007-07-20 Hermetically sealed light emitting display device and method of sealing TWI366416B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/593,819 US7800303B2 (en) 2006-11-07 2006-11-07 Seal for light emitting display device, method, and apparatus

Publications (2)

Publication Number Publication Date
TW200822789A TW200822789A (en) 2008-05-16
TWI366416B true TWI366416B (en) 2012-06-11

Family

ID=38961194

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096126736A TWI366416B (en) 2006-11-07 2007-07-20 Hermetically sealed light emitting display device and method of sealing

Country Status (7)

Country Link
US (2) US7800303B2 (zh)
EP (2) EP1925601B1 (zh)
JP (1) JP4615000B2 (zh)
KR (1) KR100916693B1 (zh)
CN (1) CN100595944C (zh)
AT (1) ATE553070T1 (zh)
TW (1) TWI366416B (zh)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100703458B1 (ko) * 2006-04-20 2007-04-03 삼성에스디아이 주식회사 유기전계발광 표시 장치 및 그의 제작 방법
KR100918402B1 (ko) * 2008-02-01 2009-09-24 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치 및 그 제조 방법
JP5440997B2 (ja) * 2008-08-21 2014-03-12 日本電気硝子株式会社 有機ｅｌディスプレイ用封着材料
US8067883B2 (en) * 2008-02-29 2011-11-29 Corning Incorporated Frit sealing of large device
JP2009259572A (ja) 2008-04-16 2009-11-05 Seiko Epson Corp 有機エレクトロルミネッセンス装置及び有機エレクトロルミネッセンス装置の製造方法
JP5308717B2 (ja) 2008-05-26 2013-10-09 浜松ホトニクス株式会社 ガラス溶着方法
JP5308718B2 (ja) * 2008-05-26 2013-10-09 浜松ホトニクス株式会社 ガラス溶着方法
US7992411B2 (en) * 2008-05-30 2011-08-09 Corning Incorporated Method for sintering a frit to a glass plate
KR101665727B1 (ko) * 2008-06-11 2016-10-12 하마마츠 포토닉스 가부시키가이샤 유리 용착 방법
US8839643B2 (en) 2008-06-11 2014-09-23 Hamamatsu Photonics K.K. Fusion bonding process for glass
WO2009157282A1 (ja) * 2008-06-23 2009-12-30 浜松ホトニクス株式会社 ガラス溶着方法
KR101574125B1 (ko) * 2008-07-16 2015-12-04 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
US20100095705A1 (en) * 2008-10-20 2010-04-22 Burkhalter Robert S Method for forming a dry glass-based frit
US8245536B2 (en) * 2008-11-24 2012-08-21 Corning Incorporated Laser assisted frit sealing of high CTE glasses and the resulting sealed glass package
JP5261151B2 (ja) * 2008-11-27 2013-08-14 京セラ株式会社 パッケージの製造方法
JP5699932B2 (ja) * 2009-03-27 2015-04-15 日立化成株式会社 ガラス組成物およびそれを用いた被覆部材と封着部材
KR101117715B1 (ko) * 2009-04-30 2012-02-24 삼성모바일디스플레이주식회사 레이저 조사 장치 및 상기 레이저 조사 장치를 이용한 평판 디스플레이 장치의 제조 방법
DE102009036395A1 (de) * 2009-04-30 2010-11-04 Osram Opto Semiconductors Gmbh Bauteil mit einem ersten und einem zweiten Substrat und Verfahren zu dessen Herstellung
US8440479B2 (en) * 2009-05-28 2013-05-14 Corning Incorporated Method for forming an organic light emitting diode device
US8710492B2 (en) 2009-06-11 2014-04-29 Sharp Kabushiki Kaisha Organic EL display device and method for manufacturing the same
WO2011004567A1 (ja) * 2009-07-07 2011-01-13 パナソニック株式会社 有機エレクトロルミネッセンス表示装置及びその製造方法
US8505337B2 (en) * 2009-07-17 2013-08-13 Corning Incorporated Methods for forming fritted cover sheets and glass packages comprising the same
KR101084272B1 (ko) 2009-10-05 2011-11-16 삼성모바일디스플레이주식회사 레이저 조사 시스템
JP5481167B2 (ja) 2009-11-12 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法
KR101206608B1 (ko) * 2009-11-17 2012-11-29 (주)엘지하우시스 유리기판의 레이저 실링장치
JP5535590B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5481173B2 (ja) 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5481172B2 (ja) 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5466929B2 (ja) 2009-11-25 2014-04-09 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535589B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5567319B2 (ja) 2009-11-25 2014-08-06 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5525246B2 (ja) * 2009-11-25 2014-06-18 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535588B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP2011171436A (ja) * 2010-02-17 2011-09-01 Tdk Corp 電子部品内蔵モジュール及び電子部品内蔵モジュールの製造方法
