KR20070082049A - 전자 부품, 유전체 자기 조성물 및 그 제조 방법 - Google Patents
전자 부품, 유전체 자기 조성물 및 그 제조 방법 Download PDFInfo
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Abstract
Description
Claims (4)
- 티탄산 바륨을 포함하는 주성분과,MgO를 포함하는 제1 부성분과,SiO2계의 소결 조제를 포함하는 제2 부성분과,V2O5, MoO3 및 WO3에서 선택되는 적어도 1개를 포함하는 제3 부성분과,R1의 산화물(단, R1은 Y, Ho, Er, Tm, Yb 및 Lu에서 선택되는 적어도 1개)을 포함하는 제4 부성분과,R2의 산화물(단, R2는 Dy, Tb, Gd 및 Eu에서 선택되는 적어도 1개)을 포함하는 제5 부성분과,MnO 및 Cr2O3의 적어도 1개를 포함하는 제6 부성분을 갖는 유전체 자기 조성물로서,상기 주성분 100몰에 대한 각 부성분의 비율이,제1 부성분 : 0.8∼2몰,제2 부성분 : 1.5∼5몰,제3 부성분 : 0.01∼0.1몰,제4 부성분 : 0.5∼2몰(단, 제4 부성분의 몰수는, R1 단독에서의 비율),제5 부성분 : 1.5∼4.5몰(단, 제5 부성분의 몰수는, R2 단독에서의 비율),제6 부성분 : 0.1∼0.2몰이고,상기 주성분 100몰에 대한 제4 부성분 및 제5 부성분의 합계 몰수가, 상기 R1 환산 및 상기 R2 환산으로, 2∼6몰이고, 또한,주성분 100몰에 대한 제4 부성분 및 제5 부성분의 합계 몰수에 대한 제5 부성분의 비율이, 상기 R1 환산 및 상기 R2 환산으로, 0.5≤R2/(R1+R2)≤0.75의 관계인 것을 특징으로 하는 유전체 자기 조성물.
- 청구항 1에 기재의 유전체 자기 조성물로 구성되어 있는 유전체층을 갖는 전자 부품으로서, 상기 유전체층의 1층당 두께가 4㎛ 이상 7㎛ 이하인, 전자 부품.
- 청구항 2에 있어서, 직류 전압의 인가에 의한 유전체층의 1층당 걸리는 전계 강도가 14V/㎛ 이상이 되는 조건으로 사용되는, 전자 부품.
- 청구항 1에 기재의 유전체 자기 조성물을 제조하는 방법으로서,상기 주성분의 원료와, 상기 제1∼제6 부성분의 원료를 혼합하여, 유전체 자기 조성물 분말을 얻는 공정과,상기 유전체 자기 조성물 분말을 소성하여, 유전체 자기 조성물을 얻는 공정을 가지고,상기 주성분의 원료로서 평균 입경이 0.1∼0.3㎛인 원료를 사용하고,소성후의 상기 유전체 자기 조성물에 포함되는 유전체 입자의 평균 결정 입경이, 상기 주성분 원료의 평균 입경의 1.5배 이상 2.0배 이하가 되도록 소성하는 것을 특징으로 하는 유전체 자기 조성물의 제조 방법.
