KR20070072385A - 기판의 세척 장치 및 방법 - Google Patents
기판의 세척 장치 및 방법 Download PDFInfo
- Publication number
- KR20070072385A KR20070072385A KR1020060135452A KR20060135452A KR20070072385A KR 20070072385 A KR20070072385 A KR 20070072385A KR 1020060135452 A KR1020060135452 A KR 1020060135452A KR 20060135452 A KR20060135452 A KR 20060135452A KR 20070072385 A KR20070072385 A KR 20070072385A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- foam
- head unit
- fluid
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/003—Cleaning involving contact with foam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US75537705P | 2005-12-30 | 2005-12-30 | |
| US60/755,377 | 2005-12-30 | ||
| US11/532,493 | 2006-09-15 | ||
| US11/532,493 US8522799B2 (en) | 2005-12-30 | 2006-09-15 | Apparatus and system for cleaning a substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20070072385A true KR20070072385A (ko) | 2007-07-04 |
Family
ID=37998277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020060135452A Abandoned KR20070072385A (ko) | 2005-12-30 | 2006-12-27 | 기판의 세척 장치 및 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8522799B2 (https=) |
| EP (1) | EP1803503A3 (https=) |
| JP (1) | JP2007208247A (https=) |
| KR (1) | KR20070072385A (https=) |
| CN (1) | CN102601078A (https=) |
| SG (1) | SG133543A1 (https=) |
| TW (2) | TWI350561B (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180131345A (ko) * | 2017-05-31 | 2018-12-10 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 반도체 디바이스의 화학적 세정 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8522799B2 (en) * | 2005-12-30 | 2013-09-03 | Lam Research Corporation | Apparatus and system for cleaning a substrate |
| US8051863B2 (en) | 2007-10-18 | 2011-11-08 | Lam Research Corporation | Methods of and apparatus for correlating gap value to meniscus stability in processing of a wafer surface by a recipe-controlled meniscus |
| US20090101166A1 (en) * | 2007-10-18 | 2009-04-23 | Lam Research Corporation | Apparatus and methods for optimizing cleaning of patterned substrates |
| US8105997B2 (en) * | 2008-11-07 | 2012-01-31 | Lam Research Corporation | Composition and application of a two-phase contaminant removal medium |
| US8739805B2 (en) * | 2008-11-26 | 2014-06-03 | Lam Research Corporation | Confinement of foam delivered by a proximity head |
| US8317934B2 (en) * | 2009-05-13 | 2012-11-27 | Lam Research Corporation | Multi-stage substrate cleaning method and apparatus |
| US9347987B2 (en) | 2009-11-06 | 2016-05-24 | Intel Corporation | Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same |
| JP4927158B2 (ja) * | 2009-12-25 | 2012-05-09 | 東京エレクトロン株式会社 | 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体及び基板処理装置 |
| WO2012068291A1 (en) * | 2010-11-16 | 2012-05-24 | Alpert Martin A | Washing apparatus and method with spiral air flow for drying |
| KR20120053319A (ko) * | 2010-11-17 | 2012-05-25 | 삼성모바일디스플레이주식회사 | 기판 세정 시스템 및 세정 방법 |
| US20120260517A1 (en) * | 2011-04-18 | 2012-10-18 | Lam Research Corporation | Apparatus and Method for Reducing Substrate Pattern Collapse During Drying Operations |
| US20130000679A1 (en) * | 2011-07-01 | 2013-01-03 | Parra-Garcia Manuel | Multi-channel de-applicator |
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| TWD163179S (zh) * | 2013-04-17 | 2014-09-21 | 東京威力科創股份有限公司 | 基板洗淨具之部分 |
| TWD161690S (zh) * | 2013-04-17 | 2014-07-11 | 東京威力科創股份有限公司 | 基板洗淨具之部分 |
| EP3247508A4 (en) * | 2015-01-20 | 2018-09-19 | Ikonics Corporation | Apparatus and method for removing abrasive particles from within a panel |
| CN108463437B (zh) | 2015-12-21 | 2022-07-08 | 德尔塔阀门公司 | 包括消毒装置的流体输送系统 |
| CN112547662B (zh) * | 2020-11-24 | 2022-04-05 | 江苏筑磊电子科技有限公司 | 异丙醇在火灾后电器表面处理的方法 |
| JP7838977B2 (ja) * | 2022-02-25 | 2026-04-01 | 株式会社ディスコ | 洗浄用治具、及び洗浄方法 |
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2006
- 2006-09-15 US US11/532,493 patent/US8522799B2/en not_active Expired - Fee Related
- 2006-12-15 SG SG200608742-3A patent/SG133543A1/en unknown
- 2006-12-15 EP EP06256392A patent/EP1803503A3/en not_active Withdrawn
- 2006-12-20 TW TW095147823A patent/TWI350561B/zh not_active IP Right Cessation
- 2006-12-20 TW TW100107390A patent/TWI430344B/zh not_active IP Right Cessation
- 2006-12-27 KR KR1020060135452A patent/KR20070072385A/ko not_active Abandoned
- 2006-12-28 JP JP2006353540A patent/JP2007208247A/ja active Pending
- 2006-12-29 CN CN2012100893996A patent/CN102601078A/zh active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180131345A (ko) * | 2017-05-31 | 2018-12-10 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 반도체 디바이스의 화학적 세정 |
| US10354913B2 (en) | 2017-05-31 | 2019-07-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chemical clean of semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1803503A2 (en) | 2007-07-04 |
| TWI350561B (en) | 2011-10-11 |
| TW200805467A (en) | 2008-01-16 |
| TW201133595A (en) | 2011-10-01 |
| CN102601078A (zh) | 2012-07-25 |
| EP1803503A3 (en) | 2012-06-20 |
| US20090308413A1 (en) | 2009-12-17 |
| TWI430344B (zh) | 2014-03-11 |
| SG133543A1 (en) | 2007-07-30 |
| US8522799B2 (en) | 2013-09-03 |
| JP2007208247A (ja) | 2007-08-16 |
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