TWI497466B (zh) * 2010-03-19 2015-08-21 Asahi Glass Co Ltd Electronic device and manufacturing method thereof
CN102211857A (zh) * 2010-04-02 2011-10-12 海洋王照明科技股份有限公司 用于制造发光玻璃的组件及其装置
US8563113B2 (en) * 2010-04-20 2013-10-22 Corning Incorporated Multi-laminate hermetic barriers and related structures and methods of hermetic sealing
TWI426815B (zh) * 2010-04-27 2014-02-11 Au Optronics Corp 電致發光顯示裝置及其製備方法
US8963422B2 (en) * 2010-07-21 2015-02-24 Sumitomo Chemical Company, Limited Method for manufacturing organic light-emitting device and organic light-emitting device
KR101401177B1 (ko) 2010-07-23 2014-05-29 파나소닉 주식회사 표시 패널 및 그 제조 방법
JP5627370B2 (ja) * 2010-09-27 2014-11-19 キヤノン株式会社 減圧気密容器及び画像表示装置の製造方法
KR20120044020A (ko) * 2010-10-27 2012-05-07 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조 방법
JP5492049B2 (ja) * 2010-10-29 2014-05-14 浜松ホトニクス株式会社 ガラス溶着方法
KR20120139392A (ko) 2011-06-17 2012-12-27 삼성디스플레이 주식회사 디스플레이 패널, 그 제조방법 및 이에 사용되는 프릿 조성물
WO2013031509A1 (en) * 2011-08-26 2013-03-07 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, electronic device, lighting device, and method for manufacturing the light-emitting device
KR20130060131A (ko) * 2011-11-29 2013-06-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 밀봉체, 발광 장치, 전자 기기, 및 조명 장치
JP6007427B2 (ja) * 2012-05-18 2016-10-12 株式会社Ｊｏｌｅｄ 表示パネルの製造方法
JP5733279B2 (ja) * 2012-07-30 2015-06-10 日立化成株式会社 電子部品及びその製法、並びにそれに用いる封止材料ペースト
CN103779503B (zh) * 2012-10-17 2017-04-12 群创光电股份有限公司 有机发光二极管显示器及其制造方法
US20140127857A1 (en) * 2012-11-07 2014-05-08 Taiwan Semiconductor Manufacturing Company, Ltd. Carrier Wafers, Methods of Manufacture Thereof, and Packaging Methods
US9666763B2 (en) 2012-11-30 2017-05-30 Corning Incorporated Glass sealing with transparent materials having transient absorption properties
KR101866624B1 (ko) 2013-05-10 2018-06-11 코닝 인코포레이티드 저융점 유리 또는 흡수성 박막을 이용한 레이저 용접 투명 유리 시트
KR20140134565A (ko) 2013-05-14 2014-11-24 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
KR102078356B1 (ko) 2013-05-16 2020-04-08 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
EP3008022B1 (en) 2013-06-14 2020-12-30 Corning Incorporated Laminated sealing sheet
US9573840B2 (en) * 2013-08-27 2017-02-21 Corning Incorporated Antimony-free glass, antimony-free frit and a glass package that is hermetically sealed with the frit
KR102035252B1 (ko) * 2013-09-03 2019-11-11 삼성디스플레이 주식회사 밀봉재를 포함하는 표시 장치 및 그 제조 방법
KR102107008B1 (ko) 2013-12-16 2020-05-29 삼성디스플레이 주식회사 유기 발광 표시장치 및 그의 제조방법
KR20150108463A (ko) * 2014-03-17 2015-09-30 삼성디스플레이 주식회사 유기발광 표시장치 및 그의 제조방법
KR102512044B1 (ko) 2014-10-31 2023-03-20 코닝 인코포레이티드 레이저 용접 유리 패키지 및 그 제조 방법
CN104576707B (zh) * 2015-01-28 2018-04-06 京东方科技集团股份有限公司 Oled面板及其制备方法和显示装置
WO2016129255A1 (ja) * 2015-02-13 2016-08-18 日本板硝子株式会社 レーザ加工用ガラス及びそれを用いた孔付きガラスの製造方法
CN106299148B (zh) * 2015-06-10 2018-04-03 上海和辉光电有限公司 显示面板的封装结构及封装方法
CN105810849B (zh) * 2016-03-17 2018-03-30 深圳市华星光电技术有限公司 基板的封装方法
CN107324648B (zh) * 2016-04-28 2021-12-17 科立视材料科技有限公司 无碱低软化点玻璃及组成物，以及其方法
DE102016110868A1 (de) * 2016-06-14 2017-12-14 Leander Kilian Gross Verfahren und Vorrichtung zur Verkapselung von Bauteilen
CN106206474B (zh) * 2016-08-31 2019-12-13 昆山国显光电有限公司 一种提高Frit封装机械强度的封装结构及其封装方法
KR20220091153A (ko) * 2020-12-23 2022-06-30 엘지디스플레이 주식회사 유기 발광 표시 장치