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Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2006-00037137 | 2006-02-14 | ||
JP2006037137A JP4821357B2 (ja) | 2006-02-14 | 2006-02-14 | 電子部品、誘電体磁器組成物およびその製造方法 |
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KR20070082049A true KR20070082049A (ko) | 2007-08-20 |
KR100889900B1 KR100889900B1 (ko) | 2009-03-20 |
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---|---|
US (1) | US20070191211A1 (ko) |
EP (1) | EP1820784A1 (ko) |
JP (1) | JP4821357B2 (ko) |
KR (1) | KR100889900B1 (ko) |
CN (1) | CN100497251C (ko) |
TW (1) | TW200735141A (ko) |
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US20090246508A1 (en) * | 2008-03-31 | 2009-10-01 | Tdk Corporation | Dielectric ceramic composition and an electronic component |
KR101106881B1 (ko) * | 2008-03-31 | 2012-01-25 | 티디케이가부시기가이샤 | 유전체 자기 조성물 및 전자 부품 |
KR101280507B1 (ko) * | 2010-03-11 | 2013-07-01 | 티디케이가부시기가이샤 | 유전체 자기 조성물 및 세라믹 전자 부품 |
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JP4839913B2 (ja) * | 2006-03-23 | 2011-12-21 | Tdk株式会社 | 電子部品、誘電体磁器組成物およびその製造方法 |
JP2007331956A (ja) * | 2006-06-12 | 2007-12-27 | Tdk Corp | 電子部品、誘電体磁器組成物およびその製造方法 |
JP2007331958A (ja) * | 2006-06-12 | 2007-12-27 | Tdk Corp | 電子部品、誘電体磁器組成物およびその製造方法 |
JP4992955B2 (ja) * | 2009-11-20 | 2012-08-08 | 株式会社村田製作所 | 誘電体セラミックおよび積層セラミックコンデンサ |
JP5360079B2 (ja) | 2010-03-05 | 2013-12-04 | Tdk株式会社 | 誘電体磁器組成物およびセラミック電子部品 |
US8492302B2 (en) | 2010-03-05 | 2013-07-23 | Tdk Corporation | Dielectric ceramic composition and ceramic electronic component |
JP5668572B2 (ja) * | 2011-03-29 | 2015-02-12 | Tdk株式会社 | 誘電体磁器組成物およびセラミック電子部品 |
JP6089770B2 (ja) | 2013-02-25 | 2017-03-08 | Tdk株式会社 | 誘電体磁器組成物および電子部品 |
KR101792368B1 (ko) | 2015-12-24 | 2017-11-20 | 삼성전기주식회사 | 유전체 자기 조성물, 유전체 재료 및 이를 포함하는 적층 세라믹 커패시터 |
CN106977178A (zh) * | 2017-03-05 | 2017-07-25 | 临沂金成电子有限公司 | 一种微波陶瓷介质材料及制备方法 |
TWI766181B (zh) * | 2019-08-16 | 2022-06-01 | 興勤電子工業股份有限公司 | 陶瓷組成物用於熱敏電阻之用途、陶瓷燒結體用於熱敏電阻之用途、熱敏電阻及其製法 |
CN112408975B (zh) * | 2019-08-23 | 2022-11-04 | 兴勤电子工业股份有限公司 | 陶瓷组成物、陶瓷烧结体、叠层型陶瓷电子元件及其制法 |
CN110483035B (zh) * | 2019-09-24 | 2022-04-15 | 福建省德化县华瓷新材料科技有限公司 | 一种微波介质陶瓷材料及其制备方法和应用、一种滤波器陶瓷材料 |
JP2022122145A (ja) * | 2021-02-09 | 2022-08-22 | Tdk株式会社 | 誘電体組成物、電子部品および積層電子部品 |
JP2022122146A (ja) * | 2021-02-09 | 2022-08-22 | Tdk株式会社 | 誘電体組成物、電子部品および積層電子部品 |
CN113563065B (zh) * | 2021-07-15 | 2022-05-13 | 潮州三环(集团)股份有限公司 | 一种介电陶瓷组合物及其制备方法与应用 |
Family Cites Families (15)
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US4764493A (en) * | 1986-06-16 | 1988-08-16 | Corning Glass Works | Method for the production of mono-size powders of barium titanate |
