KR20080020555A - 기판 탑재 기구, 기판 주고받음 방법, 기판 처리 장치 및컴퓨터 판독 가능한 기억 매체 - Google Patents

기판 탑재 기구, 기판 주고받음 방법, 기판 처리 장치 및컴퓨터 판독 가능한 기억 매체 Download PDF

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Publication number
KR20080020555A
KR20080020555A KR1020070087506A KR20070087506A KR20080020555A KR 20080020555 A KR20080020555 A KR 20080020555A KR 1020070087506 A KR1020070087506 A KR 1020070087506A KR 20070087506 A KR20070087506 A KR 20070087506A KR 20080020555 A KR20080020555 A KR 20080020555A
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KR
South Korea
Prior art keywords
substrate
processed
lifting
board
lifting pins
Prior art date
Application number
KR1020070087506A
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English (en)
Korean (ko)
Inventor
아키히코 시무라
나오야 사에구사
Original Assignee
동경 엘렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동경 엘렉트론 주식회사 filed Critical 동경 엘렉트론 주식회사
Publication of KR20080020555A publication Critical patent/KR20080020555A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020070087506A 2006-08-31 2007-08-30 기판 탑재 기구, 기판 주고받음 방법, 기판 처리 장치 및컴퓨터 판독 가능한 기억 매체 KR20080020555A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00234723 2006-08-31
JP2006234723A JP4795899B2 (ja) 2006-08-31 2006-08-31 基板載置機構および基板受け渡し方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020090045538A Division KR100993441B1 (ko) 2006-08-31 2009-05-25 기판 탑재 기구, 기판 주고받음 방법, 기판 처리 장치 및 컴퓨터 판독 가능한 기억 매체

Publications (1)

Publication Number Publication Date
KR20080020555A true KR20080020555A (ko) 2008-03-05

Family

ID=39160341

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020070087506A KR20080020555A (ko) 2006-08-31 2007-08-30 기판 탑재 기구, 기판 주고받음 방법, 기판 처리 장치 및컴퓨터 판독 가능한 기억 매체
KR1020090045538A KR100993441B1 (ko) 2006-08-31 2009-05-25 기판 탑재 기구, 기판 주고받음 방법, 기판 처리 장치 및 컴퓨터 판독 가능한 기억 매체

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020090045538A KR100993441B1 (ko) 2006-08-31 2009-05-25 기판 탑재 기구, 기판 주고받음 방법, 기판 처리 장치 및 컴퓨터 판독 가능한 기억 매체

Country Status (4)

Country Link
JP (1) JP4795899B2 (zh)
KR (2) KR20080020555A (zh)
CN (1) CN100536104C (zh)
TW (1) TWI409907B (zh)

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KR101612502B1 (ko) * 2008-12-18 2016-04-14 주성엔지니어링(주) 반도체 소자의 제조방법 및 제조장치
JP5647148B2 (ja) * 2009-01-11 2014-12-24 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板を輸送する静電エンドエフェクタ装置、システム、および方法
US8840754B2 (en) * 2010-09-17 2014-09-23 Lam Research Corporation Polar regions for electrostatic de-chucking with lift pins
JP5907681B2 (ja) * 2011-08-02 2016-04-26 東京エレクトロン株式会社 基板受け渡し方法
TWM431163U (en) * 2012-01-31 2012-06-11 Shengjia Prec Co Ltd Glass substrate transportation device
JP5854921B2 (ja) * 2012-05-10 2016-02-09 三菱電機株式会社 太陽電池製造装置および太陽電池の製造方法
KR102324405B1 (ko) * 2013-12-31 2021-11-11 세메스 주식회사 기판처리장치 및 방법
JP6369054B2 (ja) * 2014-03-03 2018-08-08 東京エレクトロン株式会社 基板載置装置及び基板処理装置
CN104991427B (zh) * 2015-08-12 2017-12-08 京东方科技集团股份有限公司 一种曝光装置及曝光方法
CN106486411B (zh) * 2015-09-01 2019-06-11 东京毅力科创株式会社 基板处理装置、升降销的位置检测、调节和异常检测方法
JP6577385B2 (ja) * 2016-02-12 2019-09-18 株式会社荏原製作所 基板保持モジュール、基板処理装置、および基板処理方法
JP7030416B2 (ja) * 2017-03-16 2022-03-07 キヤノン株式会社 基板保持装置、リソグラフィ装置、物品の製造方法
JP6461235B2 (ja) * 2017-05-22 2019-01-30 キヤノントッキ株式会社 基板載置装置、成膜装置、基板載置方法、成膜方法、および電子デバイスの製造方法
JP6869111B2 (ja) * 2017-06-06 2021-05-12 東京エレクトロン株式会社 基板受け渡し方法及び基板処理装置
CN110832633B (zh) * 2017-06-30 2023-06-02 东芝三菱电机产业系统株式会社 基板定位装置及基板定位方法
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CN107870461A (zh) * 2017-12-18 2018-04-03 武汉华星光电技术有限公司 基板加工平台及其支撑装置
CN108257908A (zh) * 2017-12-29 2018-07-06 深圳市华星光电半导体显示技术有限公司 升降方法、升降装置及计算机可读存储介质
SG11202009058SA (en) * 2018-07-30 2020-10-29 Ulvac Techno Ltd Substrate lifting apparatus and substrate transferring method
WO2020049959A1 (ja) * 2018-09-05 2020-03-12 東京エレクトロン株式会社 基板処理方法及び基板処理装置
CN109309041B (zh) * 2018-09-14 2020-12-11 惠科股份有限公司 基板处理装置及基板处理装置的调整方法
CN109343248A (zh) * 2018-12-06 2019-02-15 深圳市华星光电半导体显示技术有限公司 真空贴合装置及其脱离显示面板的方法
JP7198694B2 (ja) 2019-03-18 2023-01-04 東京エレクトロン株式会社 基板リフト機構、基板支持器、及び基板処理装置
JP2021012944A (ja) * 2019-07-05 2021-02-04 東京エレクトロン株式会社 基板処理装置及び基板の受け渡し方法
CN110571184A (zh) * 2019-09-26 2019-12-13 芜湖通潮精密机械股份有限公司 干刻机台支撑装置
CN112701027A (zh) * 2019-10-22 2021-04-23 夏泰鑫半导体(青岛)有限公司 等离子体处理装置及边缘环的更换方法
JP7438018B2 (ja) * 2020-05-11 2024-02-26 東京エレクトロン株式会社 基板載置方法及び基板載置機構
KR102582696B1 (ko) * 2020-06-15 2023-09-26 세메스 주식회사 기판 처리 장치, 리프트 핀 높이 편차 측정 방법 및 컴퓨터 판독 가능한 처리 프로그램을 기록한 기록 매체
CN116033979A (zh) * 2020-08-28 2023-04-28 日本制铁株式会社 压制成形品的制造方法及其使用的托盘和热压生产线
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Also Published As

Publication number Publication date
KR100993441B1 (ko) 2010-11-09
CN101136353A (zh) 2008-03-05
KR20090084778A (ko) 2009-08-05
TWI409907B (zh) 2013-09-21
JP4795899B2 (ja) 2011-10-19
CN100536104C (zh) 2009-09-02
TW200818385A (en) 2008-04-16
JP2008060285A (ja) 2008-03-13

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