TWI350561B - Apparatus and system for cleaning a substrate - Google Patents

Apparatus and system for cleaning a substrate

Info

Publication number
TWI350561B
TWI350561B TW095147823A TW95147823A TWI350561B TW I350561 B TWI350561 B TW I350561B TW 095147823 A TW095147823 A TW 095147823A TW 95147823 A TW95147823 A TW 95147823A TW I350561 B TWI350561 B TW I350561B
Authority
TW
Taiwan
Prior art keywords
cleaning
substrate
Prior art date
Application number
TW095147823A
Other languages
English (en)
Other versions
TW200805467A (en
Inventor
Erik M Freer
Larios John M De
Katrina Mikhaylichenko
Michael Ravkin
Mikhail Korolik
Fred C Redeker
Clint Thomas
John Parks
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of TW200805467A publication Critical patent/TW200805467A/zh
Application granted granted Critical
Publication of TWI350561B publication Critical patent/TWI350561B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/003—Cleaning involving contact with foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW095147823A 2005-12-30 2006-12-20 Apparatus and system for cleaning a substrate TWI350561B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US75537705P 2005-12-30 2005-12-30
US11/532,493 US8522799B2 (en) 2005-12-30 2006-09-15 Apparatus and system for cleaning a substrate

Publications (2)

Publication Number Publication Date
TW200805467A TW200805467A (en) 2008-01-16
TWI350561B true TWI350561B (en) 2011-10-11

Family

ID=37998277

Family Applications (2)

Application Number Title Priority Date Filing Date
TW095147823A TWI350561B (en) 2005-12-30 2006-12-20 Apparatus and system for cleaning a substrate
TW100107390A TWI430344B (zh) 2005-12-30 2006-12-20 基板之清理設備及系統

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW100107390A TWI430344B (zh) 2005-12-30 2006-12-20 基板之清理設備及系統

Country Status (7)

Country Link
US (1) US8522799B2 (zh)
EP (1) EP1803503A3 (zh)
JP (1) JP2007208247A (zh)
KR (1) KR20070072385A (zh)
CN (1) CN102601078A (zh)
SG (1) SG133543A1 (zh)
TW (2) TWI350561B (zh)

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KR20070072385A (ko) 2007-07-04
TW200805467A (en) 2008-01-16
US8522799B2 (en) 2013-09-03
SG133543A1 (en) 2007-07-30
JP2007208247A (ja) 2007-08-16
EP1803503A3 (en) 2012-06-20
US20090308413A1 (en) 2009-12-17
TW201133595A (en) 2011-10-01
CN102601078A (zh) 2012-07-25
TWI430344B (zh) 2014-03-11
EP1803503A2 (en) 2007-07-04

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