JP3091192B2 (ja) * | 1998-07-29 | 2000-09-25 | ティーディーケイ株式会社 | 誘電体磁器組成物および電子部品 |
JP3568030B2 (ja) * | 1999-02-26 | 2004-09-22 | Tdk株式会社 | 誘電体磁器組成物の製造方法と誘電体層含有電子部品の製造方法 |
JP3760364B2 (ja) * | 1999-07-21 | 2006-03-29 | Tdk株式会社 | 誘電体磁器組成物および電子部品 |
JP3340722B2 (ja) * | 1999-10-05 | 2002-11-05 | ティーディーケイ株式会社 | 誘電体磁器組成物の製造方法 |
JP2002020166A (ja) * | 2000-06-30 | 2002-01-23 | Taiyo Yuden Co Ltd | 誘電体磁器組成物及び磁器コンデンサ |
JP3417911B2 (ja) * | 2000-08-21 | 2003-06-16 | ティーディーケイ株式会社 | 誘電体磁器組成物の製造方法と誘電体層含有電子部品の製造方法 |
EP1327616B9 (en) | 2002-01-15 | 2011-04-13 | TDK Corporation | Dielectric ceramic composition and electronic device |
JP4191496B2 (ja) * | 2002-01-15 | 2008-12-03 | Tdk株式会社 | 誘電体磁器組成物および電子部品 |
US6777363B2 (en) * | 2002-07-05 | 2004-08-17 | Samsung Electro-Mechanics Co., Ltd. | Non-reducable, low temperature dielectric ceramic composition, capacitor and method of preparing |
JP2005145791A (ja) * | 2003-11-19 | 2005-06-09 | Tdk Corp | 電子部品、誘電体磁器組成物およびその製造方法 |
TW200531955A (en) * | 2004-03-16 | 2005-10-01 | Tdk Corp | Dielectric ceramic composition, multilayer ceramic capacitor, and method for manufacturing the same |
JP2005335963A (ja) * | 2004-05-24 | 2005-12-08 | Matsushita Electric Ind Co Ltd | 誘電体磁器組成物およびそれを用いた積層セラミックコンデンサ |
JP2006027939A (ja) * | 2004-07-14 | 2006-02-02 | Tdk Corp | 誘電体磁器組成物の製造方法、電子部品及び積層セラミックコンデンサ |
JP4839913B2 (ja) * | 2006-03-23 | 2011-12-21 | Tdk株式会社 | 電子部品、誘電体磁器組成物およびその製造方法 |
-
2006
- 2006-02-14 JP JP2006037137A patent/JP4821357B2/ja active Active
-
2007
- 2007-02-02 TW TW096103865A patent/TW200735141A/zh unknown
- 2007-02-09 US US11/704,195 patent/US20070191211A1/en not_active Abandoned
- 2007-02-13 EP EP07003012A patent/EP1820784A1/en not_active Withdrawn
- 2007-02-14 KR KR1020070015373A patent/KR100889900B1/ko active IP Right Grant
- 2007-02-14 CN CNB2007100053865A patent/CN100497251C/zh active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090246508A1 (en) * | 2008-03-31 | 2009-10-01 | Tdk Corporation | Dielectric ceramic composition and an electronic component |
KR101106881B1 (ko) * | 2008-03-31 | 2012-01-25 | 티디케이가부시기가이샤 | 유전체 자기 조성물 및 전자 부품 |
US8592334B2 (en) * | 2008-03-31 | 2013-11-26 | Tdk Corporation | Dielectric ceramic composition and an electronic component |
KR101280507B1 (ko) * | 2010-03-11 | 2013-07-01 | 티디케이가부시기가이샤 | 유전체 자기 조성물 및 세라믹 전자 부품 |
Also Published As
Publication number | Publication date |
---|---|
CN101024572A (zh) | 2007-08-29 |
TW200735141A (en) | 2007-09-16 |
JP2007217205A (ja) | 2007-08-30 |
JP4821357B2 (ja) | 2011-11-24 |
CN100497251C (zh) | 2009-06-10 |
EP1820784A1 (en) | 2007-08-22 |
US20070191211A1 (en) | 2007-08-16 |
KR100889900B1 (ko) | 2009-03-20 |
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