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56168632A (en) * 1980-05-29 1981-12-24 Alps Electric Co Ltd Cell of liquid crystal display device
JPH10214580A (ja) * 1997-01-30 1998-08-11 Toppan Printing Co Ltd 電界放射型ディスプレイ及びその製造方法
JPH11249107A (ja) * 1998-02-27 1999-09-17 Sharp Corp プラズマアドレス表示装置の製造方法
JP2000048952A (ja) * 1998-07-30 2000-02-18 Tdk Corp 有機ｅｌ素子モジュール
US6391809B1 (en) 1999-12-30 2002-05-21 Corning Incorporated Copper alumino-silicate glasses
JP2002280169A (ja) * 2001-03-19 2002-09-27 Futaba Corp 有機ｅｌ装置
JP2004303733A (ja) * 2003-03-31 2004-10-28 Osram Opto Semiconductors Gmbh 構成素子、とりわけ有機発光ダイオードを備える表示装置
JP4346012B2 (ja) * 2003-04-11 2009-10-14 大日本印刷株式会社 有機エレクトロルミネッセンス素子
US7344901B2 (en) 2003-04-16 2008-03-18 Corning Incorporated Hermetically sealed package and method of fabricating of a hermetically sealed package
US20050116245A1 (en) * 2003-04-16 2005-06-02 Aitken Bruce G. Hermetically sealed glass package and method of fabrication
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
WO2005046291A1 (ja) 2003-11-07 2005-05-19 Idemitsu Kosan Co., Ltd. 発光表示装置用バリア膜及びその製造方法
WO2005050751A2 (en) 2003-11-12 2005-06-02 E.I. Dupont De Nemours And Company Encapsulation assembly for electronic devices
US20050248270A1 (en) * 2004-05-05 2005-11-10 Eastman Kodak Company Encapsulating OLED devices
KR100603345B1 (ko) * 2004-05-25 2006-07-20 삼성에스디아이 주식회사 평판 표시장치의 제조방법, 평판 표시장치, 및 평판표시장치의 패널
US7393257B2 (en) * 2004-11-12 2008-07-01 Eastman Kodak Company Sealing of organic thin-film light-emitting devices
KR100685845B1 (ko) * 2005-10-21 2007-02-22 삼성에스디아이 주식회사 유기전계 발광표시장치 및 그 제조방법
US20070096631A1 (en) * 2005-11-01 2007-05-03 Un-Cheol Sung Flat panel display and fabricating method thereof
US7431628B2 (en) * 2005-11-18 2008-10-07 Samsung Sdi Co., Ltd. Method of manufacturing flat panel display device, flat panel display device, and panel of flat panel display device
CN101454860B (zh) 2005-12-06 2012-05-23 康宁股份有限公司 用玻璃料气密密封的玻璃封装物及其制造方法
US8038495B2 (en) * 2006-01-20 2011-10-18 Samsung Mobile Display Co., Ltd. Organic light-emitting display device and manufacturing method of the same
KR100673765B1 (ko) * 2006-01-20 2007-01-24 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100635514B1 (ko) * 2006-01-23 2006-10-18 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
US20070170846A1 (en) * 2006-01-23 2007-07-26 Choi Dong-Soo Organic light emitting display and method of fabricating the same
JP4624309B2 (ja) * 2006-01-24 2011-02-02 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
JP4456092B2 (ja) * 2006-01-24 2010-04-28 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100671641B1 (ko) * 2006-01-25 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100685854B1 (ko) * 2006-01-25 2007-02-22 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
US8164257B2 (en) * 2006-01-25 2012-04-24 Samsung Mobile Display Co., Ltd. Organic light emitting display and method of fabricating the same
US7999372B2 (en) * 2006-01-25 2011-08-16 Samsung Mobile Display Co., Ltd. Organic light emitting display device and method of fabricating the same
KR100688795B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100685853B1 (ko) * 2006-01-25 2007-02-22 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
KR100671647B1 (ko) * 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기전계발광 표시 장치
KR100732808B1 (ko) * 2006-01-26 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치의 제조방법
KR100671638B1 (ko) * 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치
KR100703472B1 (ko) * 2006-01-26 2007-04-03 삼성에스디아이 주식회사 프릿 경화 장치 및 이를 이용한 경화 방법
JP4633674B2 (ja) * 2006-01-26 2011-02-16 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100711882B1 (ko) 2006-01-27 2007-04-25 삼성에스디아이 주식회사 유기 전계 발광표시장치 및 그의 제조방법

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US7800303B2 (en) 2010-09-21
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KR100916693B1 (ko) 2009-09-11
ATE553070T1 (de) 2012-04-15
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TW200822789A (en) 2008-05-16
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US20080106194A1 (en) 2008-05-08
EP2495221B1 (en) 2013-07-10
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JP2008117767A (ja) 2008-05-22
KR20080041558A (ko) 2008-05-13

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