JPH02122741U - - Google Patents

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Publication number
JPH02122741U
JPH02122741U JP3078189U JP3078189U JPH02122741U JP H02122741 U JPH02122741 U JP H02122741U JP 3078189 U JP3078189 U JP 3078189U JP 3078189 U JP3078189 U JP 3078189U JP H02122741 U JPH02122741 U JP H02122741U
Authority
JP
Japan
Prior art keywords
force
conductor
applying
detachment
electrostatic chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3078189U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3078189U priority Critical patent/JPH02122741U/ja
Publication of JPH02122741U publication Critical patent/JPH02122741U/ja
Pending legal-status Critical Current

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  • Jigs For Machine Tools (AREA)
JP3078189U 1989-03-16 1989-03-16 Pending JPH02122741U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3078189U JPH02122741U (zh) 1989-03-16 1989-03-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3078189U JPH02122741U (zh) 1989-03-16 1989-03-16

Publications (1)

Publication Number Publication Date
JPH02122741U true JPH02122741U (zh) 1990-10-09

Family

ID=31256149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3078189U Pending JPH02122741U (zh) 1989-03-16 1989-03-16

Country Status (1)

Country Link
JP (1) JPH02122741U (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007073833A (ja) * 2005-09-08 2007-03-22 Dainippon Screen Mfg Co Ltd 減圧乾燥装置及び基板乾燥方法
JP2008060285A (ja) * 2006-08-31 2008-03-13 Tokyo Electron Ltd 基板載置機構および基板受け渡し方法
WO2009144938A1 (ja) * 2008-05-30 2009-12-03 パナソニック株式会社 プラズマ処理装置および方法
JP2010226039A (ja) * 2009-03-25 2010-10-07 Oki Semiconductor Co Ltd ウエハ保持装置、半導体製造装置およびウエハ吸着方法
JP2016157883A (ja) * 2015-02-26 2016-09-01 株式会社東京精密 プローバ及びウェーハ剥離方法
JP2019004168A (ja) * 2018-08-22 2019-01-10 株式会社東京精密 プローバ及びウェーハ剥離方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007073833A (ja) * 2005-09-08 2007-03-22 Dainippon Screen Mfg Co Ltd 減圧乾燥装置及び基板乾燥方法
JP2008060285A (ja) * 2006-08-31 2008-03-13 Tokyo Electron Ltd 基板載置機構および基板受け渡し方法
WO2009144938A1 (ja) * 2008-05-30 2009-12-03 パナソニック株式会社 プラズマ処理装置および方法
JP2010226039A (ja) * 2009-03-25 2010-10-07 Oki Semiconductor Co Ltd ウエハ保持装置、半導体製造装置およびウエハ吸着方法
JP2016157883A (ja) * 2015-02-26 2016-09-01 株式会社東京精密 プローバ及びウェーハ剥離方法
JP2019004168A (ja) * 2018-08-22 2019-01-10 株式会社東京精密 プローバ及びウェーハ剥離方法

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